An easily identifiable Mini LED device and module

Abstract

The present invention discloses an easily identifiable Mini LED device and a module thereof, wherein the Mini LED device comprises: a substrate, a pixel chip and a protective layer; the pixel chip is arranged on the substrate; the protective layer comprises a first protective layer and a quadrangular pyramid-shaped second protective layer; the first protective layer is arranged above the substrate and covers the pixel chip; the second protective layer is arranged on the top of the first protective layer; the upper surface of the second protective layer forms a first angle with the first side surface of the second protective layer, the upper surface of the second protective layer forms a second angle with the second side surface of the second protective layer, the first side surface and the second side surface are two adjacent side surfaces, and the first angle and the second angle are not equal; the distances between the edge of the upper surface of the second protective layer and the edges of the two adjacent side surfaces (i.e., the connection with the first protective layer) are not equal, and the Mini LED device can be identified from the front through the two unequal distances.

Description

Technical Field

[0001] The present invention belongs to the field of LED display technology, and in particular relates to an easily identifiable Mini LED device and module. Background Art

[0002] Micron-sized Mini LED has become a recent research hotspot due to its advantages such as high brightness, high contrast, high color saturation, and local dimming. Mini LED is expected to replace LCD and OLED and become the next generation of new display technology. Consumers have higher and higher requirements for the resolution and color consistency of LED display screens, which puts higher requirements on traditional LED display devices. Mini LED devices combined with Mini's high resolution are gradually being applied in batches in small-pitch display screens due to the relatively low process conditions. Since Mini LED devices cannot be marked on the front, it is impossible to judge whether the patch is correct from the front during the patch process, which leads to the problem that errors cannot be detected in the previous process, resulting in a decrease in yield. Summary of the invention

[0003] In order to overcome the above technical defects, the present invention provides an easily identifiable Mini LED device and module, which can perform anti-reverse judgment through the front side.

[0004] In order to solve the above problems, the present invention is implemented according to the following technical solutions:

[0005] An easily identifiable Mini LED device, comprising: a substrate, a pixel chip and a protective layer;

[0006] The pixel chip is arranged on the substrate; the protective layer includes a first protective layer and a quadrangular pyramid-shaped second protective layer; the first protective layer is arranged above the substrate and covers the outside of the pixel chip; the second protective layer is arranged on the top of the first protective layer; the upper surface of the second protective layer forms a first angle with the first side surface of the second protective layer, the upper surface of the second protective layer forms a second angle with the second side surface of the second protective layer, the first side surface and the second side surface are two adjacent side surfaces, and the first angle and the second angle are not equal.

[0007] Compared with the prior art, the present invention has the following beneficial effects: the angles formed by the upper surface of the Mini LED device and the two adjacent side surfaces are not equal, so that the distances between the edge of the upper surface of the second protective layer and the two adjacent side edges (i.e., the connection with the first protective layer) are not equal. Through the two unequal distances, the Mini LED device can be identified from the front.

[0008] As a further improvement of the present invention, the first angle is greater than 90°, and the second angle is greater than 90°.

[0009] As a further improvement of the present invention, the protective layer includes thermosetting material, carbon powder, SiO2, TiO2 or ZrO2.

[0010] In addition, the present invention also provides an easily identifiable Mini LED module, comprising a plurality of the above-mentioned Mini LED devices, wherein the plurality of the Mini LED devices are connected via the substrate and the first protective layer.

[0011] As a further improvement of the present invention, the Mini LED devices having the same first angle and the same second angle are arranged in the same row or column of the substrate.

[0012] As a further improvement of the present invention, the Mini LED devices having the same size are arranged in the same row or column of the substrate.

[0013] As a further improvement of the present invention, the substrate is provided with a plurality of positive electrode pads for connecting to the positive electrode of the pixel chip and a plurality of negative electrode pads for connecting to the negative electrode of the pixel chip; a plurality of the positive electrode pads are connected to each other, and a plurality of the negative electrode pads are connected to each other.

[0014] As a further improvement of the present invention, a direction identification portion is provided on the upper surface or the lower surface of the substrate.

[0015] As a further improvement of the present invention, the direction identification unit includes a triangle identification unit.

[0016] As a further improvement of the present invention, the direction identification portion includes at least two identification insulating layers with different direction patterns.

[0017] Compared with the prior art, the present invention has the following beneficial effects: when a Mini LED module has multiple Mini LED devices, since the angles formed by the upper surface of the Mini LED device and the two adjacent side surfaces are not equal, the distances between the upper surface edge of the Mini LED device and the two adjacent side edges are not equal, making it easy to identify the direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The specific embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings, wherein:

[0019] Figure 1 A side view of the Mini LED device in Example 1;

[0020] Figure 2 is another side view of the Mini LED device in Example 1;

[0021] Figure 3A side view of the Mini LED device in Example 2;

[0022] Figure 4 is another side view of the Mini LED device in Example 2;

[0023] Figure 5 is a top view of the Mini LED module in Example 5;

[0024] Figure 6 This is a connection diagram of the pixel chip in Example 5;

[0025] Figure 7 is a schematic diagram of the structure of the triangular marker in Example 5;

[0026] Figure 8 It is a schematic diagram of the structure of identifying the insulating layer in Example 5;

[0027] Fig. 9 3 is a top view of the Mini LED module in Example 6.

