Heat medium supply device

Abstract

The heat medium supply device (1) of the present application is provided with: a precooling heat medium supply pipe (41) branching from a heating-side return pipe (25) and extending to a precooling heat exchanger (40); and a precooling heat medium return pipe (42) extending from the precooling heat exchanger (40) and connected to the heating-side return pipe (25). The branching point (B1) at which the precooling heat medium supply pipe (41) branches from the heating-side return pipe (25) is located on the upstream side of the heating device (7), and the heat medium before being heated by the heating device (7) is supplied to the precooling heat exchanger (40). The connection point (C1) at which the precooling heat medium return pipe (42) is connected to the heating-side return pipe (25) is located on the upstream side of the heating device (7), and the heat medium passing through the precooling heat exchanger (40) is supplied to the heating device (7) through the heating-side return pipe (25).

Description

Technical Field

[0001] This invention relates to a heat medium supply device for supplying heat medium used to regulate the temperature of semiconductor manufacturing equipment such as etching equipment, CVD equipment, and PVD equipment to semiconductor manufacturing equipment. Background Technology

[0002] Semiconductor manufacturing apparatuses (such as etching apparatuses, CVD apparatuses, and PVD apparatuses) used to manufacture semiconductor devices are configured to control the processing temperature while performing the manufacturing process. For example, an etching apparatus regulates the processing temperature of the wafer by having a liquid, which serves as a heat medium and whose temperature has been regulated, flow through a flow path formed within a substrate supporting the wafer.

[0003] Figure 7 This is a schematic diagram illustrating a conventional example of a heat medium supply apparatus for supplying heat medium to a semiconductor manufacturing apparatus. The heat medium supply apparatus 500 includes a heating device 501 for heating the heat medium and a cooling device 502 for cooling the heat medium. The heat medium is stored in a heating-side tank 504 and a cooling-side tank 505. The heat medium heated by the heating device 501 is conveyed to the heating-side tank 504 and further conveyed from the heating-side tank 504 to a heat medium mixing device 507. Meanwhile, the heat medium stored in the cooling-side tank 505 is conveyed to the cooling device 502 and cooled by the cooling device 502. The cooled heat medium is then conveyed to the heat medium mixing device 507.

[0004] The heated and cooled heat medium are mixed in the heat medium mixing device 507 to adjust to the temperature required by the semiconductor manufacturing apparatus 510. The temperature-adjusted heat medium is then sent to the semiconductor manufacturing apparatus 510, thereby maintaining the semiconductor manufacturing apparatus 510 at the target temperature. The heat medium passing through the semiconductor manufacturing apparatus 510 returns to the heat medium mixing device 507, is split by the heat medium mixing device 507, and is then conveyed to the heating side tank 504 and the cooling side tank 505. In this way, the heat medium circulates between the heat medium supply device 500 and the semiconductor manufacturing apparatus 510.

[0005] Because the heated and cooled heat medium used to regulate the temperature of the semiconductor manufacturing apparatus 510 are mixed in the heat medium mixing device 507, the flow rate of the heat medium supplied to the semiconductor manufacturing apparatus 510 from the heating side tank 504 is inconsistent with the flow rate of the heat medium returning from the semiconductor manufacturing apparatus 510 to the heating side tank 504. Similarly, the flow rate of the heat medium supplied to the semiconductor manufacturing apparatus 510 from the cooling side tank 505 is inconsistent with the flow rate of the heat medium returning from the semiconductor manufacturing apparatus 510 to the cooling side tank 505. As a result, a difference in the liquid level of the heat medium occurs in the heating side tank 504 and the cooling side tank 505.

[0006] Therefore, when the difference in liquid level between the heating side tank 504 and the cooling side tank 505 increases, the on / off valve 520 is opened, causing the heating medium to move from the heating side tank 504 to the cooling side tank 505, or vice versa. As a result, the amount of heating medium in the heating side tank 504 and the cooling side tank 505 can be kept in balance.

[0007] However, when the high-temperature heat medium moves from the heating side tank 504 to the cooling side tank 505, the temperature of the heat medium in the cooling side tank 505 rises, leading to an increase in the load on the cooling device 502. Conversely, when the low-temperature heat medium moves from the cooling side tank 505 to the heating side tank 504, the temperature of the heat medium in the heating side tank 504, which is heated by the heating device 501, decreases, resulting in heat loss. Consequently, the temperature changes within each tank, and as a result, the temperature of the heat medium supplied to the semiconductor manufacturing apparatus 510 changes.

[0008] Therefore, in order to mitigate the temperature change of the heat medium in the heating side tank 504 and the cooling side tank 505, it is proposed to heat or cool the heat medium moving between the heating side tank 504 and the cooling side tank 505 by means of heater 522 and cooler 523 (for example, see Patent Document 1).

[0009] Patent document 1: Japanese Patent Application Publication No. 2023-98068.

[0010] However, because the heater 522 and cooler 523 are devices that utilize energy supplied from the outside (mainly electricity), the energy consumption of the entire heat transfer medium supply device 500 increases. In particular, factories equipped with many semiconductor manufacturing devices 510 are required to save energy. Summary of the Invention

[0011] Therefore, the present invention provides a heat medium supply device capable of reducing the temperature of a heat medium moving from a heating side tank to a cooling side tank without using external energy. Furthermore, the present invention provides a heat medium supply device capable of increasing the temperature of a heat medium moving from a cooling side tank to a heating side tank without using external energy.

[0012] One solution provides a heat medium supply apparatus for supplying a heat medium used to regulate the temperature of a semiconductor manufacturing apparatus, and includes: a heating device for heating the heat medium; a cooling device for cooling the heat medium; a heating medium delivery pipe for delivering the heated heat medium to the semiconductor manufacturing apparatus; a cooling medium delivery pipe for delivering the cooled heat medium to the semiconductor manufacturing apparatus; a heating side tank and a cooling side tank for holding the heat medium; a tank connecting pipe for connecting the heating side tank and the cooling side tank; a heating side return pipe for returning the heat medium passing through the semiconductor manufacturing apparatus to the heating side tank; a cooling side return pipe for returning the heat medium passing through the semiconductor manufacturing apparatus to the cooling side tank; a pre-cooling heat exchanger connected to the tank connecting pipe for cooling the heat medium flowing through the tank connecting pipe from the heating side tank toward the cooling side tank; and a pre-cooling heat medium supply pipe extending from a branch of the heating side return pipe. The heat exchanger is connected to the precooling heat medium return pipe, which extends from the precooling heat exchanger and connects to the heating-side return pipe. The heating device is disposed on the heating-side return pipe and configured to heat the heat medium flowing through the heating-side return pipe. The branching point of the precooling heat medium supply pipe from the heating-side return pipe is located upstream of the heating device, and is configured to supply the heat medium to the precooling heat exchanger before it is heated by the heating device. The connection point between the precooling heat medium return pipe and the heating-side return pipe is located upstream of the heating device, and is configured to supply the heat medium passing through the precooling heat exchanger to the heating device through the heating-side return pipe. The precooling heat exchanger is configured to perform heat exchange between the heat medium flowing from the heating-side tank toward the cooling-side tank through the tank connecting pipe and the heat medium supplied through the precooling heat medium supply pipe.

[0013] The precooling heat exchanger exchanges heat between the heat medium flowing from the heating side tank to the cooling side tank through the tank connecting pipe and the heat medium passing through the semiconductor manufacturing apparatus. The heat of the heat medium flowing through the tank connecting pipe is recovered by the heat medium passing through the semiconductor manufacturing apparatus, thereby reducing the temperature of the heat medium flowing from the heating side tank to the cooling side tank without using external energy. Furthermore, the heat medium with recovered heat from the precooling heat exchanger is sent to the heating device and heated. Since the temperature of the heat medium with recovered heat has increased, the load on the heating device is reduced, achieving energy savings.

