Semiconductor device, semiconductor package and method of forming the same

Abstract

A semiconductor device including an improved isolation bonding film is disclosed. In an embodiment, a semiconductor device includes a first die bonded to a package substrate, the first die including a via extending through the substrate, the via extending above a top surface of the substrate; a first dielectric film extending along the top surface of the package substrate, along the top surface of the substrate, and along sidewalls of the first die, the via extending through the first dielectric film; a second die bonded to the first dielectric film and the via; and an encapsulation over the package substrate, the first die, the first dielectric film, and the second die.