PCB component and wire controller

By setting heat dissipation structures and housing ventilation holes on the PCB components of the online controller, the problem of temperature sensors being affected by heat-generating devices is solved, improving the accuracy and stability of temperature measurement and ensuring the precision of air conditioner temperature regulation.

CN223515088UActive Publication Date: 2025-11-04MIDEA SMART TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422225457.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-10
Publication Date
2025-11-04
Estimated Expiration
2034-09-10

AI Technical Summary

Technical Problem

The temperature sensor in the wired controller is easily affected by surrounding heat-generating devices, causing the measured value to deviate from the actual value and affecting the measurement accuracy.

Method used

A heat dissipation structure, including first and second heat sinks, is provided on the PCB components to reduce heat transfer between the temperature sensor and the heat-generating device. Ventilation holes are also provided on the housing to promote air circulation and maintain the measurement stability and accuracy of the temperature sensor.

Benefits of technology

This effectively reduces thermal interference from heating devices on the temperature sensor, improves measurement accuracy, makes the ambient temperature measured by the temperature sensor closer to the actual value, and enhances the temperature regulation accuracy of the wired controller.

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Abstract

The utility model relates to the technical field of wire controllers, and provides a PCB component and a wire controller, the PCB component comprises a board body, and the board body is provided with a temperature sensor and a plurality of heating devices; wherein the plate body is provided with a heat dissipation structure, and the heat dissipation structure is used for reducing heat transfer between the temperature sensor and the plurality of heating devices. The heat dissipation structure is arranged on the plate body, heat transfer between the temperature sensor and the heating device can be effectively reduced through the heat dissipation structure, the temperature sensor can be prevented from being affected by the heating device, heat interference of the heating device on the temperature sensor can be reduced, and the measurement accuracy and stability of the temperature sensor can be kept; the environment temperature measured by the temperature sensor is closer to reality, and the measurement precision of the temperature sensor is improved.
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