Light emitting device and method of fabricating the same

Abstract

The application relates to a light-emitting device and a preparation method thereof, which comprises a substrate, at least two color zones, a plurality of light-emitting elements fixedly arranged on the substrate in each color zone, and a plurality of light-transmitting glue structures, each of which covers a corresponding light-emitting element, wherein the light-transmitting glue structures with the same color temperature cover each light-emitting element in the same color zone, the light-transmitting glue structures with different color temperatures cover each light-emitting element in different color zones, and the light-transmitting glue structures with different color temperatures are arranged alternately. The light-emitting device has simple structure and low cost, and the light-emitting device has uniform light emission, uniform light mixing, good light color consistency and easy control by alternately arranging the light-transmitting glue structures with different color temperatures on the light-emitting elements.

Description

Technical Field

[0001] This invention relates to the field of electronic product technology, and in particular to a light-emitting device and its preparation method. Background Technology

[0002] In existing technologies, a common method for COB LED devices to achieve multi-color light output is to use two or more CSP-type LEDs with different color temperatures together to achieve dimming and color adjustment.

[0003] Chinese patent application number 201720515129.5, entitled "A Novel Dual-Color Temperature COB Light Source Module," discloses a novel dual-color temperature COB light source module, comprising a substrate, a low color temperature CSP light source device, a high color temperature CSP light source device, and a silicone light-emitting surface. The low color temperature CSP light source device is mounted and fixed on the substrate and covered by the silicone light-emitting surface. The low color temperature CSP light source device and the high color temperature CSP light source device are uniformly arranged in the substrate using colloids. This technology uses CSP products of different colors to control the color, which can achieve the purpose of dimming and color adjustment. However, its disadvantages are that it is expensive, the brightness of the CSP products is not high, it cannot effectively improve the brightness of the product, and the flip-chip process is difficult to control.

[0004] Another common method is to divide the substrate into two or three larger areas, define these areas with dammed adhesive, place several LED chips in these areas, and cover the areas with phosphors of different color temperatures to simultaneously cover the LED chips in these areas.

[0005] Chinese patent application number 201520423063.8, entitled "An LED Light Source Encapsulated with Transparent Barrier Adhesive," discloses a substrate with several LED light-emitting chips disposed on it. Adjacent LED light-emitting chips are connected by gold wires, and the outermost LED light-emitting chip is connected to the substrate via gold wires. The gold wires and LED light-emitting chips are encapsulated within a fluorescent colloid, and a transparent barrier adhesive is disposed on the outside of the fluorescent colloid. Each fluorescent colloid and its corresponding barrier adhesive cover multiple LED light-emitting chips to form a light-emitting area. The drawback of this method is that in actual fabrication, it is difficult to control the process and parameters to ensure that the shape of the barrier adhesive is consistent in each light-emitting area. Due to the irregular shape of the fluorescent colloid and its corresponding barrier adhesive, it is difficult to control the color consistency of the light emitted by the multiple COBs covered by them. Furthermore, it can cause inconsistent light extraction efficiency between different light-emitting areas, resulting in uneven light emission.

[0006] Chinese patent No. 201420831825.3, entitled "An LED Packaging Structure," discloses a method of coating a layer of damming adhesive around an LED blue light chip, with the damming adhesive filled with a transparent lens adhesive to protect the LED blue light chip. The damming adhesive is used to define the extent of the transparent lens adhesive. Although its Figure 1 The image shows that the transparent lens adhesive only covers one LED blue light chip. If it is... Figure 1 The unit shown is defined as a light-emitting area. The drawback of this method of defining the transparent lens colloid or fluorescent colloid by using a damming adhesive is that it is difficult to ensure the regularity of the shape of the damming adhesive in the manufacturing process. The irregular shape of the damming adhesive causes the shape of the transparent lens colloid or fluorescent colloid filled in the dispensing area formed by each damming adhesive to be different. This leads to inconsistent light emission efficiency between different light-emitting areas, making it difficult to control the consistency of light color and causing uneven light emission. When it is a multi-color light-emitting product, it will also cause uneven light mixing.

