Substrate processing apparatus, control method, and computer-readable storage medium

Abstract

This invention provides a substrate processing apparatus, a control method, and a computer-readable storage medium, which are useful for reducing particulate matter in processing liquid sprayed onto a substrate. One aspect of the substrate processing apparatus includes: an ejection section having a nozzle for ejecting processing liquid onto the substrate; a delivery section for supplying processing liquid to the ejection section; a replenishment section for replenishing the delivery section with the processing liquid supplied to the ejection section; a connection section having a switching valve for opening and closing between the replenishment section and the delivery section; a filter for removing foreign matter contained in the processing liquid replenished from the replenishment section to the delivery section; a replenishment preparation section for reducing the pressure difference between the replenishment section and the delivery section, and then opening the switching valve; and a replenishment control section for initiating replenishment of processing liquid from the replenishment section to the delivery section when the switching valve is opened by the replenishment preparation section.

Description

Technical Field

[0001] This disclosure relates to a substrate processing apparatus, a control method, and a computer-readable storage medium. Background Technology

[0002] Patent Document 1 discloses a treatment fluid supply device that supplies treatment fluid from a treatment fluid supply source to a workpiece via a spray section. This treatment fluid supply device includes a first pump located downstream of the treatment fluid supply source, a filter section located on the secondary side of the first pump for removing foreign matter from the treatment fluid, and a second pump located on the secondary side of the filter section. Furthermore, the treatment fluid supply device includes a control unit that performs the step of passing the treatment fluid introduced into the first pump through the filter and then supplying it to the second pump.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-220547 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] This disclosure provides a substrate processing apparatus, control method, and computer-readable storage medium useful for reducing particulate matter in processing liquid sprayed onto a substrate.

[0008] Solution for solving the problem

[0009] One aspect of this disclosure relates to a substrate processing apparatus comprising: an ejection section having a nozzle for ejecting processing liquid onto a substrate; a delivery section for delivering processing liquid to the ejection section; a replenishment section for replenishing the delivery section with the processing liquid delivered to the ejection section; a connection section having a switching valve for opening and closing between the replenishment section and the delivery section; a filter for removing foreign matter contained in the processing liquid replenished from the replenishment section to the delivery section; a replenishment preparation section for reducing the pressure difference between the replenishment section and the delivery section, and then opening the switching valve; and a replenishment control section for initiating replenishment of processing liquid from the replenishment section to the delivery section when the switching valve is opened by the replenishment preparation section.

[0010] The effects of the invention

[0011] According to this disclosure, a substrate processing apparatus, a control method, and a computer-readable storage medium are provided that are useful for reducing particulate matter in a processing liquid ejected onto a substrate. Attached Figure Description

[0012] Figure 1This is a schematic diagram illustrating an example of the general structure of a substrate processing system.

[0013] Figure 2 This is a schematic diagram illustrating an example of the internal structure of a coating and developing apparatus.

[0014] Figure 3 This is a schematic diagram illustrating an example of the structure of a liquid treatment unit.

[0015] Figure 4 This is a schematic diagram illustrating an example of a processing fluid supply unit.

[0016] Figure 5 This is a block diagram illustrating an example of the functional structure of a control device.

[0017] Figure 6 This is a block diagram illustrating an example of the hardware structure of a control device.

[0018] Figure 7 This is a flowchart illustrating an example of a liquid processing procedure.

[0019] Figure 8 (a) is a flowchart illustrating an example of the ejection preparation process. Figure 8 (b) is a flowchart illustrating an example of the ejection control process.

[0020] Figure 9 (a) is a schematic diagram illustrating an example of the ejection preparation process. Figure 9 (b) is a schematic diagram illustrating an example of the ejection control process.

[0021] Figure 10 This is a flowchart illustrating an example of the discharge preparation process.

[0022] Figure 11 This is a flowchart illustrating an example of the discharge control process.

[0023] Figure 12 This is a flowchart illustrating an example of a supplementary preparation process.

[0024] Figure 13 This is a flowchart illustrating an example of a supplementary control process.

[0025] Figure 14 (a)~ Figure 14 (c) is a schematic diagram illustrating an example of the supplementary preparation process. Figure 14 (d) is a schematic diagram used to illustrate an example of a supplementary control process.

[0026] Figure 15 (a) and Figure 15 (b) is a graph representing an example of the measurement results of the number of particles contained in the treated liquid after spraying.

[0027] Figure 16 (a) and Figure 16 (b) is a graph representing an example of how hydraulic pressure changes over time.

[0028] Figure 17 (a) is a schematic diagram illustrating another example of the ejection preparation process. Figure 17 (b) is a schematic diagram illustrating another example of the ejection control process.

[0029] Figure 18 (a) and Figure 18 (b) is a graph illustrating another example of a method for adjusting supplemental pressure.

[0030] Figure 19 This is a flowchart illustrating an example of the supplementary preparation process involved in the second embodiment.

[0031] Figure 20 This is a flowchart illustrating an example of a supplementary control process.

[0032] Figure 21 (a) and Figure 21 (b) is a schematic diagram illustrating an example of the supplementary preparation process. Figure 21 (c) is a schematic diagram illustrating an example of a supplementary control process.

[0033] Figure 22 It is a graph representing the measurement results of the number of particles contained in the treatment solution.

[0034] Figure 23 (a) and Figure 23 (b) is a graph representing an example of how hydraulic pressure changes over time.

[0035] Figure 24 This is a schematic diagram illustrating an example of the processing fluid supply unit according to the third embodiment.

[0036] Figure 25 This is a flowchart illustrating an example of a liquid processing procedure.

[0037] Figure 26 (a) is a flowchart illustrating an example of the ejection preparation process. Figure 26 (b) is a flowchart illustrating an example of the ejection control process.

[0038] Figure 27 This is a flowchart illustrating an example of a supplementary preparation process.

[0039] Figure 28 (a) and Figure 28 (b) is a schematic diagram illustrating an example of the supplementary preparation process.

[0040] Figure 29 This is a flowchart illustrating an example of a supplementary control process.

[0041] Explanation of reference numerals in the attached figures

[0042] 2: Coating / developing apparatus; 30: Ejection section; 50, 250: Replenishment section; 51: Liquid source; 53: Pressurized delivery section; 60, 210: Liquid delivery section; 61: Liquid delivery pipe; 63, 234: Filter; 64: Pressurized delivery section; 67: First connecting valve; 68: Second connecting valve; 69: Pressure measuring section; 71: Switching valve; 72: Ejection valve; 80, 230: First connecting section; 90: Second connecting section; 100: Control device; 111: Ejection preparation section; 112: Ejection control section; 115: Replenishment preparation section; 116: Replenishment control section; 236: First switching valve; 238: Second switching valve. Detailed Implementation

[0043] Hereinafter, various exemplary embodiments will be described with reference to the accompanying drawings. In the description, the same reference numerals are used to mark the same elements or elements having the same function, and repeated descriptions are omitted.

[0044] [First Implementation Method]

[0045] First, refer to Figures 1 to 18 The substrate processing system according to the first embodiment will be described below.

[0046] [Substrate Processing System]

[0047] Figure 1 The substrate processing system 1 shown is a system for forming a photosensitive coating on a substrate, exposing the photosensitive coating, and developing the photosensitive coating. The substrate to be processed is, for example, a semiconductor wafer W. The substrate to be processed is not limited to a semiconductor wafer; it can also be, for example, a glass substrate, a mask substrate, or an FPD (Flat Panel Display). The photosensitive coating is, for example, a resist film. The substrate processing system 1 includes a coating / developing apparatus 2 and an exposure apparatus 3. The exposure apparatus 3 exposes the resist film (photosensitive coating) formed on the wafer W (substrate). Specifically, energy rays are irradiated onto the exposed portion of the resist film using methods such as immersion exposure. Before the exposure process performed by the exposure apparatus 3, the coating / developing apparatus 2 performs a process for forming a resist film on the surface of the wafer W (substrate), and after the exposure process, the coating / developing apparatus 2 performs a development process on the resist film.

[0048] [Substrate Processing Apparatus]

[0049] The structure of coating / developing apparatus 2, which is an example of a substrate processing apparatus, will be described below. Figure 1 and Figure 2 As shown, the coating / developing apparatus 2 includes a carrier block 4, a processing block 5, an interface block 6, and a control device 100.

[0050] The carrier block 4 guides the wafer W into and out of the coating / developing apparatus 2. For example, the carrier block 4 can support multiple carriers C for the wafer W and includes a built-in conveying device A1 with a transfer arm. The carriers C, for example, hold multiple circular wafers W. The conveying device A1 removes the wafer W from the carriers C and transfers it to the processing block 5, receives the wafer W from the processing block 5, and returns the wafer W to the carriers C.

[0051] Processing block 5 has multiple processing modules 11, 12, 13, and 14. Processing modules 11, 12, 13, and 14 have a liquid processing unit U1, a heat processing unit U2, and a conveying device A3 including a conveying arm for conveying wafers W to these units.

[0052] Processing module 11 forms a lower layer film on the surface of wafer W through liquid treatment unit U1 and heat treatment unit U2. Liquid treatment unit U1 of processing module 11 applies a processing liquid for forming the lower layer film onto wafer W. Accompanying the formation of the lower layer film, heat treatment unit U2 of processing module 11 performs various heat treatments.

[0053] Processing module 12 forms a resist film on the lower film through liquid treatment unit U1 and heat treatment unit U2. Liquid treatment unit U1 of processing module 12 applies a processing liquid for forming the resist film onto the lower film. Along with the formation of the resist film, heat treatment unit U2 of processing module 12 performs various heat treatments.

[0054] Processing module 13 forms an upper film on the resist film through liquid treatment unit U1 and heat treatment unit U2. Liquid treatment unit U1 of processing module 13 coats the resist film with a liquid for forming the upper film. Along with the formation of the upper film, heat treatment unit U2 of processing module 13 performs various heat treatments.

[0055] Processing module 14 performs development treatment on the exposed resist film using liquid treatment unit U1 and heat treatment unit U2. Liquid treatment unit U1 applies a developer to the surface of the exposed wafer W. Additionally, liquid treatment unit U1 rinses away the applied developer using a rinsing solution. Along with the development treatment, heat treatment unit U2 performs various heat treatments. Specific examples of heat treatment include pre-development heat treatment (PEB: Post Exposure Bake) and post-development heat treatment (PB: Post Bake).

[0056] A rack unit U10 is provided on the side of the support block 4 within the processing block 5. The rack unit U10 is divided into multiple layers arranged in the vertical direction. A conveying device A7, including a lifting arm, is provided near the rack unit U10. The conveying device A7 moves the wafer W up and down between the layers of the rack unit U10.

[0057] A frame unit U11 is provided on the side of the interface block 6 within the processing block 5. The frame unit U11 is divided into multiple layers arranged in the vertical direction.

[0058] Interface block 6 and exposure apparatus 3 exchange wafer W. For example, interface block 6 has a built-in transfer device A8 including a transfer arm, and interface block 6 is connected to exposure apparatus 3. Transfer device A8 transfers wafer W arranged in rack unit U11 to exposure apparatus 3. Transfer device A8 receives wafer W from exposure apparatus 3 and returns wafer W to rack unit U11.

[0059] Control device 100 controls, for example, coating / developing device 2 to perform coating / developing processes according to the following procedure. First, control device 100 controls conveying device A1 to convey wafer W in carrier C to rack unit U10, and controls conveying device A7 to arrange wafer W in the layer for processing module 11.

[0060] Next, the control device 100 controls the transfer device A3 to transfer the wafer W from the rack unit U10 to the liquid treatment unit U1 and the heat treatment unit U2 within the processing module 11. Additionally, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 to form a lower layer film on the surface of the wafer W. Afterward, the control device 100 controls the transfer device A3 to return the wafer W with the lower layer film formed to the rack unit U10, and controls the transfer device A7 to place the wafer W in a layer for the processing module 12.

[0061] Next, the control device 100 controls the transfer device A3 to transfer the wafer W from the rack unit U10 to the liquid treatment unit U1 and the heat treatment unit U2 within the processing module 12. Additionally, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 to form a resist film on the lower layer of the wafer W. Afterward, the control device 100 controls the transfer device A3 to return the wafer W to the rack unit U10, and controls the transfer device A7 to place the wafer W in a layer for the processing module 13.

[0062] Next, the control device 100 controls the conveying device A3 to move the wafer W from the rack unit U10 to each unit within the processing module 13. Additionally, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 to form an upper film on the resist film of the wafer W. Afterward, the control device 100 controls the conveying device A3 to move the wafer W to the rack unit U11.

[0063] Next, the control device 100 controls the conveying device A8 to deliver the wafer W from the rack unit U11 to the exposure apparatus 3. After that, the control device 100 controls the conveying device A8 to receive the wafer W that has undergone exposure processing from the exposure apparatus 3 and to place the wafer W in the layer of the processing module 14 in the rack unit U11.

[0064] Next, the control device 100 controls the conveying device A3 to transport the wafer W from the rack unit U11 to the respective units within the processing module 14, and controls the liquid treatment unit U1 and the heat treatment unit U2 to perform development processing on the resist film of the wafer W. Afterwards, the control device 100 controls the conveying device A3 to return the wafer W to the rack unit U10, and controls the conveying devices A7 and A1 to return the wafer W to the carrier C. Through the above process, the coating / development process is completed.

[0065] Furthermore, the specific structure of the substrate processing apparatus is not limited to the structure of the coating / developing apparatus 2 illustrated above. The substrate processing apparatus can be any substrate processing apparatus equipped with a liquid processing unit that sprays processing liquid onto the wafer W for liquid processing and a control device capable of controlling the liquid processing unit.

[0066] (Liquid processing unit)

[0067] Next, refer to Figure 3 and Figure 4 Here is a detailed description of an example of the liquid processing unit U1 in the processing module 12. The liquid processing unit U1 includes a rotating holding part 20 and a processing liquid supply part 29.

[0068] The rotation holding unit 20 holds and rotates the wafer W based on the operation instruction of the control device 100. The rotation holding unit 20 includes a holding unit 21 and a drive unit 22. The holding unit 21 supports the center portion of the wafer W, which is horizontally arranged with its surface Wa facing upwards, and holds the wafer W by adsorption (e.g., vacuum adsorption). The drive unit 22 is, for example, a rotation actuator powered by an electric motor, which rotates the holding unit 21 about a vertical rotation axis. Thus, the wafer W rotates about the vertical rotation axis.

[0069] The processing liquid supply unit 29 supplies processing liquid to the wafer W, which is held rotatably in the spin-holding unit 20. For example... Figure 3 and Figure 4 As shown, the processing fluid supply unit 29 includes a spraying part 30, a fluid delivery part 60, a replenishment part 50, a first connecting part 80 (connecting part), and a second connecting part 90.

[0070] The ejection section 30 ejects a processing liquid toward the surface Wa of the wafer W. The ejection section 30 includes a nozzle 31 and a liquid delivery pipe 32. The nozzle 31 ejects the processing liquid toward the wafer W. Figure 3 As shown, nozzle 31 is positioned, for example, above wafer W, and sprays the processing liquid downwards. Liquid delivery pipe 32 guides the processing liquid to nozzle 31. The processing liquid is applied (supplied) to wafer W by spraying it from nozzle 31 toward wafer W.

[0071] like Figure 4 As shown, the liquid delivery unit 60 delivers the treatment liquid to the spraying unit 30. Specifically, the liquid delivery unit 60 delivers the treatment liquid toward the spraying unit 30 (nozzle 31) at a predetermined pressure. The liquid delivery unit 60 includes a liquid delivery pipe 61, a filter 63, a pressurized delivery unit 64 (pressurized delivery unit for spraying), branch pipes 62a and 62b, a first connecting valve 67, a second connecting valve 68, and a pressure measuring unit 69.

[0072] The delivery pipe 61 guides the treatment fluid to the spray section 30. Specifically, the delivery pipe 61 is connected to the upstream end of the delivery pipe 32 of the spray section 30. A filter 63 is provided in the delivery pipe 61 to remove foreign matter contained in the treatment fluid. The filter 63 collects foreign matter contained in the treatment fluid passing through the delivery pipe 61.

[0073] The pressurized delivery unit 64 receives the treatment liquid through the liquid delivery pipe 61, pressurizes the received treatment liquid, and then delivers it toward the ejection unit 30. The pressurized delivery unit 64 includes, for example, a pump 76, a pump drive unit 77, a flow measurement unit 65, and a pressure measurement unit 66.

[0074] Pump 76 has a receiving chamber for containing the processing liquid and a contraction section for contracting the receiving chamber. Pump 76 expands the receiving chamber through the contraction section to receive the processing liquid and contracts the receiving chamber through the contraction section to deliver the processing liquid. As pump 76, for example, a tubular diaphragm pump, a diaphragm pump, or a bellows pump can be used.

[0075] The pump drive unit 77 drives the pump 76 based on the operation instruction of the control device 100. Specifically, the pump drive unit 77 actuates (drives) the contraction section to contract the housing of the pump 76. For example, the pump drive unit 77 is a gas-driven type drive unit that actuates the contraction section using gas. The pump drive unit 77 can contract the housing of the pump 76 by adjusting the pressure (drive pressure) of the gas.

[0076] The flow measurement unit 65 acquires information related to the input and output volume of the processed liquid for pump 76. The flow rate of the gas used to drive pump 76 is related to the input and output volume of the processed liquid for pump 76, therefore it is information related to the input and output volume of the processed liquid for pump 76. For example, the flow measurement unit 65 measures the flow rate of the gas flowing in the connecting pipe between pump 76 and pump drive unit 77. The flow measurement unit 65 outputs the measured value to the control device 100. The pressure measurement unit 66 acquires information related to the pressure within pump 76. For example, the pressure measurement unit 66 measures the pressure in the connecting pipe between pump 76 and pump drive unit 77. The pressure measurement unit 66 outputs the measured value to the control device 100.

[0077] Branch pipe 62a branches off from the upstream portion of filter 63 in delivery pipe 61, and connects delivery pipe 61 to pump 76. Branch pipe 62b branches off from the downstream portion of filter 63 in delivery pipe 61, and connects delivery pipe 61 to pump 76.

