Wafer peeling and cleaning equipment

The wafer peeling and cleaning apparatus addresses stability and transfer issues by using controlled suction pads and actuators to securely separate wafers from the slice base, enhancing efficiency and reducing damage risks.

JP7763897B2Active Publication Date: 2025-11-04TOKYO SEIMITSU CO LTD
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Patent Information

Application Number
JP2024093896
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-01-21
Filing Date
2024-06-10
Publication Date
2025-11-04
Estimated Expiration
2040-01-20

AI Technical Summary

Technical Problem

Existing wafer peeling and cleaning devices struggle with efficiently separating wafers from a slice base while maintaining stability and preventing damage, especially when increasing the speed of the lifting movement, and fail to reliably transfer wafers to the next process.

Method used

A wafer peeling and cleaning apparatus that uses a combination of first and second peeling suction pads, a hot water bath, and controlled actuators to securely separate wafers from the slice base, ensuring stable transfer to the single wafer cleaning section, with features like bellows-type vacuum pads, tilt prevention, and air nozzles to manage wafer positioning and cleaning.

Benefits of technology

The apparatus reliably holds and separates wafers even if tilted, reduces time from peeling to transfer, and improves overall efficiency by preventing damage and ensuring stable transport to the cleaning section.

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Abstract

To reduce the time for transporting a wafer to a sheet cleaning unit from peeling work by means of a delivery device and improve overall efficiency without damaging the wafer.SOLUTION: In a wafer peeling and cleaning device, a wafer peeling slicing unit 100 has first and second suctioning pads 200, 201 for peeling, an overturn prevention plate 214, and a two-sheet pick-up preventing plate 216 having a slit 216a formed in an upper portion of the overturn prevention plate 214. A delivery device 118 has a suctioning pad 300 for delivery, and a pressure switch that detects that a wafer W has been suctioned and held by the suctioning pad 300 for delivery. In response to a detection signal from the pressure switch, the vacuum suctioning of the first and second suctioning pads 200, 201 for peeling is released and the retraction of the suctioning pad 300 for delivery and the lowering of the first and second suctioning pads 200, 201 for peeling are started.SELECTED DRAWING: Figure 7
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