[0007] Chinese patent application number 201721259762.9, entitled "A Dual-Color Electrodeless Lamp Bead," discloses a substrate with a first cup and a second cup, with a first LED chip and a second LED chip respectively disposed within the first and second cups. The first cup is filled with a first encapsulating colloid, and the second cup is filled with a second encapsulating colloid. The transparent or translucent material filling the cups is combined with a transparent insulating layer material, making the entire lamp bead almost completely transparent and capable of 360-degree light emission. This solution divides the light-emitting area into two regions using the cup design; however, the light-emitting areas are relatively independent, which can easily lead to uneven light mixing when emitting multiple colors.

[0008] Chinese patent application number 201721169834.0, entitled "An Integrated Dual-Color LED Lamp," discloses an integrated dual-color LED lamp, comprising a substrate and multiple LED chips mounted on the substrate. The substrate has a light-emitting surface with grooves, and the LED chips are mounted on the light-emitting surface, with some LED chips mounted within the grooves. A first phosphor layer is disposed within the grooves, and a second phosphor layer is disposed across the entire light-emitting surface. This technology requires mounting the chips separately on the light-emitting surface and within the grooves, followed by dispensing the phosphor over a large area. The mounting process is relatively complex, and due to the inconsistent mounting planes of the LEDs, processing differences between the mounting planes can easily lead to uneven light mixing.

[0009] Therefore, the existing multi-color temperature-adjustable light-emitting devices suffer from problems such as uneven light output, uneven light mixing, difficulty in controlling color consistency, low brightness, high cost, and complicated processes, which have become urgent technical problems to be solved in the industry. Summary of the Invention

[0010] To address the aforementioned technical problems, this invention provides a light-emitting device and its fabrication method, which has a simple structure and fabrication process, low cost, high brightness, uniform light output and mixing, and good color consistency.

[0011] The technical solution of the present invention to solve the above technical problems is to provide a light-emitting device, comprising: a substrate;

[0012] At least two color zones, each of which includes a plurality of light-emitting elements fixedly disposed on the substrate;

[0013] Multiple light-transmitting adhesive structures, each covering the corresponding light-emitting element;

[0014] Furthermore, each light-emitting element in the same color region is covered with a light-transmitting adhesive structure with the same color temperature, and each light-emitting element in different color regions is covered with a light-transmitting adhesive structure with a different color temperature, and the light-transmitting adhesive structures with different color temperatures are arranged alternately.

[0015] Optionally, each of the color zones includes several light-emitting lines composed of several light-emitting elements, and the light-emitting lines belonging to different color zones are alternately spaced.

[0016] Optionally, each of the light-emitting lines includes multiple light-emitting areas, and multiple adjacent light-emitting areas are connected in series or in parallel via wires to form the light-emitting line; each light-emitting area includes at least one light-emitting element; the color area includes multiple mounting slots; and the light-emitting areas are arranged in the mounting slots one-to-one.

[0017] Optionally, each adjacent translucent adhesive structure is connected to cover the conductor.

[0018] Optionally, the light-emitting device further includes a third colloidal structure filled between adjacent light-emitting regions, the third colloidal structure including a highly reflective colloidal structure and / or a transparent colloidal structure.

[0019] Optionally, each light-transmitting adhesive structure covers the top and side surfaces of the corresponding light-emitting element, and the third adhesive structure is combined with the side surfaces of the light-transmitting adhesive structure. The light-transmitting adhesive structure and the third adhesive structure are connected to cover the wire.

[0020] Optionally, when a single color region emits white light, the light-transmitting adhesive structure within that region includes at least a colloidal structure made of fluorescent adhesive; when a single color region emits monochromatic light, the light-transmitting adhesive structure within that region includes a colloidal structure made of fluorescent adhesive and / or a colloidal structure made of transparent adhesive.