[0078] A first connecting valve 67 is provided on branch pipe 62a, and opens and closes the connection between the liquid delivery pipe 61 and the pressurized delivery unit 64 based on the operation instruction of the control device 100. The first connecting valve 67 is, for example, a pneumatic valve. A second connecting valve 68 is provided on branch pipe 62b, and opens and closes the connection between the liquid delivery pipe 61 and the pressurized delivery unit 64 based on the operation instruction of the control device 100. The second connecting valve 68 is, for example, a pneumatic valve.

[0079] The pressure measuring unit 69 measures the pressure of the processing fluid flowing in the pipeline within the liquid delivery unit 60. For example, the pressure measuring unit 69 measures the pressure between the filter 63 and the pressurized delivery unit 64. Specifically, the pressure measuring unit 69 is provided in the branch pipe 62b and measures the pressure (hydraulic pressure) of the processing fluid within the branch pipe 62b. The pressure measuring unit 69 outputs the measured value to the control device 100.

[0080] The replenishment unit 50 replenishes the liquid delivery unit 60 with the processing liquid for delivery toward the ejection unit 30. The replenishment unit 50 includes a liquid source 51, a pressurized delivery unit 53 (pressurized delivery unit for replenishment), and a delivery pipe 55.

[0081] Liquid source 51 is the supply source of the processing liquid to replenish the liquid delivery unit 60. Pressurized delivery unit 53 delivers the processing liquid from liquid source 51 to liquid delivery unit 60. For example, pressurized delivery unit 53 temporarily stores the processing liquid supplied from liquid source 51 and delivers it to liquid delivery unit 60 in a pressurized state. Alternatively, pressurized delivery unit 53 may receive the processing liquid by drawing it from liquid source 51 and deliver the received processing liquid to liquid delivery unit 60. Pressurized delivery unit 53 may include, for example, a pump 56, a pump drive unit 57, and a pressure measuring unit 54.

[0082] Pump 56 draws in the treatment liquid from liquid source 51 and delivers the drawn-in treatment liquid toward ejection section 30. Pump 56 has, for example, a receiving chamber for containing the treatment liquid and a contraction section for contracting the receiving chamber. Pump 56 expands the receiving chamber by the contraction section to receive the treatment liquid and contracts the receiving chamber by the contraction section to deliver the treatment liquid. As pump 56, for example, a tubular diaphragm pump, a diaphragm pump, or a bellows pump can be used.

[0083] The pump drive unit 57 drives the pump 56 based on the operation instruction of the control device 100. Specifically, the pump drive unit 57 actuates (drives) the contraction section to contract the housing of the pump 56. For example, the pump drive unit 57 is a pneumatic type drive unit that actuates the contraction section using gas. The pump drive unit 57 can contract the housing of the pump 56 by adjusting the pressure of the gas (hereinafter referred to as "drive pressure").

[0084] The pressure measuring unit 54 acquires information related to the pressure within the pump 56. For example, the pressure measuring unit 54 is connected to the connecting pipe between the pump 56 and the pump drive unit 57, and is used to measure the pressure within that connecting pipe. The pressure measuring unit 54, for example, measures the pressure of the gas used to drive the pump 56. The pressure measuring unit 54 outputs the measured value to the control device 100.

[0085] The delivery pipe 55 guides the treatment fluid from the pressurized delivery unit 53 (pump 56) to the delivery unit 60. Specifically, the delivery pipe 55 is connected to the upstream end of the delivery pipe 61 of the delivery unit 60. That is, the delivery pipe 61 is connected between the replenishment unit 50 and the delivery unit 60 via a filter 63. The filter 63 removes foreign matter contained in the treatment fluid (the treatment fluid replenished from the replenishment unit 50 to the delivery unit 60) flowing in the flow path within the delivery pipe 61.

[0086] The first connecting part 80 connects the replenishment part 50 and the liquid delivery part 60. The first connecting part 80 includes, for example, a switching valve 71. The switching valve 71 opens and closes between the replenishment part 50 and the liquid delivery part 60 based on the operation instruction of the control device 100. The switching valve 71 is provided at the connection between the outlet pipe 55 of the replenishment part 50 and the liquid delivery pipe 61 of the liquid delivery part 60. The switching valve 71 is, for example, a pneumatic valve.

[0087] The switching valve 71 can open and close at an opening change rate smaller than that of at least one of the first connecting valve 67 and the second connecting valve 68. The opening change rate is the proportion of the valve's opening change per unit time. When switching the valve from a closed state to an open state, the opening change rate is the rate of increase in the valve's opening. When switching the valve from an open state to a closed state, the opening change rate is the rate of decrease in the valve's opening. For example, the switching valve 71 can be a valve that opens and closes at an operating speed slower than that of at least one of the first connecting valve 67 and the second connecting valve 68. Alternatively, the opening and closing action of the switching valve 71 can be controlled by the control device 100 to make its operating speed slower than that of at least one of the first connecting valve 67 and the second connecting valve 68. The opening and closing action of the switching valve 71 can be controlled by the control device 100 to make the opening change gradually, thereby satisfying the above-mentioned relationship of opening change rate.

[0088] The second connecting part 90 connects the liquid delivery part 60 and the spraying part 30. The second connecting part 90 includes, for example, a spraying valve 72. The spraying valve 72 opens and closes between the liquid delivery part 60 and the spraying part 30 based on the operation command of the control device 100. The spraying valve 72 is located at the connection point between the liquid delivery pipe 61 of the liquid delivery part 60 and the liquid delivery pipe 32 of the spraying part 30. The spraying valve 72 is, for example, a pneumatic valve.

[0089] The relationship between the opening change rate of the ejector valve 72 and the first connecting valve 67 (second connecting valve 68) can be the same as the relationship between the opening change rate of the switching valve 71 and the first connecting valve 67 (second connecting valve 68). That is, the ejector valve 72 can be opened and closed at an opening change rate smaller than that of at least one of the first connecting valve 67 and the second connecting valve 68.

[0090] (Control device)

[0091] Next, refer to Figure 5 and Figure 6 The control device 100 will be described in detail. The control device 100 is configured to perform the following actions: reduce the pressure difference between the replenishment unit 50 and the delivery unit 60, and then open the switching valve 71; and with the switching valve 71 open, cause the replenishment unit 50 to start replenishing the delivery unit 60 with the processing fluid.

[0092] like Figure 5 As shown, the control device 100 includes an action command holding unit 102, a first pressure acquisition unit 103, a second pressure acquisition unit 104, a flow acquisition unit 105, a hydraulic pressure acquisition unit 106, and a processing fluid supply control unit 101 as functional modules (hereinafter referred to as "functional modules").

[0093] The action command holding unit 102 holds action commands for specifying the liquid treatment process executed in the liquid treatment unit U1. The action commands may include a target value (set value) for the ejection pressure when the treatment liquid is ejected from the nozzle 31, the execution time for ejecting the treatment liquid from the nozzle 31, target values ​​(set values) for the replenishment pressure and replenishment flow rate, and the execution time for replenishing the treatment liquid from the replenishment unit 50 to the liquid delivery unit 60.

[0094] The first pressure acquisition unit 103 acquires a measured value from the pressure measurement unit 54. Specifically, the first pressure acquisition unit 103 acquires a measured value representing the pressure (driving pressure for pump 56) in the connecting pipe between pump 56 and pump drive unit 57 in replenishment unit 50. The first pressure acquisition unit 103 outputs the acquired measured value to the processing fluid supply control unit 101.

[0095] The second pressure acquisition unit 104 acquires a measured value from the pressure measurement unit 66. Specifically, the second pressure acquisition unit 104 acquires a measured value representing the pressure (driving pressure for pump 76) in the connecting pipe between pump 76 and pump drive unit 77 in the liquid delivery unit 60. The second pressure acquisition unit 104 outputs the acquired measured value to the processing liquid supply control unit 101.

[0096] The flow acquisition unit 105 acquires a measured value from the flow measurement unit 65. Specifically, the flow acquisition unit 105 acquires a measured value indicating the flow rate of the gas used to drive the pump 76 in the connecting pipe between the pump 76 and the pump drive unit 77. The flow acquisition unit 105 outputs the acquired measured value to the processing liquid supply control unit 101.

[0097] The hydraulic acquisition unit 106 acquires measured values ​​from the pressure measuring unit 69. Specifically, the hydraulic acquisition unit 106 acquires measured values ​​representing the pressure of the treatment fluid between the filter 63 and the pressurized delivery unit 64 (pump 76). The hydraulic acquisition unit 106 outputs the acquired measured values ​​to the treatment fluid supply control unit 101.

[0098] The processing fluid supply control unit 101 controls the processing fluid supply unit 29 to cause the nozzle 31 to spray the processing fluid. The processing fluid supply control unit 101 may include, for example, a spray preparation unit 111, a spray control unit 112, a discharge preparation unit 113, a discharge control unit 114, a replenishment preparation unit 115, and a replenishment control unit 116 as functional modules.

[0099] The ejection preparation unit 111 is configured to prepare for ejecting the treatment fluid from the nozzle 31. Specifically, the ejection preparation unit 111 adjusts the pressure of the treatment fluid in the delivery unit 60 (hereinafter referred to as "pressure in the delivery unit 60") before starting to eject the treatment fluid from the nozzle 31. With the ejection valve 72 closed, the ejection preparation unit 111 changes the pressure in the delivery unit 60 to reduce the pressure difference between the delivery unit 60 and the ejection unit 30. The ejection preparation unit 111 controls the pump drive unit 77, for example, based on a measurement value obtained from the pressure measuring unit 69, to bring the pressure in the delivery unit 60 close to a set value. The ejection preparation unit 111 adjusts the drive pressure from the pump drive unit 77 to the pump 76 according to the deviation between the measurement value from the pressure measuring unit 69 and the set value, so that the deviation is close to zero. The ejection preparation unit 111 opens the ejection valve 72 when the pressure difference between the delivery unit 60 and the ejection unit 30 has been reduced.

[0100] The ejection control unit 112 is configured to eject the processing liquid from the nozzle 31 toward the wafer W. Specifically, the ejection control unit 112 ejects the processing liquid from the nozzle 31 toward the wafer W when the pressure difference between the liquid delivery unit 60 and the ejection unit 30 is reduced by the ejection preparation unit 111 and the ejection valve 72 is opened. The ejection control unit 112 controls the pressurized delivery unit 64 (pump drive unit 77) to make the pressure of the processing liquid delivered to the nozzle 31 (hereinafter referred to as "ejection pressure") follow a target value. The ejection control unit 112 maintains the target value at a fixed set value Pd, thereby ejecting the processing liquid from the nozzle 31 toward the wafer W at a substantially fixed flow rate. The ejection control unit 112 can adjust the drive pressure from the pump drive unit 77 to the pump 76 based on the deviation between the measured value of the pressure measuring unit 69 and the aforementioned set value Pd, so that the deviation is close to zero.

[0101] The discharge preparation unit 113 is configured to prepare for the process of returning the treatment fluid from the delivery unit 60 to the replenishment unit 50 (hereinafter referred to as "discharge"). Specifically, before starting discharge, the discharge preparation unit 113 adjusts the pressure of the treatment fluid in the replenishment unit 50 (hereinafter referred to as "pressure in the replenishment unit 50") and the pressure in the delivery unit 60, thereby reducing the pressure difference between the replenishment unit 50 and the delivery unit 60. The discharge preparation unit 113 opens the switching valve 71 when the pressure difference between the replenishment unit 50 and the delivery unit 60 has been reduced.

[0102] The discharge control unit 114 is configured to discharge the processed liquid from the delivery unit 60 back to the replenishment unit 50. The discharge control unit 114 begins discharging the processed liquid from the pressurized delivery unit 64 (pump 76) to the pressurized delivery unit 53 (pump 56) after the pressure difference between the replenishment unit 50 and the delivery unit 60 has been reduced by the discharge preparation unit 113. For example, the discharge control unit 114 can control the pressurized delivery unit 64 (pump drive unit 77) and the pressurized delivery unit 53 (pump drive unit 57) to maintain the pressure (hereinafter referred to as "discharge pressure") of the processed liquid delivered from the pressurized delivery unit 64 to the pressurized delivery unit 53 at a substantially constant level, and maintain the flow rate of the processed liquid per unit time (hereinafter referred to as "discharge flow rate") at a substantially constant level.

[0103] The replenishment preparation unit 115 is configured to prepare for replenishing the processing fluid from the replenishment unit 50 to the delivery unit 60. Specifically, before replenishing the processing fluid from the replenishment unit 50 to the delivery unit 60, the replenishment preparation unit 115 reduces the pressure difference between the replenishment unit 50 and the delivery unit 60, and opens the switching valve 71 while the pressure difference is reduced. For example, the replenishment preparation unit 115 changes the pressure in the replenishment unit 50 while the switching valve 71 is closed, so as to reduce the pressure difference between the replenishment unit 50 and the delivery unit 60. The replenishment preparation unit 115 only needs to reduce the pressure difference between the replenishment unit 50 and the delivery unit 60 after replenishment preparation to be at least smaller than the pressure difference before replenishment preparation began. As an example, the replenishment preparation unit 115 changes the pressure in the replenishment unit 50 so that the pressure in the replenishment unit 50 is approximately the same as the pressure in the delivery unit 60.

[0104] As an example of supplementary preparation, the supplementary preparation unit 115 first controls the pressurized delivery unit 53 (pump drive unit 57) with the switching valve 71 closed to reduce the pressure difference between the replenishment unit 50 and the delivery unit 60. The supplementary preparation unit 115 can control the pump drive unit 57 to make the measured value of the pressure measuring unit 54 close to the set value Pd. For example, the supplementary preparation unit 115 adjusts the drive pressure from the pump drive unit 57 to the pump 56 based on the deviation between the measured value of the pressure measuring unit 54 and the set value Pd, so that the deviation is close to zero. Next, with the switching valve 71 open and the ejection valve 72 and the second connecting valve 68 closed, the supplementary preparation unit 115 controls the pressurized delivery unit 53 based on the measured value of the pressure measuring unit 69 to make the pressure between the pressurized delivery unit 53 and the pressurized delivery unit 64 close to the set value (e.g., the set value Pd). For example, the supplementary preparation unit 115 adjusts the driving pressure from the pump drive unit 57 to the pump 56 based on the deviation between the measured value of the pressure measuring unit 69 and the set value Pd, so that the deviation is close to zero.

[0105] Next, with the switching valve 71 and the ejection valve 72 closed and the second connecting valve 68 open, the replenishment preparation unit 115 controls the pressurized delivery unit 64 based on the measured value of the pressure measuring unit 69, so that the pressure in the liquid delivery unit 60 is close to the aforementioned set value (e.g., set value Pd). For example, the replenishment preparation unit 115 adjusts the drive pressure from the pump drive unit 77 to the pump 76 based on the deviation between the pressure measuring unit 69 and the set value Pd, so that the deviation is close to zero.

[0106] The replenishment control unit 116 is configured to replenish the processing fluid from the replenishment unit 50 to the delivery unit 60. Specifically, the replenishment control unit 116 begins replenishing the processing fluid from the replenishment unit 50 to the delivery unit 60 when the switching valve 71 is open via the replenishment preparation unit 115 (after the switching valve 71 is open). As an example, the replenishment control unit 116 opens the switching valve 71 via the replenishment preparation unit 115, sequentially performs pressure adjustment in the replenishment unit 50, pressure adjustment in the delivery unit 60, and re-switching the switching valve 71 to the open state, and then begins replenishing the processing fluid to the delivery unit 60. When the pressure difference between the replenishment unit 50 and the delivery unit 60 is reduced by the replenishment preparation unit 115, the replenishment control unit 116 replenishes the processing fluid from the replenishment unit 50 to the delivery unit 60.

[0107] The supplementary control unit 116 controls either the pressurized delivery unit 53 or the pressurized delivery unit 64 to make the pressure of the processed fluid (hereinafter referred to as "supplementary pressure") delivered from the pressurized delivery unit 53 to the pressurized delivery unit 64 follow a target value. The supplementary control unit 116 controls the other of the pressurized delivery unit 53 (pump drive unit 57) and the pressurized delivery unit 64 (pump drive unit 77) to perform follow-up control that makes the supplementary pressure follow the target value, and to make the flow rate of the processed fluid per unit time (hereinafter referred to as "supplementary flow rate") follow the target value. The supplementary control unit 116 controls the pressurized delivery unit 53 and the pressurized delivery unit 64 from the start of supplementation until the completion of supplementation, thereby performing follow-up control of the supplementary pressure and follow-up control of the supplementary flow rate. At least a portion of the execution period of the follow-up control of the supplementary pressure and the execution period of the follow-up control of the supplementary flow rate overlap. As an example, the supplementary control unit 116 controls the pressurized delivery unit 53 to make the supplementary pressure follow the target value, and controls the pressurized delivery unit 64 to make the supplementary flow rate follow the target value.

[0108] In controlling the replenishment pressure to follow the target value, the replenishment control unit 116 can set the target value of the replenishment pressure to the target value of the ejection pressure (set value Pd) during the period from the start to the end of replenishment. For example, the replenishment control unit 116 adjusts the drive pressure from the pump drive unit 57 to the pump 56 based on the deviation between the measured value from the pressure measuring unit 69 and the set value Pd, so that the deviation is close to zero. In controlling the replenishment flow rate to follow the target value, the replenishment control unit 116 can set the target value of the replenishment flow rate to a fixed value during the period from the start to the end of replenishment. For example, the replenishment control unit 116 can adjust the drive pressure from the pump drive unit 77 to the pump 76 based on the measured value from the flow measuring unit 65, so that the replenishment flow rate follows the target value. Furthermore, the replenishment control unit 116 can use a flow meter installed in the delivery pipe 61 or the branch pipe 62b instead of the flow measuring unit 65 to perform replenishment flow rate tracking control.

[0109] The control device 100 comprises one or more control computers. For example, the control device 100 has... Figure 6 The circuit 120 shown is equipped with one or more processors 121, memory 122, storage device 123, input / output port 124, and timer 125.

