MEMS microphone and method of manufacturing the same

By hanging and fixing the diaphragm on the back plate structure in the MEMS microphone, the structural defects caused by process deviation are solved, the yield and reliability are improved, and the working sensitivity of the device is improved.

CN111083621BActive Publication Date: 2025-03-28HANGZHOU SILAN MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN201911426163.5
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-12-31
Publication Date
2025-03-28
Estimated Expiration
2039-12-31

AI Technical Summary

Technical Problem

The structural defects introduced by process deviations during manufacturing and application of MEMS microphones lead to low yield and deterioration in performance.

Method used

By hanging and fixing the diaphragm on the back plate structure, stress on the diaphragm is released, thereby improving the operating sensitivity of the device. The specific implementation method includes providing a first connecting portion connected to the back plate structure on the first surface of the diaphragm, so that the diaphragm is fixedly suspended from the back plate structure through electrical connection.

Benefits of technology

This method effectively improves the yield and reliability of MEMS microphones, reduces the adverse impact of process deviations on device performance, and improves the sensitivity of the mechanical response of the diaphragm.

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Abstract

Disclosed are a MEMS microphone and a method for manufacturing the same. The MEMS microphone comprises: a substrate; a diaphragm and a back plate structure located on a first surface of the substrate, the diaphragm and the back plate structure being spaced apart from each other, the first surface of the diaphragm and the first surface of the back plate structure being opposite to each other; and a sound cavity penetrating the substrate to reach the second surface of the diaphragm, wherein the first surface of the diaphragm is provided with a first connection portion connected to the back plate structure. The present application suspends the diaphragm on the back plate structure through the first connection portion on the surface, which greatly releases the stress of the diaphragm and improves the sensitivity of the mechanical response of the diaphragm.
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