[0014] In one embodiment, the heat medium supply device further comprises: a connecting valve disposed in the tank connecting pipe; a precooling supply valve disposed in the precooling heat medium return pipe or the precooling heat medium supply pipe; and an operation control unit for controlling the operation of the connecting valve and the precooling supply valve; the operation control unit is configured to open the precooling supply valve while the connecting valve is open.

[0015] During the opening of the connecting valve, the precooling supply valve is opened, and the hot medium from the semiconductor manufacturing apparatus is supplied to the precooling heat exchanger. Therefore, the hot medium flowing through the tank connecting pipe is cooled by the precooling heat exchanger. As a result, the high-temperature hot medium in the heating side tank is prevented from directly moving to the low-temperature side tank.

[0016] In one embodiment, the heat medium supply device further comprises: a heating-side return temperature measuring device disposed on the heating-side return pipe upstream of the heating device; and a communication temperature measuring device disposed on the tank communication pipe; the operation control unit is configured to open the communication valve and the precooling supply valve when the temperature of the heat medium in the heating-side return pipe measured by the heating-side return temperature measuring device is lower than the temperature of the heat medium in the tank communication pipe measured by the communication temperature measuring device.

[0017] In a certain stage of the manufacturing process performed using a semiconductor manufacturing apparatus, a heat transfer medium is heated by the apparatus. When the heat transfer medium passing through the semiconductor manufacturing apparatus is at a high temperature, it cannot cool the heat transfer medium flowing through the tank connecting pipe, nor can it recover heat. Therefore, when the temperature of the heat transfer medium in the heating-side return pipe is lower than the temperature of the heat transfer medium in the tank connecting pipe, the operation control unit opens the connecting valve and the pre-cooling supply valve. Through this action, the heat transfer medium passing through the semiconductor manufacturing apparatus can cool the heat transfer medium flowing through the tank connecting pipe, and heat can be recovered.

[0018] In one embodiment, the heat medium supply device further comprises: a preheating heat exchanger connected to the tank connecting pipe and heating the heat medium flowing through the tank connecting pipe from the cooling side tank toward the heating side tank; a preheating heat medium supply pipe branching from the cooling side return pipe and extending to the preheating heat exchanger; and a preheating heat medium return pipe extending from the preheating heat exchanger and connected to the cooling side return pipe; a cooling device disposed on the cooling side return pipe and configured to cool the heat medium flowing through the cooling side return pipe; the preheating heat medium supply pipe branching from the cooling side return pipe. The bifurcation point is located upstream of the cooling device, configured to supply the heat medium before it is cooled by the cooling device to the preheating heat exchanger; the connection point between the preheating heat medium return pipe and the cooling side return pipe is located upstream of the cooling device, configured to supply the heat medium passing through the preheating heat exchanger to the cooling device through the cooling side return pipe; the preheating heat exchanger is configured to perform heat exchange between the heat medium flowing from the cooling side tank toward the heating side tank through the tank connecting pipe and the heat medium supplied through the preheating heat medium supply pipe.

[0019] The preheating heat exchanger exchanges heat between the heat medium flowing from the cooling side tank to the heating side tank through the tank connecting pipe and the heat medium passing through the semiconductor manufacturing apparatus. The heat from the heat medium passing through the semiconductor manufacturing apparatus is recovered via the heat medium flowing through the tank connecting pipe, thereby increasing the temperature of the heat medium flowing from the cooling side tank to the heating side tank without using external energy. Furthermore, the heat medium whose heat has been removed by the preheating heat exchanger is sent to a cooling device and cooled there. Since the temperature of the heat medium whose heat has been removed is already lowered, the load on the cooling device is reduced, achieving energy savings.

[0020] In one embodiment, the semiconductor manufacturing apparatus comprises multiple semiconductor manufacturing apparatuses, and the heating medium delivery pipe, the cooling medium delivery pipe, the heating-side return pipe, and the cooling-side return pipe are respectively connected to the multiple semiconductor manufacturing apparatuses.

[0021] One solution provides a heat medium supply apparatus for supplying a heat medium used to regulate the temperature of a semiconductor manufacturing apparatus, and includes: a heating device for heating the heat medium; a cooling device for cooling the heat medium; a heating medium delivery pipe for delivering the heated heat medium to the semiconductor manufacturing apparatus; a cooling medium delivery pipe for delivering the cooled heat medium to the semiconductor manufacturing apparatus; a heating side tank and a cooling side tank for holding the heat medium; a tank connecting pipe for connecting the heating side tank and the cooling side tank; a heating side return pipe for returning the heat medium passing through the semiconductor manufacturing apparatus to the heating side tank; a cooling side return pipe for returning the heat medium passing through the semiconductor manufacturing apparatus to the cooling side tank; a preheating heat exchanger connected to the tank connecting pipe for heating the heat medium flowing through the tank connecting pipe from the cooling side tank toward the heating side tank; and a preheating heat medium supply pipe branching off from the cooling side return pipe and extending... The heat exchanger extends to the preheating heat exchanger; and a preheating heat medium return pipe extends from the preheating heat exchanger and connects to the cooling side return pipe; the cooling device is disposed on the cooling side return pipe and is configured to cool the heat medium flowing through the cooling side return pipe; the branching point of the preheating heat medium supply pipe from the cooling side return pipe is located upstream of the cooling device, and is configured to supply the heat medium to be cooled by the cooling device to the preheating heat exchanger; the connection point of the preheating heat medium return pipe and the cooling side return pipe is located upstream of the cooling device, and is configured to supply the heat medium passing through the preheating heat exchanger to the cooling device through the cooling side return pipe; the preheating heat exchanger is configured to perform heat exchange between the heat medium flowing from the cooling side tank toward the heating side tank through the tank connecting pipe and the heat medium supplied through the preheating heat medium supply pipe.

[0022] The preheating heat exchanger exchanges heat between the heat medium flowing from the cooling side tank to the heating side tank through the tank connecting pipe and the heat medium passing through the semiconductor manufacturing apparatus. Heat from the heat medium passing through the semiconductor manufacturing apparatus is recovered via the heat medium flowing through the tank connecting pipe, thereby increasing the temperature of the heat medium flowing from the cooling side tank to the heating side tank without using external energy. Furthermore, the heat medium that has had its heat removed by the preheating heat exchanger is sent to a cooling device and cooled there. Since the temperature of the heat medium that has had its heat removed is already lowered, the load on the cooling device is reduced, achieving energy savings.

[0023] In one embodiment, the heat medium supply device further comprises: a connecting valve disposed in the tank connecting pipe; a preheating supply valve disposed in the preheating heat medium return pipe or the preheating heat medium supply pipe; and an operation control unit for controlling the operation of the connecting valve and the preheating supply valve; the operation control unit is configured to open the preheating supply valve while the connecting valve is open.

[0024] During the opening of the connecting valve, the preheating supply valve is opened, and the heat medium from the semiconductor manufacturing apparatus is sent to the preheating heat exchanger. Therefore, the heat medium flowing through the tank connecting pipe is heated by the preheating heat exchanger. As a result, the low-temperature heat medium in the cooling side tank is prevented from directly moving to the high-temperature side tank.

[0025] In one embodiment, the heat medium supply device further comprises: a cooling-side return temperature measuring device disposed on the cooling-side return pipe upstream of the cooling device; and a connecting temperature measuring device disposed on the tank connecting pipe; the operation control unit is configured to open the connecting valve and the preheating supply valve when the temperature of the heat medium in the cooling-side return pipe measured by the cooling-side return temperature measuring device is higher than the temperature of the heat medium in the tank connecting pipe measured by the connecting temperature measuring device.