[0110] Storage device 123 includes, for example, a computer-readable storage medium such as a hard disk. The storage medium records a program for causing the coating / developing apparatus 2 to perform the liquid treatment process described later. The storage medium can be a removable medium such as a non-volatile semiconductor memory, a disk, or an optical disk. Memory 122 temporarily records the program loaded from the storage medium of storage device 123 and the calculation results of processor 121. Processor 121 executes the aforementioned program in cooperation with memory 122 to constitute the aforementioned functional modules. Input / output port 124 performs electrical signal input / output with pressurized delivery units 53 and 64, switching valve 71, first connecting valve 67, second connecting valve 68, ejection valve 72, pressure measuring units 54, 66, 69, flow measuring unit 65, etc. Timer 125 measures elapsed time, for example, by counting reference pulses of a fixed period.

[0111] Furthermore, the hardware structure of the control device 100 is not necessarily limited to constructing each functional module through a program. For example, each functional module of the control device 100 may also be constructed from dedicated logic circuits or ASICs (Application Specific Integrated Circuits) obtained by integrating such logic circuits.

[0112] [Processing fluid supply process]

[0113] Next, refer to Figures 7-14The following describes a liquid processing process executed by the control device 100 as an example of a control method for a substrate processing apparatus. Figure 7 This is a flowchart illustrating an example of a liquid processing procedure.

[0114] like Figure 7 As shown, the control device 100 first executes steps S01 and S02 sequentially. In step S01, for example, as preparation for ejecting the processing liquid from the nozzle 31, the ejection preparation unit 111 controls the processing liquid supply unit 29 to reduce the pressure difference between the liquid delivery unit 60 and the ejection unit 30. In step S02, for example, the ejection control unit 112 controls the processing liquid supply unit 29 in a state where the pressure difference between the liquid delivery unit 60 and the ejection unit 30 has been reduced, so that the nozzle 31 ejects the processing liquid toward the wafer W. Details of the ejection preparation process and the ejection process will be described later.

[0115] Next, the control device 100 sequentially executes steps S03 and S04. In step S03, for example, as preparation for discharging the treatment fluid from the delivery section 60 back to the replenishment section 50, the discharge preparation section 113 controls the treatment fluid supply section 29 to reduce the pressure difference between the replenishment section 50 and the delivery section 60. In step S04, for example, the discharge control section 114 controls the treatment fluid supply section 29 in a state where the pressure difference between the replenishment section 50 and the delivery section 60 has been reduced, so as to return the treatment fluid from the delivery section 60 to the replenishment section 50 (perform discharge). Details of the discharge preparation process and the discharge process will be described later.

[0116] Next, the control device 100 sequentially executes steps S05 and S06. In step S05, for example, as preparation for replenishing the processing liquid from the replenishment unit 50 to the liquid delivery unit 60, the replenishment preparation unit 115 controls the processing liquid supply unit 29 to reduce the pressure difference between the replenishment unit 50 and the liquid delivery unit 60. In step S06, for example, the replenishment control unit 116 controls the processing liquid supply unit 29 when the pressure difference between the replenishment unit 50 and the liquid delivery unit 60 has been reduced, so that the replenishment unit 50 replenishes the processing liquid to the liquid delivery unit 60. The replenishment preparation process and the replenishment process will be described later. Through the above process, a series of liquid processing processes are completed. Furthermore, during the liquid processing, the discharge preparation process and discharge process in steps S03 and S04 can be omitted, or discharge can be performed once in each liquid processing of multiple liquid processing processes.

[0117] (Preparation process for spraying)

[0118] Figure 8 (a) is a flowchart illustrating an example of the ejection preparation process in step S01. For example... Figure 8As shown in (a), the control device 100 first executes step S11. In step S11, with the switching valve 71, the spray valve 72, the first connecting valve 67, and the second connecting valve 68 closed, the spray preparation unit 111 switches the second connecting valve 68 from the closed state to the open state.

[0119] Next, the control device 100 executes steps S12 and S13. In step S12, the ejection preparation unit 111 adjusts the pressure within the liquid delivery unit 60. For example, Figure 9 As shown in (a), the ejection preparation unit 111 adjusts the pressure within the liquid delivery unit 60 based on the measured value from the pressure measuring unit 69. The ejection preparation unit 111 can control the pump drive unit 77 to make the measured value from the pressure measuring unit 69 follow (approach) the set value Pd of the ejection pressure. For example, the ejection preparation unit 111 can adjust the drive pressure from the pump drive unit 77 to the pump 76 based on the deviation between the measured value from the pressure measuring unit 69 and the set value Pd, so that the deviation approaches zero. Figure 9 In (a), thick lines represent pipelines that are directly or indirectly connected to the pressure measuring unit 69, blank spaces represent valves in the open state, and black lines represent valves in the closed state.

[0120] The ejection preparation unit 111 repeats steps S12 and S13 until a predetermined time has elapsed since the start of step S12. The predetermined time is pre-determined so that the pressure adjustment within the delivery unit 60 is repeated until the measured value from the pressure measuring unit 69 is approximately equal to the set value Pd, and this predetermined time is stored in the operation command holding unit 102. Furthermore, the ejection preparation unit 111 may repeat step S12 until the pressure within the delivery unit 60 reaches a set range including the set value Pd, rather than until the predetermined time has elapsed. By performing steps S12 and S13, the ejection preparation unit 111 reduces the pressure difference between the delivery unit 60 and the ejection unit 30 while the ejection valve 72 is closed.

[0121] If the predetermined time has elapsed, the ejection preparation unit 111 executes step S14. In step S14, for example, while maintaining the switching valve 71 and the first connecting valve 67 in a closed state and the second connecting valve 68 in an open state, the ejection preparation unit 111 switches the ejection valve 72 from a closed state to an open state. At this time, the ejection preparation unit 111 can switch the ejection valve 72 from a closed state to an open state at a smaller rate of change of opening (slower operating speed) than the second connecting valve 68. Through these steps, the ejection preparation unit 111 completes the ejection preparation process.

[0122] (Ejection process)

[0123] Figure 8(b) is a flowchart illustrating the ejection process in step S02. For example, in a state where the pressure difference between the liquid delivery section 60 and the ejection section 30 is reduced by the ejection preparation section 111 and the ejection valve 72 is opened, as shown... Figure 8 As shown in (b), the control device 100 executes steps S21 and S22. In step S21, the ejection control unit 112 adjusts the ejection pressure of the treatment fluid delivered to the nozzle 31. In step S21, the ejection control unit 112 starts controlling the pressurized delivery unit 64 (the contraction section of the pump 76) to deliver the treatment fluid to the ejection unit 30 at a set ejection pressure Pd. As a result, the ejection control unit 112 causes the nozzle 31 to start ejecting the treatment fluid while the ejection valve 72 is open. The ejection control unit 112 continues to adjust the ejection pressure after ejection begins.

[0124] For example, Figure 9 As shown in (b), the ejection control unit 112 adjusts the pump drive unit 77 (the pressure applied to the treatment fluid from the pump 76) based on the measured value from the pressure measuring unit 69. The ejection control unit 112 can adjust the pump drive unit 77 so that the ejection pressure of the treatment fluid follows the set value Pd. The ejection control unit 112 can adjust the drive pressure from the pump drive unit 77 to the pump 76 based on the deviation between the measured value from the pressure measuring unit 69 and the set value Pd, so that the deviation is close to zero. The ejection control unit 112 repeats the processes of steps S21 and S22 until a predetermined time has elapsed since the start of step S21.

[0125] If a predetermined time has elapsed in step S22, the control device 100 executes step S23. In step S23, the ejection control unit 112, while maintaining the switching valve 71 and the first connecting valve 67 in a closed state, switches the second connecting valve 68 and the ejection valve 72 from an open state to a closed state, respectively. In step S23, the ejection control unit 112 switches the ejection valve 72 from an open state to a closed state with a smaller rate of change of opening than the second connecting valve 68 (slower operating speed). After the ejection valve 72 is closed, the pressure in the liquid delivery unit 60 is maintained at a value close to the set value Pd. The predetermined time is determined based on the operating command held by the operating command holding unit 102, for example, it is predetermined based on the amount of processing liquid used in each liquid processing. The control device 100 can control the rotation holding unit 20 to rotate the wafer W during the execution of step S02, thereby forming a resist coating film on the surface Wa of the wafer W.

[0126] (Preparation process)

[0127] Figure 10 This is a flowchart illustrating an example of the discharge preparation process in step S03. For example... Figure 10As shown, the control device 100 first executes step S31. In step S31, the discharge preparation unit 113 adjusts the pressure in the replenishment unit 50 with the switching valve 71 closed, so as to reduce the pressure difference between the replenishment unit 50 and the delivery unit 60. The discharge preparation unit 113 controls the pump drive unit 57 (pressure in the pump 56) to make the pressure in the replenishment unit 50 approach the set value Pd of the ejection pressure from the standby pressure Pw1. The standby pressure Pw1 is a set value that maintains the pressure in the replenishment unit 50 during the execution of steps S01 and S02, and can be greater than the set value Pd of the ejection pressure.

[0128] Next, the control device 100 executes step S32. In step S32, the discharge preparation unit 113, while maintaining the first connecting valve 67, the second connecting valve 68, and the ejection valve 72 in a closed state, switches the switching valve 71 from a closed state to an open state. At this time, the discharge preparation unit 113 can switch the switching valve 71 from a closed state to an open state at an opening change rate smaller than that of the second connecting valve 68.

[0129] Next, the control device 100 executes steps S33 and S34. In step S33, the discharge preparation unit 113 readjusts the pressure in the replenishment unit 50 based on the measurement value from the pressure measuring unit 69. The discharge preparation unit 113 controls, for example, the pump drive unit 57 to bring the measurement value from the pressure measuring unit 69 close to the set value Pd. Furthermore, in step S33, the switching valve 71 is opened to connect the replenishment unit 50 to the liquid delivery unit 60, but the pressurized delivery unit 64 of the liquid delivery unit 60 is disconnected from the pipeline connected to the pressure measuring unit 69, thus adjusting the pressure in the replenishment unit 50. The discharge preparation unit 113 repeats steps S33 and S34 until a predetermined time has elapsed since the start of step S33. The predetermined time is predetermined so that the pressure adjustment in the replenishment unit 50 is repeated until the pressure in the replenishment unit 50 is approximately equal to the set value Pd, and this predetermined time is stored in the operation command holding unit 102.

[0130] When it is determined in step S34 that a predetermined time has elapsed, the control device 100 executes step S35. In step S35, while the discharge preparation unit 113 maintains the second connecting valve 68 and the ejection valve 72 in a closed state, the switching valve 71 is switched from an open state to a closed state, and the first connecting valve 67 is switched from a closed state to an open state. At this time, the discharge preparation unit 113 can switch the switching valve 71 from an open state to a closed state at a smaller rate of change of opening than the first connecting valve 67 (slower operating speed).

[0131] Next, the control device 100 executes steps S36 and S37. In step S36, the discharge preparation unit 113 adjusts the pressure in the delivery unit 60 based on the measurement value of the pressure measuring unit 69. The discharge preparation unit 113 controls, for example, the pump drive unit 77 to make the measurement value of the pressure measuring unit 69 close to the set value Pd. The discharge preparation unit 113 repeats the process of steps S36 and S37 until a predetermined time has elapsed since the start of step S36. The predetermined time is predetermined so that the adjustment of the pressure in the delivery unit 60 is repeated until the pressure in the delivery unit 60 is approximately consistent with the set value Pd, and this predetermined time is stored in the operation command holding unit 102.

[0132] When it is determined in step S37 that a predetermined time has elapsed, the discharge preparation unit 113 executes step S38. In step S38, the discharge control unit 114, while maintaining the second connecting valve 68 and the ejection valve 72 in a closed state and the first connecting valve 67 in an open state, switches the switching valve 71 from a closed state to an open state. At this time, the discharge control unit 114 can switch the switching valve 71 from a closed state to an open state at a smaller rate of change of opening than the first connecting valve 67 (slower operating speed). Through the above steps, the discharge preparation unit 113 ends the discharge preparation process.

[0133] (Emission control)

[0134] Figure 11 This is a flowchart illustrating an example of a discharge control process. For example... Figure 11 As shown, the control device 100 first executes steps S41 and S42. In step S41, the discharge control unit 114 adjusts the discharge pressure and discharge flow rate of the processed liquid supplied from the pressurized delivery unit 64 of the liquid delivery unit 60 to the pressurized delivery unit 53 of the replenishment unit 50. In step S41, the discharge control unit 114 begins to control the pressurized delivery unit 53 and the pressurized delivery unit 64, thereby starting to adjust the discharge pressure and discharge flow rate, and continues to adjust the discharge pressure and discharge flow rate after discharge begins. For example, the discharge control unit 114 controls the pump drive unit 57 to reduce the pressure inside the pump 76 so that the discharge pressure (measured by the pressure measuring unit 69) follows the target value. In addition, the discharge control unit 114 controls the pump drive unit 77 based on the measured value of the flow measuring unit 65 so that the discharge flow rate follows the target value. The aforementioned target values ​​of discharge pressure and discharge flow rate can be set to fixed values, for example, until discharge is completed. The discharge control unit 114 repeats steps S41 and S42 until a predetermined time has elapsed since the start of step S41. The predetermined time is predetermined so that the discharge ends within that time, and the predetermined time is stored in the action command holding unit 102.

[0135] When it is determined in step S42 that a predetermined time has elapsed, the control device 100 executes step S43. In step S43, while maintaining the second connecting valve 68 and the ejection valve 72 in a closed state, the discharge control unit 114 switches the switching valve 71 and the first connecting valve 67 from the open state to the closed state, respectively. At this time, the discharge control unit 114 can switch the switching valve 71 from the open state to the closed state at a smaller rate of change of opening than the first connecting valve 67 (slower operating speed). Through the above steps, the discharge control unit 114 ends the discharge control process.

[0136] (Supplementary preparations)

[0137] Figure 12 This is a flowchart illustrating an example of the supplementary preparation process for step S05. For example... Figure 12 As shown, the control device 100 first executes step S51. In step S51, the replenishment preparation unit 115 adjusts the pressure in the replenishment unit 50 while the switching valve 71 is closed, so as to reduce the pressure difference between the replenishment unit 50 and the delivery unit 60. For example, Figure 14 As shown in (a), the supplementary control unit 116 controls the pressurized delivery unit 53 (pump drive unit 57) based on the measured value of the pressure measuring unit 54.

[0138] The supplementary control unit 116 can control the pump drive unit 57 to bring the pressure in the supplementary unit 50 close to the set value Pd of the discharge pressure. For example, the supplementary control unit 116 can adjust the drive pressure from the pump drive unit 57 to the pump 56 based on the deviation between the measured value from the pressure measuring unit 54 and the set value Pd, so that the deviation is close to zero. In the case where discharge is not performed (steps S03 and S04 are omitted), the pressure in the supplementary unit 50 is maintained at a standby pressure Pw1 before the start of step S05. Therefore, in this case, the supplementary control unit 116 controls the pump drive unit 57 to bring the pressure in the supplementary unit 50 from the standby pressure Pw1 close to the set value Pd.

[0139] Next, the control device 100 executes step S52. In step S52, as follows... Figure 14 As shown in (b), the replenishment preparation unit 115 switches the switching valve 71 from the closed state to the open state while keeping the first connecting valve 67, the second connecting valve 68, and the ejection valve 72 in the closed state. At this time, the replenishment preparation unit 115 can switch the switching valve 71 from the closed state to the open state at a smaller rate of change of opening (slower operating speed) than the second connecting valve 68.

[0140] Next, the control device 100 executes steps S53 and S54. In step S53, the replenishment preparation unit 115 readjusts the pressure within the replenishment unit 50 based on the measured value from the pressure measuring unit 69. Specifically, the replenishment preparation unit 115 controls the pressurization delivery unit 53 to bring the pressure between the pressurization delivery unit 53 and the pressurization delivery unit 64 close to a predetermined set value. For example, the replenishment preparation unit 115 may control the pump drive unit 57 to bring the measured value from the pressure measuring unit 69 close to the set value Pd. For example, the replenishment preparation unit 115 adjusts the drive pressure from the pump drive unit 57 to the pump 56 based on the deviation between the measured value from the pressure measuring unit 69 and the set value Pd, so that the deviation is close to zero. The replenishment preparation unit 115 repeats steps S53 and S54 until a predetermined time has elapsed since the start of step S53. A predetermined time is determined so that the pressure in the replenishment unit 50 (the pressure between the pressurization delivery unit 53 and the pressurization delivery unit 64) is approximately consistent with the set value Pd within that time, and the predetermined time is stored in the action command holding unit 102.

[0141] When it is determined in step S54 that a predetermined time has elapsed, the control device 100 executes step S55. In step S55, if... Figure 14 As shown in (c), while maintaining the first connecting valve 67 and the ejection valve 72 in a closed state, the replenishment preparation unit 115 switches the switching valve 71 from an open state to a closed state and switches the second connecting valve 68 from a closed state to an open state. At this time, the replenishment preparation unit 115 can switch the switching valve 71 from an open state to a closed state at a smaller rate of change of opening (slower operating speed) than the second connecting valve 68.

[0142] Next, the control device 100 executes steps S56 and S57. In step S56, the replenishment preparation unit 115 adjusts the pressure within the delivery unit 60 based on the measured value from the pressure measuring unit 69. Specifically, the replenishment preparation unit 115 controls the pressurized delivery unit 64 (pump drive unit 77) based on the measured value from the pressure measuring unit 69, so that the pressure within the delivery unit 60 is close to the set value used in step S53. The replenishment preparation unit 115 can control the pump drive unit 77 to make the measured value from the pressure measuring unit 69 close to the set value Pd. For example, the replenishment preparation unit 115 adjusts the drive pressure from the pump drive unit 77 to the pump 76 based on the deviation between the measured value from the pressure measuring unit 69 and the set value Pd, so that the deviation is close to zero. The replenishment preparation unit 115 repeats the processing of steps S56 and S57 until a predetermined time has elapsed since the start of step S56. A predetermined time is set so that the pressure in the liquid delivery section 60 is approximately the same as the set value Pd within that time, and the predetermined time is stored in the action command holding section 102.

