Integrated circuit board and electromagnetic test device

Abstract

The utility model provides a kind of integrated circuit board, comprising: electrically conductive patch group, measured integrated circuit, drive circuit and circuit;Measured integrated circuit and drive circuit are respectively arranged on the first surface and the second surface of circuit board;Drive circuit connects the drive end of integrated circuit;Measured integrated circuit is arranged on the working area of first surface, and electrically conductive patch group is arranged at the magnetic flux leakage of first shielding area of first surface, and / or the magnetic flux leakage of second shielding area.The utility model also provides a kind of electromagnetic testing device, comprising: integrated circuit board and electromagnetic wave chamber, integrated circuit board is based on first shielding area and is arranged on the test window of electromagnetic wave chamber.The utility model can well exclude the interference of electromagnetic noise, and utilize the easily obtained advantages of electrically conductive patch, save time and cost, without affecting the original working state of measured integrated circuit.

Description

Technical Field

[0001] This utility model relates to the field of electromagnetic testing, and in particular to an integrated circuit board and an electromagnetic testing device. Background Technology

[0002] The development of new energy vehicles has promoted low-carbon and environmentally friendly transportation, but the resulting electromagnetic interference has become a major challenge to vehicle safety. This is because electromagnetic radiation can affect the stable operation of electronic devices inside the vehicle, thereby impacting the driving experience and safety. To ensure the stability and safety of the vehicle's internal systems, reliability testing of integrated circuits in the vehicle's components is crucial. The Automotive Electronics Industry Association (AECQ-100) standard reliability verification regulations include a section on electromagnetic interference (EMC) testing, with reliability verification referencing the SAE J1752-3 standard. If the products of automotive manufacturers' integrated circuit suppliers pass this verification test, it not only certifies the products but also provides assurance for the reliability and safety of new energy vehicles.

[0003] In electromagnetic interference (EMC) testing, the complete working circuit of the integrated circuit under test must first be placed in a transverse electromagnetic wave chamber. The ambient values ​​are measured with the integrated circuit in a non-powered state (i.e., without power). At this point, the ambient value should be less than the minimum level of 6 dBuV. If it exceeds this level, the cause of the exceedance must be identified, or the hardware must be redesigned until it meets the requirements before proceeding with subsequent experiments to avoid affecting the final test result. However, due to the highly complex internal electronic circuitry of integrated circuits, both redesigning the hardware and identifying the cause and location of electromagnetic noise leakage are extremely time-consuming and labor-intensive.

[0004] Therefore, how to design a convenient, fast, and effective electromagnetic shielding device for integrated circuits has become one of the problems that urgently needs to be solved by those skilled in the art.

[0005] It should be noted that the above introduction to the technical background is only for the purpose of providing a clear and complete explanation of the technical solutions of this utility model and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background section of this utility model. Utility Model Content

[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide an integrated circuit board and an electromagnetic testing device to solve the problem of electromagnetic leakage of integrated circuit boards that cannot be effectively solved in the prior art.

[0007] To achieve the above and other related objectives, this utility model provides an integrated circuit board, which includes at least: a conductive patch group, an integrated circuit under test (ICD), a driving circuit, and a circuit board; the circuit board includes a first side and a second side, the first side being provided with a first shielding area, a second shielding area, and a working area, the first shielding area surrounding the second shielding area, and the second shielding area surrounding the working area; the ICD is disposed in the working area; the driving circuit is disposed on the second side and passes through the circuit board to connect to the driving terminal of the ICD; the conductive patch group is disposed on the first side and includes n conductive patches, where n is a natural number greater than or equal to 1, the conductive patches being attached to the magnetic leakage points of the first shielding area, and / or the conductive patches being attached from the magnetic leakage points of the second shielding area to the first shielding area.

[0008] Optionally, the first shielding area may be plated with gold, silver, copper, or aluminum.