[0021] Optionally, the light-transmitting adhesive structure includes a first adhesive structure and a second adhesive structure. The first adhesive structure is correspondingly covered on the top surface and side surface of each light-emitting element, and the second adhesive structure is at least partially disposed on the top surface of the first adhesive structure. The first adhesive structure is a transparent adhesive and / or a first fluorescent adhesive, and the second adhesive structure is a second fluorescent adhesive. The first fluorescent adhesive and the second fluorescent adhesive have different color temperatures.

[0022] Optionally, the light-emitting element is an LED chip, which includes a horizontal structure chip, a vertical structure chip, or a flip chip.

[0023] The present invention also provides a method for preparing the above-mentioned light-emitting device, comprising the following steps:

[0024] S1. Divide the substrate into at least two color zones, and fix multiple light-emitting elements in the color zones;

[0025] S2. At least two color temperature light-transmitting adhesives are distributed on the top surface of each light-emitting element or the inner surface of the mold corresponding to each light-emitting element, such that light-emitting elements in the same color zone are covered with light-transmitting adhesives of the same color temperature, and light-emitting elements in different color zones are covered with light-transmitting adhesives of different color temperatures, wherein the light-transmitting adhesives of different color temperatures are arranged alternately.

[0026] S3. Press the light-transmitting adhesive together using a mold and mold it into a light-transmitting adhesive structure;

[0027] S4. The cured and molded translucent adhesive structure;

[0028] S6. Remove the mold.

[0029] Optionally, step S1 includes the following steps:

[0030] S11. A plurality of light-emitting areas are provided in each of the aforementioned color zones, and at least one of the aforementioned light-emitting elements is fixed in each light-emitting area;

[0031] S12. Each light-emitting area is connected in series or parallel via wires to form a light-emitting circuit;

[0032] S13. Light-emitting lines belonging to different color zones are alternately spaced.

[0033] Optionally, the following steps may be included after step S4:

[0034] S5. Inject a third colloid to fill the gap between the substrate and the mold to form a plurality of third colloid structures, and cure the third colloid structures, wherein the third colloid includes a high-reflectivity adhesive and / or a transparent adhesive.

[0035] Optionally, step S2 includes the following steps:

[0036] S21. Apply a first adhesive to the top surface of each light-emitting element or the inner surface of the mold corresponding to each light-emitting element, wherein the first adhesive is a transparent adhesive or a first fluorescent adhesive;

[0037] S22. Use a mold to press the first adhesive and mold it into a first colloidal structure, and cure the molded first colloidal structure;

[0038] S23. Dispense a second fluorescent adhesive onto the top surface of at least a portion of the first colloidal structure or onto the inner surface of the mold corresponding to the at least a portion of the first colloidal structure and mold it into a second colloidal structure, and cure the molded second colloidal structure.

[0039] The first fluorescent adhesive and the second fluorescent adhesive have different color temperatures.

[0040] Optionally, when the light-emitting element includes at least two monochromatic light-emitting elements, step S2 includes the following steps:

[0041] S21. Apply transparent adhesive to the top surface of each light-emitting element or the inner surface of the mold corresponding to each light-emitting element;

[0042] S22. Press the transparent adhesive with a mold to form a transparent gel structure, and cure the molded transparent gel structure.

[0043] Optionally, the mold includes a plurality of sub-molds, each sub-mold having a bottom for pressing and coating the light-transmitting adhesive onto the top surface of the light-emitting element; or for dispensing a corresponding light-transmitting adhesive and pressing the corresponding light-transmitting adhesive onto the light-emitting element to mold a light-transmitting adhesive structure.

