High-strength copper-clad silicon nitride ceramic substrate

Abstract

This utility model discloses a high-strength copper-clad silicon nitride ceramic substrate, including a reinforced substrate and a copper foil layer. The invention utilizes a reinforced substrate, firstly coating the bottom surface of the assembly groove with an adhesive layer, then embedding a reinforcing frame into the inner side of the assembly groove and securing it with the adhesive layer, and finally welding a reinforcing base frame to the bottom edge of the reinforcing frame, thus fixing the reinforcing base frame to the bottom surface of the silicon nitride substrate to complete the assembly. By embedding a reinforcing frame along the edge of the silicon nitride substrate, the four-sided strength of the silicon nitride substrate is enhanced, making it less susceptible to damage from impacts. The reinforcing base frame, composed of vertically intersecting horizontal and vertical frames, resists bending pressure in two directions, enhancing the bending resistance of the silicon nitride substrate and effectively improving its structural strength to better meet market demands.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a high-strength copper-clad silicon nitride ceramic substrate. Background Technology

[0002] Silicon nitride ceramic substrates are circuit boards made of silicon nitride ceramic materials. They are mainly used for packaging power electronic devices and belong to the category of ceramic circuit boards. They are suitable for the heat dissipation requirements of high-power, high-frequency circuits.

[0003] Existing patent application number: CN202123179372.X, copper-clad silicon nitride substrate for power device modules, includes a silicon nitride ceramic substrate, a composite layer is coated on the silicon nitride ceramic substrate, a plurality of recesses are formed on the surface of the composite layer, a copper-clad film layer is coated on the upper surface of the composite layer, a copper plate layer is superimposed on the copper-clad film layer, and a bonding layer is provided between the copper plate layer and the copper-clad film layer.

[0004] The aforementioned patent describes a silicon nitride ceramic substrate. In the prior art, the substrate structure of silicon nitride ceramic substrate is relatively simple, and its bending and folding resistance is difficult to meet the requirements. On the basis of the existing technology, a reinforcing structure can be added to the substrate to further improve the structural strength of the substrate and better meet market demand. Utility Model Content

[0005] The purpose of this invention is to provide a high-strength copper-clad silicon nitride ceramic substrate to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a high-strength copper-clad silicon nitride ceramic substrate, comprising a reinforced substrate and a copper foil layer, wherein the reinforced substrate comprises a silicon nitride substrate, an assembly groove, an adhesive layer, a reinforcing frame, and a reinforcing base. The top edge of the silicon nitride substrate is provided with an assembly groove, the bottom surface of the assembly groove is coated with an adhesive layer, the reinforcing frame is embedded into the inner side of the assembly groove from top to bottom and is bonded and fixed to each other by the adhesive layer, the bottom surface of the silicon nitride substrate is fitted with a reinforcing base, and the reinforcing base is welded and fixed to the bottom edge of the reinforcing frame, and the entire surface of the reinforced substrate is covered with a copper foil layer.

[0007] Preferably, the width of the assembly groove is 4-10mm.

[0008] Preferably, the shape and size of the reinforcing frame match those of the assembly slot.

[0009] Preferably, the reinforcing frame and the reinforcing base are made of aluminum-magnesium alloy.

[0010] Preferably, the reinforced base frame consists of a transverse frame and a longitudinal frame, with the transverse frame and the longitudinal frame connected perpendicularly to each other. There are two sets of each transverse frame and longitudinal frame, and the two sets of transverse frames and longitudinal frames are distributed in a grid pattern.

[0011] Compared with the prior art, the beneficial effects of this utility model are: This invention utilizes a reinforced substrate. First, an adhesive layer is applied to the bottom surface of the assembly slot. Then, a reinforcing frame is embedded into the inner side of the assembly slot and bonded in place using the adhesive layer. Next, a reinforcing base frame is welded to the bottom edge of the reinforcing frame, allowing it to adhere and fix to the bottom surface of the silicon nitride substrate, thus completing the assembly. By embedding a reinforcing frame along the edge of the silicon nitride substrate, the four-sided strength of the substrate is enhanced, making it less susceptible to damage from impacts. The reinforcing base frame, composed of vertically intersecting transverse and longitudinal frames, resists bending pressure in two directions, enhancing the bending resistance of the silicon nitride substrate and effectively improving its structural strength to better meet market demands. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the exploded structure of this utility model; Figure 2 This is a schematic diagram of the silicon nitride substrate in this utility model; Figure 3 This is a bottom view of the silicon nitride substrate in this utility model. Figure 4 This is a schematic diagram of the assembly groove in this utility model; Figure 5 This is a bottom view of the reinforcing frame in this utility model.

[0013] In the figure: reinforced substrate-1, silicon nitride substrate-11, assembly groove-12, adhesive layer-13, reinforcing frame-14, reinforcing base frame-15, horizontal frame-151, vertical frame-152, copper foil layer-2. Detailed Implementation

[0014] To further explain the technical solution of this utility model, a detailed description is provided below through specific embodiments.

