Distributed photon synaptic arithmetic unit multilayer microcrack optical waveguide carrying integration process
By employing machine vision for precise alignment, dynamic weight matching, and layered dispensing and gradient curing processes, combined with quartz fiber-plastic fiber composite transition connections, the problems of low assembly precision and performance degradation caused by internal stress in traditional optoelectronic devices have been solved. This has enabled the integration of high-precision, low-stress photonic devices, improving the yield and consistency of finished products.
Patent Information
- Application Number
- CN202610865934.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-06-16
- Publication Date
- 2026-07-24
AI Technical Summary
Traditional optoelectronic devices have low assembly precision. The internal stress generated by the curing of the colloid can easily compress microcracks in the optical path, leading to performance degradation or failure. Furthermore, conventional processes cannot match the optical path weight requirements at different sites, resulting in poor performance consistency of the integrated devices.
By employing machine vision for precise alignment, dynamic weight matching, and layered dispensing and gradient curing, combined with a quartz fiber-plastic fiber composite transition connection structure, high-precision assembly and low-stress integration are achieved. Visual alignment identifies positioning marks, and optical path performance is monitored in real time. Layered dispensing gradually releases curing stress, and gradient curing reduces internal stress impact.
It significantly improves the assembly yield and performance consistency of multilayer microcracked optical waveguides, with an optical path performance attenuation rate of less than 5% and an assembly yield of over 90%, making it suitable for high-precision and high-reliability photonic device integration.