[0009] Optionally, the magnetic leakage area on the first surface includes a significant defect, the significant defect being located in the first shielding area and / or the second shielding area, and the conductive patch being attached to the first significant defect.

[0010] Alternatively, when the obvious defect is located in the first shielding area, the conductive patch is applied to the obvious defect in the first shielding area; when the obvious defect is located in the second shielding area, the conductive patch is applied from the obvious defect in the second shielding area to the first shielding area; when the obvious defect is located in both the first and second shielding areas, the conductive patch is applied from the second shielding area to the first shielding area and covers the obvious defect.

[0011] Optionally, the conductive patch is any one of copper foil, aluminum foil, silver foil, or gold foil.

[0012] Optionally, the conductive patch group covers the first shielding area.

[0013] Optionally, the conductive patch group covers the second shielding area.

[0014] To achieve the above and other related objectives, this utility model also provides an electromagnetic testing device, which includes at least: an electromagnetic wave chamber and the integrated circuit board; the electromagnetic wave chamber includes a test window, the frame of which is grounded; a first shielding area of ​​the integrated circuit board is fixed on the frame of the test window, and the first surface of the integrated circuit board faces the electromagnetic wave chamber.

[0015] Optionally, a first positioning hole is provided on the first shielding area, and a second positioning hole is provided on the frame. The first positioning hole and the second positioning hole correspond one-to-one, and the integrated circuit board is fixed on the frame based on the first positioning hole and the corresponding second positioning hole.

[0016] Optionally, conductive adhesive is provided between the first shielding area and the frame, and the integrated circuit board is fixed to the frame based on the conductive adhesive.

[0017] As described above, the integrated circuit board and electromagnetic testing device of this utility model have the following beneficial effects:

[0018] 1. This utility model solves the problem of magnetic leakage of integrated circuit boards simply and quickly by placing conductive patches at the magnetic leakage points of the first shielding area and / or the second shielding area.

[0019] 2. This utility model achieves a good electromagnetic shielding effect by directly grounding all electromagnetic noise on the first shielding area during the testing process of the integrated circuit board through the contact between the first shielding area and the electromagnetic wave chamber test window, and by utilizing the good grounding capability of the test window.

[0020] 3. The conductive patch of this utility model is inexpensive and readily available, which can significantly reduce the cost of integrated circuits in electromagnetic interference experiments. Attached Figure Description

[0021] Figure 1 The diagram shown is a structural schematic of the integrated circuit board of this utility model.

[0022] Figure 2 The diagram shown is a schematic of the first side of the circuit board of this utility model.

[0023] Figure 3 This diagram shows a first configuration of the conductive patch of this invention.

[0024] Figure 4 This diagram shows a second configuration of the conductive patch according to the present invention.

[0025] Figure 5 This diagram shows a third configuration of the conductive patch according to the present invention.

[0026] Figure 6 The diagram shown is a schematic of the conductive patch of this invention in the first quadrant on the first surface.

[0027] Figure 7 The diagram shown is a schematic of the conductive patch of this invention in the second quadrant on the first surface.

[0028] Figure 8 The diagram shown is a schematic of the conductive patch of this invention in the third quadrant of the first surface.

[0029] Figure 9 The diagram shown is a schematic of the conductive patch of this invention in the fourth quadrant on the first surface.

[0030] Figure 10 This is a schematic diagram showing the first result of the electromagnetic radiation interference experiment.

[0031] Figure 11 This is a schematic diagram showing the second result of the electromagnetic radiation interference experiment.

[0032] Figure 12 This is a schematic diagram showing the third result of the electromagnetic radiation interference experiment.

[0033] Figure 13 This is a schematic diagram showing the fourth result of the electromagnetic radiation interference experiment.

[0034] Figure 14 This diagram shows a clear defect on an integrated circuit board.

[0035] Figure 15 This diagram shows the fourth configuration of the conductive patch of this invention.