[0026] At a certain stage of the manufacturing process performed using a semiconductor manufacturing apparatus, the heat transfer medium is cooled by the semiconductor manufacturing apparatus. When the heat transfer medium passing through the semiconductor manufacturing apparatus is at a low temperature, it cannot heat the heat transfer medium flowing through the tank connecting pipe, and the heat transfer medium flowing through the tank connecting pipe cannot recover heat from the heat transfer medium passing through the semiconductor manufacturing apparatus. Therefore, when the temperature of the heat transfer medium in the cooling-side return pipe is higher than the temperature of the heat transfer medium in the tank connecting pipe, the operation control unit opens the connecting valve and the preheating supply valve. Through this operation, the heat transfer medium passing through the semiconductor manufacturing apparatus can heat the heat transfer medium flowing through the tank connecting pipe, and the heat transfer medium flowing through the tank connecting pipe can recover heat from the heat transfer medium passing through the semiconductor manufacturing apparatus.

[0027] In one embodiment, the heat medium supply device further comprises: a precooling heat exchanger connected to the tank connecting pipe and cooling the heat medium flowing through the tank connecting pipe from the heating side tank toward the cooling side tank; a precooling heat medium supply pipe branching from the heating side return pipe and extending to the precooling heat exchanger; and a precooling heat medium return pipe extending from the precooling heat exchanger and connected to the heating side return pipe; the heating device is disposed on the heating side return pipe and configured to heat the heat medium flowing through the heating side return pipe; the precooling heat medium supply pipe branching from the heating side return pipe... The bifurcation point of the branch is located upstream of the heating device, configured to supply the heat medium to the precooling heat exchanger before it is heated by the heating device; the connection point of the precooling heat medium return pipe and the heating side return pipe is located upstream of the heating device, configured to supply the heat medium passing through the precooling heat exchanger to the heating device through the heating side return pipe; the precooling heat exchanger is configured to perform heat exchange between the heat medium flowing from the heating side tank toward the cooling side tank through the tank connecting pipe and the heat medium supplied through the precooling heat medium supply pipe.

[0028] The precooling heat exchanger exchanges heat between the heat medium flowing from the heating side tank to the cooling side tank through the tank connecting pipe and the heat medium passing through the semiconductor manufacturing apparatus. The heat of the heat medium flowing through the tank connecting pipe is recovered by the heat medium passing through the semiconductor manufacturing apparatus, thereby reducing the temperature of the heat medium flowing from the heating side tank to the cooling side tank without using external energy. Furthermore, the heat medium with recovered heat from the precooling heat exchanger is sent to the heating device and heated. Since the temperature of the heat medium with recovered heat has increased, the load on the heating device is reduced, achieving energy savings.

[0029] In one embodiment, the semiconductor manufacturing apparatus comprises multiple semiconductor manufacturing apparatuses, and the heating medium delivery pipe, the cooling medium delivery pipe, the heating-side return pipe, and the cooling-side return pipe are respectively connected to the multiple semiconductor manufacturing apparatuses.

[0030] The heat medium supply device performs heat exchange between the heat medium flowing through the slot connecting pipe and the heat medium passing through the semiconductor manufacturing apparatus. Since the heat medium passing through the semiconductor manufacturing apparatus is used for temperature regulation, the heat medium supply device can reduce the temperature of the heat medium moving from the heating side slot to the cooling side slot, or increase the temperature of the heat medium moving from the cooling side slot to the heating side slot, without using external energy. Attached Figure Description

[0031] Figure 1 This is a schematic diagram illustrating one embodiment of a semiconductor manufacturing system that includes a heat medium supply device and a semiconductor manufacturing device.

[0032] Figure 2 This is a schematic diagram illustrating other embodiments of the heat medium supply device.

[0033] Figure 3 This is a schematic diagram illustrating yet another embodiment of the heat medium supply device.

[0034] Figure 4 This is a schematic diagram illustrating yet another embodiment of the heat medium supply device.

[0035] Figure 5 This is a schematic diagram illustrating yet another embodiment of the heat medium supply device.

[0036] Figure 6 This is a schematic diagram illustrating one embodiment of a semiconductor manufacturing system that includes a heat medium supply device and multiple semiconductor manufacturing devices.

[0037] Figure 7 This is a schematic diagram illustrating a conventional example of a heat medium supply device that supplies heat medium to a semiconductor manufacturing apparatus. Detailed Implementation

[0038] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a schematic diagram illustrating one embodiment of a semiconductor manufacturing system including a heat medium supply device 1 and a semiconductor manufacturing apparatus 2. The heat medium supply device 1 is configured to supply a heat medium used to regulate the temperature of the semiconductor manufacturing apparatus 2 (e.g., an etching apparatus, a CVD apparatus, a PVD apparatus, etc.) to the semiconductor manufacturing apparatus 2.

[0039] like Figure 1 As shown, the semiconductor manufacturing system includes: a heat transfer medium supply device 1; a heat transfer medium mixing device 5 connected to the heat transfer medium supply device 1; and a semiconductor manufacturing apparatus 2 connected to the heat transfer medium mixing device 5. The heat transfer medium supply device 1 is connected to the semiconductor manufacturing apparatus 2 via the heat transfer medium mixing device 5. Figure 1 In the embodiment shown, an etching apparatus for performing dry etching on wafers is used as the semiconductor manufacturing apparatus 2; however, the semiconductor manufacturing apparatus 2 is not limited to this embodiment.

[0040] The heat medium supply device 1 includes: a heating device 7 for heating the heat medium; a cooling device 8 for cooling the heat medium; a heating medium delivery pipe 11 for delivering the heated heat medium to the semiconductor manufacturing apparatus 2; and a cooling medium delivery pipe 12 for delivering the cooled heat medium to the semiconductor manufacturing apparatus 2. The heating medium delivery pipe 11 and the cooling medium delivery pipe 12 are connected to a heat medium mixing device 5 and are connected to the semiconductor manufacturing apparatus 2 via the heat medium mixing device 5. The heat medium mixing device 5 includes multiple flow regulating valves (not shown) that are respectively connected to the heating medium delivery pipe 11 and the cooling medium delivery pipe 12. The heat medium mixing device 5 is configured to adjust the flow rate of the heated heat medium and the flow rate of the cooled heat medium, while simultaneously mixing the heated heat medium and the cooled heat medium, to achieve the temperature required by the semiconductor manufacturing apparatus 2.

[0041] In one embodiment, a fluorine-based inactive liquid is used as the heat medium. An electric heater can be cited as an example of the heating device 7. A vapor compression chiller or absorption chiller can be cited as an example of the cooling device 8. Vapor compression chillers include turbine chillers, spiral chillers, rotary chillers, scroll chillers, etc., and these can be used. The configuration of the heating device 7 and the cooling device 8 is not particularly limited, as long as they can heat and cool the heat medium.

[0042] The heat medium supply device 1 further includes: a heating side tank 15 and a cooling side tank 16 for holding the heat medium; a tank connecting pipe 20 connecting the heating side tank 15 and the cooling side tank 16; a connecting valve 21 provided in the tank connecting pipe 20; a heating side return pipe 25 for returning the heat medium passing through the semiconductor manufacturing apparatus 2 to the heating side tank 15; and a cooling side return pipe 26 for returning the heat medium passing through the semiconductor manufacturing apparatus 2 to the cooling side tank 16. The heating side return pipe 25 extends from the heat medium mixing device 5 to the heating side tank 15. The cooling side return pipe 26 extends from the heat medium mixing device 5 to the cooling side tank 16. The heating medium delivery pipe 11 extends from the heating side tank 15 to the heat medium mixing device 5. The cooling medium delivery pipe 12 extends from the cooling side tank 16 to the heat medium mixing device 5. The gas layer portion of the heating side tank 15 and the gas layer portion of the cooling side tank 16 are connected by a gas layer connecting pipe 17. The gas layer connecting pipe 17 is located at a position higher than the liquid level of the heat medium in the heating side tank 15 and the cooling side tank 16.

