Device and method for forming the same

Abstract

A device and a method for forming the device, the device comprising: a first film having a first interior, a first sealing portion and a first contact portion; and a second film having a second interior, a second sealing portion and a second contact portion; a first circuit member having a first contact point; and a second circuit member having a second contact point. The first sealing portion and the second sealing portion are combined together. The first contact portion and the second contact portion are in contact with each other in a contact area that surrounds the first interior and the second interior over the entire edge of the first interior and the second interior. The first circuit member and the second circuit member are enclosed in a closed space surrounded by the first interior and the second interior. The first contact point and the second contact point are in contact with each other. The present invention provides a new device that can be made thinner.

Description

Technical Field

[0001] The present invention relates to a device including a circuit member sealed by a thin film and a method for forming the device. Background Art

[0002] For example, a device that can be made thinner is disclosed in JP2001-332654A (Patent Document 1), the contents of which are incorporated herein by reference.

[0003] refer to Fig.17 , Patent document 1 discloses a module (device) 90 with a built-in semiconductor chip. The device 90 includes a thermosetting resin composition (sealing resin) 92 and a circuit member 94 including a semiconductor chip 96 and a wiring pattern 98. The sealing resin 92 is formed so that the circuit member 94 is embedded therein. Then, the surface of the sealing resin 92 is polished so that the device 90 is thinned.

[0004] For devices including circuit members, further thickness reduction is required. Summary of the invention

[0005] Therefore, an object of the present invention is to provide a novel device that can be made thinner.

[0006] One aspect of the present invention provides a device including a first film, a second film, a first circuit member and a second circuit member. The first film has a first interior and a first exterior. The first interior is located inside the first exterior. The second film has a second interior and a second exterior. The second interior is located inside the second exterior. The first exterior has a first sealing portion and a first contact portion. The second exterior has a second sealing portion and a second contact portion. The first sealing portion and the second sealing portion are combined together to form a sealing trace. The first contact portion and the second contact portion contact each other in a contact area. The contact area surrounds the entire edge of the first interior and the second interior. The device is formed with a closed space surrounded by the first interior and the second interior. The first circuit member and the second circuit member are enclosed in the closed space. The first circuit member has a first contact point. The second circuit member has a second contact point. The first contact point and the second contact point contact each other. The second circuit member has a second contact point. The first contact point and the second contact point contact each other. The second circuit member has a second contact point. The first contact point and the second contact point contact each other.

[0007] Another aspect of the present invention provides a method for forming a device, which includes a first film, a second film, a first circuit member and a second circuit member. The forming method includes a preparation step, an arrangement step and a sealing step. In the preparation step, the first film, the second film, the first circuit member and the second circuit member are prepared. The first circuit member includes a first contact point. The second circuit member includes a second contact point. In the arrangement step, the first film, the first circuit member, the second circuit member and the second film stacked in sequence are arranged in a chamber while the first contact point and the second contact point face each other. In the sealing step, the first film and the second film are sealed in a state where the chamber is evacuated, so that the first circuit member and the second circuit member are enclosed in a closed space surrounded by the first film and the second film, and the first contact point and the second contact point are in contact with each other.

[0008] According to a device of one aspect of the present invention, a first film and a second film overlap each other to contact each other, and a first circuit member and a second circuit member (hereinafter referred to as "circuit member") are sandwiched between them. Except that a contact point should be set for each circuit member, the structure of each circuit member is not limited. Therefore, each circuit member of one aspect of the present invention has a simple structure and can be formed by various materials. For example, each circuit member can be an insulating film formed with a conductive pattern having a contact point. In this case, the thickness of the entire device can be made very thin. Thus, one aspect of the present invention provides a new type of device that can be made thinner.

[0009] An appreciation of the objectives of the present invention and a more complete understanding of its structure may be had by studying the following description of the preferred embodiment and referring to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 : is a perspective view showing a device according to an embodiment of the present invention, in which a boundary line of a contact region formed between a first film and a second film is shown by a dotted line, and a portion surrounded by a dashed line is enlarged and shows a portion of the device.

[0011] Figure 2 It is shown Figure 1 FIG. 1 is an exploded perspective view of a device of FIG. 1 , wherein a boundary line of a contact region of each of the first film and the second film is shown by a dotted line.

