Film adhesives, die-cutting bonding monolithic films, and semiconductor devices and methods for manufacturing the same.
A film adhesive with alumina filler and silane coupling agent improves heat dissipation and embedding properties, addressing the limitations of conventional adhesives in semiconductor devices.
TW202629728APending Publication Date: 2026-07-16RESONAC CORP
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Patent Information
- Application Number
- TW114147301
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-04
- Filing Date
- 2025-12-03
- Publication Date
- 2026-07-16
AI Technical Summary
Technical Problem
Conventional film adhesives fail to achieve high levels of heat dissipation and embedding properties required for miniaturized semiconductor devices, particularly those generating heat due to current supply.
Method used
A film adhesive comprising thermosetting resin, elastomers, and alumina filler surface-treated with a silane coupling agent, with a content of at least 60% by mass alumina filler, is used to enhance heat dissipation and embedding properties.
Benefits of technology
The adhesive enables the manufacture of semiconductor devices with excellent heat dissipation and embedding properties, along with good adhesion before curing, using a die-cutting bonding integral film.
✦ Generated by Eureka AI based on patent content.
Abstract
This disclosure provides a film-like adhesive containing a thermosetting resin component, an elastomer, and an alumina filler surface-treated with a silane coupling agent. In this film-like adhesive, the content of the alumina filler surface-treated with a silane coupling agent is 60% by mass or more, based on the total amount of the film-like adhesive.
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