Heat dissipation substrate with composite enhanced heat transfer structure and application of heat dissipation substrate in electronic device heat dissipation device

By using a heat dissipation substrate with a composite enhanced heat transfer structure, combined with an integrated base plate, micro-rib structure and porous skeleton, the problems of flow dead zones and hot spot accumulation in chip heat dissipation are solved, achieving efficient and uniform heat conduction and adapting to the heat dissipation needs of different chips.

CN121888949APending Publication Date: 2026-04-17SHANGHAI INST OF TECH
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Patent Information

Application Number
CN202511942690.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-22
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

In existing chip heat dissipation technologies, traditional heat dissipation structures are prone to flow dead zones within the micro-fin gaps, leading to local hot spot accumulation and uneven heat flow, making it difficult to meet the rapid heat dissipation requirements of high-power chips.

Method used

The heat dissipation substrate adopts a composite enhanced heat transfer structure, including an integrated base plate, micro-rib structure and porous skeleton. By optimizing the fluid flow path and increasing the heat exchange area, combined with cold plate and cover plate heat dissipation devices, uniform heat conduction and efficient heat dissipation are achieved.

Benefits of technology

It significantly improves heat flow uniformity and overall heat exchange efficiency, avoids local hot spot accumulation, ensures continuous and efficient heat dissipation of high-power chips, and adapts to the heat dissipation needs of different chips.

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Abstract

The invention relates to a heat dissipation substrate with a composite enhanced heat transfer structure and application of the heat dissipation substrate in a heat dissipation device of an electronic device, a bottom plate and micro-rib structures are of an integrated structure, and a porous framework is filled among the micro-rib structures; the electronic device heat dissipation device comprises a cold plate type heat dissipation device and a cover plate type heat dissipation device. The cold plate type heat dissipation device is basically composed of a radiator connector, a heat dissipation cover plate, a splitter plate, a heat dissipation substrate and a main board. The basic structure of the cover plate type heat dissipation device is as follows: a radiator joint, a chip cover plate, a splitter plate, a heat dissipation substrate and a core mainboard. Compared with the prior art, the multi-hole framework and the micro-rib structure are designed to be compounded, the heat exchange area can be increased cooperatively, fluid flowing is optimized to improve the heat exchange efficiency, meanwhile, local hot spots and flowing dead zones are avoided, different heat dissipation requirements can be flexibly met, and it is ensured that the chip dissipates heat continuously and efficiently under high power.
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