Reinforced electromagnetic wave-absorbing plate
By designing a "wave-shaped" structure and bumps on the wave inlet hole of the wave absorber plate, and combining the design of the wave absorber plate and the heat dissipation plate, the problem of reducing the wave absorbing effect caused by the wave inlet hole when the thickness of the wave absorber plate is the same, and a more efficient electromagnetic wave absorption and heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202420776018.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-04-15
AI Technical Summary
The cylindrical inlet holes on the wave absorbing plate of the same thickness lead to a short trajectory of electromagnetic wave reflection, which easily makes the wave absorbing plate saturated and reduces the wave absorbing effect.
The wave inlet hole of the wave absorbing motherboard is designed as a "wavy shape", and multiple bumps are fixedly connected on the inside to form an irregular and rough surface structure. At the same time, the wave absorbing secondary plate and the heat dissipation plate are fixedly connected on the side of the wave absorbing motherboard, and a heat conduction hole and a heat conduction rod are provided on the side of the heat dissipation plate to improve the heat dissipation effect.
Through the design of "wave-shaped" wave inlet holes and bumps, the reflection path of electromagnetic waves is extended, energy loss is increased, the absorption effect is improved, and the upper saturation limit of the absorber motherboard is increased through the heat dissipation structure, solving the problem that the absorber plate is easily in a saturated state.