[0143] When it is determined in step S57 that a predetermined time has elapsed, the control device 100 executes step S58. In step S58, the supplementary control unit 116, while maintaining the second connecting valve 68 and the ejection valve 72 in a closed state and maintaining the second connecting valve 68 in an open state, switches the switching valve 71 from a closed state to an open state. At this time, the supplementary control unit 116 can switch the switching valve 71 from a closed state to an open state at a smaller rate of change of opening than the second connecting valve 68 (slower operating speed). Through the above steps, the supplementary preparation unit 115 ends the supplementary preparation process.

[0144] (Supplementary Controls)

[0145] Figure 13 This is a flowchart illustrating an example of a supplementary control process. For example... Figure 13 As shown, the control device 100 first executes steps S61 and S62. In step S61, the replenishment control unit 116 adjusts the replenishment pressure and replenishment flow rate of the processed liquid conveyed from the pressurized delivery unit 53 of the replenishment unit 50 to the pressurized delivery unit 64 of the liquid delivery unit 60. To adjust the replenishment pressure and replenishment flow rate, the replenishment control unit 116 starts replenishing the processed liquid by controlling the pressurized delivery units 53 and 64. The replenishment control unit 116 continues to adjust the replenishment pressure and replenishment flow rate after replenishment begins. Specifically, the replenishment control unit 116 controls either the pressurized delivery unit 53 or the pressurized delivery unit 64 to make the replenishment pressure follow a target value, and controls the other of the pressurized delivery units 53 and 64 to make the replenishment flow rate follow a target value. Figure 14 As shown in (d), the supplementary control unit 116 can, for example, control the pressurized delivery unit 53 (pump drive unit 57) based on the measured value of the pressure measuring unit 69, so that the supplementary pressure follows the target value. The supplementary control unit 116 can also control the pressurized delivery unit 64 (pump drive unit 77) based on the measured value of the flow measuring unit 65, so that the supplementary flow rate follows the target value.

[0146] The replenishment control unit 116 repeats steps S61 and S62 until a predetermined time has elapsed since the start of step S61. A predetermined time is predetermined to ensure that the replenishment of the treatment fluid to the delivery unit 60 (pump 76) is completed within that time, and this predetermined time is stored in the operation command holding unit 102. In controlling the replenishment pressure to follow the target value, the replenishment control unit 116 can set the target value of the replenishment pressure to the set value Pd of the ejection pressure until the predetermined time has elapsed (until the replenishment of the treatment fluid is completed). For example, the replenishment control unit 116 can adjust the drive pressure from the pump drive unit 57 to the pump 56 during the period from the start of replenishment to its completion, so that the deviation between the measured value of the pressure measuring unit 69 and the set value Pd is close to zero, maintaining this deviation at approximately zero.

[0147] When it is determined in step S62 that a predetermined time has elapsed, the control device 100 executes step S63. In step S63, while maintaining the first connecting valve 67 and the ejection valve 72 in a closed state, the supplementary control unit 116 switches the switching valve 71 and the second connecting valve 68 from an open state to a closed state, respectively. At this time, the supplementary control unit 116 switches the switching valve 71 from an open state to a closed state at a smaller rate of change of opening (slower operating speed) than that of the second connecting valve 68.

[0148] Next, the control device 100 executes step S64. In step S64, the control device 100 adjusts the pressure in pump 56 of the replenishment unit 50 and the pressure in pump 76 of the delivery unit 60, respectively. For example, the control device 100 controls the pump drive unit 57 based on the measured value of the pressure measuring unit 54, thereby adjusting the pressure in pump 56 (the pressure in the replenishment unit 50) to the standby pressure Pw1. For example, the control device 100 controls the pump drive unit 77 based on the measured value of the pressure measuring unit 66, thereby adjusting the pressure in pump 76 to the standby pressure Pw2. The standby pressure Pw2 may be smaller than the standby pressure Pw1. Through the above steps, the replenishment control unit 116 ends the replenishment control process.

[0149] [Effects of the Implementation Method]

[0150] The coating / developing apparatus 2 described above includes: an ejection section 30 having a nozzle 31 for ejecting processing liquid onto the wafer W; a liquid delivery section 60 for delivering processing liquid to the ejection section 30; a replenishment section 50 for replenishing the liquid delivery section 60 with the processing liquid delivered to the ejection section 30; a first connection section 80 having a switching valve 71 for opening and closing between the replenishment section 50 and the liquid delivery section 60; a filter 63 for removing foreign matter contained in the processing liquid replenished from the replenishment section 50 to the liquid delivery section 60; a replenishment preparation section 115 for opening the switching valve 71 after reducing the pressure difference between the replenishment section 50 and the liquid delivery section 60; and a replenishment control section 116 for causing the replenishment section 50 to begin replenishing the liquid delivery section 60 with processing liquid while the switching valve 71 is open via the replenishment preparation section 115.

[0151] The control method of the coating / developing apparatus 2 described above includes: opening the switching valve 71 after reducing the pressure difference between the replenishment section 50 and the liquid delivery section 60; and starting to replenish the processing liquid from the replenishment section 50 to the liquid delivery section 60 while the switching valve 71 is open.

[0152] Assuming that when the switching valve 71 is opened when the pressure difference between the replenishment section 50 and the delivery section 60 is large, fluctuations in the processing fluid may occur in the flow path used to replenish the processing fluid from the replenishment section 50 to the delivery section 60. These fluctuations refer to the processing fluid reciprocating within the flow path. When these fluctuations occur, the processing fluid passes through the filter 63 in a reciprocating manner, thus easily generating particles from the filter 63. In contrast, in the coating / developing apparatus 2 and the control method described above, the switching valve 71 is opened after the pressure difference between the replenishment section 50 and the delivery section 60 is reduced. Therefore, the generation of particles caused by fluctuations in the processing fluid can be suppressed. Thus, the coating / developing apparatus 2 and the control method described above are useful for reducing particles in the processing fluid ejected onto the wafer W.

[0153] In the above embodiment, the filter 63 is disposed within the liquid delivery section 60. When the switching valve 71 is opened when the pressure difference between the replenishment section 50 and the liquid delivery section 60 is large, fluctuations in the processing liquid within the liquid delivery section 60 may occur, corresponding to the degree of particulate generation from the filter 63. In contrast, in the above configuration, the switching valve 71 is opened after the pressure difference between the replenishment section 50 and the liquid delivery section 60 is reduced. Therefore, it is useful for suppressing the generation of particulates caused by fluctuations in the processing liquid within the liquid delivery section 60.

[0154] In the above embodiment, the liquid delivery unit 60 includes a liquid delivery pipe 61 connecting the replenishment unit 50 and the discharge unit 30 via a filter 63, a pressurized delivery unit 64 receiving treatment liquid from the replenishment unit 50 via the liquid delivery pipe 61 and discharging treatment liquid to the discharge unit 30 via the liquid delivery pipe 61, and a second connecting valve 68 opening and closing between the liquid delivery pipe 61 and the pressurized delivery unit 64. The replenishment unit 50 includes a liquid source 51 and a pressurized delivery unit 53 discharging treatment liquid from the liquid source 51 to the liquid delivery unit 60. The replenishment control unit 116 controls either the pressurized delivery unit 53 or the pressurized delivery unit 64 to make the replenishment pressure from the pressurized delivery unit 53 to the pressurized delivery unit 64 follow a target value. The replenishment control unit 116 controls the other of the pressurized delivery unit 53 and the pressurized delivery unit 64 to make the replenishment flow rate from the pressurized delivery unit 53 to the pressurized delivery unit 64 follow a target value. In this case, the replenishment flow rate and the pressure of the treatment liquid being replenished can be adjusted. As a result, the treatment fluid can be replenished using hydraulic pressure suitable for reducing particulate matter.

[0155] In the above embodiment, the coating / developing apparatus 2 includes: an ejection valve 72 that opens and closes the liquid delivery section 60 and the ejection section 30; an ejection preparation section 111 that changes the pressure within the liquid delivery section 60 to reduce the pressure difference between the liquid delivery section 60 and the ejection section 30, and then opens the ejection valve 72; and an ejection control section 112 that, with the ejection valve 72 open by the ejection preparation section 111, causes the nozzle 31 to begin ejecting the processing liquid onto the wafer W. In this case, since the ejection valve 72 is opened while the pressure difference between the liquid delivery section 60 and the ejection section 30 is reduced, fluctuations in the processing liquid that occur along with the opening of the ejection valve 72 can be suppressed. Therefore, this is more useful for reducing particulate matter in the processing liquid ejected onto the wafer W.

[0156] In the above embodiment, the liquid delivery unit 60 includes: a liquid delivery pipe 61 that connects the replenishment unit 50 to the ejection unit 30 via a filter 63; a pressurized delivery unit 64 that receives the processing liquid from the replenishment unit 50 via the liquid delivery pipe 61 and delivers the processing liquid to the ejection unit 30 via the liquid delivery pipe 61; and a second connecting valve 68 that opens and closes the liquid delivery pipe 61 and the pressurized delivery unit 64. The switching valve 71 opens and closes at a smaller rate of change than the second connecting valve 68. As the switching valve 71 opens and closes, hydraulic pressure fluctuates during the opening and closing operation. In this structure, by opening and closing the switching valve 71 at a small rate of change, abrupt fluctuations in the hydraulic pressure acting on the filter 63 are suppressed. Therefore, this is more useful for reducing particulate matter in the processing liquid ejected onto the wafer W.

[0157] In the above embodiment, the replenishment preparation unit 115 changes the pressure within the replenishment unit 50 while the switching valve 71 is closed, thereby reducing the pressure difference between the replenishment unit 50 and the delivery unit 60. In this case, since the pressure within the replenishment unit 50 is changed before the switching valve 71 is opened to reduce the pressure difference between the replenishment unit 50 and the delivery unit 60, fluctuations in the processed liquid that occur when the switching valve 71 is opened can be suppressed.

[0158] In the above embodiment, the coating / developing apparatus 2 includes an ejection control unit 112, which controls the pressurized delivery unit 64 to ensure that the ejection pressure of the treatment liquid delivered to the nozzle 31 follows a target value. The replenishment preparation unit 115 sets the target value of the replenishment pressure to the target value of the ejection pressure during the control of ensuring the replenishment pressure follows the target value until the replenishment of the treatment liquid is completed. In this case, during the replenishment of the treatment liquid, fluctuations in the pressure acting on the filter 63 are suppressed, thus further suppressing the generation of particles from the filter 63.

[0159] In the above embodiment, the coating / developing apparatus 2 includes an ejection valve 72 that opens and closes the liquid delivery unit 60 and the ejection unit 30. The liquid delivery unit 60 includes: a liquid delivery pipe 61 that connects the replenishment unit 50 and the ejection unit 30 via a filter 63; a pressurized delivery unit 64 that receives the processing liquid from the replenishment unit 50 via the liquid delivery pipe 61 and delivers the processing liquid to the ejection unit 30 via the liquid delivery pipe 61; a second connecting valve 68 that opens and closes the liquid delivery pipe 61 and the pressurized delivery unit 64; and a pressure measuring unit 69 that measures the pressure between the filter 63 and the pressurized delivery unit 64. The replenishment unit 50 includes a liquid source 51 and a pressurized delivery unit 53 that delivers the processing liquid from the liquid source 51 to the liquid delivery unit 60. The replenishment preparation unit 115 sequentially performs the following operations: With the switching valve 71 closed, it controls the pressurized delivery unit 53 to reduce the pressure difference between the replenishment unit 50 and the delivery unit 60; with the switching valve 71 open and the ejection valve 72 and the second connecting valve 68 closed, it controls the pressurized delivery unit 53 based on the measurement value of the pressure measuring unit 69 to bring the pressure between the pressurized delivery unit 53 and the pressurized delivery unit 64 close to a set value; and with the switching valve 71 and the ejection valve 72 closed and the second connecting valve 68 open, it controls the pressurized delivery unit 64 based on the measurement value of the pressure measuring unit 69 to bring the pressure in the delivery unit 60 close to the aforementioned set value. In this case, with the switching valve 71 open, the pressure in the replenishment unit 50 and the delivery unit 60 are brought close to the same set value based on the measurement value of the pressure measuring unit 69, thus further reducing the pressure difference between the replenishment unit 50 and the delivery unit 60 before replenishment begins. Therefore, this is more useful for reducing particulate matter in the processing liquid ejected onto the wafer W.

[0160] Figure 15 (a) and Figure 15 (b) is an example graph showing the measurement results of the number of particles contained in the treated liquid after spraying. Figure 15 (a) and Figure 15 In (b), the vertical axis represents the number of particles. Figure 15 The measurement results shown in (a) and Figure 15 In the measurement results shown in (b), the minimum size of the particles being measured is different from each other. Figure 15 The minimum value mentioned above in the measurement results shown in (b) is compared to Figure 15 The minimum value shown in (a) is larger than the above.

[0161] In the comparative example measurement, the switching valve 71 was opened without reducing the pressure difference between the replenishment unit 50 and the delivery unit 60. With the switching valve 71 open, processing fluid was replenished from the replenishment unit 50 to the delivery unit 60. The target value of the ejection pressure was maintained at the set value Pd. The pressure in the delivery unit 60 during replenishment preparation was adjusted to be close to the set value Pr. The pressure in the replenishment unit 50 during standby before ejection and during ejection was maintained at the set value Pr. The set value Pr can be larger than the set value Pd.

[0162] In the measurement under "Condition 1", the liquid treatment process was performed in the same manner as in the embodiment described above, except that the target value of the replenishment pressure was not maintained at the set value Pd during the replenishment period. In "Condition 1", during the replenishment of the treatment liquid, no follow-up control was performed to make the replenishment pressure follow the target value; instead, the pressurized delivery unit 53 (pump drive unit 57) of the replenishment unit 50 was controlled to keep the replenishment flow rate to the liquid delivery unit 60 approximately constant. In the measurement under "Condition 2", the liquid treatment process was performed in the same manner as in the embodiment described above. Figure 15 (a) and Figure 15 As shown in (b), it was confirmed that by reducing the pressure difference with the switching valve 71 closed, the number of particles contained in the treated liquid was reduced. Furthermore, when comparing the measurement results for conditions 1 and 2, it was found that by maintaining the supplemental pressure at a substantially constant level, the number of particles was further reduced.

[0163] exist Figure 16 (a) shows the variation of the measured value (hydraulic pressure) of the pressure measuring unit 69 in the comparative example over time. Figure 16 (b) shows the variation of the pressure measurement value (hydraulic pressure) of the pressure measuring unit 69 under condition 2 over time. Figure 16 (a) and Figure 16 (b) shows the measured values ​​over time when discharge preparation and discharge treatment are omitted. In the comparative example, during the replenishment preparation stage after discharge, the switching valve 71 is opened when the pressure difference between the replenishment section 50 and the delivery section 60 is large. Figure 16 As shown in (a), during the replenishment preparation period, the hydraulic pressure fluctuates upwards or downwards around a set value Pr. This pressure fluctuation represents the fluctuation of the aforementioned processing fluid. On the other hand, in the measurement results of condition 2, during the replenishment preparation stage after the spraying has ended, the switching valve 71 is opened in a state where the pressure difference between the replenishment section 50 and the delivery section 60 is reduced. Figure 16As shown in (b), during replenishment preparation, the fluctuation (pressure variation) of the above-mentioned treatment fluid was significantly smaller than that of the comparative example. This suppression of fluctuation is considered one of the reasons for the reduction in particulate matter. Furthermore, the replenishment pressure was maintained at a substantially constant level during the replenishment of the treatment fluid. Maintaining this substantially constant replenishment pressure is also considered one of the reasons for the reduction in particulate matter.

[0164] The first embodiment has been described above, but this disclosure is not necessarily limited to the above embodiment and changes can be made without departing from its spirit.

[0165] (Variation Example 1)

[0166] In the above example, during the ejection process, the processing liquid is delivered from the delivery section 60 to the ejection section 30 without passing through the filter 63, but the ejection process is not limited to this. For example, the delivery section 60 may deliver the processing liquid to the ejection section 30 via the branch pipe 62a and the delivery pipe 61 instead of the branch pipe 62b. During the ejection preparation process (the same process as step S12), such as... Figure 17 As shown in (a), it is also possible that, with the switching valve 71, the ejection valve 72, the second connecting valve 68 closed and the first connecting valve 67 open, the ejection preparation unit 111 controls the pump drive unit 77 based on the measured value of the pressure measuring unit 69, thereby adjusting the pressure in the liquid delivery unit 60.

[0167] Furthermore, the spray preparation unit 111 can spray the treatment liquid from the nozzle 31 while the spray valve 72 is open by performing the same control as in steps S21 to S23. At this time, as... Figure 17 As shown in (b), the treatment fluid is delivered from the pressurized delivery unit 64 (pump 76) to the spraying unit 30 via the filter 63. During the spraying of the treatment fluid, with the switching valve 71 and the second connecting valve 68 closed and the first connecting valve 67 and the spraying valve 72 open, the spraying preparation unit 111 controls the pump drive unit 77, for example, based on the measured value of the pressure measuring unit 69, thereby adjusting the pressure in the delivery unit 60.

[0168] (Variation Example 2)

[0169] In the above example, during the replenishment process, the replenishment pressure is maintained at a roughly fixed value Pd from the start of replenishment until its completion. However, the target value of the replenishment pressure during the replenishment period is not limited to this. For example, if the set value Pd of the ejection pressure is not suitable for replenishing the treatment fluid, the replenishment preparation unit 115 can perform replenishment preparation at the start of replenishment to make the replenishment pressure different from the set value Pd. Furthermore, the replenishment control unit 116 can perform follow-up control during the replenishment of the treatment fluid to make the replenishment pressure follow the target value, so that the replenishment pressure gradually approaches the set value Pd. Figure 18(a) represents an example where the pressure at the start of replenishment is higher than the set value Pd of the ejection pressure. Figure 18 (b) represents an example where the pressure at the start of replenishment is lower than the set value Pd of the ejection pressure.