[0036] Figure 16 The diagram shown is a structural schematic of the electromagnetic wave chamber of this utility model.

[0037] Figure 17 The diagram shown is a schematic of the first side of the integrated circuit board of this utility model.

[0038] Figure 18 The diagram shown is a schematic of the second side of the integrated circuit board of this utility model.

[0039] Component designation explanation

[0040] 1 Integrated Circuit Board

[0041] 11 Circuit Board

[0042] 12 Integrated Circuits Under Test

[0043] 13 Conductive Patch

[0044] 1a The first side of the circuit board

[0045] 1b The second side of the circuit board

[0046] 1c First shielding area of ​​the first side

[0047] 1d Second shielding area of ​​the first surface

[0048] 1e First side work area

[0049] 1f First positioning hole

[0050] 1g The obvious defect on the first side

[0051] 2 Electromagnetic wave chamber

[0052] 21. Border of the test window

[0053] 2a Second positioning hole Detailed Implementation

[0054] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0055] Please see Figures 1-18 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the illustrations only show the components related to this utility model and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0056] The integrated circuit board is mounted on the test window of the electromagnetic wave chamber, which conducts an electromagnetic radiation interference experiment on the integrated circuit board. The side of the integrated circuit board with the integrated circuit under test faces the electromagnetic wave chamber. When the integrated circuit board is qualified, the electromagnetic wave chamber can only receive electromagnetic wave signals from the integrated circuit under test, which are relatively weak. However, when the integrated circuit board is unqualified, such as due to design defects or quality problems, electromagnetic noise will enter the electromagnetic wave chamber. The electromagnetic wave chamber will detect high-intensity electromagnetic noise, and therefore the electromagnetic radiation interference test result of the integrated circuit board will be unqualified. In this case, it is necessary to troubleshoot the integrated circuit board to ensure that the electromagnetic radiation interference test result of the integrated circuit board is qualified. However, the circuit design of integrated circuit boards is intricate, and troubleshooting design defects or quality problems will consume a lot of time and effort.

[0057] The utility model avoids the troubleshooting problems of integrated circuits and is result-oriented. No matter what problems occur in the integrated circuit board, there will be electromagnetic wave noise on the surface of the integrated circuit under test on the integrated circuit board. As long as the electromagnetic wave noise on this surface is eliminated, the electromagnetic radiation interference test result of the integrated circuit board can be qualified, without spending a lot of time and effort to troubleshoot the reasons. The specific technical solution of the utility model is as follows:

[0058] Embodiment 1

[0059] As Figure 1 shown, this embodiment provides an integrated circuit board 1, including: a conductive patch group, an integrated circuit under test 12, a drive circuit, and a circuit board 11.

[0060] As Figure 1 shown, the circuit board 11 includes a first surface 1a and a second surface 1b. A first shielding area 1c, a second shielding area 1d, and a working area 1e are provided on the first surface 1a. The first shielding area 1c is arranged around the second shielding area 1d, and the second shielding area 1d is arranged around the working area 1e.

[0061] Specifically, in this embodiment, the integrated circuit under test 12 is arranged on the first surface 1a of the circuit board 11, and the drive circuit (not shown in the figure) is arranged on the second surface 1b of the circuit board 11, and the first surface 1a and the second surface 1b are opposite surfaces. As an example, the circuit board 11 selects a PCB board. Only the integrated circuit under test is provided on the first surface of the PCB board, and the second surface opposite to the first surface is used to specifically arrange the drive circuit for driving the integrated circuit under test. In practical applications, the specific types of the circuit board 11, the integrated circuit under test 12, and the drive circuit are selected according to needs, not limited to this embodiment. Further, as Figure 2 shown, the first shielding area 1c, the second shielding area 1d, and the working area 1e do not overlap with each other, and the second shielding area 1d is located outside the working area 1e and is adjacent to the working area 1e. The first shielding area 1c is located outside the second shielding area 1d and is adjacent to the second shielding area 1d. The complete continuous figure formed by the first shielding area 1c, the second shielding area 1d, and the working area 1e enables only the electromagnetic wave signal of the integrated circuit under test 12 provided on the working area 1e to exist on the first surface 1a. Furthermore, in order to exert the electromagnetic shielding function of the first and second shielding areas, the first shielding area 1c can be gold-plated, silver-plated, copper-plated, or aluminum-plated for grounding when contacting the electromagnetic wave chamber 2 later. The second shielding area 1d is directly grounded. In practical applications, the specific compositions of the first shielding area 1c and the second shielding area 1d are set according to needs, not limited to this embodiment.

