Combined ripping and chipping device for creating holes in a substrate

The device addresses the challenge of creating clean holes in thick lightweight concrete by combining tearing and machining functions, ensuring precise edges and adaptable diameters with conventional power tools.

DE102014101656B4Active Publication Date: 2025-08-07ADOLF WURTH GMBH & CO KG
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Patent Information

Application Number
DE102014101656
Authority / Receiving Office
DE · DE
Patent Type
Patents
Current Assignee / Owner
Filing Date
2014-02-11
Publication Date
2025-08-07
Estimated Expiration
2034-02-11

AI Technical Summary

Technical Problem

Existing devices struggle to produce clean holes in thick lightweight concrete substrates, as milling cutters fail to achieve precise edges and drills result in uneven borehole walls.

Method used

A device with a rotating shaft and radially extending material removal sections, featuring both tearing and machining capabilities, allows for the formation of holes with clean edges by initially tearing the substrate circumference and then machining the interior, enabling holes of variable depth.

Benefits of technology

The device ensures clean, uniform hole walls and allows for quick changes in borehole diameter without interrupting the process, using conventional drives like cordless screwdrivers or drilling machines.

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Abstract

Device (1) for forming a hole (202) in a substrate (200), the device (1) comprising: a rotationally drivable shaft section (9); and a plurality of material removal sections (15) extending radially from the shaft section (9) and rotatably drivable by the shaft section (9); wherein at least some of the material removal sections (15) have an external tearing device (5) for tearing off material of the substrate (200) for circumferentially defining the hole (202) in the substrate (200), and wherein at least some of the material removal sections (15) have a chipping device (13) arranged between the shaft section (9) and a radial outer side of the respective material removal section (15) for chipping away material of the substrate (200), wherein, starting from an outer material tear-off tip (300) of the tearing device (5), a curved material removal edge (302) of the tearing device (5) extends to a material removal edge (304) of the chipping device (13), wherein the material removal edge (302) of the tearing device (5) is curved in the direction of rotation (306) from an outer front end (308) of the respective material removal section (15) towards a further inner rear end (310) of the respective material removal section (15); wherein at least one rib (7) arranged between respective gaps (19) is provided on at least some of the material removal sections (15) in the region of the respective chipping device (13) for comminuting removed material; wherein at least some of the chip devices (13) and / or ribs (7) are arranged replaceably on at least some of the material removal sections (15); wherein the tearing device (5) is arranged at the front of the respective material removal section (15) in the direction of rotation (306).
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