Method and apparatus for predicting temperature change of electronic component based on pentahedron unit

By using a pentahedral element-based temperature change prediction method, combined with Galerkin finite element method and virtual nodal domain to correct the initial algebraic equations, the simulation error problem of Galerkin finite element method in predicting temperature changes of electronic components is solved, achieving higher precision temperature and thermal stress deformation control and reducing the risk of damage.

CN121744760BActive Publication Date: 2026-07-03UNIV OF ELECTRONIC SCI & TECH OF CHINA CHENGDU COLLEGE
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Patent Information

Application Number
CN202511840012.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-12-08
Publication Date
2026-07-03
Estimated Expiration
2045-12-08

AI Technical Summary

Technical Problem

The existing Galerkin finite element method suffers from problems in predicting temperature changes in electronic components, such as mesh generation mode dependence and low element quality, which leads to increased numerical errors in simulations. This affects the accuracy of simulation results and increases the risk of damage to electronic components due to temperature changes and thermal stress deformation.

Method used

A temperature change prediction method based on pentahedral elements is adopted. By obtaining the structural parameter information of the target object, the pentahedral elements and the three-dimensional transient heat conduction governing equation are determined. The correction term is determined by combining the Galerkin finite element method and virtual nodal domain to correct the initial algebraic equation and obtain a more accurate target algebraic equation, which is used for high-precision simulation of temperature changes and thermal stress deformation.

Benefits of technology

It improves the accuracy of predicting temperature changes and thermal stress deformation of electronic components, reduces the risk of damage caused by temperature changes and thermal stress deformation, and ensures that temperature and thermal stress are within acceptable ranges.

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Abstract

This invention provides a method and device for predicting temperature changes in electronic components based on pentahedral elements. The method includes: meshing the electronic component into pentahedral elements based on its structural parameters; determining the three-dimensional transient heat conduction governing equation and initial algebraic equation for the target region; determining correction terms based on the virtual node domain defined for the pentahedral elements, the Galerkin weight function, the three-dimensional transient heat conduction governing equation, and the initial algebraic equation; correcting the initial algebraic equation based on the correction terms to obtain the target algebraic equation; determining the final algebraic equation based on the target algebraic equation and a preset time interval; solving the final algebraic equation to obtain the transient heat conduction temperature simulation result; adjusting design parameters based on the transient heat conduction temperature simulation result; and implementing optimized design of the electronic component based on the adjusted design parameters.
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