Circuit board with built-in heat dissipation diversion structure

By incorporating a heat dissipation and flow guiding structure and a connection protection design, the problem of insufficient heat dissipation and connection protection of the circuit board in high-temperature environments is solved, achieving efficient heat dissipation and reinforced protection, thereby improving the reliability and lifespan of the circuit board.

CN224290163UActive Publication Date: 2026-05-26DIGITAL PRINTED CIRCUIT BOARD CO LTD
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Patent Information

Application Number
CN202521578754.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-07-28
Publication Date
2026-05-26
Estimated Expiration
2035-07-28

AI Technical Summary

Technical Problem

Existing circuit boards have insufficient heat dissipation capacity in high-temperature environments, which may lead to component failure, signal distortion or fire risk, and lack effective connection protection and reinforcement measures.

Method used

A circuit board with a built-in heat dissipation and airflow guiding structure was designed. The combination of copper heat-conducting strips, heat dissipation base, airflow guiding pipe, heat dissipation fin seat and heat dissipation fan realizes the effective transfer and dissipation of heat. The combination structure of transparent protective plate, sealing ring and protective ring provides connection protection. The PTFE layer and ceramic filling layer inside the circuit board enhance mechanical strength and protection function.

Benefits of technology

It achieves efficient heat dissipation and airflow, reduces the risk of dust and water ingress, and improves the reliability and lifespan of the circuit board, especially significantly improving the performance and reliability of the circuit board in harsh environments.

✦ Generated by Eureka AI based on patent content.
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Abstract

The utility model relates to the technical field of circuit boards, and discloses a circuit board with a built-in heat dissipation flow guide structure, which comprises a circuit board body, a copper heat conduction strip is embedded in the circuit board body, the front end of the circuit board body is connected with a heat dissipation base, the outside of the heat dissipation base is connected with a flow guide pipe, and the flow guide pipe is connected with the heat dissipation base. The front end of the flow guide pipe is connected with a heat dissipation fin base, a heat dissipation fan is installed on the top of the heat dissipation fin base, a connector is installed on the left side of the circuit board body, and a CPU module is installed at the front end of the circuit board body. According to the utility model, through the arrangement of the heat dissipation flow guide structure, the heat dissipation base is contacted with the intersection of the copper heat conduction strips embedded in the circuit board body during use, then the heat is transferred to the flow guide pipe and the heat dissipation fin seat through the heat dissipation base during the operation of the circuit board body, and then the heat is dissipated by starting the heat dissipation fan. And the heat on the heat dissipation fin seat is transmitted out through the heat dissipation fan, so that the heat dissipation and flow guide functions are realized.
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