[0028] Marking instructions: 1. Mini LED device; 11. Substrate; 12. Pixel chip; 121. Red chip; 122. Green chip; 123. Blue chip; 13. Protective layer; 131. First protective layer; 132. Second protective layer; 14. Upper surface; 15. First side surface; 16. Second side surface; 2. Mini LED module; 21. Gap; 22. Center line; 23. Positive electrode pad; 24. Negative electrode pad; 25. Triangular marker; 26. Identify the insulating layer. DETAILED DESCRIPTION

[0029] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0030] Example 1

[0031] This embodiment discloses a Mini LED device 1 that is easy to identify, such as Figure 1 and Figure 2As shown, it includes: a substrate 11, a pixel chip 12 and a protective layer 13; the pixel chip 12 is arranged on the substrate 11; wherein the pixel chip 12 includes a red chip 121 that displays red, a green chip 122 that displays green and a blue chip 123 that displays blue; the protective layer 13 includes a first protective layer 131 and a quadrangular pyramid-shaped second protective layer 132; the first protective layer 131 is arranged above the substrate 11 and covers the pixel chip 12; the second protective layer 132 is arranged on the top of the first protective layer 131; the upper surface 14 of the second protective layer 132 forms a first angle with the first side surface 15 of the second protective layer 132, the upper surface 14 of the second protective layer 132 forms a second angle with the second side surface 16 of the second protective layer 132, the first side surface 15 and the second side surface 16 are two adjacent side surfaces, and the first angle is not equal to the second angle.

[0032] Specifically, the first protective layer 131 and the second protective layer 132 are coated on the top of the substrate 11 and the top, front, back, left and right sides of the pixel chip 12. Based on this, the influence of oxygen and moisture in the external environment on the pixel chip 12 can be effectively reduced, and the life of the Mini LED device 1 is extended. The surfaces of the first protective layer 131 and the second protective layer 132 have a microstructure; the first protective layer 131 is set to a rectangular shape. It is worth noting that in this embodiment, the first protective layer 131 and the second protective layer 132 are distinguished for the convenience of description. In fact, the first protective layer 131 and the second protective layer 132 belong to the same protective layer 13 of the Mini LED device 1. Through cutting and forming, the second protective layer 132 presents a different shape.

[0033] In the above embodiment, if Figure 1 and Figure 2 As shown, the first angle is equal to 115° and the second angle is equal to 90.5°, so that L11 and L12 are not equal, so that the front and back sides of the Mini LED device 1 can be easily identified from the front.

[0034] In the above embodiment, the protective layer 13 includes a thermosetting material, carbon powder, SiO 2 , TiO 2 or ZrO 2 , wherein the thermosetting material may be silica gel.

[0035] Based on the different angle settings of the first angle and the second angle, when looking from top to bottom, the distances between the connection points between the two adjacent edges of the upper surface 14 and the first protective layer 131 are different, so that the front and back sides of the Mini LED device 1 can be quickly identified.

[0036] Example 2

[0037] This embodiment provides another easily identifiable Mini LED device 1, such as Figure 3 and Figure 4As shown, the difference between it and Example 1 is that the first angle is equal to 135°, and the second angle is equal to 113°, so that L21 and L22 are not equal, so that the front and back sides of the Mini LED device 1 can be easily identified from the front, and the first protective layer 131 is set to a quadrangular pyramid shape and is smoothly connected to the second protective layer 132. The principle of this embodiment is the same as that of Example 1, and will not be repeated here.

[0038] Example 3

[0039] This embodiment provides another easily identifiable Mini LED device 1, which differs from Embodiment 1 in that the first angle is equal to 155° and the second angle is equal to 165°. The principle of this embodiment is the same as that of Embodiment 1 and will not be described in detail here.

[0040] Example 4

[0041] This embodiment provides another easily identifiable Mini LED device 1, which differs from Embodiment 1 in that the first angle is equal to 165° and the second angle is equal to 179°. The principle of this embodiment is the same as that of Embodiment 1 and will not be described in detail here.

[0042] Example 5

[0043] This embodiment provides a Mini LED module 2 that is easy to identify. Figure 5 As shown, four Mini LED devices 1 in Embodiment 1 are included to form a 2*2 Mini LED module 2, and the four Mini LED devices 1 are connected through a substrate 11 and a first protective layer 131.

