A splicable circuit board and circuit board
By designing a splicable circuit board, electrical connection is achieved using the holes, connection parts and bonding electrodes on the substrate, the problem of difficulty in manufacturing large circuit boards in the prior art is solved, and the rapid and simple splicing manufacturing of large circuit boards is achieved.
CN111491443BActive Publication Date: 2025-03-28BEIJING DREAM INK TECH CO LTD
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Patent Information
- Application Number
- CN201910073582.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-01-25
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2039-01-25
AI Technical Summary
Technical Problem
It is difficult to quickly and simply produce large circuit boards in the prior art, and the existing liquid metal printing technology is limited by the size of the circuit board, so it is impossible to manufacture large circuit boards.
Method used
A splicable circuit board is designed to realize electrical connection between different circuit boards by dividing the circuit area and the connection area on the substrate and setting holes, connecting portions and bonding electrodes in the connection area.
Benefits of technology
By splitting the large circuit board into multiple splicable circuit boards and making and splicing them separately, the simple and rapid manufacturing of large circuit boards is achieved, and the problem of size limitations in the prior art is solved.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention provides a splicable circuit board and a circuit board, and relates to the field of electronic circuit technology. The splicable circuit board provided by the present invention includes a substrate, which is divided into a circuit area and a connection area surrounding the circuit area, the circuit area is used to place the circuit, and the connection area is used to realize the electrical connection between different splicable circuit boards; at least one channel, the first opening of the channel is located on the upper surface of the connection area, and the second opening of the channel is located on the side of the substrate; at least one connecting part, the connecting part is filled in the channel; at least one combining electrode, the combining electrode is located on the side of the substrate, and is connected to the connecting part one by one; wherein, when a circuit is provided in the circuit area, at least one end of the circuit extends into the connection area and is connected to at least one connecting part. The technical solution of the present invention can make large circuit boards relatively simply.
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