[0170] like Figure 18 As shown in (a), the replenishment preparation unit 115 can control the processing fluid supply unit 29 during the replenishment preparation process in step S05, so that the pressure in the replenishment unit 50 and the pressure in the delivery unit 60 are both higher than the set value Pd. The replenishment control unit 116 can gradually reduce the target value of the replenishment pressure from a value higher than the set value Pd to the set value Pd (the target value of the ejection pressure) during the period from the start of replenishment to the completion of replenishment. As a result, during the replenishment process in step S06, the replenishment pressure is gradually reduced from a value higher than the set value Pd to a set value Pd that is approximately equal to the ejection pressure at the time of ejection.

[0171] like Figure 18 As shown in (b), the replenishment preparation unit 115 can control the processing fluid supply unit 29 during the replenishment preparation process in step S05, so that the pressure in the replenishment unit 50 and the pressure in the delivery unit 60 are both lower than the set value Pd. The replenishment control unit 116 can gradually increase the target value of the replenishment pressure from a value lower than the set value Pd to the set value Pd (the target value of the ejection pressure) during the period from the start of replenishment to the completion of replenishment. As a result, during the replenishment process in step S06, the replenishment pressure gradually increases from a value lower than the set value Pd to a set value Pd that is approximately equal to the ejection pressure at the time of ejection.

[0172] The coating / developing apparatus 2 involved in this modified example includes an ejection control unit 112, which controls the pressurized delivery unit 64 to make the ejection pressure of the processing liquid delivered to the nozzle 31 follow a target value. The replenishment control unit 116, in controlling the replenishment pressure to follow the target value, gradually brings the target value of the replenishment pressure closer to the target value of the ejection pressure (set value Pd) until the replenishment of the processing liquid is completed. In this case, replenishment of the processing liquid can begin when the replenishment pressure is set to a pressure suitable for replenishing the processing liquid, and the replenishment process approaches the target value of the ejection pressure. As a result, liquid processing can be performed more efficiently.

[0173] Furthermore, in the liquid treatment process described in the above embodiment, the adjustment of the pressure in the replenishment unit 50 in step S53 and the adjustment of the pressure in the liquid delivery unit 60 in step S56 can be omitted in the replenishment preparation unit 115. In this case, the pressure difference can be reduced by adjusting the standby pressure in the replenishment preparation unit 115 (performing the process in step S51), the switching valve 71 can be opened just before replenishment begins, and then the replenishment control unit 116 can begin replenishing the treatment liquid.

[0174] [Second Implementation]

[0175] Next, refer to Figures 19-23 The coating / developing apparatus 2 included in the substrate processing system according to the second embodiment will be described below. Regarding the liquid processing performed in the coating / developing apparatus 2 according to the second embodiment, the replenishment preparation process in step S05 and the replenishment control process in step S06 differ from those in the first embodiment. In this liquid processing, for example, the target value of the ejection pressure is set to a set value Pd, and the pressure in the liquid delivery section 60 before ejection begins and before replenishment begins, as well as the replenishment pressure, are set to a set value Pr. The set value Pr is greater than the set value Pd.

[0176] The replenishment preparation unit 115, for example, changes the pressure within the delivery unit 60 while the switching valve 71 is closed, to reduce the pressure difference between the replenishment unit 50 and the delivery unit 60. After replenishment preparation, the replenishment preparation unit 115 should at least reduce the pressure difference between the replenishment unit 50 and the delivery unit 60 compared to the pressure difference before replenishment preparation began. As an example, the replenishment preparation unit 115 changes the pressure within the delivery unit 60 so that the pressure within the delivery unit 60 is approximately the same as the pressure within the replenishment unit 50. Thus, in the replenishment preparation according to the first embodiment, the pressure within the replenishment unit 50 is changed to reduce the pressure difference; in contrast, in the replenishment preparation according to the second embodiment, the pressure within the delivery unit 60 is changed.

[0177] As an example of supplementary preparation, firstly, with the switching valve 71 and the ejection valve 72 closed and the second connecting valve 68 open, the supplementary preparation unit 115 controls the pressurized delivery unit 64 (pump drive unit 77) based on the measured value of the pressure measuring unit 69, so that the pressure in the delivery unit 60 is close to a set value (e.g., set value Pr). For example, the supplementary preparation unit 115 adjusts the pressure from the pump drive unit 77 to the pump 76 based on the deviation between the measured value of the pressure measuring unit 69 and the set value Pr, so that the deviation is close to zero. Next, after opening the switching valve 71, with the ejection valve 72 and the second connecting valve 68 closed, the supplementary preparation unit 115 controls the pressurized delivery unit 53 based on the measured value of the pressure measuring unit 69, so that the pressure between the pressurized delivery unit 53 and the pressurized delivery unit 64 is close to the aforementioned set value (e.g., set value Pr). For example, the supplementary preparation unit 115 adjusts the pressure from the pump drive unit 57 to the pump 56 based on the deviation between the measured value of the pressure measuring unit 69 and the set value Pr, so that the deviation is close to zero.

[0178] The replenishment control unit 116 adjusts the pressure in the delivery unit 60, for example, via the replenishment preparation unit 115, and adjusts the pressure in the replenishment unit 50 with the switching valve 71 open, and then begins replenishing the processing fluid from the replenishment unit 50 to the delivery unit 60. The replenishment control unit 116 replenishes the processing fluid from the replenishment unit 50 to the delivery unit 60 with the switching valve 71 open. Similar to the first embodiment, the replenishment control unit 116 performs follow-up control of the replenishment pressure and the replenishment flow rate by controlling the pressurized delivery unit 53 and the pressurized delivery unit 64. In controlling the replenishment pressure to follow the target value, the replenishment control unit 116 can set the target value of the replenishment pressure to a set value Pr during the period from the start of replenishment to the end of replenishment. For example, the replenishment control unit 116 adjusts the drive pressure from the pump drive unit 57 to the pump 56 based on the deviation between the measured value from the pressure measuring unit 69 and the set value Pr, so that the deviation is close to zero.

[0179] (Supplementary preparations)

[0180] Figure 19 This is a flowchart illustrating the replenishment preparation process according to the second embodiment. In this replenishment preparation process, for example, while maintaining the pressure within the replenishment unit 50 at a set value Pr, the control device 100 first executes step S151. In step S151, for example... Figure 21 As shown in (a), the supplementary control unit 116 switches the second connecting valve 68 from the closed state to the open state while keeping the switching valve 71, the injection valve 72 and the first connecting valve 67 in the closed state.

[0181] Next, the control device 100 executes steps S152 and S153. In step S152, the replenishment control unit 116 adjusts the pressure in the liquid delivery unit 60 while the switching valve 71 is closed, so as to reduce the pressure difference between the replenishment unit 50 and the liquid delivery unit 60. For example, Figure 21 As shown in (a), the supplementary control unit 116 controls the pressurized delivery unit 64 (pump drive unit 77) based on the measured value of the pressure measuring unit 69. The supplementary control unit 116 can control the pump drive unit 77 to make the pressure in the delivery unit 60 close to the set value Pr of the supplementary pressure. For example, the supplementary control unit 116 can adjust the drive pressure from the pump drive unit 77 to the pump 76 based on the deviation between the measured value of the pressure measuring unit 69 and the set value Pr, so that the deviation is close to zero. The supplementary control unit 116 repeats the processing of steps S152 and S153 until a predetermined time has elapsed since the execution of step S152. The predetermined time is predetermined so that the pressure in the delivery unit 60 is approximately consistent with the set value Pr within this time, and this predetermined time is stored in the operation command holding unit 102.

[0182] When it is determined in step S153 that a predetermined time has elapsed, the control device 100 executes step S154. In step S154, if... Figure 21 As shown in (b), while maintaining the first connecting valve 67 and the ejection valve 72 in a closed state, the replenishment preparation unit 115 switches the switching valve 71 from a closed state to an open state and switches the second connecting valve 68 from an open state to a closed state. At this time, the replenishment preparation unit 115 can switch the switching valve 71 from a closed state to an open state at a smaller rate of change of opening (slower operating speed) than the second connecting valve 68.

[0183] Next, the control device 100 executes steps S155 and S156. In step S155, for example, the replenishment preparation unit 115 adjusts the pressure within the replenishment unit 50 (between the pressurized delivery unit 53 and the pressurized delivery unit 64) based on the measured value from the pressure measuring unit 69. Specifically, the replenishment preparation unit 115 can control the pressurized delivery unit 53 to bring the pressure between the pressurized delivery unit 53 and the pressurized delivery unit 64 close to the set value used in step S152. The replenishment preparation unit 115, for example, controls the pump drive unit 57 to bring the measured value from the pressure measuring unit 69 close to the set value Pr. As an example, the replenishment preparation unit 115 adjusts the drive pressure from the pump drive unit 57 to the pump 56 based on the deviation between the measured value from the pressure measuring unit 69 and the set value Pr, so that the deviation is close to zero. The replenishment preparation unit 115 repeats the process of steps S155 and S156 until a predetermined time has elapsed since the start of step S155. A predetermined time is determined so that the pressure between the pressurizing delivery unit 53 and the pressurizing delivery unit 64 is approximately consistent with the set value Pr within that time period, and the predetermined time is stored in the action command holding unit 102.

[0184] When it is determined in step S156 that a predetermined time has elapsed, the replenishment preparation unit 115 executes step S157. In step S157, the replenishment control unit 116, while maintaining the first connecting valve 67 and the ejection valve 72 in a closed state and maintaining the switching valve 71 in an open state, switches the second connecting valve 68 from a closed state to an open state. Through the above steps, the replenishment preparation unit 115 ends the replenishment preparation process.

[0185] In the replenishment preparation process according to the first embodiment, the pressure is adjusted in the following order: pressure adjustment in the replenishment section 50 with the switching valve 71 closed, pressure readjustment in the replenishment section 50 with the switching valve 71 open, and pressure adjustment in the delivery section 60 with the switching valve 71 closed. In contrast, in the replenishment preparation process according to the second embodiment described above, the pressure is adjusted in the following order: pressure adjustment in the delivery section 60 with the switching valve 71 closed, and pressure adjustment in the replenishment section 50 with the switching valve 71 open.

[0186] (Supplementary Controls)

[0187] Figure 20 This is a flowchart illustrating an example of the supplementary control process involved in the second embodiment. For example... Figure 20 As shown, the control device 100 executes steps S161 and S162. In step S162, the replenishment control unit 116 begins to control the pressurized delivery unit 53 and the pressurized delivery unit 64 to adjust the replenishment pressure and flow rate of the processed liquid delivered from the pressurized delivery unit 53 of the replenishment unit 50 to the pressurized delivery unit 64 of the liquid delivery unit 60, thereby initiating the replenishment of the processed liquid. For example, as... Figure 21 As shown in (c), the supplementary control unit 116 performs the same follow-up control as steps S61 and S62, making the supplementary pressure and supplementary flow follow the target value.

[0188] The replenishment control unit 116 repeats steps S161 and S162 until a predetermined time has elapsed since the start of step S162. A predetermined time is determined in advance so that the replenishment of the treatment fluid to the liquid delivery unit 60 (pump 76) is completed within that time, and this predetermined time is stored in the operation command holding unit 102. The replenishment control unit 116 can set the target value of the replenishment pressure to a set value Pr in the control that makes the replenishment pressure follow the target value, until the predetermined time has elapsed (until the replenishment of the treatment fluid is completed). For example, the replenishment control unit 116 adjusts the drive pressure from the pump drive unit 57 to the pump 56 during the period from the start of replenishment to the completion of replenishment, so that the deviation between the measured value of the pressure measuring unit 69 and the set value Pr is close to zero and is maintained in a state where the deviation is approximately zero.

[0189] When it is determined in step S162 that a predetermined time has elapsed, the control device 100 executes step S163. In step S163, similarly to step S64, the supplementary control unit 116, while maintaining the first connecting valve 67 and the ejection valve 72 in a closed state, switches the switching valve 71 and the second connecting valve 68 from the open state to the closed state, respectively. At this time, the supplementary control unit 116 can switch the switching valve 71 from the open state to the closed state at a smaller rate of change of opening (slower operating speed) than the second connecting valve 68.

[0190] Next, the control device 100 executes step S164. In step S164, the control device 100 adjusts the pressure in pump 56 of the replenishment unit 50 and the pressure in pump 76 of the delivery unit 60, respectively. For example, the control device 100 controls the pump drive unit 57 based on the measured value of the pressure measuring unit 54, thereby adjusting the pressure in pump 56 (pressure in replenishment unit 50) to a set value Pr (standby pressure). For example, the control device 100 controls the pump drive unit 77 based on the measured value of the pressure measuring unit 66, thereby adjusting the pressure in pump 76 to a standby pressure lower than the set value Pr. Through the above steps, the replenishment control unit 116 ends the replenishment control process.

[0191] In the liquid treatment process according to the second embodiment, the ejection control of the treatment liquid can be performed as follows: Figure 9 As shown in (b), the treatment fluid is delivered from the pressurized delivery unit 64 (pump 76) to the ejection unit 30 without passing through the filter 63. Alternatively, it can be as shown in (b). Figure 17 As shown in (b), the pressurized delivery unit 64 (pump 76) delivers the treatment fluid to the ejection unit 30 via the filter 63.

[0192] In the discharge preparation process of the liquid treatment process according to the second embodiment, these adjustments can be performed in the same order as the replenishment preparation described above, namely, the pressure adjustment in the liquid delivery section 60 when the switching valve 71 is closed, and the pressure adjustment in the replenishment section 50 when the switching valve 71 is open.

[0193] [Effects of the Second Implementation]

[0194] In the coating / developing apparatus 2 and liquid processing process described in the second embodiment above, the switching valve 71 is opened after the pressure difference between the replenishment section 50 and the liquid delivery section 60 is reduced, similar to the first embodiment. Therefore, when the switching valve 71 is opened, fluctuations in the processing liquid within the flow path used to replenish the processing liquid from the replenishment section 50 to the liquid delivery section 60 can be suppressed. In the second embodiment described above, a filter 63 is provided in the liquid delivery section 60, which can suppress fluctuations in the processing liquid within the liquid delivery section 60. Therefore, this is useful for reducing particulate matter in the processing liquid ejected onto the wafer W.

[0195] In the second embodiment described above, the replenishment preparation unit 115 changes the pressure within the delivery unit 60 while the switching valve 71 is closed, thereby reducing the pressure difference between the replenishment unit 50 and the delivery unit 60. In this case, since the pressure within the delivery unit 60 is changed before the switching valve 71 is opened to reduce the pressure difference between the replenishment unit 50 and the delivery unit 60, fluctuations in the processed liquid that occur when the switching valve 71 is opened can be suppressed. Furthermore, in most cases, the volume of processed liquid in the pressurized delivery unit 64 (pump 76) of the delivery unit 60 is smaller than the volume of processed liquid in the pressurized delivery unit 53 (pump 56) of the replenishment unit 50. In addition, in most cases, the piping volume up to the filter 63 and the pressure measuring unit 69 is smaller on the delivery unit 60 side than on the replenishment unit 50 side (the distance between the pressurized delivery unit 64 and the pressure measuring unit 69 is shorter than the distance between the pressurized delivery unit 53 and the pressure measuring unit 69). Therefore, by changing the pressure within the liquid delivery section 60 in the above structure, pressure control can be performed with higher resolution (higher precision) and faster pressure control compared to the first embodiment.

[0196] In the second embodiment described above, the liquid delivery unit 60 includes: a liquid delivery pipe 61 that connects the replenishment unit 50 to the ejection unit 30 via a filter 63; a pressurized delivery unit 64 that receives the treatment liquid from the replenishment unit 50 via the liquid delivery pipe 61 and delivers the treatment liquid to the ejection unit 30 via the liquid delivery pipe 61; and a second connecting valve 68 that opens and closes the connection between the liquid delivery pipe 61 and the pressurized delivery unit 64. The replenishment unit 50 includes a liquid source 51 and a pressurized delivery unit 53 that delivers the treatment liquid from the liquid source 51 to the liquid delivery unit 60. The replenishment control unit 116 controls either the pressurized delivery unit 53 or the pressurized delivery unit 64 to make the replenishment pressure from the pressurized delivery unit 53 to the pressurized delivery unit 64 follow a target value. The replenishment control unit 116 controls the other of the pressurized delivery unit 53 and the pressurized delivery unit 64 to make the replenishment flow rate from the pressurized delivery unit 53 to the pressurized delivery unit 64 follow a target value. In this case, the replenishment flow rate and the pressure of the replenished treatment fluid can be adjusted. As a result, the treatment fluid can be replenished with a hydraulic pressure suitable for reducing particulate matter.

[0197] In the second embodiment described above, the coating / developing apparatus 2 includes: an ejection valve 72 that opens and closes the liquid delivery section 60 and the ejection section 30; an ejection preparation section 111 that changes the pressure within the liquid delivery section 60 to reduce the pressure difference between the liquid delivery section 60 and the ejection section 30, and then opens the ejection valve 72; and an ejection control section 112 that, with the ejection valve 72 open by the ejection preparation section 111, causes the nozzle 31 to begin ejecting the processing liquid onto the wafer W. In this case, by opening the ejection valve 72 while the pressure difference between the liquid delivery section 60 and the ejection section 30 has been reduced, fluctuations in the processing liquid that occur with the opening of the ejection valve 72 can be suppressed. Therefore, this is more useful for reducing the amount of particulate matter in the processing liquid ejected onto the wafer W.

