U-shaped busbar electroplating equipment and electroplating method for eliminating hanging blind area
By designing an electroplating equipment with a movable column and a limiting clamping mechanism, the problem of blind spots formed in the through holes during the electroplating process of U-shaped busbars was solved, achieving comprehensive electroplating treatment and improving electroplating quality and performance.
Patent Information
- Application Number
- CN202511288124.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-10
- Publication Date
- 2025-11-21
AI Technical Summary
During the electroplating process of U-shaped busbars, water films and bubbles are easily formed in the through holes, which prevents the electroplating solution from covering the area evenly, creating localized electroplating blind spots and affecting the quality and performance of the electroplating.
An electroplating device is used, which, through the design of a movable column and an elastic mechanism, ensures that the column is pulled out from the through hole during the electroplating process. Combined with a limiting component and a clamping mechanism, it avoids obstruction and achieves complete conductivity of the through hole, ensuring the fluidity of the electroplating solution.
This effectively avoids the problem of localized electroplating blind spots caused by suspended electroplating, ensuring the electroplating quality and performance of the busbar and guaranteeing electroplating uniformity.