[0043] A heating device 7 is installed in the heating-side return pipe 25 and is configured to heat the heat medium flowing through the heating-side return pipe 25. The heating device 7 is located upstream of the heating-side tank 15. The heat medium heated by the heating device 7 is transported to the heating-side tank 15 through the heating-side return pipe 25 and stored in the heating-side tank 15. The heat medium supply device 1 includes a heating-side liquid level detection device 31 for detecting the liquid level of the heat medium in the heating-side tank 15.

[0044] The heat medium supply device 1 includes a heating side pump 33 connected to the heating medium delivery pipe 11. When the heating side pump 33 is operated, the heat medium (the heated medium) in the heating side tank 15 is sent to the heat medium mixing device 5 through the heating medium delivery pipe 11, and further sent from the heat medium mixing device 5 to the semiconductor manufacturing device 2.

[0045] A cooling device 8 is provided in the cooling medium delivery pipe 12 and is configured to cool the hot medium flowing through the cooling medium delivery pipe 12. The cooling device 8 is located downstream of the cooling side tank 16. The hot medium supply device 1 includes a cooling side pump 34 connected to the cooling medium delivery pipe 12. When the cooling side pump 34 is operated, the hot medium flows from the cooling side tank 16 through the cooling medium delivery pipe 12 and is simultaneously cooled by the cooling device 8. The cooled hot medium is sent through the cooling medium delivery pipe 12 to the hot medium mixing device 5, and further from the hot medium mixing device 5 to the semiconductor manufacturing apparatus 2. The hot medium supply device 1 includes a cooling side liquid level detection device 32 for detecting the liquid level of the hot medium in the cooling side tank 16.

[0046] A heat medium with a preset temperature is generated by mixing a heat medium to be heated with a heat medium to be cooled using a heat medium mixing device 5. The heat medium at the preset temperature is then transported from the heat medium mixing device 5 to the semiconductor manufacturing apparatus 2, where it simultaneously heats or cools a wafer (not shown) within the semiconductor manufacturing apparatus 2. The heat medium passing through the semiconductor manufacturing apparatus 2 returns to the heat medium mixing device 5 and branches into two flow paths. One flow path flows into the heating-side return pipe 25, and the other flows into the cooling-side return pipe 26. The heat medium flowing into the heating-side return pipe 25 is heated by the heating device 7 and then flows into the heating-side tank 15. The heat medium flowing into the cooling-side return pipe 26 flows into the cooling-side tank 16 via the cooling-side return pipe 26.

[0047] In this way, the heat medium circulates between the heating side tank 15 and the semiconductor manufacturing apparatus 2 through the heating medium delivery pipe 11 and the heating side return pipe 25, and simultaneously circulates between the cooling side tank 16 and the semiconductor manufacturing apparatus 2 through the cooling medium delivery pipe 12 and the cooling side return pipe 26. As the heat medium circulates between the heat medium supply device 1 and the semiconductor manufacturing apparatus 2, a difference arises between the heat medium level in the heating side tank 15 and the heat medium level in the cooling side tank 16.

[0048] In this embodiment, the heat medium supply device 1 is configured such that when the heat medium level in the heating side tank 15 is too high or the heat medium level in the cooling side tank 16 is too low, the heat medium is moved from the heating side tank 15 to the cooling side tank 16 as described below.

[0049] The heat medium supply device 1 includes an operation control unit 35 that controls the operation of the connecting valve 21 provided in the tank connecting pipe 20. The operation control unit 35 is configured to open the connecting valve 21 when the heat medium level in the heating side tank 15, detected by the heating side liquid level detection device 31, is higher than a preset upper limit, or when the heat medium level in the cooling side tank 16, detected by the cooling side liquid level detection device 32, is lower than a preset lower limit, so that the heat medium moves from the heating side tank 15 to the cooling side tank 16 through the tank connecting pipe 20. The driving force for the movement of the heat medium is the head difference between the heating side tank 15 and the cooling side tank 16.

[0050] The motion control unit 35 includes at least one computer. The motion control unit 35 includes: a storage device 35a storing programs, etc.; and a processing unit 35b executing calculations according to the commands contained in the programs. The storage device 35a includes: a main storage device such as random access memory (RAM); and auxiliary storage devices such as hard disk drives (HDDs) and solid-state drives (SSDs). Examples of the processing unit 35b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the motion control unit 35 is not limited to these examples.

[0051] The configuration is such that, as a result of the movement of the heat medium, when the level of the heat medium in the heating side tank 15 drops to a specified level, or when the level of the heat medium in the cooling side tank 16 rises to a specified level, the action control unit 35 closes the connecting valve 21. The connecting valve 21 is an actuator-driven valve such as an electric valve.

[0052] The heat medium supply device 1 is configured to cool the heat medium that moves from the heating side tank 15 to the cooling side tank 16 through the tank connecting pipe 20 when the connecting valve 21 is opened. More specifically, the heat medium supply device 1 includes: a precooling heat exchanger 40 connected to the tank connecting pipe 20 and cooling the heat medium flowing through the tank connecting pipe 20 from the heating side tank 15 toward the cooling side tank 16; a precooling heat medium supply pipe 41 branching from the heating side return pipe 25 and extending to the precooling heat exchanger 40; and a precooling heat medium return pipe 42 extending from the precooling heat exchanger 40 and connected to the heating side return pipe 25.

[0053] The heat medium supply device 1 further includes a precooling supply valve 45 located on the precooling heat medium return pipe 42. In this embodiment, the precooling supply valve 45 is a three-way valve and is located at the connection point C1 between the precooling heat medium return pipe 42 and the heating side return pipe 25. The precooling supply valve 45 is an actuator-driven valve such as an electric valve. In one embodiment, the precooling supply valve 45 may also be a two-way valve (on / off valve). The precooling supply valve 45 is electrically connected to the operation control unit 35, and the operation of the precooling supply valve 45 is controlled by the operation control unit 35.

[0054] When the operation control unit 35 opens the precooling supply valve 45, the precooling hot medium return pipe 42 is connected to the heating side return pipe 25. As a result, at least a portion of the hot medium flowing through the heating side return pipe 25 flows into the precooling hot medium supply pipe 41. The hot medium is then transported to the precooling heat exchanger 40 through the precooling hot medium supply pipe 41. When the operation control unit 35 closes the precooling supply valve 45, it blocks the connection between the precooling hot medium return pipe 42 and the heating side return pipe 25. As a result, the supply of hot medium through the precooling hot medium supply pipe 41 to the precooling heat exchanger 40 is stopped.

[0055] The precooling heat exchanger 40 is configured to exchange heat between a heat medium supplied through a precooling heat medium supply pipe 41 and a heat medium flowing from the heating side tank 15 toward the cooling side tank 16 through a tank connecting pipe 20. The heat medium flowing through the tank connecting pipe 20 is the heat medium heated by the heating device 7 and is at a high temperature. On the other hand, the heat medium flowing through the precooling heat medium supply pipe 41 is a mixture of the heated and cooled heat medium. Therefore, the temperature of the heat medium flowing through the precooling heat medium supply pipe 41 is lower than the temperature of the heat medium flowing through the tank connecting pipe 20. Within the precooling heat exchanger 40, the heat of the heat medium flowing through the tank connecting pipe 20 is recovered by the heat medium transported through the precooling heat medium supply pipe 41. As a result, the temperature of the heat medium flowing through the tank connecting pipe 20 decreases, and then the cooled heat medium flows into the cooling side tank 16.

[0056] In this way, the precooling heat exchanger 40 can reduce the temperature of the heat medium flowing from the heating side tank 15 to the cooling side tank 16 without using external energy. Since the temperature of the heat medium is prevented from rising excessively in the cooling side tank 16, the load on the cooling device 8 can be reduced, and the heat medium supply device 1 can precisely control the temperature of the heat medium to be supplied to the semiconductor manufacturing device 2.