[0198] In the second embodiment described above, the liquid delivery unit 60 includes: a liquid delivery pipe 61 that connects the replenishment unit 50 to the ejection unit 30 via a filter 63; a pressurized delivery unit 64 that receives the processing liquid from the replenishment unit 50 via the liquid delivery pipe 61 and delivers the processing liquid to the ejection unit 30 via the liquid delivery pipe 61; and a second connecting valve 68 that opens and closes the liquid delivery pipe 61 and the pressurized delivery unit 64. The switching valve 71 opens and closes at a smaller rate of change than the second connecting valve 68. As the switching valve 71 opens and closes, hydraulic pressure fluctuates during the opening and closing operation. In this structure, the switching valve 71 opens and closes at a small rate of change, thereby suppressing abrupt fluctuations in the hydraulic pressure acting on the filter 63. Therefore, this is more useful for reducing particulate matter in the processing liquid ejected onto the wafer W.

[0199] In the second embodiment described above, the coating / developing apparatus 2 includes a switching valve 71 for opening and closing between the replenishment unit 50 and the liquid delivery unit 60, and an ejection valve for opening and closing between the liquid delivery unit 60 and the ejection unit 30. The liquid delivery unit 60 includes: a liquid delivery pipe 61 that connects the replenishment unit 50 and the ejection unit 30 via a filter 63; a pressurized delivery unit 64 that receives processing liquid from the replenishment unit 50 via the liquid delivery pipe 61 and delivers processing liquid to the ejection unit 30 via the liquid delivery pipe 61; a second connecting valve 68 that opens and closes between the liquid delivery pipe 61 and the pressurized delivery unit 64; and a pressure measuring unit 69 that measures the pressure between the filter 63 and the pressurized delivery unit 64. The replenishment unit 50 includes a liquid source 51 and a pressurized delivery unit 53 that delivers processing liquid from the liquid source 51 to the liquid delivery unit 60. The replenishment preparation unit 115 sequentially performs the following operations: with the switching valve 71 and the ejection valve 72 closed and the second connecting valve 68 open, it controls the pressurized delivery unit 64 based on the measurement value of the pressure measuring unit 69 to bring the pressure in the delivery pipe 61 close to the set value; and with the switching valve 71 open and the ejection valve 72 and the second connecting valve 68 closed, it controls the pressurized delivery unit 53 based on the measurement value of the pressure measuring unit 69 to bring the pressure between the pressurized delivery unit 53 and the pressurized delivery unit 64 close to the aforementioned set value. In this case, the pressure in the replenishment unit 50 and the pressure in the delivery unit 60 are brought close to the same set value based on the measurement value of the same pressure measuring unit 69, thus enabling a more reliable reduction of the pressure difference between the replenishment unit 50 and the delivery unit 60 before replenishment begins. Therefore, this is more useful for reducing particulate matter in the processing liquid ejected onto the wafer W. Furthermore, unlike the first embodiment, the pressure in the delivery unit 60 is adjusted first with the switching valve 71 closed, so the adjustment range of the pressure in the replenishment unit 50 is small. Therefore, even if the pressure on the delivery section 60 side and the pressure on the replenishment section 50 side are consistent with the set value before the replenishment of the treatment fluid is started, pressure control can be performed more quickly than in the first embodiment.

[0200] Figure 22 This is an example graph showing the measurement results of the number of particles contained in the treated liquid after spraying. Figure 22 In the diagram, the vertical axis represents the number of particles. Figure 22 The results of the measurements for "Comparative Example 1", "Comparative Example 2", "Condition 1", and "Condition 2" are shown. In the measurements of Comparative Example 1 and Comparative Example 2, the switching valve 71 was opened without reducing the pressure difference between the replenishment section 50 and the delivery section 60, and the processing liquid was replenished from the replenishment section 50 to the delivery section 60 with the switching valve 71 open. In Comparative Example 1, the processing liquid was sprayed through the filter 63 during the spraying of the processing liquid. In Comparative Example 2, the processing liquid was sprayed without passing through the filter 63 during the spraying of the processing liquid.

[0201] Under conditions 1 and 2, similar to the liquid treatment process described in the second embodiment above, the switching valve 71 is opened after the pressure difference between the replenishment unit 50 and the delivery unit 60 is reduced, and the treatment liquid is replenished from the replenishment unit 50 to the delivery unit 60 while the switching valve 71 is open. Under condition 1, the treatment liquid is ejected through the filter 63 during the ejection of the treatment liquid. Under condition 2, the treatment liquid is ejected without passing through the filter 63 during the ejection of the treatment liquid. In any of Comparative Example 1, Comparative Example 2, Condition 1, and Condition 2, the pressure during replenishment of the treatment liquid is set to a set value Pr that is greater than the set value Pd of the ejection pressure.

[0202] When comparing the measurement results of Comparative Example 1 and Condition 1, it can be seen that by reducing the pressure difference and then opening the switching valve 71, the number of particles decreased. When comparing the measurement results of Comparative Example 2 and Condition 2, it can be seen that by reducing the pressure difference and then opening the switching valve 71, the number of particles decreased. Figure 23 (a) shows the variation of the measured value (hydraulic pressure) of the pressure measuring unit 69 over time under condition 2. It can be seen that the variation of the hydraulic pressure over time is different compared to the case where the switching valve 71 is opened without reducing the pressure difference (e.g., Figure 14 As shown in (a) over time, the fluctuation (pressure variation) of the treatment fluid during the replenishment preparation period is small. This suppression of fluctuation is considered to be the reason for the reduction in particulate matter. Furthermore, in condition 2, the target value of the replenishment pressure of the treatment fluid during the replenishment period is maintained at the set value Pr for measurement.

[0203] (Modified Example)

[0204] The target value of the replenishment pressure of the treatment fluid during the replenishment period can be maintained at the set value Pr as described above, or the target value of the replenishment pressure can be gradually made closer to the target value of the ejection pressure until the replenishment of the treatment fluid is completed. Figure 23 (b) represents the change in hydraulic pressure over time when the pressure at the start of replenishment is set to a set value Pr and the replenishment pressure is brought close to the set value Pd during replenishment. In the follow-up control that brings the replenishment pressure to the target value, the replenishment control unit 116 gradually brings the target value of the replenishment pressure from the set value Pr closer to the set value Pd (the target value of the ejection pressure) from the start of replenishment until replenishment is complete. Therefore, in the replenishment process of step S06, the replenishment pressure gradually decreases from the set value Pr to the set value Pd, which is approximately equal to the ejection pressure at the time of ejection.

[0205] The coating / developing apparatus 2 described in the above-described modification includes an ejection control unit 112 that controls the pressurized delivery unit 64 to ensure that the ejection pressure of the processing liquid delivered to the nozzle 31 follows a target value. The replenishment control unit 116, in controlling the replenishment pressure to follow the target value, gradually brings the target value of the replenishment pressure closer to the target value of the ejection pressure until the replenishment of the processing liquid is completed. In this case, replenishment of the processing liquid begins with the replenishment pressure set to a pressure suitable for replenishing the processing liquid, and during replenishment, the replenishment pressure approaches the target value of the ejection pressure. As a result, liquid processing can be performed more efficiently.

[0206] Furthermore, in the liquid treatment process involved in the second embodiment, the set value of the replenishment pressure Pr and the set value of the ejection pressure Pd can be set to approximately equal values.

[0207] [Third Implementation Method]

[0208] Next, refer to Figures 24-29 The coating / developing apparatus 2 included in the substrate processing system according to the third embodiment will be described below. The liquid processing unit U1 of the coating / developing apparatus 2 according to the third embodiment includes a processing liquid supply unit 29A, replacing the processing liquid supply unit 29. The processing liquid supply unit 29A supplies processing liquid to the wafer W, which is rotatably held in the spin-holding unit 20, in the same manner as the processing liquid supply unit 29. Figure 24 As shown, the processing fluid supply unit 29A includes a spraying part 30, a fluid delivery part 210, a first connecting part 230 (connecting part), a replenishing part 250, and a second connecting part 90.

[0209] The liquid delivery unit 210 supplies processing fluid to the spraying unit 30. Specifically, the liquid delivery unit 210 delivers processing fluid to the spraying unit 30 (nozzle 31) at a predetermined pressure. The liquid delivery unit 210 is connected to the spraying unit 30 via a second connection unit 90 (spray valve 72). The liquid delivery unit 210 and the spraying unit 30 are opened and closed by the spray valve 72. The liquid delivery unit 210 includes, for example, a liquid delivery pipe 212 and a pressurized delivery unit 214 (pressurized delivery unit for spraying).

[0210] The delivery pipe 212 guides the treatment fluid to the ejection section 30. Specifically, the delivery pipe 212 is connected to the upstream end of the delivery pipe 32 of the ejection section 30 via the ejection valve 72. The pressurized delivery section 214 receives the treatment fluid from the replenishment section 250, pressurizes the received treatment fluid, and delivers it toward the ejection section 30. The pressurized delivery section 214 includes, for example, a pump 216, an output valve 218, a pump drive section 222, and a pressure measuring section 224.

[0211] Pump 216 has a receiving chamber for containing the treatment fluid and a contraction section for contracting the receiving chamber. Pump 216 expands the receiving chamber through the contraction section to receive the treatment fluid and contracts the receiving chamber through the contraction section to deliver the treatment fluid. Pump 216 can be, for example, a tubular diaphragm pump, a diaphragm pump, or a bellows pump. Output valve 218 is provided in the delivery pipe 212 and opens and closes the flow path within the delivery pipe 212 based on the operation instruction of the control device 100. Output valve 218 is, for example, a pneumatic valve.

[0212] The pump drive unit 222 drives the pump 216 based on the operation instruction from the control device 100. Specifically, the pump drive unit 222 actuates (drives) the contraction section to contract the housing of the pump 216. For example, the pump drive unit 222 is a gas-driven type drive unit that actuates the contraction section using gas. The pump drive unit 222 can contract the housing of the pump 216 by adjusting the pressure (drive pressure) of the gas. The pressure measuring unit 224 acquires information related to the pressure inside the pump 216. For example, the pressure measuring unit 224 measures the pressure in the connecting pipe between the pump 216 and the pump drive unit 222. The pressure measuring unit 224 outputs the measured value to the control device 100.

[0213] The first connecting part 230 connects the liquid delivery part 210 and the replenishment part 250. The liquid delivery part 210 receives the processing liquid via the first connecting part 230. The first connecting part 230 includes, for example, a connecting pipe 232, a filter 234, a first switching valve 236 (switching valve), and a second switching valve 238.

[0214] The connecting pipe 232 guides the treatment fluid to the delivery section 210 (pump 216). Specifically, the downstream end of the connecting pipe 232 is connected to the delivery section 210, and the upstream end of the connecting pipe 232 is connected to the replenishment section 250. In this way, the connecting pipe 232 connects the delivery section 210 (pump 216) and the replenishment section 250, forming a flow path for replenishing the treatment fluid from the replenishment section 250 to the delivery section 210. A filter 234 is provided in the connecting pipe 232 to remove foreign matter contained in the treatment fluid. Specifically, the filter 234 removes foreign matter contained in the treatment fluid (the treatment fluid replenished from the replenishment section 250 to the delivery section 210) flowing in the flow path within the connecting pipe 232.

[0215] The first switching valve 236 and the second switching valve 238 open and close the connection between the liquid delivery section 210 and the replenishment section 250. The first switching valve 236 is located downstream of the filter 234 in the connecting pipe 232. Based on the operation instruction of the control device 100, the first switching valve 236 opens and closes the connection between the filter 234 and the liquid delivery section 210 in the flow path within the connecting pipe 232. The second switching valve 238 is located upstream of the filter 234 in the connecting pipe 232. Based on the operation instruction of the control device 100, the second switching valve 238 opens and closes the connection between the filter 234 and the replenishment section 250 in the flow path within the connecting pipe 232. The first switching valve 236 and the second switching valve 238 are, for example, pneumatic valves.

[0216] The replenishment unit 250 replenishes the liquid delivery unit 210 with the processing liquid to be delivered toward the ejection unit 30. The replenishment unit 250 includes, for example, a liquid source 252, a storage tank 254, a pressurized delivery unit 256 (pressurized delivery unit for replenishment), and a delivery pipe 262.

[0217] Liquid source 252 is the supply source of the processing liquid to replenish the liquid delivery unit 210. Liquid source 252 supplies processing liquid to pressurized delivery unit 256 via liquid delivery pipe 262. Storage tank 254 is provided on liquid delivery pipe 262 to temporarily store the processing liquid to be supplied to pressurized delivery unit 256.

[0218] The pressurized delivery unit 256 delivers the treatment liquid from the storage tank 254 to the liquid delivery unit 210 via the first connection 230. The pressurized delivery unit 256 receives the treatment liquid from the storage tank 254, pressurizes the received treatment liquid, and then delivers it to the first connection 230. The pressurized delivery unit 256 includes, for example, a pump 266, a pump drive unit 272, and a pressure measuring unit 274.

[0219] Pump 266 has a receiving chamber for containing the processing liquid and a contraction section for contracting the receiving chamber. Pump 266 expands the receiving chamber through the contraction section to receive the processing liquid and contracts the receiving chamber through the contraction section to deliver the processing liquid. As pump 266, for example, a tubular diaphragm pump, a diaphragm pump, or a bellows pump can be used.

[0220] The pump drive unit 272 drives the pump 266 based on the operation instruction from the control device 100. Specifically, the pump drive unit 272 actuates (drives) the contraction section to contract the housing chamber of the pump 266. For example, the pump drive unit 272 is a gas-driven type drive unit that actuates the contraction section using gas. The pump drive unit 272 can contract the housing chamber of the pump 266 by adjusting the pressure (drive pressure) of the gas. The pressure measuring unit 274 acquires information related to the pressure inside the pump 266. For example, the pressure measuring unit 274 measures the pressure in the connecting pipe between the pump 266 and the pump drive unit 272. The pressure measuring unit 274 outputs the measured value to the control device 100.

[0221] The above-described processing fluid supply unit 29A is also controlled by the control device 100 in the same way as the processing fluid supply unit 29 in the first and second embodiments. The control device 100 is configured to perform the following: after reducing the pressure difference between the replenishment unit 250 and the delivery unit 210, open the first switching valve 236; and start replenishing processing fluid from the replenishment unit 250 to the delivery unit 210 while the first switching valve 236 is open.

[0222] The dispensing preparation unit 111 of the control device 100 adjusts the pressure of the processing liquid in the delivery unit 210 before the processing liquid is dispensed from the nozzle 31. With the output valve 218 open and the dispensing valve 72 closed, the dispensing preparation unit 111 changes the pressure in the delivery unit 210 to reduce the pressure difference between the delivery unit 210 and the dispensing unit 30. The dispensing preparation unit 111 opens the dispensing valve 72 after the pressure difference between the delivery unit 210 and the dispensing unit 30 has been reduced.

[0223] The replenishment preparation unit 115 of the control device 100 prepares for replenishing the processing fluid from the replenishment unit 250 to the delivery unit 210. Specifically, the replenishment preparation unit 115 can change the pressure in the replenishment unit 250 and the delivery unit 210 while the first switching valve 236 and the second switching valve 238 are closed, thereby reducing the pressure difference between the replenishment unit 250 and the delivery unit 210. Then, while keeping the first switching valve 236 closed, the replenishment preparation unit 115 opens the second switching valve 238, and then changes the pressure between the replenishment unit 250 (pump 266) and the second switching valve 238, as well as the pressure in the delivery unit 210, thereby reducing the pressure difference between the first connection portion 230 and the delivery unit 210. Through these processes, after replenishment preparation, the pressure difference between the replenishment unit 250 and the delivery unit 210 is reduced compared to the pressure difference before replenishment preparation began. The replenishment preparation unit 115 opens the first switching valve 236 when the pressure difference between the replenishment unit 250 and the liquid delivery unit 210 is reduced.

[0224] After replenishment preparation, the replenishment preparation unit 115 reduces the pressure difference between the replenishment unit 250 and the delivery unit 210 compared to the pressure difference before replenishment preparation began. For example, the replenishment preparation unit 115 controls the pressurized delivery unit 256 to make the pressure in the replenishment unit 250 (the pressure in the first connection unit 230) approximately equal to the first set value Pr1, and controls the pressurized delivery unit 214 to make the pressure in the delivery unit 210 approximately equal to the second set value Pr2. The first set value Pr1 and the second set value Pr2 can be approximately the same as each other, and the first set value Pr1 can also be larger or smaller than the second set value Pr2. Below, an example is given where the first set value Pr1 is set to a value larger than the second set value Pr2. In one example, the first set value Pr1 is set to a value approximately 1 kPa to 15 kPa larger than the second set value Pr2.

[0225] As an example of supplementary preparation, firstly, with the first switching valve 236 and the second switching valve 238 closed, the supplementary preparation unit 115 controls the pressurized delivery unit 256 to bring the pressure in the supplementary unit 250 close to the first set value Pr1, and controls the pressurized delivery unit 214 to bring the pressure in the delivery unit 210 close to the second set value Pr2. Furthermore, after opening the second switching valve 238, the supplementary preparation unit 115, while keeping the first switching valve 236 closed, controls the pressurized delivery unit 256 to bring the pressure in the first connection 230 (the pressure between the supplementary unit 250 and the first switching valve 236) close to the first set value Pr1, and controls the pressurized delivery unit 214 to bring the pressure in the delivery unit 210 close to the second set value Pr2. The supplementary preparation unit 115 can keep the output valve 218 of the delivery unit 210 closed during the supplementary preparation process.

[0226] Figure 25 This is a flowchart illustrating an example of the liquid processing process involved in the third embodiment. For example... Figure 25 As shown, the control device 100 first executes steps S201 and S202 sequentially. In step S201, as preparation for ejecting the processing liquid from the nozzle 31, for example, the ejection preparation unit 111 controls the processing liquid supply unit 29A to reduce the pressure difference between the liquid delivery unit 210 and the ejection unit 30. In step S202, for example, with the pressure difference between the liquid delivery unit 210 and the ejection unit 30 reduced, the ejection control unit 112 controls the processing liquid supply unit 29A to eject the processing liquid from the nozzle 31 toward the wafer W. Details of the ejection preparation in step S201 and the ejection processing in step S202 will be described later.

