Flexible chip packaging structure and flexible chip packaging method
By designing the electrical interconnection between the leads and the pads in the flexible chip packaging structure, and allowing the leads to be stretched and deformed when bent, combined with strengthening structure and dispensing fixation, the problem of leads breaking and bonding points when bent is solved, improving the stability and performance of the product.
Patent Information
- Application Number
- CN201911037343.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-10-29
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2039-10-29
AI Technical Summary
When the existing flexible chip packaging structure is bent, the leads are prone to break and the bonding points are prone to debonding, which affects the performance of flexible electronic products.
A flexible chip packaging structure is designed. Through the electrical interconnection between the leads and the pads, the leads can be stretched and deformed when the flexible circuit board is bent, buffering the deformation and tension generated by bend, and the stability of the connection is improved by strengthening the structure and dispensing fixation.
It improves the stability and reliability of the flexible chip packaging structure, reduces the possibility of lead breakage and bonding point debonding, and improves the performance of flexible electronic products.