[0015] Please see Figure 1-4This utility model provides a high-strength copper-clad silicon nitride ceramic substrate, including a reinforced substrate 1 and a copper foil layer 2. The reinforced substrate 1 includes a silicon nitride substrate 11, an assembly groove 12, an adhesive layer 13, a reinforcing frame 14, and a reinforcing base frame 15. The top edge of the silicon nitride substrate 11 is provided with an assembly groove 12, and the bottom surface of the assembly groove 12 is coated with an adhesive layer 13. The reinforcing frame 14 is embedded into the inner side of the assembly groove 12 from top to bottom and is bonded and fixed to each other by the adhesive layer 13. The bottom surface of the silicon nitride substrate 11 is fitted with the reinforcing base frame 15, and the reinforcing base frame 15 is welded and fixed to the bottom edge of the reinforcing frame 14. The entire surface of the reinforced substrate 1 is covered with a copper foil layer 2.

[0016] This utility model provides a high-strength copper-clad silicon nitride ceramic substrate with an assembly groove 12 width of 4-10mm, and the installation of the reinforcing frame 14 will not occupy the top center area of ​​the silicon nitride substrate 11.

[0017] This utility model provides a high-strength copper-clad silicon nitride ceramic substrate, in which the shape and size of the reinforcing frame 14 are matched with the assembly groove 12, so that the reinforcing frame 14 can be tightly fitted into the inner side of the assembly groove 12, and no height difference will be generated after assembly.

[0018] To further explain, the reinforcing frame 14 and the reinforcing base frame 15 are made of aluminum-magnesium alloy. Aluminum-magnesium alloy has the characteristics of high strength and good heat dissipation, which makes the reinforcing frame 14 and the reinforcing base frame 15 structurally strong. It can effectively help the silicon nitride substrate 11 resist bending and does not affect the normal heat dissipation of the silicon nitride substrate 11.

[0019] Please see Figure 5 This utility model provides a high-strength copper-clad silicon nitride ceramic substrate. The reinforcing frame 15 is composed of a horizontal frame 151 and a vertical frame 152. The horizontal frame 151 and the vertical frame 152 are perpendicularly connected. There are two sets of each of the horizontal frame 151 and the vertical frame 152. The two sets of horizontal frame 151 and vertical frame 152 are distributed in a grid pattern. The horizontal frame 151 and the vertical frame 152 can resist bending pressure in two directions, thereby enhancing the bending resistance of the silicon nitride substrate 11.

[0020] Specifically, during assembly, firstly, an adhesive layer 13 is applied to the bottom surface of the assembly slot 12. Then, the reinforcing frame 14 is inserted into the inner side of the assembly slot 12 and bonded and fixed through the adhesive layer 13. Next, the reinforcing base frame 15 is welded to the bottom edge of the reinforcing frame 14 so that the reinforcing base frame 15 is attached and fixed to the bottom surface of the silicon nitride substrate 11, thus completing the assembly of the reinforced substrate 1. Finally, the copper foil layer 2 is covered and applied to the surface of the reinforced substrate 1 to complete the assembly operation. By embedding a reinforcing frame 14 along the edge of the silicon nitride substrate 11, the strength of the four sides of the silicon nitride substrate 11 is enhanced, making it less susceptible to damage from impacts. A reinforcing base frame 15 is laid on the bottom surface of the silicon nitride substrate 11. The reinforcing base frame 15 consists of vertically intersecting horizontal frames 151 and vertical frames 152. The horizontal frames 151 and vertical frames 152 can resist bending pressure in two directions, thereby enhancing the bending resistance of the silicon nitride substrate 11 and effectively improving the structural strength of the silicon nitride substrate 11 to better meet market demands.

[0021] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-strength copper-clad silicon nitride ceramic substrate, characterized by: The substrate includes a reinforced substrate (1) and a copper foil layer (2). The reinforced substrate (1) includes a silicon nitride substrate (11), an assembly groove (12), an adhesive layer (13), a reinforcing frame (14), and a reinforcing base (15). The top edge of the silicon nitride substrate (11) is provided with an assembly groove (12). The bottom surface of the assembly groove (12) is coated with an adhesive layer (13). The reinforcing frame (14) is embedded into the inner side of the assembly groove (12) from top to bottom and is bonded and fixed to each other by the adhesive layer (13). The bottom surface of the silicon nitride substrate (11) is fitted with a reinforcing base (15), and the reinforcing base (15) is welded and fixed to the bottom edge of the reinforcing frame (14). The entire surface of the reinforced substrate (1) is covered with a copper foil layer (2).

2. The high strength copper clad silicon nitride ceramic substrate of claim 1, wherein: The width of the assembly slot (12) is 4-10mm.

3. The high strength copper clad silicon nitride ceramic substrate of claim 1, wherein: The shape and size of the reinforcing frame (14) are matched with those of the assembly slot (12).

4. The high strength copper clad silicon nitride ceramic substrate of claim 1, wherein: The reinforcing frame (14) and the reinforcing base frame (15) are made of aluminum-magnesium alloy.

5. The high-strength copper-clad silicon nitride ceramic substrate according to claim 1, characterized in that: The reinforced base frame (15) consists of a transverse frame (151) and a longitudinal frame (152). The transverse frame (151) and the longitudinal frame (152) are vertically connected. There are two sets of each of the transverse frame (151) and the longitudinal frame (152), and the two sets of transverse frames (151) and longitudinal frames (152) are distributed in a grid pattern.

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