[0227] Next, the control device 100 sequentially executes steps S203 and S204. In step S03, as preparation for replenishing the processing liquid from the replenishment unit 250 to the liquid delivery unit 210, for example, the replenishment preparation unit 115 controls the processing liquid supply unit 29A to reduce the pressure difference between the replenishment unit 250 and the liquid delivery unit 210. In step S204, for example, the replenishment control unit 116 controls the processing liquid supply unit 29A when the pressure difference between the replenishment unit 250 and the liquid delivery unit 210 has been reduced, so that the replenishment unit 250 replenishes the processing liquid to the liquid delivery unit 210. The details of the replenishment preparation in step S203 and the replenishment processing in step S04 will be described later. Through the above steps, a series of liquid processing processes are completed.

[0228] Figure 26 (a) is a flowchart illustrating an example of the ejection preparation process in step S201. For example... Figure 26 As shown in (a), the control device 100 first executes step S211. In step S211, for example, the ejection preparation unit 111 switches the output valve 218 from the closed state to the open state while the first switching valve 236, the second switching valve 238, and the ejection valve 72 are closed.

[0229] Next, the control device 100 executes steps S212 and S213. In step S212, for example, the ejection preparation unit 111 adjusts the pressure within the liquid delivery unit 210. The ejection preparation unit 111 adjusts the pressure within the liquid delivery unit 210 (the pressure within the liquid delivery pipe 212) based, for example, on the measured value of the pressure measuring unit 224. The ejection preparation unit 111 can control the pump drive unit 222 so that the measured value of the pressure measuring unit 224 follows (approaches) the set value Pd of the ejection pressure. For example, the ejection preparation unit 111 can adjust the drive pressure from the pump drive unit 222 to the pump 216 based on the deviation between the measured value of the pressure measuring unit 224 and the set value Pd, so that the deviation approaches zero. The ejection preparation unit 111 repeats the processing of steps S212 and S213 until the pressure within the liquid delivery unit 210 reaches the set value Pd. By executing steps S212 and S213, the spray preparation unit 111 reduces the pressure difference between the liquid delivery unit 210 and the spraying unit 30 while the spraying valve 72 is closed.

[0230] Next, the control device 100 executes step S214. In step S214, for example, the ejection preparation unit 111, while maintaining the first switching valve 236 and the second switching valve 238 in a closed state and the output valve 218 in an open state, switches the ejection valve 72 from a closed state to an open state. Through the above steps, the ejection preparation unit 111 completes the ejection preparation.

[0231] Figure 25(b) is a flowchart illustrating an example of the ejection control process in step S202. For example, in a state where the pressure difference between the liquid delivery section 210 and the ejection section 30 is reduced by the ejection preparation section 111 and the ejection valve 72 is opened, as follows... Figure 25 As shown in (b), the control device 100 executes steps S221 and S222. In step S221, the ejection control unit 112 adjusts the ejection pressure of the treatment fluid supplied to the nozzle 31. In step S221, the ejection control unit 112 begins to control the pressurized delivery unit 214 (pump drive unit 222) to supply the treatment fluid to the ejection unit 30 according to the set ejection pressure value Pd. As a result, the ejection control unit 112 begins to eject the treatment fluid from the nozzle 31 with the ejection valve 72 open. The ejection control unit 112 continues to adjust the ejection pressure after the ejection begins.

[0232] The ejection control unit 112 adjusts the pump drive unit 222 (the pressure applied to the treatment fluid from the pump 216) based, for example, on the measured value of the pressure measuring unit 224. The ejection control unit 112 can adjust the pump drive unit 222 so that the ejection pressure of the treatment fluid follows the set value Pd. The ejection control unit 112 can adjust the drive pressure from the pump drive unit 222 to the pump 216 based on the deviation between the measured value of the pressure measuring unit 224 and the set value Pd, so that the deviation is close to zero. The ejection control unit 112 repeats the processing of steps S221 and S222 until a predetermined time has elapsed since the start of step S221. The predetermined time is determined based on the operation command held by the operation command holding unit 102, and is preset, for example, based on the amount of treatment fluid used in each liquid treatment.

[0233] Next, the control device 100 sequentially executes steps S223 and S224. In step S223, for example, while maintaining the first switching valve 236 and the second switching valve 238 in a closed state, the ejection control unit 112 switches the output valve 218 and the ejection valve 72 from an open state to a closed state, respectively. In step S234, for example, the ejection control unit 112 controls the pump drive unit 222 based on the measured value of the pressure measuring unit 224, thereby adjusting the pressure in the liquid delivery unit 210 (the pressure in the pump 216) to the standby pressure Ps2. Furthermore, during the ejection preparation and ejection processing in steps S201 and S202, the control device 100 can maintain the pressure in the replenishment unit 250 (the pressure in the pump 266) to the standby pressure Ps1 through the pressurized delivery unit 256. The standby pressure Ps1 can be greater than the standby pressure Ps2. The standby pressure Ps1 in the replenishment unit 250 can be predetermined to be a value greater than the first setting value Pr1 mentioned above. The standby pressure Ps2 in the liquid delivery unit 210 can be predetermined to be a value greater than the second setting value Pr2 mentioned above.

[0234] Figure 27This is a flowchart illustrating an example of the supplementary preparation process for step S203. For example... Figure 27 As shown, the control device 100 first executes steps S231 and S232. In step S231, for example, with the replenishment preparation unit 115 in a closed state (first switching valve 236 and second switching valve 238), it adjusts the pressure in the replenishment unit 250 and the pressure in the delivery unit 210 to reduce the pressure difference between the replenishment unit 250 and the delivery unit 210. For example... Figure 28 As shown in (a), the replenishment control unit 116 controls the pump drive unit 272 based on the measured value of the pressure measuring unit 274 to adjust the pressure in the replenishment unit 250. Additionally, the replenishment control unit 116 controls the pump drive unit 222 based on the measured value of the pressure measuring unit 224 to adjust the pressure in the liquid delivery unit 210.

[0235] In one example, the replenishment preparation unit 115 controls the pump drive unit 272 to bring the pressure in the replenishment unit 250 from the standby pressure Ps1 close to the first set value Pr1, and controls the pump drive unit 222 to bring the pressure in the delivery unit 210 from the standby pressure Ps2 close to the second set value Pr2. The replenishment preparation unit 115 repeats steps S231 and S232 until the pressure in the replenishment unit 250 reaches the first set value Pr1 and the pressure in the delivery unit 210 reaches the second set value Pr2. By executing steps S231 and S232, the replenishment preparation unit 115 reduces the pressure difference between the replenishment unit 250 and the delivery unit 210 while the first switching valve 236 and the second switching valve 238 are closed.

[0236] Next, the control device 100 executes step S233. In step S233, for example, the replenishment preparation unit 115 switches the second switching valve 238 from the closed state to the open state while keeping the first switching valve 236, the output valve 218 and the ejection valve 72 in the closed state.

[0237] Next, the control device 100 executes steps S234 and S235 sequentially. In step S234, for example, with the second switching valve 238 open and the first switching valve 236 closed, the replenishment preparation unit 115 adjusts the pressure in the first connection part 230 (the pressure of the pump 266) and the pressure in the liquid delivery part 210 to reduce the pressure difference between the first connection part 230 (between the pump 266 and the first switching valve 236) and the liquid delivery part 210. For example... Figure 28 As shown in (b), the supplementary control unit 116 controls the pump drive unit 272 based on the measured value of the pressure measuring unit 274 to adjust the pressure in the first connection unit 230. In addition, the supplementary control unit 116 controls the pump drive unit 222 to maintain the pressure in the liquid delivery unit 210 at the value adjusted by executing steps S231 and S232.

[0238] In one example, the replenishment preparation unit 115 controls the pump drive unit 272 to bring the pressure between the pump 266 of the replenishment unit 250 and the first switching valve 236 close to the first set value Pr1. The replenishment preparation unit 115 repeats steps S234 and S235 until the pressure between the replenishment unit 250 and the first switching valve 236 reaches the first set value Pr1. By executing steps S234 and S235, the replenishment preparation unit 115 reduces the pressure difference between the first connection part 230 and the liquid delivery part 210 while the second switching valve 238 is open and the first switching valve 236 is closed.

[0239] Next, the control device 100 executes step S236. In step S236, for example, the replenishment preparation unit 115, while maintaining the second switching valve 238 in the open state and the output valve 218 and the spray valve 72 in the closed state, switches the first switching valve 236 from the closed state to the open state. As a result, a flow of processed liquid from the pump 266 of the liquid delivery unit 210 through the filter 234 toward the pump 216 of the liquid delivery unit 210 is generated. Through the above steps, the replenishment preparation unit 115 completes the replenishment preparation process.

[0240] Figure 29 This is a flowchart illustrating an example of the supplementary control process in step S204. For example... Figure 29 As shown, the control device 100 first executes steps S241 and S242. In step S241, for example, the replenishment control unit 116 adjusts the replenishment pressure and replenishment flow rate of the processed liquid delivered from the pressurized delivery unit 256 (pump 266) of the replenishment unit 250 to the pressurized delivery unit 214 (pump 216) of the liquid delivery unit 210. In one example, the replenishment control unit 116 controls either the pressurized delivery unit 256 or the pressurized delivery unit 214 in the same way as the adjustment of the replenishment pressure / replenishment flow rate in the first embodiment, so that the replenishment pressure follows the target value, and controls the other of the pressurized delivery unit 256 and the pressurized delivery unit 214 so that the replenishment flow rate follows the target value.

[0241] The replenishment control unit 116 repeats steps S241 and S242 until a predetermined time has elapsed since the start of step S241. The predetermined time is predetermined so that the replenishment of the processing fluid to the liquid delivery unit 210 (pump 216) is completed within that time, and the predetermined time is stored in the operation command holding unit 102.

[0242] Next, the control device 100 executes step S243. In step S243, while maintaining the output valve 218 and the spray valve 72 in a closed state, the replenishment control unit 116 switches the first switching valve 236 and the second switching valve 238 from an open state to a closed state, respectively. As a result, the flow of the processing liquid from the pump 266 of the replenishment unit 250 to the pump 216 of the delivery unit 210 stops.

[0243] Next, the control device 100 executes step S244. In step S244, for example, the control device 100 adjusts the pressure in pump 266 of the replenishment unit 250 and the pressure in pump 216 of the delivery unit 210, respectively. In one example, the control device 100 controls the pump drive unit 272 based on the measured value of the pressure measuring unit 274, thereby adjusting the pressure in pump 266 (the pressure in the replenishment unit 250) to the standby pressure Ps1. The control device 100 controls the pump drive unit 222 based on the measured value of the pressure measuring unit 224, thereby adjusting the pressure in pump 216 (the pressure in the delivery unit 210) to the standby pressure Ps2. Through the above steps, the replenishment control unit 116 ends the replenishment process.

[0244] [Effects of the Third Implementation]

[0245] In the coating / developing apparatus 2 and liquid processing process described in the third embodiment above, the first switching valve 236 is opened after the pressure difference between the replenishment section 250 and the liquid delivery section 210 decreases, similar to the first and second embodiments. Therefore, when the first switching valve 236 is opened, fluctuations in the processing liquid within the flow path used to replenish the processing liquid from the replenishment section 250 to the liquid delivery section 210 can be suppressed. This is therefore useful for reducing particulate matter in the processing liquid ejected onto the wafer W.

[0246] In the third embodiment described above, the filter 234 is disposed within the first connection portion 230. A first switching valve 236 opens and closes the filter 234 and the liquid delivery portion 210. When the first switching valve 236 is opened, a flow of processed liquid passes through the filter 234 and reaches the liquid delivery portion 210. Assuming that the first switching valve 236 is opened when the pressure difference between the replenishment portion 250 and the liquid delivery portion 210 is large, fluctuations in the processed liquid corresponding to the degree of particle generation from the filter 234 may occur within the first connection portion 230 connecting the replenishment portion 250 and the liquid delivery portion 210. In contrast, in the above configuration, the first switching valve 236 is opened after the pressure difference between the replenishment portion 250 and the liquid delivery portion 210 has decreased. Therefore, it is useful for suppressing the generation of particles caused by fluctuations in the processed liquid within the first connection portion 230.

[0247] In the third embodiment described above, the first connection portion 230 includes a second switching valve 238 that opens and closes the connection between the replenishment portion 250 and the filter 234. The replenishment preparation portion 115 sequentially performs the following: reducing the pressure difference between the replenishment portion 250 and the delivery portion 210 while the first switching valve 236 and the second switching valve 238 are closed; and reducing the pressure difference between the first connection portion 230 and the delivery portion 210 while the second switching valve 238 is open and the first switching valve 236 is closed. In this case, compared to switching the first switching valve 236 and the second switching valve 238 to the open state at approximately the same timing, the pressure difference between the upstream and downstream of the first switching valve 236 can be reduced with higher precision. Therefore, it is more useful for suppressing the generation of particles caused by fluctuations in the processed liquid within the first connection portion 230. Furthermore, there is a tendency for the piping volume within the replenishment portion 250 to be larger than the piping volume of the processed liquid within the delivery portion 210. In the above structure, the switching valve located on the upstream side with the larger piping volume is opened in stages, thereby making it easy to adjust the pressure difference between the replenishment section 250 and the delivery section 210.

[0248] (Modified Example)

[0249] In the replenishment preparation process of step S203, in the above example, the pressure in the delivery section 210 and the pressure in the replenishment section 250 are changed respectively. However, the replenishment preparation section 115 can reduce the pressure difference between the delivery section 210 and the replenishment section 250 by changing the pressure of either one. For example, with the first switching valve 236 and the second switching valve 238 closed, the replenishment preparation section 115 can change the pressure in the replenishment section 250 without changing the pressure in the delivery section 210 to reduce the pressure difference between the replenishment section 250 and the delivery section 210. Moreover, with the second switching valve 238 open and the first switching valve 236 closed, the replenishment preparation section 115 can change the pressure in the first connection section 230 without changing the pressure in the delivery section 210 to reduce the pressure difference between the first connection section 230 and the delivery section 210.

[0250] The replenishment preparation unit 115 can, with the first switching valve 236 and the second switching valve 238 closed, change the pressure in the delivery unit 210 without changing the pressure in the replenishment unit 250, thereby reducing the pressure difference between the replenishment unit 250 and the delivery unit 210. Furthermore, with the second switching valve 238 open and the first switching valve 236 closed, the replenishment preparation unit 115 can, with the second switching valve 238 open and the first switching valve 236 closed, change the pressure in the delivery unit 210 without changing the pressure in the replenishment unit 250, thereby reducing the pressure difference between the first connection unit 230 and the delivery unit 210.

[0251] In the above example, the opening and closing states are switched sequentially according to the second switching valve 238 and the first switching valve 236. However, the replenishment preparation unit 115 can switch the second switching valve 238 to the open state after switching the first switching valve 236 to the open state. Specifically, the replenishment preparation unit 115 can reduce the pressure difference between the replenishment unit 250 and the delivery unit 210 while the first switching valve 236 and the second switching valve 238 are closed, and then switch the first switching valve 236 to the open state. Moreover, the replenishment preparation unit 115 can reduce the pressure difference between the delivery unit 210 (more specifically, the area downstream of the second switching valve 238 in the first connection unit 230) and the replenishment unit 250 while the first switching valve 236 is open and the second switching valve 238 (switching valve) is closed. Afterward, the replenishment preparation unit 115 can switch the second switching valve 238 to the open state, thereby opening the gap between the replenishment unit 250 and the delivery unit 210.

[0252] The first connecting portion 230 may also omit the second switching valve 238. In this case, the replenishment preparation unit 115 can reduce the pressure difference between the replenishment unit 250 (more specifically, the area upstream of the first switching valve 236 in the replenishment unit 250 and the delivery unit 210) while the first switching valve 236 is closed. The first connecting portion 230 may also omit the first switching valve 236. In this case, the replenishment preparation unit 115 can reduce the pressure difference between the delivery unit 210 (more specifically, the area downstream of the second switching valve 238 in the first connecting portion 230 and the replenishment unit 250) while the second switching valve 238 (switching valve) is closed.

[0253] Furthermore, the specific examples mentioned above include the following structures.

[0254] (Postscript 1)

[0255] A substrate processing apparatus comprising:

[0256] The ejection section has a nozzle that ejects the processing liquid onto the substrate;

[0257] A liquid delivery unit that supplies the treatment liquid to the spraying unit;

[0258] A replenishment unit that replenishes the liquid delivery unit with the processing liquid intended for delivery to the ejection unit;

[0259] The connecting part has a switching valve that opens and closes the replenishment part and the liquid delivery part;

[0260] A filter that removes foreign matter contained in the treatment liquid supplied from the replenishment unit to the delivery unit;

[0261] The replenishment preparation unit opens the switching valve after reducing the pressure difference between the replenishment unit and the delivery unit; and

[0262] The replenishment control unit, when the switching valve is opened by the replenishment preparation unit, causes the replenishment unit to begin replenishing the processing liquid to the liquid delivery unit.

[0263] The filter is disposed within the liquid delivery section.

[0264] The replenishment preparation unit changes the pressure within the replenishment unit when the switching valve is closed, so as to reduce the pressure difference between the replenishment unit and the liquid delivery unit.

[0265] (Postscript 2)

[0266] According to the substrate processing apparatus described in Appendix 2,

[0267] The liquid delivery unit further includes: a liquid delivery pipe that connects the replenishment unit to the ejection unit via the filter; a pressurized delivery unit for ejection that receives the treatment liquid from the replenishment unit via the liquid delivery pipe and delivers the treatment liquid to the ejection unit via the liquid delivery pipe; and a connecting valve that opens and closes the connection between the liquid delivery pipe and the pressurized delivery unit for ejection.

[0268] The replenishment unit includes a liquid source and a pressurized delivery unit for replenishing the processed liquid from the liquid source to the liquid delivery unit.

[0269] The supplementary control unit controls either the supplementary pressurized conveying unit or the ejection pressurized conveying unit to make the supplementary pressure from the supplementary pressurized conveying unit to the ejection pressurized conveying unit follow the target value, and controls the other of the supplementary pressurized conveying unit and the ejection pressurized conveying unit to make the supplementary flow rate from the supplementary pressurized conveying unit to the ejection pressurized conveying unit follow the target value.