[0057] The branch point B1 of the precooling heat medium supply pipe 41, which branches off from the heating-side return pipe 25, is located upstream of the heating device 7, allowing the heat medium to be heated by the heating device 7 to be supplied to the precooling heat exchanger 40. The connection point C1 between the precooling heat medium return pipe 42 and the heating-side return pipe 25 is also located upstream of the heating device 7. The heat medium passing through the precooling heat exchanger 40 is supplied to the heating device 7 via the precooling heat medium return pipe 42 and the heating-side return pipe 25. The branch point B1 is upstream of the connection point C1.

[0058] The hot medium flowing through the precooled hot medium return pipe 42 has already been heated due to heat recovery at the precooled heat exchanger 40. Therefore, the hot medium passing through the precooled hot medium return pipe 42 is sent to the heating device 7 while its temperature is rising, and is further heated by the heating device 7. Since the temperature of the hot medium that has recovered heat has already risen, the load on the heating device 7 is reduced, thus achieving energy saving.

[0059] The action control unit 35 is configured to open the precooling supply valve 45 during the opening of the connecting valve 21. During the opening of the connecting valve 21, the precooling supply valve 45 is opened, and the heat medium from the semiconductor manufacturing apparatus 2 is supplied to the precooling heat exchanger 40. Therefore, the heat medium flowing through the tank connecting pipe 20 is cooled by the precooling heat exchanger 40. As a result, the high-temperature heat medium in the heating side tank 15 is prevented from directly moving to the low-temperature side tank.

[0060] The heat medium supply device 1 further includes: a heating-side return temperature measuring device 47 located upstream of the heating device 7 in the heating-side return pipe 25; and a connection temperature measuring device 51 located in the tank connection pipe 20. The connection temperature measuring device 51 is disposed between the heating-side tank 15 and the connection valve 21. The heating-side return temperature measuring device 47 and the connection temperature measuring device 51 are electrically connected to the operation control unit 35. The temperature measurement value of the heat medium in the heating-side return pipe 25 measured by the heating-side return temperature measuring device 47 and the temperature measurement value of the heat medium in the tank connection pipe 20 measured by the connection temperature measuring device 51 are sent to the operation control unit 35. The operation control unit 35 is configured to open the connection valve 21 and the pre-cooling supply valve 45 when the temperature of the heat medium in the heating-side return pipe 25 is lower than the temperature of the heat medium in the tank connection pipe 20.

[0061] During a certain stage of the manufacturing process performed using the semiconductor manufacturing apparatus 2, a heat transfer medium is heated by the semiconductor manufacturing apparatus 2. When the heat transfer medium passing through the semiconductor manufacturing apparatus 2 is at a high temperature, it cannot cool the heat transfer medium flowing through the tank connecting pipe 20, nor can it recover heat. Therefore, when the temperature of the heat transfer medium in the heating-side return pipe 25 is lower than the temperature of the heat transfer medium in the tank connecting pipe 20, the operation control unit 35 opens the connecting valve 21 and the pre-cooling supply valve 45. Through this operation, the heat transfer medium passing through the semiconductor manufacturing apparatus 2 can cool the heat transfer medium flowing through the tank connecting pipe 20, and heat can be recovered.

[0062] Figure 1 In the illustrated embodiment, the precooling supply valve 45 is located on the precooling hot medium return pipe 42. However, in one embodiment, the precooling supply valve 45 may also be located on the precooling hot medium supply pipe 41. For example, the precooling supply valve 45 may also be located at the bifurcation point B1 where the precooling hot medium supply pipe 41 branches off from the heating side return pipe 25. In this configuration, when the precooling supply valve 45 is opened, the precooling hot medium supply pipe 41 is connected to the heating side return pipe 25, resulting in at least a portion of the hot medium flowing through the heating side return pipe 25 flowing into the precooling hot medium supply pipe 41. When the precooling supply valve 45 is closed, the connection between the precooling hot medium supply pipe 41 and the heating side return pipe 25 is blocked. As a result, the supply of hot medium through the precooling hot medium supply pipe 41 to the precooling heat exchanger 40 is stopped.

[0063] Figure 2This is a schematic diagram illustrating another embodiment of the heat medium supply device 1. Unless otherwise specified, the configuration and operation of this embodiment are similar to those described above. Figure 1 The implementation methods described are the same, so repeated descriptions are omitted. Figure 2 In the embodiment shown, the precooling supply valve 45 located in the precooling hot medium return pipe 42 is a two-way valve (on / off valve). The precooling supply valve 45 is an actuator-driven valve such as an electric valve.

[0064] The heat medium supply device 1 includes a heating-side flow restriction device 55 located on the heating-side return pipe 25. The heating-side flow restriction device 55 is positioned upstream of the heating device 7. More specifically, the heating-side flow restriction device 55 is located downstream of the bifurcation point B1 where the precooling heat medium supply pipe 41 branches off from the heating-side return pipe 25, and upstream of the connection point C1 between the precooling heat medium return pipe 42 and the heating-side return pipe 25.

[0065] The heating-side flow limiting device 55 is configured to limit the flow rate of the heat medium flowing through the heating-side return pipe 25. Specific examples of the heating-side flow limiting device 55 include throttle orifices, flow regulating valves, etc. A portion of the heat medium flowing through the heating-side return pipe 25 is transported to the precooling heat exchanger 40 through the precooling heat medium supply pipe 41, and the other portion of the heat medium flowing through the heating-side return pipe 25 is transported to the heating device 7 through the heating-side flow limiting device 55.

[0066] In this embodiment, the precooling heat exchanger 40 can also reduce the temperature of the heat medium flowing from the heating side tank 15 to the cooling side tank 16 without using external energy. Furthermore, the heat medium that has had its heat recovered by the precooling heat exchanger 40 is sent to the heating device 7 and heated by it. Since the temperature of the heat medium that has had its heat recovered has increased, the load on the heating device 7 is reduced, thus achieving energy savings.

[0067] Figure 2 In the illustrated embodiment, the precooling supply valve 45 is located on the precooling hot medium return pipe 42. However, in another embodiment, the precooling supply valve 45 may also be located on the precooling hot medium supply pipe 41. In this configuration, when the precooling supply valve 45 is opened, the precooling hot medium supply pipe 41 is connected to the heating side return pipe 25. As a result, a portion of the hot medium flowing through the heating side return pipe 25 flows into the precooling hot medium supply pipe 41. When the precooling supply valve 45 is closed, the connection between the precooling hot medium supply pipe 41 and the heating side return pipe 25 is blocked. Consequently, the supply of hot medium through the precooling hot medium supply pipe 41 to the precooling heat exchanger 40 is stopped.

[0068] Figure 3 This is a schematic diagram illustrating another embodiment of the heat medium supply device 1. Unless otherwise specified, the configuration and operation of this embodiment are similar to those described above. Figure 1The implementation methods described are the same, so repeated descriptions are omitted. Figure 3 The heat medium supply device 1 shown in the embodiment replaces the precooling heat exchanger 40 and has a preheating heat exchanger 60 that heats the heat medium flowing from the cooling side tank 16 toward the heating side tank 15 through the tank connecting pipe 20.

[0069] like Figure 3 As shown, the heat medium supply device 1 includes: the aforementioned preheating heat exchanger 60 connected to the tank connecting pipe 20; a preheating heat medium supply pipe 61 branching from the cooling side return pipe 26 and extending to the preheating heat exchanger 60; and a preheating heat medium return pipe 62 extending from the preheating heat exchanger 60 and connected to the cooling side return pipe 26. The cooling device 8 is configured to be installed in the cooling side return pipe 26 and to cool the heat medium flowing through the cooling side return pipe 26. The heat medium cooled by the cooling device 8 is transported to the cooling side tank 16 through the cooling side return pipe 26 and stored in the cooling side tank 16.

