Film adhesives, die-cutting bonding monolithic films, and semiconductor devices and methods for manufacturing the same.
TW202629728APending Publication Date: 2026-07-16RESONAC CORP
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Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- RESONAC CORP
- Filing Date
- 2025-12-03
- Publication Date
- 2026-07-16
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Abstract
This disclosure provides a film-like adhesive containing a thermosetting resin component, an elastomer, and an alumina filler surface-treated with a silane coupling agent. In this film-like adhesive, the content of the alumina filler surface-treated with a silane coupling agent is 60% by mass or more, based on the total amount of the film-like adhesive.
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