[0044] This invention provides a light-emitting device and its fabrication method, which has the following advantages: First, its structure involves setting light-emitting elements on a substrate to form several light-emitting lines, and setting light-transmitting adhesive structures with different colors or color temperatures on the light-emitting elements to form a light-emitting device whose color or color temperature can be adjusted. The structure and fabrication process of this light-emitting device are relatively simple and inexpensive. Second, high-reflectivity adhesive structures can be added between the light-emitting areas to improve the light extraction efficiency of the light-emitting device. Finally, by staggering the light-transmitting adhesive structures with different color temperatures, uniform light mixing, good color consistency, and easy control are achieved. Attached Figure Description

[0045] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0046] Figure 1This is a schematic diagram of the structure of the light-emitting device provided by the present invention;

[0047] Figure 2 This is a front view of the light-emitting device provided by the present invention;

[0048] Figure 3 yes Figure 1 The schematic diagram of the substrate provided in the diagram;

[0049] Figure 4 yes Figure 3 Enlarged view of region A in the middle;

[0050] Figure 5 This is a schematic diagram of the structure of the light-emitting device provided by the present invention when no wires are connected.

[0051] Figure 6 yes Figure 4 A schematic diagram of the structure when a light-emitting element is installed;

[0052] Figure 7 This is a schematic diagram of the structure of the light-emitting device according to Embodiment 4 of the present invention;

[0053] Figure 8 This is a schematic diagram of the structure of the light-emitting device according to Embodiment Six of the present invention;

[0054] Figure 9 This is a schematic diagram of the structure of the light-emitting device according to Embodiment Seven of the present invention;

[0055] Figure 10 This is a step diagram of the method for fabricating the light-emitting device provided by the present invention;

[0056] Figure 11 This is a flowchart of step S2 in the method for preparing the light-emitting device according to Embodiment 3 of the present invention;

[0057] Figure 12 This is a flowchart of step S2 in the fabrication method of the light-emitting device according to Embodiment 4 of the present invention;

[0058] Figure 13 This is a flowchart of step S2 in the method for preparing the light-emitting device according to Embodiment 5 of the present invention;

[0059] Figure 14 This is a schematic diagram of the structure of the mold and light-emitting device provided by the present invention. Detailed Implementation

[0060] To enable those skilled in the art to more clearly understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0061] like Figure 1As shown, this invention discloses a light-emitting device, including a substrate 100; at least two color regions, each color region including multiple light-emitting elements 210 fixedly disposed on the substrate 100; multiple light-transmitting adhesive structures 220, each light-transmitting adhesive structure 220 covering the corresponding light-emitting element 210; and each light-emitting element 210 in the same color region is covered with a light-transmitting adhesive structure 220 having the same color temperature, while each light-emitting element 210 in different color regions is covered with a light-transmitting adhesive structure 220 having a different color temperature, the light-transmitting adhesive structures 220 having different color temperatures being staggered. This light-emitting device has a relatively simple structure and manufacturing process, and is inexpensive; at the same time, by staggering the light-transmitting adhesive structures 220 having different color temperatures, the light-emitting device achieves uniform light mixing; and by providing a corresponding light-transmitting adhesive structure 220 on each light-emitting element 210, the light emission of the light-emitting element 210 can be ensured to be uniform, achieving good overall color consistency and easy color temperature control. Preferably, the light-emitting element 210 is an LED chip, which can be a vertical structure chip or a flip chip. Understandably, it can also be other light-emitting elements 210, as long as they can emit light, and no limitation is made here.

[0062] exist Figure 1 In the diagram, the translucent adhesive structure 220 with and without shaded lines represent translucent adhesive structures 220 with different color temperatures. Figure 1 In this embodiment, there are two color zones, and two color temperatures or colors. Understandably, in other embodiments, there may be three or more color temperatures or colors, which is not limited here. Preferably, each light-transmitting adhesive structure 220 covers the top and side surfaces of the corresponding light-emitting element 210 to make the light emission more uniform. The light-transmitting adhesive structure 220 does not require a specific shape design, making the processing simple and convenient; it only needs to cover the light-emitting element 210. Of course, it can also be bowl-shaped, trapezoidal, arc-shaped, etc., to achieve the required brightness and illumination range.