[0070] When the level of the heat medium in the cooling side tank 16 is too high, or the level of the heat medium in the heating side tank 15 is too low, the heat medium supply device 1 of this embodiment is configured to move the heat medium from the cooling side tank 16 to the heating side tank 15 as described below.

[0071] The motion control unit 35 is configured to open the connecting valve 21 to allow the hot medium to move from the cooling side tank 16 to the heating side tank 15 through the tank connecting pipe 20 when the hot medium level in the cooling side tank 16 detected by the cooling side liquid level detection device 32 is higher than a preset upper limit, or when the hot medium level in the heating side tank 15 detected by the heating side liquid level detection device 31 is lower than a preset lower limit. The driving force for the movement of the hot medium is the head difference between the heating side tank 15 and the cooling side tank 16.

[0072] The preheating heat exchanger 60 is configured such that when the connecting valve 21 is opened, the heat medium that moves from the cooling side tank 16 to the heating side tank 15 through the tank connecting pipe 20 is heated. The configuration is such that, as a result of the movement of the heat medium, the operation control unit 35 closes the connecting valve 21 when the heat medium level in the cooling side tank 16 drops to a specified level, or when the heat medium level in the heating side tank 15 rises to a specified level.

[0073] The heat medium supply device 1 further includes a preheating supply valve 65 located on the preheating heat medium return pipe 62. In this embodiment, the preheating supply valve 65 is a three-way valve and is located at the connection point C2 between the preheating heat medium return pipe 62 and the cooling side return pipe 26. The preheating supply valve 65 is an actuator-driven valve such as an electric valve. In one embodiment, the preheating supply valve 65 may also be a two-way valve (on / off valve). The preheating supply valve 65 is electrically connected to the operation control unit 35, and the operation of the preheating supply valve 65 is controlled by the operation control unit 35.

[0074] When the operation control unit 35 opens the preheating supply valve 65, the preheating heat medium return pipe 62 is connected to the cooling side return pipe 26. As a result, at least a portion of the heat medium flowing through the cooling side return pipe 26 flows into the preheating heat medium supply pipe 61. The heat medium is then transported to the preheating heat exchanger 60 through the preheating heat medium supply pipe 61. When the operation control unit 35 closes the preheating supply valve 65, it blocks the connection between the preheating heat medium return pipe 62 and the cooling side return pipe 26. As a result, the supply of heat medium through the preheating heat medium supply pipe 61 to the preheating heat exchanger 60 is stopped.

[0075] The preheating heat exchanger 60 is configured to exchange heat between a heat medium supplied through a preheating heat medium supply pipe 61 and a heat medium flowing from the cooling side tank 16 toward the heating side tank 15 through a tank connecting pipe 20. The heat medium flowing through the tank connecting pipe 20 is a heat medium cooled by the cooling device 8 and is at a low temperature. On the other hand, the heat medium flowing through the preheating heat medium supply pipe 61 is a mixture of the heated and cooled heat medium. Therefore, the temperature of the heat medium flowing through the preheating heat medium supply pipe 61 is higher than the temperature of the heat medium flowing through the tank connecting pipe 20. In the preheating heat exchanger 60, the heat of the heat medium transported through the preheating heat medium supply pipe 61 is recovered by the heat medium flowing through the tank connecting pipe 20. As a result, the temperature of the heat medium flowing through the tank connecting pipe 20 rises, and then the heated heat medium flows into the heating side tank 15.

[0076] In this way, the preheating heat exchanger 60 can increase the temperature of the heat medium flowing from the cooling side tank 16 to the heating side tank 15 without using external energy. Since the temperature of the heat medium in the heating side tank 15 is prevented from dropping too much, the load on the heating device 7 can be reduced, and the heat medium supply device 1 can precisely control the temperature of the heat medium to be supplied to the semiconductor manufacturing device 2.

[0077] The branch point B2 of the preheating heat medium supply pipe 61, where it branches off from the cooling-side return pipe 26, is located upstream of the cooling device 8. This branch point supplies the heat medium to the preheating heat exchanger 60 before it is cooled by the cooling device 8. The connection point C2 between the preheating heat medium return pipe 62 and the cooling-side return pipe 26 is also located upstream of the cooling device 8. The heat medium after passing through the preheating heat exchanger 60 is supplied to the cooling device 8 via the preheating heat medium return pipe 62 and the cooling-side return pipe 26. The branch point B2 is located upstream of the connection point C2.

[0078] The hot medium flowing through the preheating hot medium return pipe 62 has been cooled by the heat loss through the preheating heat exchanger 60. Therefore, the hot medium passing through the preheating hot medium return pipe 62 is sent to the cooling device 8 at a lower temperature and is further cooled by the cooling device 8. Since the temperature of the heat medium that has lost heat has been reduced, the load on the cooling device 8 is reduced, thus achieving energy saving.

[0079] The operation control unit 35 is configured to open the preheating supply valve 65 during the opening of the connecting valve 21. During the opening of the connecting valve 21, the preheating supply valve 65 is opened, and the heat medium from the semiconductor manufacturing apparatus 2 is supplied to the preheating heat exchanger 60. Therefore, the heat medium flowing through the tank connecting pipe 20 is heated by the preheating heat exchanger 60. As a result, the low-temperature heat medium in the cooling side tank 16 is prevented from directly moving to the high-temperature side tank.

[0080] The heat medium supply device 1 further includes: a cooling-side return temperature measuring device 67 located upstream of the cooling device 8 in the cooling-side return pipe 26; and a connection temperature measuring device 52 located in the tank connection pipe 20. The connection temperature measuring device 52 is disposed between the cooling-side tank 16 and the connection valve 21. The cooling-side return temperature measuring device 67 and the connection temperature measuring device 52 are electrically connected to the operation control unit 35. The measured values ​​of the temperature of the heat medium in the cooling-side return pipe 26, measured by the cooling-side return temperature measuring device 67, and the measured values ​​of the temperature of the heat medium in the tank connection pipe 20, measured by the connection temperature measuring device 52, are sent to the operation control unit 35. The operation control unit 35 is configured to open the connection valve 21 and the preheating supply valve 65 when the temperature of the heat medium in the cooling-side return pipe 26 is higher than the temperature of the heat medium in the tank connection pipe 20.

[0081] During a certain stage of the manufacturing process performed using the semiconductor manufacturing apparatus 2, the heat transfer medium is cooled by the semiconductor manufacturing apparatus 2. When the heat transfer medium through the semiconductor manufacturing apparatus 2 is at a low temperature, it cannot heat the heat transfer medium flowing through the tank connecting pipe 20, and the heat transfer medium flowing through the tank connecting pipe 20 cannot recover heat from the heat transfer medium through the semiconductor manufacturing apparatus 2. Therefore, when the temperature of the heat transfer medium in the cooling-side return pipe 26 is higher than the temperature of the heat transfer medium in the tank connecting pipe 20, the operation control unit 35 opens the connecting valve 21 and the preheating supply valve 65. Through this operation, the heat transfer medium through the semiconductor manufacturing apparatus 2 can heat the heat transfer medium flowing through the tank connecting pipe 20, and the heat transfer medium flowing through the tank connecting pipe 20 can recover heat from the heat transfer medium through the semiconductor manufacturing apparatus 2.