[0062] As Figure 1 shown, the integrated circuit under test 12 is arranged in the working area 1e; the drive circuit is arranged on the second surface 1b and passes through the circuit board 11 to connect to the drive end of the integrated circuit under test 12.

[0063] Specifically, in this embodiment, the size of the working area 1e is set according to the size of the integrated circuit under test 12, that is, the outer side of the integrated circuit under test 12 is immediately adjacent to the second shielding area 1d, so electromagnetic noise should not be able to enter the electromagnetic wave chamber 2 through the first surface 1a of the circuit board 11. Furthermore, the integrated circuit under test 12 is the integrated circuit that needs to be tested in practical applications, and the driving circuit is the circuit that needs to drive the integrated circuit under test 12. In order not to affect the electromagnetic shielding function of the integrated circuit board 1, the driving circuit is connected to the driving terminal of the integrated circuit under test 12 through the inside of the circuit board 11. In practical applications, the specific integrated circuit under test 12 and driving circuit are selected as needed, which will not be described in detail here.

[0064] like Figure 1 As shown, the conductive patch group is disposed on the first surface 1a and includes n conductive patches 13, where n is a natural number greater than or equal to 1. The conductive patches 13 are attached to the magnetic leakage point of the first shielding area 1c, and / or the conductive patches 13 are attached from the magnetic leakage point of the second shielding area 1d to the first shielding area 1c.

[0065] Specifically, in this embodiment, the first shielding area 1c and the second shielding area 1d are disposed around the integrated circuit under test 12. Ideally, only the electromagnetic wave signal of the integrated circuit under test 12 should exist on the first surface 1a. However, due to magnetic leakage points on the first shielding area 1c and / or the second shielding area 1d, a conductive patch 13 needs to be attached to the magnetic leakage point on the first surface 1a to ensure that only the electromagnetic wave signal of the integrated circuit under test 12 exists on the first surface 1a. The integrated circuit under test 12 disposed on the working area 1e does not make electrical contact with the first and second shielding areas; that is, the electrical signal of the integrated circuit under test will not enter the first and second shielding areas, and the conductive patch 13 will not be attached to the integrated circuit under test 12 or the working area 1e to avoid affecting the operation of the integrated circuit under test 12. Furthermore, when the magnetic leakage point is located in the first shielding area 1c, such as... Figure 3 As shown, the conductive patch 13 is disposed on the first shielding area 1c and completely covers the leakage magnetic field on the first shielding area 1c. The conductive patch 13 can ground the electromagnetic wave noise at the leakage magnetic field of the first shielding area 1c using the electromagnetic wave chamber 2 in subsequent electromagnetic wave radiation experiments, avoiding interference with the electromagnetic wave signal of the integrated circuit under test; when the leakage magnetic field is located in the second shielding area, as... Figure 4 and Figure 5As shown, the conductive patch 13 is attached from the magnetic leakage point of the second shielding area 1d to the first shielding area 1c, completely covering the magnetic leakage point on the second shielding area 1d. The conductive patch 13 can ground the electromagnetic noise at the magnetic leakage point of the second shielding area 1d using the electromagnetic wave chamber 2 in subsequent electromagnetic radiation experiments, avoiding interference with the electromagnetic signal of the integrated circuit 12 under test. Furthermore, the number and size of the conductive patches 13 are set according to the specific magnetic leakage point on the first surface 1a. As an example, the conductive patches 13 can be any one of gold foil, aluminum foil, silver foil, or copper foil, and are not limited to this embodiment.