[0063] like Figure 2 As shown, each color zone includes several light-emitting elements 210 (see details). Figure 1 A plurality of light-emitting lines 230, comprising different color regions, are arranged alternately. Each light-emitting line 230 includes multiple light-emitting regions 240. Figure 2In the diagram, black and white blocks represent light-emitting areas 240 with different color temperatures. The size of each light-emitting area 240 can be selected and set according to actual needs. In this embodiment, the different light-emitting areas 240 are of the same size, making processing simpler. Multiple adjacent light-emitting areas 240 are connected in series or parallel via wires 250 to form a light-emitting circuit 230. In this embodiment, the light-emitting circuit 230 is curved, but it can also be a straight line; there is no limitation here. By controlling the power supply to the light-emitting circuits 230 of different color areas through circuitry, the effect of adjusting the color temperature or color of the light can be achieved. The wires 250 can be connected and covered by adjacent light-transmitting adhesive structures 220.

[0064] like Figure 3 As shown, the substrate 100 includes multiple mounting slots 260 at positions corresponding to the color areas. For example... Figure 4 As shown, each mounting groove 260 is provided with two mounting protrusions 111 to define the molding boundary of the light-transmitting adhesive structure 220.

[0065] like Figure 5 As shown, in this embodiment, the light-emitting areas 240 are arranged one-to-one in the mounting groove 260, and each light-emitting area 240 includes at least one light-emitting element 210 (see details). Figure 6 This completes the light-emitting function of the light-emitting area 240. In this embodiment, two light-emitting elements 210 are provided in the light-emitting area 240.

[0066] like Figure 6 As shown, optionally, a gap is provided between the two light-emitting elements 210, allowing the light-transmitting adhesive to penetrate into the gap to form a light-transmitting adhesive structure 220 (see details). Figure 1 This allows the light-transmitting adhesive structure 220 to completely cover the side surface of each light-emitting element 210, resulting in more uniform light with different color temperatures. Each light-emitting element 210 has a mounting gap 112 between its side surface facing the adjacent mounting protrusion 111 and the mounting protrusion 111. The mounting gap 112 prevents wear between the side surface of the light-emitting element 210 and the mounting protrusion 111 from damaging the light-emitting element 210. Furthermore, the mounting gap 112 provides space for the penetration of the light-transmitting adhesive, allowing the light-transmitting adhesive structure 220 to completely cover the side surface of each light-emitting element 210, thus resulting in more uniform light output.

[0067] When a color region is set to emit white light, the light-transmitting adhesive structure within that color region includes a colloidal structure made of fluorescent adhesive; when a color region is set to emit monochromatic light, the light-transmitting adhesive structure within that color region includes a colloidal structure made of fluorescent adhesive and / or a colloidal structure made of transparent adhesive. Preferred embodiments of the present invention are shown below.

[0068] Example 1

[0069] In Embodiment 1 of the present invention, the light-transmitting adhesive structure 220 (see details) Figure 1 It is made of fluorescent adhesive. There are two color zones, including a low color temperature zone and a high color temperature zone. The low color temperature zone has a color temperature value of 3000K, and the high color temperature zone has a color temperature value range of 5000K-6000K.

[0070] Example 2

[0071] In the second embodiment of the present invention, the light-transmitting adhesive structure 220 (see details) Figure 1 It is made of fluorescent adhesive. There are three color zones, including a low color temperature zone, a medium color temperature zone, and a high color temperature zone. The color temperature of the low color temperature zone is 3000K, the color temperature of the medium color temperature zone is 4000K, and the color temperature of the high color temperature zone ranges from 5000K to 6000K.

[0072] Example 3

[0073] In Embodiment 3 of the present invention, the light-transmitting adhesive structure 220 (see details) Figure 1 It is made of transparent adhesive. It has two color zones: a green zone and a red zone. The light-emitting element in the green zone emits monochromatic green light, and the light-emitting element in the red zone emits monochromatic red light. Optionally, the light-emitting element can also be other monochromatic light-emitting elements, and the number of color zones can be three or more; this is not limited here.