[0082] Figure 3In the illustrated embodiment, the preheating supply valve 65 is located on the preheating heat medium return pipe 62. However, in one embodiment, the preheating supply valve 65 may also be located on the preheating heat medium supply pipe 61. For example, the preheating supply valve 65 may also be located at the bifurcation point B2 where the preheating heat medium supply pipe 61 branches off from the cooling side return pipe 26. In this configuration, when the preheating supply valve 65 is opened, the preheating heat medium supply pipe 61 is connected to the cooling side return pipe 26, resulting in at least a portion of the heat medium flowing through the cooling side return pipe 26 flowing into the preheating heat medium supply pipe 61. When the preheating supply valve 65 is closed, the connection between the preheating heat medium supply pipe 61 and the cooling side return pipe 26 is blocked. As a result, the supply of heat medium through the preheating heat medium supply pipe 61 to the preheating heat exchanger 60 is stopped.

[0083] Figure 4 This is a schematic diagram illustrating another embodiment of the heat medium supply device 1. Unless otherwise specified, the configuration and operation of this embodiment are similar to those described above. Figure 3 The implementation methods described are the same, so repeated descriptions are omitted. Figure 4 In the embodiment shown, the preheating supply valve 65 provided in the preheating heat medium return pipe 62 is a two-way valve (on / off valve). The preheating supply valve 65 is an actuator-driven valve such as an electric valve.

[0084] The heat medium supply device 1 includes a cooling-side flow restriction device 75 located on the cooling-side return pipe 26. The cooling-side flow restriction device 75 is positioned upstream of the cooling device 8. More specifically, the cooling-side flow restriction device 75 is located downstream of the bifurcation point B2 where the preheating heat medium supply pipe 61 branches off from the cooling-side return pipe 26, and upstream of the connection point C2 between the preheating heat medium return pipe 62 and the cooling-side return pipe 26.

[0085] The cooling-side flow limiting device 75 is configured to limit the flow rate of the hot medium flowing through the cooling-side return pipe 26. Specific examples of the cooling-side flow limiting device 75 include orifices, flow regulating valves, etc. A portion of the hot medium flowing through the cooling-side return pipe 26 is transported to the preheating heat exchanger 60 via the preheating heat medium supply pipe 61, and the remaining portion of the hot medium flowing through the cooling-side return pipe 26 is transported to the cooling device 8 via the cooling-side flow limiting device 75.

[0086] In this embodiment, the preheating heat exchanger 60 can also increase the temperature of the heat medium flowing from the cooling side tank 16 toward the heating side tank 15 without using external energy. Furthermore, the heat medium whose heat has been removed by the preheating heat exchanger 60 is sent to the cooling device 8 and cooled by it. Since the temperature of the heat medium that has had its heat removed has been reduced, the load on the cooling device 8 is reduced, thus achieving energy savings.

[0087] Figure 4In the illustrated embodiment, the preheating supply valve 65 is located in the preheating heat medium return pipe 62. However, in one embodiment, the preheating supply valve 65 may also be located in the preheating heat medium supply pipe 61. In this configuration, when the preheating supply valve 65 is opened, the preheating heat medium supply pipe 61 is connected to the cooling side return pipe 26. As a result, at least a portion of the heat medium flowing through the cooling side return pipe 26 flows into the preheating heat medium supply pipe 61. When the preheating supply valve 65 is closed, the connection between the preheating heat medium supply pipe 61 and the cooling side return pipe 26 is blocked. As a result, the supply of heat medium through the preheating heat medium supply pipe 61 to the preheating heat exchanger 60 is stopped.

[0088] Figure 5 It represents a combination Figure 1 The implementation methods shown are the same as Figure 3 A schematic diagram of one embodiment of the heat medium supply device 1 shown in the figure. Figure 5 The heat medium supply device 1 of the illustrated embodiment includes: a precooling heat exchanger 40 for cooling the heat medium flowing from the heating side tank 15 toward the cooling side tank 16 through the tank connecting pipe 20; and a preheating heat exchanger 60 for heating the heat medium flowing from the cooling side tank 16 toward the heating side tank 15 through the tank connecting pipe 20. Other configurations of this embodiment, unless otherwise specified, are not included in this description. Figure 1 and Figure 3 The implementation methods shown are the same, so repeated descriptions are omitted.

[0089] The embodiment equipped with the precooling heat exchanger 40 and the preheating heat exchanger 60 can reduce thermal fluctuations in the heating side tank 15 and the cooling side tank 16 as the heat medium moves, and can reduce the load on both the heating device 7 and the cooling device 8.

[0090] Reference Figure 2 The description includes the heating-side flow limiting device 55 and reference. Figure 4 The cooling-side flow limiting device 75 described above can also be applied to... Figure 5 The embodiment shown. The precooling supply valve 45 may also be provided on the precooling hot medium supply pipe 41. The preheating supply valve 65 may also be provided on the preheating hot medium supply pipe 61.

[0091] Figure 6 This is a schematic diagram illustrating another embodiment of a semiconductor manufacturing system including a heat transfer medium supply device 1 and multiple semiconductor manufacturing devices 2. The heat transfer medium supply device 1 is referenced from... Figures 1 to 5 The heat medium supply device 1 of any of the described embodiments. For example... Figure 6As shown, the heat medium supply device 1 is connected to multiple semiconductor manufacturing apparatuses 2 via multiple heat medium mixing devices 5. More specifically, the heating medium delivery pipe 11, cooling medium delivery pipe 12, heating-side return pipe 25, and cooling-side return pipe 26 of the heat medium supply device 1 are each connected to multiple semiconductor manufacturing apparatuses 2 via multiple heat medium mixing devices 5. The heat medium supply device 1 of this embodiment can adjust the processing temperature of the multiple semiconductor manufacturing apparatuses 2.

[0092] The above embodiments are described with the aim of enabling those skilled in the art to implement the present invention. It will be apparent to those skilled in the art that various modifications of the above embodiments can be made, and the technical concept of the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is interpreted as being within the broadest scope of the technical concept as defined in the claims.

[0093] Industrial availability

[0094] This invention can be used to supply a heat medium supply device for semiconductor manufacturing equipment, such as etching equipment, CVD equipment, and PVD equipment, to the semiconductor manufacturing equipment.

[0095] Explanation of reference numerals in the attached figures

[0096] 1: Heat medium supply device

[0097] 2: Semiconductor manufacturing equipment

[0098] 5: Heat medium mixing device

[0099] 7: Heating device

[0100] 8: Cooling device

[0101] 11: Heating medium delivery pipe

[0102] 12: Cooling medium delivery pipe

[0103] 15: Heating side groove

[0104] 16: Cooling side groove

[0105] 20: Channel connecting pipe

[0106] 21: Connecting valve

[0107] 25: Heating side return pipe

[0108] 26: Cooling side return pipe

[0109] 17: Gas layer connecting pipe

[0110] 31: Heating side liquid level detection device

[0111] 32: Cooling side liquid level detection device

[0112] 33: Heating side pump

[0113] 34: Cooling side pump

[0114] 35: Motion Control Department

[0115] 40: Precooling heat exchanger

[0116] 41: Precooling hot medium supply pipe

[0117] 42: Precooling hot medium return pipe

[0118] 45: Pre-cooling supply valve

[0119] 47: Heating side reflux temperature measuring instrument

[0120] 51, 52: Connecting temperature measuring device

[0121] 55: Heating side flow restriction device

[0122] 60: Preheating heat exchanger

[0123] 61: Preheating heat medium supply pipe

[0124] 62: Preheating heat medium return pipe

[0125] 65: Preheating supply valve

[0126] 67: Cooling side return flow temperature measuring instrument

[0127] 75: Cooling side flow restriction device

[0128] B1, B2: Bifurcation points

[0129] C1, C2: Connection points.