[0066] Specifically, in this embodiment, the location and size of the magnetic leakage point on the first surface 1a can be determined using an electromagnetic radiation experiment in the electromagnetic wave chamber 2, and the number and size of the conductive patches 13 can be set according to the experimental results. As an example, such as... Figure 6 , Figure 7 , Figure 8 , Figure 9 As shown, the first surface 1a is divided into first, second, third, and fourth quadrants based on its geometric center. Conductive patches 13 are sequentially placed in the first, second, third, and fourth quadrants of the first surface 1a. An electromagnetic radiation test experiment is conducted on the integrated circuit board 1 with conductive patches 13 attached to different quadrants of the first surface 1a using an electromagnetic wave chamber 2. This yields the number and location of quadrants with magnetic leakage on the first surface 1a. The position, number, and size of the conductive patches 13 can be determined based on the experimental results. In practical applications, the specific method for dividing the first surface 1a and the specific position, number, and size of the conductive patches 13 can be set as needed, and are not limited to this embodiment.

[0067] Specifically, in this embodiment, when there is a noticeable defect 1g on the first surface 1a, the conductive patch 13 can be directly attached to the noticeable defect 1g. Furthermore, the noticeable defect 1g on the first surface 1a refers to a location where no electromagnetic shielding design has been implemented. This location can be identified as a magnetic leakage point without requiring testing in the electromagnetic wave chamber 2, making it a noticeable defect compared to other magnetic leakage points that require electromagnetic wave chamber testing. Moreover, electromagnetic noise can easily enter the electromagnetic wave chamber 2 through the noticeable defect 1g, therefore the conductive patch 13 needs to be placed on the noticeable defect. Furthermore, when the obvious defect is located in the first shielding area 1c, the conductive patch 13 is attached to the obvious defect 1g in the first shielding area 1c and completely covers the obvious defect 1g in the first shielding area 1c; when the obvious defect 1g is located in the second shielding area 1d, the conductive patch 13 is attached from the obvious defect 1g in the second shielding area 1d to the first shielding area 1c and completely covers the obvious defect 1g in the second shielding area 1d; when the obvious defect 1g is located in both the first shielding area 1c and the second shielding area 1d, the conductive patch 13 is attached from the second shielding area 1d to the first shielding area 1c and completely covers the obvious defect 1g on the first surface. Furthermore, each leakage point on the first surface 1a can be covered by the same conductive patch 13 or by different conductive patches 13, depending on the actual situation, and no restrictions are imposed here.

[0068] Specifically, in this embodiment, since the main purpose of this utility model is to eliminate electromagnetic noise on the first surface without affecting the integrated circuit 12 under test, in order to further save time and effort, the conductive patch 13 can completely cover the first shielding area 1c and / or completely cover the second shielding area 1d. That is, there is no need to carefully search for the location of electromagnetic leakage on the first surface 1a. The conductive patch can be directly applied to the entire first shielding area 1c and / or the entire second shielding area 1d.