[0074] Example 4

[0075] like Figure 7 As shown, in Embodiment 4 of the present invention, the light-transmitting adhesive structure 220 (see details) Figure 1 The device includes a first colloidal structure 221 and a second colloidal structure 222. The first colloidal structure 221 is correspondingly covered on the top surface and side surface of each corresponding light-emitting element 210. The second colloidal structure 222 is at least partially disposed on the top surface of the first colloidal structure 221. The first colloidal structure 221 is a transparent colloid and / or a first fluorescent colloid, and the second colloidal structure 222 is a second fluorescent colloid. The first fluorescent colloid and the second fluorescent colloid have different color temperatures.

[0076] Example 5

[0077] In Embodiment 5 of the present invention, the color area is divided into a first color area and a second color area, wherein the light-emitting element 210 in the first color area (see details) Figure 1 The top and side surfaces of the light-emitting element 210 in the second color region are covered with a first colloidal structure (not shown), and the top and side surfaces of the light-emitting element 210 in the second color region are covered with a second colloidal structure (not shown). The first colloidal structure is a transparent colloidal structure, and the second colloidal structure is a fluorescent colloidal structure.

[0078] Example 6

[0079] like Figure 8 As shown, in Embodiment Six, a third colloidal structure 270 is provided between adjacent light-emitting regions 240. In this case, the third colloidal structure 270 is combined with the side surface of the light-transmitting adhesive structure 220, and the light-transmitting adhesive structure 220 and the third colloidal structure 270 are connected to cover the wire 250 (see details). Figure 2 The third colloidal structure 270 includes a high-reflectivity colloidal structure and / or a transparent colloidal structure. Specifically, adding a high-reflectivity colloidal structure between the light-transmitting colloidal structures 220 can improve the light extraction efficiency of the light-emitting device. Preferably, the top surface of the third colloidal structure 270 is flush with the top surface of the light-transmitting colloidal structure 220, making processing convenient and the structure simple.

[0080] Example 7

[0081] like Figure 9 As shown, in Embodiment Seven of the present invention, the light-transmitting adhesive structure 220 (see details) Figure 1 It includes a first colloidal structure 221 and a second colloidal structure 222. The first colloidal structure 221 completely covers the top and side surfaces of each corresponding light-emitting element 210, and the second colloidal structure 222 is disposed on the top surface of the first colloidal structure 221. The first colloidal structure 221 is a transparent colloidal or a first fluorescent colloidal, and the second colloidal structure 222 is a second fluorescent colloidal. The first fluorescent colloidal and the second fluorescent colloidal have different color temperatures.

[0082] A third colloidal structure 270 is disposed between adjacent light-emitting regions 240. In this case, the third colloidal structure 270 is combined with the side surface of the light-transmitting adhesive structure 220, and the light-transmitting adhesive structure 220 and the third colloidal structure 270 are connected to cover the wire 250 (see details). Figure 2 The third colloidal structure 270 includes a high-reflectivity colloidal structure and / or a transparent colloidal structure. Specifically, adding a high-reflectivity colloidal structure between the transparent colloidal structures 220 can improve the light extraction efficiency of the light-emitting device. Preferably, the top surface of the third colloidal structure 270 is flush with the top surface of the second colloidal structure 222, making processing convenient and the structure simple.

[0083] Understandably, in addition to the seven embodiments described above, any combination of the seven embodiments is also possible. This may include any combination of other transparent colloids and / or fluorescent colloids to form a light-transmitting adhesive structure, and may also include any combination of different color temperatures, any combination of different colors, and any combination of different color temperatures and colors to achieve a multi-color light dimming effect.

