Prime-coat-free high-heat-dissipation portable potting inductor

By using a self-adhesive potting structure and heat sink design, the primerless, high-heat-dissipation, and convenient potting inductor solves the problems of reduced production efficiency and high costs associated with applying primer, achieving efficient production and stable heat dissipation.

CN223526959UActive Publication Date: 2025-11-07ANHUI NENGQI ELECTRIC TECH CO LTD
0 Cites 0 Cited by

Patent Information

Application Number
CN202422926315.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-11-07
Estimated Expiration
2034-11-29

AI Technical Summary

Technical Problem

The existing potted inductors suffer from high production costs due to the need to apply a primer during the production process, which affects production efficiency and requires reapplication because the primer has a short effective time.

Method used

It adopts a self-adhesive potting structure and heat sink design. The self-adhesive potting structure is formed by directly pouring in adhesive potting material, which is combined with the heat sink to form an air duct, avoiding the need to apply a primer, improving production efficiency and reducing costs.

Benefits of technology

It achieves high production efficiency and low cost without the need for primer, while quickly removing heat through the air duct to maintain the stability and heat dissipation capacity of the inductor structure.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The utility model discloses a prime-coat-free high-heat-dissipation portable potting inductor which comprises a shell, an inductor structure, a first heat dissipation layer, a second heat dissipation layer and a third heat dissipation layer. The shell is internally provided with a containing cavity, and the containing cavity is internally provided with the inductor structure; the self-adhesion encapsulation structure is arranged between the inductor structure and the shell; and the multiple heat dissipation plates are installed at the bottom of the shell at intervals, and an air channel is formed between every two adjacent heat dissipation plates. In the production process, the encapsulating material with viscosity is directly poured to form the self-adhesive encapsulating structure, the self-adhesive encapsulating structure has viscosity, and it is ensured that strong cohesive force exists between the self-adhesive encapsulating structure and the shell, so that the stability of the self-adhesive encapsulating structure is ensured, a primer does not need to be brushed, the production efficiency is high, and the production cost is low. The two adjacent heat dissipation plates and the bottom of the shell define the air channel, cold air rapidly takes away heat on the shell when passing through the air channel, stable work of the shell is maintained, and the situation that the temperature of an internal inductor structure area is too high due to insufficient heat dissipation capacity of the shell is avoided.
Need to check novelty before this filing date? Find Prior Art