[0069] It should be noted that, as an example, such as Figure 10 As shown, the standard for electromagnetic radiation interference experiments is that the voltage intensity generated by the electromagnetic wave signal received by electromagnetic wave chamber 2 should not exceed 6 dBuV. However, due to defects in the integrated circuit board, there are 5 points of electromagnetic wave noise in the experimental results. By using the integrated circuit board 1 of this utility model and attaching the conductive patch 13 to the leakage magnetic field of the first surface 1a, it can be seen that, as Figure 11 As shown, the electromagnetic wave signal of the integrated circuit board 1 of this invention meets the experimental requirements in the electromagnetic radiation interference experiment. As another example, such as... Figure 12 As shown, the experimental standard remains that the voltage intensity generated by the electromagnetic wave signal received in electromagnetic wave chamber 2 should not exceed 6 dBuV. However, due to obvious defects on the first surface of the integrated circuit board, such as... Figure 13As shown, since the integrated circuit board is composed of two PCB boards spliced ​​together, there are two gaps at the splicing point of the PCB boards. Neither of the gaps has been electromagnetically shielded, resulting in two electromagnetic noise points in the experimental results. By using the integrated circuit board 1 of this utility model, as... Figure 14 As shown, the conductive patch 13 is attached to two obvious defects on the first surface 1a. It can be seen that, as Figure 15 As shown, the electromagnetic wave signal of the integrated circuit board 1 of this invention meets the experimental requirements in the electromagnetic radiation interference experiment. Therefore, this invention will not affect the normal working state of the integrated circuit 12 under test, and can also block other radiation interference sources outside the integrated circuit 12 under test. At the same time, it can quickly, economically and easily solve the problem of electromagnetic leakage, avoiding the need to redesign the hardware or troubleshoot the hardware step by step.

[0070] Example 2

[0071] like Figure 16 As shown, this embodiment provides an electromagnetic testing device, including: an electromagnetic wave chamber 2 and an integrated circuit board 1.

[0072] like Figure 16 As shown, the electromagnetic wave chamber 2 includes a test window, and the border 21 of the test window is grounded.

[0073] Specifically, in this embodiment, the electromagnetic wave chamber 2 can be used for electromagnetic compatibility testing, electromagnetic radiation interference experiments, and electromagnetic propagation characteristic research, and is a common electromagnetic field device; wherein, the test window of the electromagnetic wave chamber is used to place various devices to be tested, and the grounding of the test window frame 21 can shield the electromagnetic wave chamber 2 from external electromagnetic noise.

[0074] like Figure 16 As shown, the first shielding area 1c of the integrated circuit board 1 is fixed on the frame 21 of the test window, and the first surface 1a of the integrated circuit board 1 faces the electromagnetic wave chamber.

[0075] Specifically, in this embodiment, the first shielding area 1c is fixed to the frame 21 of the test window. Therefore, this invention can utilize the electromagnetic wave chamber 2 with good grounding function to divert and eliminate various electromagnetic wave noises on the first shielding area 1c. The first surface 1a of the integrated circuit board 1 faces the electromagnetic wave chamber. When the integrated circuit board 1 is mounted on the test window, the integrated circuit board 1 and the electromagnetic wave chamber 2 together form a sealed electromagnetic shielding device, allowing the electromagnetic wave chamber 2 to focus on testing the electromagnetic wave signal of the integrated circuit 12 under test. As an example, such as... Figure 17 and Figure 18 As shown, a first positioning hole 1f is provided on the first shielding area 1c, and the first positioning hole 1f penetrates the circuit board 11, as shown. Figure 14As shown, a second positioning hole 2a is provided on the frame 21 of the test window. Each first positioning hole 1f and each second positioning hole 2a corresponds one-to-one. The integrated circuit board 1 is fixed to the frame 21 based on the correspondence between the first positioning hole 1f and the corresponding second positioning hole 2a. The positioning holes ensure that the first shielding area 1c and the frame 21 are tightly joined together, preventing the entry of electromagnetic noise. As another example, conductive adhesive is provided between the first shielding area 1c and the frame 21 of the test window. The integrated circuit board 1 is fixed to the frame 21 based on the conductive adhesive. The conductive adhesive ensures that the first shielding area 1c and the frame 21 are tightly joined together, preventing the entry of electromagnetic noise. In practical applications, the specific fixing method of the first shielding area 1c and the frame 21 can be set as needed, and is not limited to this embodiment.

