Microfluidic chip
By introducing a silicon dioxide layer as an intermediate bonding layer in a microfluidic chip, the problem of direct bonding between PDMS prepolymer cover sheets and metal film substrates is solved, achieving a stable bonding effect that is suitable for biomedical and bioanalysis applications and is resistant to high-temperature processing.
CN223875071UActive Publication Date: 2026-02-06SHENZHEN UNIV
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Patent Information
- Application Number
- CN202422845426.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2034-11-20
AI Technical Summary
Technical Problem
Direct bonding between PDMS prepolymer cover sheets and metal film substrates is difficult, resulting in weak adhesion and affecting chip structure stability and sealing performance.
Method used
A silica layer is introduced between the substrate and the cover plate as an intermediate bonding layer, and stable bonding is achieved by utilizing the good bonding ability of silica with the metal film and PDMS prepolymer.
Benefits of technology
It provides long-term stable bonding, enhances the structural stability and sealing of the chip, is suitable for biomedical and bioanalysis, and is non-toxic to biological samples and resistant to high-temperature processing.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model relates to the technical field of cell sorting and detection, in particular to a micro-fluidic chip. The micro-fluidic chip comprises a substrate, a micro-fluidic chip, a micro-fluidic chip and a micro-fluidic chip, wherein a metal film layer is arranged on the substrate; the cover plate is at least provided with a micro-channel; the intermediate bonding layer is located between the substrate and the cover plate and covers the metal film layer; wherein the cover plate is a PDMS (Polydimethylsiloxane) prepolymer cover plate; the intermediate bonding layer is a silicon dioxide layer. According to the utility model, the problem that the PDMS prepolymer cover plate and the metal film layer substrate are difficult to directly bond can be solved.
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