Vibration element and vibration device
The vibrating element addresses the issue of deteriorated performance in piezoelectric devices by routing lead wires orthogonally to the direction of thickness-shear vibration, enhancing vibration characteristics and reducing resistance.
Patent Information
- Application Number
- JP2022120270
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-07-28
- Publication Date
- 2026-09-08
- Estimated Expiration
- 2042-07-28
AI Technical Summary
Existing piezoelectric vibrating elements suffer from deteriorated vibration characteristics due to lead-out wirings being drawn in the direction of thickness-shear vibration, which affects the lead-out wirings and degrades performance.
The vibrating element is designed with excitation electrodes on opposing main surfaces, support electrodes on a support portion, and lead wires drawn in a direction orthogonal to the direction of thickness-shear vibration, with the support portion bonded to a base via a conductive adhesive, reducing the impact of vibrations on the lead wires.
This configuration suppresses the deterioration of vibration characteristics, such as Q value and Crystal Impedance, by minimizing the effect of thickness-sliding vibrations on the lead wires, while also reducing wiring resistance and parasitic capacitance.