[0076] It should be noted that the integrated circuit board 1 used in this embodiment can be the integrated circuit board 1 of Embodiment 1, or any other integrated circuit board 1 that uses conductive patches to shield electromagnetic noise, and no specific restrictions are made here.

[0077] In summary, the integrated circuit board of this invention includes: a conductive patch group, an integrated circuit under test (ICP-UTC), a driving circuit, and a circuit; the ICP-UTC and the driving circuit are respectively disposed on the first and second sides of the board; the driving circuit is connected to the driving terminal of the ICP; the ICP-UTC is disposed on the working area of ​​the first side, and the conductive patch group is disposed at the leakage magnetic field of the first shielding area and / or the leakage magnetic field of the second shielding area of ​​the first side. The electromagnetic testing device of this invention includes: an integrated circuit board and an electromagnetic wave chamber, with the integrated circuit board disposed on the test window of the electromagnetic wave chamber based on the first shielding area. This invention can effectively eliminate electromagnetic noise interference and, by utilizing the readily available conductive patches, saves time and cost without affecting the original working state of the ICP-UTC. Therefore, this invention effectively overcomes the various shortcomings of the prior art and has high industrial application value.

[0078] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. An integrated circuit board, characterized in that, The integrated circuit board includes at least: a conductive patch group, an integrated circuit under test, a driving circuit, and a circuit board; The circuit board includes a first side and a second side. A first shielding area, a second shielding area and a working area are provided on the first side. The first shielding area surrounds the second shielding area, and the second shielding area surrounds the working area. The integrated circuit under test is located in the working area; The driving circuit is disposed on the second surface and passes through the circuit board to connect to the driving terminal of the integrated circuit under test; The conductive patch group is disposed on the first surface and includes n conductive patches, where n is a natural number greater than or equal to 1. The conductive patches are attached to the magnetic leakage point of the first shielding area, and / or the conductive patches are attached from the magnetic leakage point of the second shielding area to the first shielding area.

2. The integrated circuit board according to claim 1, characterized in that: The first shielding area is plated with gold, silver, copper or aluminum.

3. The integrated circuit board according to claim 1, characterized in that: The magnetic leakage area on the first surface includes a significant defect, which is located in the first shielding area and / or the second shielding area, and the conductive patch is attached to the first significant defect.

4. The integrated circuit board according to claim 3, characterized in that: When the obvious defect is located in the first shielding area, the conductive patch is attached to the obvious defect in the first shielding area; when the obvious defect is located in the second shielding area, the conductive patch is attached from the obvious defect in the second shielding area to the first shielding area. When the obvious defect is located in both the first shielding area and the second shielding area, the conductive patch is attached from the second shielding area to the first shielding area and covers the obvious defect.

5. The integrated circuit board according to claim 1, characterized in that: The conductive patch is any one of copper foil, aluminum foil, silver foil, or gold foil.

6. The integrated circuit board according to claim 1, characterized in that: The conductive patch group covers the first shielding area.

7. The integrated circuit board according to claim 1, characterized in that: The conductive patch group covers the second shielding area.

8. An electromagnetic testing device, characterized in that, The electromagnetic testing device includes at least: an electromagnetic wave chamber and an integrated circuit board as described in any one of claims 1-7; The electromagnetic wave chamber includes a test window, the border of which is grounded; The first shielding area of ​​the integrated circuit board is fixed on the frame of the test window, and the first surface of the integrated circuit board faces the electromagnetic wave chamber.

9. The electromagnetic testing device according to claim 8, characterized in that: The first shielding area is provided with a first positioning hole, and the frame is provided with a second positioning hole. The first positioning hole and the second positioning hole correspond one-to-one. The integrated circuit board is fixed on the frame based on the first positioning hole and the corresponding second positioning hole.

10. The electromagnetic testing device according to claim 8, characterized in that: A conductive adhesive is provided between the first shielding area and the frame, and the integrated circuit board is fixed to the frame based on the conductive adhesive.

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