Universal laser path optimization method and module for metal 3D printing
By optimizing the slice and path thermal balance of the three-dimensional model and dynamically adjusting the laser parameters and scanning paths, the thermal stress concentration problem of complex structural parts in metal 3D printing is solved, and the forming quality and production efficiency are improved.
Patent Information
- Application Number
- CN202510567662.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-30
- Publication Date
- 2025-08-12
AI Technical Summary
When the existing metal 3D printing process prints complex structural parts, the temperature field is uneven, resulting in excessive local temperature gradient, causing concentrated thermal stress, and mass defects such as warping, collapse, and fracture. The existing path planning lacks universality.
By slicing the three-dimensional model and initial path planning, the path thermal equilibrium optimization module is used to evaluate the high-forming risk areas, and dynamically adjust the laser power, vector spacing, scan timing and vector length through the optimization function to generate a new laser scanning path data set to reduce the local temperature gradient.
It significantly improves defects such as warping and collapse, improves the forming quality and production efficiency of complex structural parts, and is suitable for efficient printing of a variety of complex structures, reducing printing time.