Claims

1. A heat medium supply device for supplying a heat medium used to regulate the temperature of a semiconductor manufacturing apparatus, characterized in that, have: Heating device, which heats the heat medium; Cooling device for cooling the heat medium; A heating medium delivery pipe delivers the heated medium to the semiconductor manufacturing apparatus; A cooling medium delivery pipe delivers the cooled heat medium to the semiconductor manufacturing apparatus; Heating and cooling side tanks are used to maintain the heat medium. A connecting pipe connects the heating side tank and the cooling side tank; A heating-side return pipe allows the thermal medium passing through the semiconductor manufacturing apparatus to return to the heating-side tank. A cooling-side return pipe allows the thermal medium passing through the semiconductor manufacturing apparatus to return to the cooling-side tank. A precooling heat exchanger, connected to the tank connecting pipe, cools the heat medium flowing through the tank connecting pipe from the heating side tank toward the cooling side tank; A precooling heat medium supply pipe branches off from the heating-side return pipe and extends to the precooling heat exchanger; and A precooling heat medium return pipe extends from the precooling heat exchanger and connects to the heating-side return pipe; The heating device is located in the heating-side return pipe and is configured to heat the heat medium flowing through the heating-side return pipe; The branching point of the precooling heat medium supply pipe from the heating side return pipe is located on the upstream side of the heating device, which is configured to supply the heat medium to be heated by the heating device to the precooling heat exchanger. The connection point between the precooling heat medium return pipe and the heating side return pipe is located on the upstream side of the heating device, which is configured to supply the heat medium passing through the precooling heat exchanger to the heating device through the heating side return pipe; The precooling heat exchanger is configured to exchange heat between the heat medium flowing from the heating side tank toward the cooling side tank through the tank connecting pipe and the heat medium supplied through the precooling heat medium supply pipe.

2. The heat medium supply device according to claim 1, wherein, Further features include: A connecting valve is provided in the groove connecting pipe; A precooling supply valve is provided on the precooling hot medium return pipe or the precooling hot medium supply pipe; and The action control unit controls the operation of the connecting valve and the precooling supply valve; The action control unit is configured to open the precooling supply valve during the opening of the connecting valve.

3. The heat medium supply device according to claim 2, wherein, Further features include: A heating-side return temperature measuring device is disposed upstream of the heating device on the heating-side return pipe; and A connected temperature measuring device is installed in the groove connecting pipe; The action control unit is configured to open the connecting valve and the precooling supply valve when the temperature of the heat medium in the heating side return pipe, as measured by the heating side return temperature measuring device, is lower than the temperature of the heat medium in the tank connecting pipe, as measured by the connecting temperature measuring device.

4. The heat medium supply device according to claim 1, wherein, Further features include: A preheating heat exchanger is connected to the tank connecting pipe and heats the heat medium flowing through the tank connecting pipe from the cooling side tank toward the heating side tank; The preheating heat medium supply pipe branches off from the cooling-side return pipe and extends to the preheating heat exchanger; and A preheating heat medium return pipe extends from the preheating heat exchanger and connects to the cooling side return pipe; The cooling device is located in the cooling-side return pipe and is configured to cool the heat medium flowing through the cooling-side return pipe; The branching point of the preheating heat medium supply pipe from the cooling side return pipe is located on the upstream side of the cooling device, which is configured to supply the heat medium to the preheating heat exchanger before it is cooled by the cooling device. The connection point between the preheating heat medium return pipe and the cooling side return pipe is located on the upstream side of the cooling device, which is configured to supply the heat medium passing through the preheating heat exchanger to the cooling device through the cooling side return pipe; The preheating heat exchanger is configured to exchange heat between the heat medium flowing from the cooling side tank toward the heating side tank through the tank connecting pipe and the heat medium supplied through the preheating heat medium supply pipe.

5. The heat medium supply device according to claim 1, wherein, The semiconductor manufacturing apparatus comprises multiple semiconductor manufacturing apparatuses; The heating medium delivery pipe, the cooling medium delivery pipe, the heating-side return pipe, and the cooling-side return pipe are respectively connected to the plurality of semiconductor manufacturing devices.

6. A heat medium supply device for supplying a heat medium used to regulate the temperature of a semiconductor manufacturing apparatus, characterized in that, have: Heating device, which heats the heat medium; Cooling device for cooling the heat medium; A heating medium delivery pipe delivers the heated medium to the semiconductor manufacturing apparatus; A cooling medium delivery pipe delivers the cooled heat medium to the semiconductor manufacturing apparatus; Heating and cooling side tanks are used to maintain the heat medium. A connecting pipe connects the heating side tank and the cooling side tank; A heating-side return pipe allows the thermal medium passing through the semiconductor manufacturing apparatus to return to the heating-side tank. A cooling-side return pipe allows the thermal medium passing through the semiconductor manufacturing apparatus to return to the cooling-side tank. A preheating heat exchanger, connected to the tank connecting pipe, heats the heat medium flowing from the cooling side tank toward the heating side tank through the tank connecting pipe; The preheating heat medium supply pipe branches off from the cooling-side return pipe and extends to the preheating heat exchanger; and A preheating heat medium return pipe extends from the preheating heat exchanger and connects to the cooling side return pipe; The cooling device is located in the cooling-side return pipe and is configured to cool the heat medium flowing through the cooling-side return pipe. The branching point of the preheating heat medium supply pipe from the cooling side return pipe is located on the upstream side of the cooling device, which is configured to supply the heat medium to the preheating heat exchanger before it is cooled by the cooling device. The connection point between the preheating heat medium return pipe and the cooling side return pipe is located on the upstream side of the cooling device, which is configured to supply the heat medium passing through the preheating heat exchanger to the cooling device through the cooling side return pipe; The preheating heat exchanger is configured to exchange heat between the heat medium flowing from the cooling side tank toward the heating side tank through the tank connecting pipe and the heat medium supplied through the preheating heat medium supply pipe.

7. The heat medium supply device according to claim 6, wherein, Further features include: A connecting valve is provided in the groove connecting pipe; A preheating supply valve is provided in the preheating heat medium return pipe or the preheating heat medium supply pipe; and The action control unit controls the operation of the connecting valve and the preheating supply valve; The action control unit is configured to open the preheating supply valve during the opening of the connecting valve.

8. The heat medium supply device according to claim 7, wherein, Further features include: A cooling-side return flow temperature measuring device is disposed upstream of the cooling device on the cooling-side return flow pipe; and A connected temperature measuring device is installed in the groove connecting pipe; The action control unit is configured to open the connecting valve and the preheating supply valve when the temperature of the heat medium in the cooling side return pipe, as measured by the cooling side return temperature measuring device, is higher than the temperature of the heat medium in the tank connecting pipe, as measured by the connecting temperature measuring device.

9. The heat medium supply device according to claim 6, wherein, Further features include: A precooling heat exchanger is connected to the tank connecting pipe and cools the heat medium flowing through the tank connecting pipe from the heating side tank toward the cooling side tank; A precooling heat medium supply pipe branches off from the heating-side return pipe and extends to the precooling heat exchanger; and A precooling heat medium return pipe extends from the precooling heat exchanger and connects to the heating-side return pipe; The heating device is located in the heating-side return pipe and is configured to heat the heat medium flowing through the heating-side return pipe; The branching point of the precooling heat medium supply pipe from the heating side return pipe is located on the upstream side of the heating device, which is configured to supply the heat medium to be heated by the heating device to the precooling heat exchanger. The connection point between the precooling heat medium return pipe and the heating side return pipe is located on the upstream side of the heating device, which is configured to supply the heat medium passing through the precooling heat exchanger to the heating device through the heating side return pipe; The precooling heat exchanger is configured to exchange heat between the heat medium flowing from the heating side tank toward the cooling side tank through the tank connecting pipe and the heat medium supplied through the precooling heat medium supply pipe.

10. The heat medium supply device according to claim 6, wherein, The semiconductor manufacturing apparatus comprises multiple semiconductor manufacturing apparatuses; The heating medium delivery pipe, the cooling medium delivery pipe, the heating-side return pipe, and the cooling-side return pipe are respectively connected to the plurality of semiconductor manufacturing devices.

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