[0044] In the above embodiment, the Mini LED devices 1 having the same first angle and the same second angle are arranged in the same row or column of the substrate 11 , that is, the first side surfaces 15 having the first angle are all located on the same side of the substrate 11 .

[0045] Based on this, according to the difference between L11 and L12, the front and back of the Mini LED module 2 can be easily determined from above, which is easy to identify.

[0046] In the above embodiment, if Figure 6 As shown, the substrate 11 is provided with a plurality of positive electrode pads 23 and a plurality of negative electrode pads 24 near each pixel chip 12; each positive electrode pad 23 is used to connect the positive electrode of the red chip 121, the green chip 122 or the blue chip 123; each negative electrode pad 24 is used to connect the negative electrode of the red chip 121, the green chip 122 or the blue chip 123.

[0047] Specifically, the pixel chips 12 are connected to each other via wires laid on the substrate 11 .

[0048] In the above embodiment, a plurality of positive electrode pads 23 are electrically connected to each other; a plurality of negative electrode pads 24 are electrically connected to each other.

[0049] In the above embodiment, if Figure 7 As shown, a triangular marker 25 is provided on the lower surface of the substrate 11. The triangular marker 25 can be a triangular groove or a triangular mark protruding outward. The front and back of the Mini LED module 2 can be quickly distinguished through the triangular marker 25.

[0050] In the above embodiment, if Figure 8 As shown, the substrate 11 is provided with at least two identification insulating layers 26 with patterns in different directions. By identifying the insulating layer 26 , the front and back of the Mini LED module 2 can also be quickly distinguished.

[0051] Example 6

[0052] This embodiment provides another easily identifiable Mini LED module 2, such as Fig. 9 As shown, the difference between it and Example 5 is that the Mini LED devices 1 of this embodiment are arranged outside the same row or column of the substrate 11, and the Mini LED devices 1 with the same size are arranged in the same row of the substrate 11. A gap 21 is formed between two adjacent Mini LED devices 1, and the gap 21 deviates from the center line 22 of the Mini LED module 2 by no more than 10% of the length or width of the module. If the asymmetry of each Mini LED device 1 in the Mini LED module 2 is too high, it will affect the light color uniformity of the Mini LED device 1. Therefore, this embodiment needs to control the asymmetry.

[0053] In this embodiment, the Mini LED module 2 is configured as an asymmetric structure. On the basis of the difference between L11 and L12, an additional identification method is also provided to make the Mini LED module 2 easier to identify. For other structures of this embodiment, please refer to Embodiment 5, which will not be described one by one here.

[0054] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Therefore, any modification, equivalent change and modification made to the above embodiment according to the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. An easily identifiable Mini LED device, characterized in that: include: Substrate, pixel chip and protective layer; The pixel chip is arranged on the substrate; the protective layer includes a first protective layer and a quadrangular pyramid-shaped second protective layer; the first protective layer is arranged above the substrate and covers the pixel chip; the second protective layer is arranged on the top of the first protective layer; the upper surface of the second protective layer forms a first angle with the first side surface of the second protective layer, the upper surface of the second protective layer forms a second angle with the second side surface of the second protective layer, the first side surface and the second side surface are two adjacent side surfaces, the first angle and the second angle are not equal, and the distances between the two adjacent edges of the upper surface and the connection point of the first protective layer are not the same.

2. The Mini LED device according to claim 1, characterized in that: The first angle is greater than 90°, and the second angle is greater than 90°.

3. The Mini LED device according to claim 1, characterized in that: The protective layer includes thermosetting material, carbon powder, SiO2, TiO2 or ZrO2.

4. An easily identifiable Mini LED module, characterized in that: It comprises several Mini LED devices as described in any one of claims 1 to 3, wherein the several Mini LED devices are connected through the substrate and the first protective layer.

5. The Mini LED module according to claim 4, characterized in that: The Mini LED devices having the same first angle and the same second angle are arranged in the same row or column of the substrate.

6. The Mini LED module according to claim 4, characterized in that: The Mini LED devices having the same size are arranged in the same row or column of the substrate.

7. The Mini LED module according to any one of claims 4 to 6, characterized in that: The substrate is provided with a plurality of positive electrode pads for connecting to the positive electrode of the pixel chip and a plurality of negative electrode pads for connecting to the negative electrode of the pixel chip; a plurality of the positive electrode pads are connected to each other, and a plurality of the negative electrode pads are connected to each other.

8. The Mini LED module according to any one of claim 6, wherein: A gap is formed between two adjacent Mini LED devices, and the gap deviates from the center line of the Mini LED module by no more than 10% of the length or width of the Mini LED module.

9. The Mini LED module according to any one of claims 4 to 6, characterized in that: A triangular marker is arranged on the substrate.

10. The Mini LED module according to any one of claims 4 to 6, characterized in that: The substrate is provided with at least two identification insulating layers with patterns in different directions.

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