[0270] (Note 3)

[0271] According to the substrate processing apparatus described in Appendix 2,

[0272] It also includes a spray control unit that controls the spray pressurized delivery unit to ensure that the spray pressure of the treatment fluid delivered to the nozzle follows a target value.

[0273] In controlling the replenishment pressure to follow the target value, the replenishment control unit sets the target value of the replenishment pressure to the target value of the ejection pressure until the replenishment of the treatment fluid is completed.

[0274] (Note 4)

[0275] According to the substrate processing apparatus described in Appendix 2,

[0276] It also includes a spray control unit that controls the spray pressurized delivery unit to ensure that the spray pressure of the treatment fluid delivered to the nozzle follows a target value.

[0277] In controlling the replenishment pressure to follow the target value, the replenishment control unit gradually brings the target value of the replenishment pressure closer to the target value of the ejection pressure until the replenishment of the treatment fluid is completed.

[0278] (Note 5)

[0279] The substrate processing apparatus according to Appendix 1 or 2 further includes:

[0280] A spray valve that opens and closes the liquid delivery section and the spray section;

[0281] The ejection preparation unit changes the pressure within the liquid delivery section to reduce the pressure difference between the liquid delivery section and the ejection section, and then opens the ejection valve; and

[0282] The ejection control unit causes the nozzle to begin ejecting the processing liquid onto the substrate when the ejection valve is opened by the ejection preparation unit.

[0283] (Note 6)

[0284] According to the substrate processing apparatus described in Appendix 1,

[0285] The liquid delivery unit further includes: a liquid delivery pipe that connects the replenishment unit to the ejection unit via the filter; a pressurized delivery unit for ejection that receives the treatment liquid from the replenishment unit via the liquid delivery pipe and delivers the treatment liquid to the ejection unit via the liquid delivery pipe; and a connecting valve that opens and closes the connection between the liquid delivery pipe and the pressurized delivery unit for ejection.

[0286] The switching valve opens and closes with a smaller rate of change of opening than the connecting valve.

[0287] (Note 7)

[0288] According to the substrate processing apparatus described in Appendix 1,

[0289] It also includes a spray valve, which opens and closes the liquid delivery section and the spray section.

[0290] The liquid delivery unit includes: a liquid delivery pipe that connects the replenishment unit to the ejection unit via the filter; a pressurized delivery unit for ejection that receives the treatment liquid from the replenishment unit via the liquid delivery pipe and delivers the treatment liquid to the ejection unit via the liquid delivery pipe; a connecting valve that opens and closes the connection between the liquid delivery pipe and the pressurized delivery unit for ejection; and a pressure measuring unit that measures the pressure between the filter and the pressurized delivery unit for ejection.

[0291] The replenishment unit includes a liquid source and a pressurized delivery unit for replenishing the processed liquid from the liquid source to the liquid delivery unit.

[0292] The supplementary preparation section is executed sequentially as follows:

[0293] With the switching valve closed, the replenishment pressurization delivery unit is controlled to reduce the pressure difference between the replenishment unit and the delivery unit.

[0294] With the switching valve open and the ejection valve and the connecting valve closed, the supplementary pressurized delivery unit is controlled based on the measured value of the pressure measuring unit, so that the pressure between the supplementary pressurized delivery unit and the ejection pressurized delivery unit is close to a set value; and

[0295] With the switching valve and the ejection valve closed and the connecting valve open, the ejection pressurized delivery unit is controlled based on the measured value of the pressure measuring unit so that the pressure in the delivery unit is close to the set value.

Claims

1. A substrate processing apparatus comprising: The ejection section has a nozzle that ejects the processing liquid onto the substrate; A liquid delivery unit that supplies the treatment liquid to the spraying unit; A replenishment unit that replenishes the liquid delivery unit with the processing liquid intended for delivery to the ejection unit; The connecting part has a switching valve that opens and closes the replenishment part and the liquid delivery part; A filter that removes foreign matter contained in the treatment liquid supplied from the replenishment unit to the liquid delivery unit; The replenishment preparation unit opens the switching valve after reducing the pressure difference between the replenishment unit and the delivery unit; and The replenishment control unit, when the switching valve is opened by the replenishment preparation unit, causes the replenishment unit to begin replenishing the processing liquid to the liquid delivery unit in a unidirectional flow manner. The filter is installed inside the liquid delivery section. The liquid delivery unit further includes: a liquid delivery pipe that connects the replenishment unit to the ejection unit via the filter; a pressurized delivery unit for ejection that receives the treatment liquid from the replenishment unit via the liquid delivery pipe and delivers the treatment liquid to the ejection unit via the liquid delivery pipe; and a connecting valve that opens and closes the connection between the liquid delivery pipe and the pressurized delivery unit for ejection. The replenishment unit includes a liquid source and a pressurized delivery unit for replenishing the processed liquid from the liquid source to the liquid delivery unit. The supplementary control unit controls either the supplementary pressurized delivery unit or the ejection pressurized delivery unit to ensure that the supplementary pressure from the supplementary pressurized delivery unit to the ejection pressurized delivery unit follows a target value. The supplementary control unit controls the other of the supplementary pressurized delivery unit and the ejection pressurized delivery unit to make the supplementary flow rate from the supplementary pressurized delivery unit to the ejection pressurized delivery unit follow the target value.

2. The substrate processing apparatus according to claim 1, characterized in that, The replenishment preparation unit changes the pressure in the liquid delivery unit when the switching valve is closed, so as to reduce the pressure difference between the replenishment unit and the liquid delivery unit.

3. The substrate processing apparatus according to claim 1, characterized in that, It also includes a spray control unit that controls the spray pressurized delivery unit to ensure that the spray pressure of the treatment fluid delivered to the nozzle follows a target value. In controlling the replenishment pressure to follow the target value, the replenishment control unit gradually brings the target value of the replenishment pressure closer to the target value of the ejection pressure until the replenishment of the treatment fluid is completed.

4. A substrate processing apparatus comprising: The ejection section has a nozzle that ejects the processing liquid onto the substrate; A liquid delivery unit that supplies the treatment liquid to the spraying unit; A replenishment unit that replenishes the liquid delivery unit with the processing liquid intended for delivery to the ejection unit; The connecting part has a switching valve that opens and closes the replenishment part and the liquid delivery part; A filter that removes foreign matter contained in the treatment liquid supplied from the replenishment unit to the liquid delivery unit; The replenishment preparation unit opens the switching valve after reducing the pressure difference between the replenishment unit and the liquid delivery unit. A replenishment control unit, which, when the switching valve is opened by the replenishment preparation unit, causes the replenishment unit to begin replenishing the processing liquid to the liquid delivery unit in a unidirectional flow manner; and The ejection valve opens and closes the connection between the liquid delivery section and the ejection section. The filter is installed inside the liquid delivery section. The replenishment preparation unit changes the pressure in the liquid delivery unit when the switching valve is closed, so as to reduce the pressure difference between the replenishment unit and the liquid delivery unit. The liquid delivery unit further includes: a liquid delivery pipe that connects the replenishment unit to the ejection unit via the filter; a pressurized delivery unit for ejection that receives the treatment liquid from the replenishment unit via the liquid delivery pipe and delivers the treatment liquid to the ejection unit via the liquid delivery pipe; a connecting valve that opens and closes the connection between the liquid delivery pipe and the pressurized delivery unit for ejection; and a pressure measuring unit that measures the pressure between the filter and the pressurized delivery unit for ejection. The replenishment unit includes a liquid source and a pressurized delivery unit for replenishing the processed liquid from the liquid source to the liquid delivery unit. The supplementary preparation section is executed sequentially as follows: With the switching valve and the ejection valve closed and the connecting valve open, the ejection pressurized delivery unit is controlled based on the measured value of the pressure measuring unit so that the pressure in the delivery unit is close to the set value. as well as With the switching valve open and the ejection valve and the connecting valve closed, the supplementary pressurized delivery unit is controlled based on the measured value of the pressure measuring unit, so that the pressure between the supplementary pressurized delivery unit and the ejection pressurized delivery unit is close to the set value.

5. The substrate processing apparatus according to claim 1 or 4, wherein The switching valve opens and closes with a smaller rate of change of opening than the connecting valve.

6. The substrate processing apparatus according to claim 4, wherein It also has: The ejection preparation section changes the pressure in the liquid delivery section to reduce the pressure difference between the liquid delivery section and the ejection section, and then opens the ejection valve; as well as The ejection control unit causes the nozzle to begin ejecting the processing liquid onto the substrate when the ejection valve is opened by the ejection preparation unit.

7. A substrate processing apparatus comprising: The ejection section has a nozzle that ejects the processing liquid onto the substrate; A liquid delivery unit that supplies the treatment liquid to the spraying unit; A replenishment unit that replenishes the liquid delivery unit with the processing liquid intended for delivery to the ejection unit; The connecting part has a switching valve that opens and closes the replenishment part and the liquid delivery part; A filter that removes foreign matter contained in the treatment liquid supplied from the replenishment unit to the liquid delivery unit; The replenishment preparation unit opens the switching valve after reducing the pressure difference between the replenishment unit and the delivery unit; and The replenishment control unit, when the switching valve is opened by the replenishment preparation unit, causes the replenishment unit to begin replenishing the processing liquid to the liquid delivery unit in a unidirectional flow manner. The filter is disposed within the connecting part. The switching valve opens and closes the connection between the filter and the liquid delivery unit. The connecting part also has a second switching valve, which opens and closes the connection between the replenishment part and the filter. The supplementary preparation section is executed sequentially as follows: With the switching valve and the second switching valve closed, the pressure difference between the replenishment section and the delivery section is reduced. as well as With the second switching valve open and the switching valve closed, the pressure difference between the connection section and the liquid delivery section is reduced. Specifically, after the treatment liquid is sprayed out and before the pressure difference between the replenishment section and the delivery section is reduced, the replenishment preparation section changes the pressure in the replenishment section to a pressure greater than the standby pressure in the delivery section after the treatment liquid is sprayed out from the nozzle.

8. A substrate processing apparatus comprising: The ejection section has a nozzle that ejects the processing liquid onto the substrate; A liquid delivery unit that supplies the treatment liquid to the spraying unit; A replenishment unit that replenishes the liquid delivery unit with the processing liquid intended for delivery to the ejection unit; The connecting part has a switching valve that opens and closes the replenishment part and the liquid delivery part; A filter that removes foreign matter contained in the treatment liquid supplied from the replenishment unit to the liquid delivery unit; The replenishment preparation unit opens the switching valve after reducing the pressure difference between the replenishment unit and the delivery unit; and The replenishment control unit, when the switching valve is opened by the replenishment preparation unit, causes the replenishment unit to begin replenishing the processing liquid to the liquid delivery unit in a unidirectional flow manner. The filter is disposed within the connecting part. The switching valve opens and closes the connection between the filter and the liquid delivery unit. The connecting part also has a second switching valve, which opens and closes the connection between the replenishment part and the filter. The supplementary preparation section is executed sequentially as follows: With the switching valve and the second switching valve closed, the pressure difference between the replenishment section and the delivery section is reduced; and With the second switching valve open and the switching valve closed, the pressure difference between the connection section and the liquid delivery section is reduced. wherein While maintaining a pressure in the replenishment section that is greater than the pressure in the delivery section, the replenishment preparation section reduces the pressure difference between the replenishment section and the delivery section, and also reduces the pressure difference between the connection section and the delivery section.

9. The substrate processing apparatus according to any one of claims 1, 7, and 8, characterized in that, It also has: A spray valve that opens and closes the liquid delivery section and the spray section; The ejection preparation section changes the pressure in the liquid delivery section to reduce the pressure difference between the liquid delivery section and the ejection section, and then opens the ejection valve; as well as The ejection control unit causes the nozzle to begin ejecting the processing liquid onto the substrate when the ejection valve is opened by the ejection preparation unit.

10. A control method for controlling a substrate processing apparatus, the substrate processing apparatus comprising: an ejection section having a nozzle for ejecting processing liquid onto a substrate; a liquid delivery section for delivering the processing liquid to the ejection section; a replenishment section for replenishing the liquid delivery section with the processing liquid delivered to the ejection section; and a connection section having a switching valve for opening and closing between the replenishment section and the liquid delivery section. And a filter that removes foreign matter contained in the treatment fluid supplied from the replenishment unit to the delivery unit. The control method includes: Reduce the pressure difference between the replenishment section and the delivery section, and then open the switching valve; and With the switching valve open, the replenishment unit begins to replenish the processing liquid to the delivery unit in a unidirectional flow manner. The filter is disposed within the liquid delivery section, which further comprises: a liquid delivery pipe connecting the replenishment section and the ejection section via the filter; a pressurized delivery section for ejection that receives the treatment liquid from the replenishment section via the liquid delivery pipe and delivers the treatment liquid to the ejection section via the liquid delivery pipe; and a connecting valve that opens and closes the connection between the liquid delivery pipe and the pressurized delivery section for ejection. The replenishment section has a liquid source and a pressurized delivery section for replenishing the treatment liquid from the liquid source to the liquid delivery section. The control method further includes: Control either the replenishment pressurized conveying unit or the ejection pressurized conveying unit so that the replenishment pressure from the replenishment pressurized conveying unit to the ejection pressurized conveying unit follows a target value. The other of the supplementary pressurized conveying unit and the ejection pressurized conveying unit is controlled so that the supplementary flow rate from the supplementary pressurized conveying unit to the ejection pressurized conveying unit follows the target value.

11. A control method for controlling a substrate processing apparatus, the substrate processing apparatus comprising: an ejection section having a nozzle for ejecting a processing liquid onto a substrate; a delivery section for supplying the processing liquid to the ejection section; a replenishment section for replenishing the delivery section with the processing liquid supplied to the ejection section; a connection section having a switching valve for opening and closing between the replenishment section and the delivery section; a filter for removing foreign matter contained in the processing liquid supplied from the replenishment section to the delivery section; and an ejection valve for opening and closing between the delivery section and the ejection section. The filter is installed inside the liquid delivery section. The liquid delivery unit further includes: a liquid delivery pipe that connects the replenishment unit to the ejection unit via the filter; a pressurized delivery unit for ejection that receives the treatment liquid from the replenishment unit via the liquid delivery pipe and delivers the treatment liquid to the ejection unit via the liquid delivery pipe; a connecting valve that opens and closes the connection between the liquid delivery pipe and the pressurized delivery unit for ejection; and a pressure measuring unit that measures the pressure between the filter and the pressurized delivery unit for ejection. The replenishment unit includes a liquid source and a pressurized delivery unit for replenishing the processed liquid from the liquid source to the liquid delivery unit. The control method includes: Reduce the pressure difference between the replenishment section and the delivery section, and then open the switching valve; as well as With the switching valve open, the replenishment unit begins to replenish the processing liquid to the delivery unit in a unidirectional flow manner. Specifically, when the switching valve is closed, the pressure within the liquid delivery section is changed to reduce the pressure difference between the replenishment section and the liquid delivery section. The control method further includes executing the following sequentially: With the switching valve and the ejection valve closed and the connecting valve open, the ejection pressurized delivery unit is controlled based on the measured value of the pressure measuring unit so that the pressure in the delivery unit is close to the set value. as well as With the switching valve open and the ejection valve and the connecting valve closed, the supplementary pressurized delivery unit is controlled based on the measured value of the pressure measuring unit, so that the pressure between the supplementary pressurized delivery unit and the ejection pressurized delivery unit is close to the set value.

12. The control method according to claim 10 or 11, characterized in that, The switching valve opens and closes with a smaller rate of change of opening than the connecting valve.

13. The control method according to claim 11, characterized in that, Also includes: The pressure inside the liquid delivery section is changed to reduce the pressure difference between the liquid delivery section and the spray section, and then the spray valve is opened; as well as With the spray valve open, the nozzle begins to spray the processing liquid onto the substrate.

14. A control method for controlling a substrate processing apparatus, the substrate processing apparatus comprising: an ejection section having a nozzle for ejecting processing liquid onto a substrate; a liquid delivery section for delivering the processing liquid to the ejection section; a replenishment section for replenishing the liquid delivery section with the processing liquid delivered to the ejection section; and a connection section having a switching valve for opening and closing between the replenishment section and the liquid delivery section. And a filter that removes foreign matter contained in the treatment fluid supplied from the replenishment unit to the delivery unit. The control method includes: Reduce the pressure difference between the replenishment section and the delivery section, and then open the switching valve; With the switching valve open, the replenishment unit begins to replenish the processing liquid to the liquid delivery unit in a unidirectional flow manner; Specifically, before reducing the pressure difference between the replenishment section and the delivery section, the pressure in the replenishment section is changed to a pressure greater than the pressure in the delivery section.

15. A control method for controlling a substrate processing apparatus, the substrate processing apparatus comprising: an ejection section having a nozzle for ejecting processing liquid onto a substrate; a liquid delivery section for delivering the processing liquid to the ejection section; a replenishment section for replenishing the liquid delivery section with the processing liquid delivered to the ejection section; and a connection section having a switching valve for opening and closing between the replenishment section and the liquid delivery section. And a filter that removes foreign matter contained in the treatment fluid supplied from the replenishment unit to the delivery unit. The control method includes: Reduce the pressure difference between the replenishment section and the delivery section, and then open the switching valve; and With the switching valve open, the replenishment unit begins to replenish the processing liquid to the delivery unit in a unidirectional flow manner. Specifically, from the moment the pressure difference between the replenishment section and the delivery section begins to decrease until the processing liquid is replenished from the replenishment section to the delivery section, the pressure in the replenishment section is maintained at a level greater than the pressure in the delivery section.

16. The control method according to any one of claims 10, 14, and 15, characterized in that, The substrate processing apparatus further includes: a spray valve that opens and closes the liquid delivery section and the spray section. The control method further includes: changing the pressure in the liquid delivery section to reduce the pressure difference between the liquid delivery section and the ejection section, and then opening the ejection valve; and With the spray valve open, the nozzle begins to spray the processing liquid onto the substrate.

17. A computer-readable storage medium storing a program for causing a device to perform the control method according to any one of claims 10 to 16.

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