[0084] The present invention also provides a method for preparing the above-mentioned light-emitting device, such as... Figure 10 As shown, it includes the following steps:

[0085] S1. Divide the substrate into at least two color zones, and fix multiple light-emitting elements in the color zones;

[0086] S2. At least two color temperature light-transmitting adhesives are distributed on the top surface of each light-emitting element or the inner surface of the mold corresponding to each light-emitting element, such that light-emitting elements in the same color zone are covered with light-transmitting adhesives of the same color temperature, and light-emitting elements in different color zones are covered with light-transmitting adhesives of different color temperatures, wherein the light-transmitting adhesives of different color temperatures are arranged alternately.

[0087] S3. Press the light-transmitting adhesive together using a mold and mold it into a light-transmitting adhesive structure;

[0088] S4. The cured and molded translucent adhesive structure;

[0089] S6. Remove the mold.

[0090] Step S1 includes the following steps:

[0091] S11. A plurality of light-emitting areas are provided in each of the aforementioned color zones, and at least one of the aforementioned light-emitting elements is fixed in each light-emitting area;

[0092] S12. Each light-emitting area is connected in series or parallel via wires to form a light-emitting circuit;

[0093] S13. Light-emitting lines belonging to different color zones are alternately spaced.

[0094] When preparing Examples 1 and 2 above, only the above steps are required, wherein the light-transmitting adhesive structure is made of fluorescent adhesive.

[0095] In preparing Examples 6 and 7 above, the following steps are included after step S4:

[0096] S5. Inject a third colloid to fill the gap between the substrate and the mold to form a plurality of third colloid structures, and cure the third colloid structures, wherein the third colloid includes a high-reflectivity adhesive and / or a transparent adhesive.

[0097] like Figure 11 As shown, when preparing the light-emitting device in Embodiment 3 of the present invention, step S2 includes the following steps:

[0098] S21. Apply transparent adhesive to the top surface of each light-emitting element or the inner surface of the mold corresponding to each light-emitting element;

[0099] S22. Press the transparent adhesive with a mold to form a transparent gel structure, and cure the molded transparent gel structure.

[0100] like Figure 12As shown, when preparing the light-emitting device in Embodiment 4 of the present invention, step S2 includes the following steps:

[0101] S21. Apply a first adhesive to the top surface of each light-emitting element or the inner surface of the mold corresponding to each light-emitting element, wherein the first adhesive is a transparent adhesive or a first fluorescent adhesive;

[0102] S22. Use a mold to press the first adhesive and mold it into a first colloidal structure, and cure the molded first colloidal structure;

[0103] S23. Dispense a second fluorescent adhesive onto the top surface of at least a portion of the first colloidal structure or onto the inner surface of the mold corresponding to the at least a portion of the first colloidal structure and mold it into a second colloidal structure, and cure the molded second colloidal structure.

[0104] The first fluorescent adhesive and the second fluorescent adhesive have different color temperatures.

[0105] like Figure 13 As shown, when preparing the light-emitting device in Embodiment 5 of the present invention, step S2 includes the following steps:

[0106] S21. A first color zone and a second color zone are set in the color zone. Transparent adhesive is applied to the top surface of each light-emitting element in the first color zone or to the inner surface of the mold corresponding to each light-emitting element. Fluorescent adhesive is applied to the top surface of each light-emitting element in the second color zone or to the inner surface of the mold corresponding to each light-emitting element.

[0107] S22. Press the light-transmitting adhesive with a mold to form a first colloidal structure, and simultaneously press the fluorescent adhesive to form a second colloidal structure, and cure the molded first and second colloidal structures.

[0108] like Figure 14 As shown, mold 300 includes a plurality of sub-molds 310, each sub-mold 310 having a bottom for pressing and coating the light-transmitting adhesive onto the top surface of the light-emitting element 210; or for dispensing a corresponding light-transmitting adhesive and pressing the corresponding light-transmitting adhesive onto the light-emitting element 210 to mold a light-transmitting adhesive structure (see details). Figure 1 The light-transmitting adhesive can be applied to the top surface of the light-emitting element 210 or the bottom of the sub-mold 310 using methods such as dispensing. In this embodiment, the pressing is hot pressing; however, other pressing methods are also possible and are not limited here. The bottom of the sub-mold 310 can be a flat surface, a concave surface, or a convex surface, and is not limited here.

