Semiconductor device and method of double shielding

The double-shielding semiconductor device addresses the complexity and cost issues of conventional shielding by using a selective and conformal shielding layer with an insulating layer to isolate them, effectively reducing EMI loop currents and enhancing electrical performance.

KR103003641B1Active Publication Date: 2026-08-11STATS CHIPPAC LTD
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Patent Information

Application Number
KR1020230068805
Authority / Receiving Office
KR · KR
Patent Type
Patents
Current Assignee / Owner
Priority Date
2022-06-24
Filing Date
2023-05-30
Publication Date
2026-08-11
Estimated Expiration
2043-05-30

AI Technical Summary

Technical Problem

Conventional semiconductor package shielding methods are complex and costly due to the need for both selective and conformal shielding, as conformal shielding layers fail to prevent EMI loop currents from inducing electric and magnetic fields in sensitive components.

Method used

A double-shielding approach is implemented, comprising a selective shielding layer formed between conductive pillars and a conformal shielding layer, with an insulating layer isolating them to reduce EMI loop currents, thereby enhancing electrical performance and reducing manufacturing complexity and cost.

Benefits of technology

The double-shielding method effectively shields sensitive components from EMI while minimizing interference and manufacturing costs by isolating the selective and conformal layers, ensuring efficient electromagnetic interference reduction.

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Abstract

A semiconductor device has a substrate. A first electric component and a second electric component are disposed on the substrate. A conductive pillar is formed on the substrate between the first electric component and the second electric component. A first shielding layer is formed on the first electric component and the conductive pillar by jet printing a conductive material. A second shielding layer is formed on the first electric component and the second electric component by sputtering, spraying, or plating a conductive material. An insulating layer is optionally formed between the first shielding layer and the second shielding layer by jet printing an insulating material onto the first shielding layer.
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