[0109] The fluorescent adhesive in this invention includes a mixture of fluorescent materials and resins and other similar fluorescent colloidal materials with different color temperatures, and the transparent adhesive includes colloidal materials such as colorless semi-transparent adhesive and colorless transparent adhesive.

[0110] In summary, the present invention provides a light-emitting device and its preparation method. The light-emitting device has a simple structure and a convenient preparation method, and is inexpensive. At the same time, by interleaving light-transmitting adhesive structures with different color temperatures, the light-emitting device achieves uniform light output, uniform light mixing, good color consistency, and is easy to control.

[0111] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A method for fabricating a light-emitting device, characterized in that, Includes the following steps: S1. At least two color zones are provided on a substrate, and multiple light-emitting elements are fixed in the color zones; the color zones include multiple mounting slots; light-emitting areas are arranged in the mounting slots one by one; each mounting slot is provided with two mounting protrusions, and each light-emitting element has a mounting gap between its side surface facing the adjacent mounting protrusion and the mounting protrusion; the height of the mounting slot and the mounting protrusion is less than the height of the light-emitting element. S2. At least two color temperature light-transmitting adhesives are distributed on the top surface of each light-emitting element or the inner surface of the mold corresponding to each light-emitting element, such that light-emitting elements in the same color zone are covered with light-transmitting adhesives of the same color temperature, and light-emitting elements in different color zones are covered with light-transmitting adhesives of different color temperatures, wherein the light-transmitting adhesives of different color temperatures are arranged alternately. S3. Press the light-transmitting adhesive together using a mold and mold it into a light-transmitting adhesive structure; S4. The cured and molded light-transmitting adhesive structure; S5. Inject a third colloid to fill the gap between the substrate and the mold to form a plurality of third colloid structures, and cure the third colloid structures, wherein the third colloid includes a high-reflectivity adhesive; S6. Remove the mold.

2. The method for preparing a light-emitting device according to claim 1, characterized in that, Step S1 includes the following steps: S11. A plurality of light-emitting areas are provided in each of the aforementioned color zones, and at least one of the aforementioned light-emitting elements is fixed in each light-emitting area; S12. Each light-emitting area is connected in series or parallel via wires to form a light-emitting circuit; S13. Light-emitting lines belonging to different color zones are alternately spaced.

3. The method for fabricating a light-emitting device according to claim 1, characterized in that, Step S2 includes the following steps: S21. Apply a first adhesive to the top surface of each light-emitting element or the inner surface of the mold corresponding to each light-emitting element, wherein the first adhesive is a transparent adhesive or a first fluorescent adhesive; S22. Use a mold to press the first adhesive and mold it into a first colloidal structure, and cure the molded first colloidal structure; S23. Dispense a second fluorescent adhesive onto the top surface of at least a portion of the first colloidal structure or onto the inner surface of the mold corresponding to the at least a portion of the first colloidal structure and mold it into a second colloidal structure, and cure the molded second colloidal structure. The first fluorescent adhesive and the second fluorescent adhesive have different color temperatures.

4. The method for fabricating a light-emitting device according to claim 1, characterized in that, When the light-emitting element includes at least two monochromatic light-emitting elements, step S2 includes the following steps: S21. Apply transparent adhesive to the top surface of each light-emitting element or the inner surface of the mold corresponding to each light-emitting element; S22. Press the transparent adhesive with a mold to form a transparent gel structure, and cure the molded transparent gel structure.

5. The method for fabricating a light-emitting device according to claim 1, characterized in that, The mold includes multiple sub-molds, each sub-mold having a bottom for pressing and bonding the light-transmitting adhesive coated on the top surface of the light-emitting element; or for dispensing the corresponding light-transmitting adhesive and pressing the corresponding light-transmitting adhesive onto the light-emitting element to mold a light-transmitting adhesive structure.

Images