[0012] Figure 3 It is shown Figure 1 0013 is a perspective view of a device, in which the first film is not shown, the boundary line of the contact area of ​​the second film is shown by a dotted line, and the outline pattern of the hidden first conductive body and the hidden second conductive pattern are represented by dot-dash lines.

[0013] Figure 4 It is shown Figure 3FIG. 1 is a diagram of a specific example of a first conductive pattern of a first circuit member and a second conductive pattern of a second circuit member.

[0014] Figure 5 It was taken along line VV Figure 1 sectional views of a device, in which three parts of the device (respectively surrounded by dot-dash lines) are enlarged and shown, and the boundary line of the contact area is shown by a dotted line in one of the enlarged views.

[0015] Figure 6 is shown for forming Figure 1 A flow chart of an example of a method of forming a device.

[0016] Figure 7 It is shown in Figure 6 A perspective view of a device material set prepared in a preparatory step of a forming method, wherein outlines of a hidden first circuit component and a hidden second circuit component are shown with dotted lines.

[0017] Figure 8 It is shown Figure 7 1 is a side view of a device material group, wherein three parts of the device material group surrounded by dotted lines are enlarged and illustrated.

[0018] Fig. 9 It is shown Figure 6 A schematic structural view of a side surface of a chamber in an arrangement step of a forming method and a device material group arranged in the chamber.

[0019] Fig.10 It is shown that multiple Figure 7 1 is a view of components of a device material group, wherein the outlines of a hidden first circuit component and a hidden second circuit component are shown with dotted lines, and the boundary lines between each device material group and other device material groups are shown with dot-dash lines.

[0020] Fig.11 It is shown Figure 7 0014] A perspective view of a variant of a component material group, wherein the outlines of a hidden first circuit component and a hidden second circuit component are shown by dashed lines.

[0021] Fig.12 It is shown by Fig.11 1 is a perspective view of a device formed of a device material group, wherein a boundary line of a contact region formed between a first film and a second film is shown by a dotted line.

[0022] Fig.13 It is shown Figure 7 0026] A perspective view of another variant of a component material group, wherein the outlines of a hidden first circuit component and a hidden second circuit component are shown by dashed lines.

[0023] Fig.14 It is shown by Fig.13 1 is a perspective view of a device formed of a device material group, wherein a boundary line of a contact region formed between a first film and a second film is shown by a dotted line.

[0024] Fig.15 It is shown Figure 2 0 is an exploded perspective view of a variation of the device, wherein the outline of the hidden first conductive pattern is shown with a dotted line.

[0025] Fig.16 It is shown Fig.15 A side view of a device material group of a device, wherein a portion of the device material group surrounded by a dotted line is enlarged and shown, the position of the main surface of the compression elastic component is represented by a double dotted line in the enlarged view of the figure, and a portion of the device material group surrounded by a dotted line is enlarged, and the cross-section of the device manufactured is represented by an enlarged view.

[0026] Fig.17 : is a cross-sectional view showing the device of Patent Document 1.

[0027] Although the invention is susceptible to various modifications and alternative forms, specific embodiments of the invention are shown by way of example in the drawings and will be described in detail herein. It should be understood, however, that the drawings and detailed description thereof are not intended to limit the invention to the particular forms disclosed, but on the contrary, are intended to cover all modifications, equivalents and alternative forms falling within the spirit and scope of the invention as defined by the appended claims. DETAILED DESCRIPTION

[0028] refer to Figure 1 , the device 10 according to an embodiment of the present invention is an independent electronic device. More specifically, the device 10 can work alone without being physically attached to another electronic device (not shown). For example, the device 10 measures the heart rate of the subject by attaching the device 10 near the heart of the subject, and sends the measurement result to another electronic device. Therefore, the device 10 can be used as an electronic device for measuring biological information such as heart rhythm. However, the present invention is not limited to this, but can be applied to various devices with various functions.

[0029] The device 10 of the present embodiment includes a circuit structure 12 and a film member 14. The circuit structure 12 is a member for enabling the device 10 to be used as an electronic device. For example, the circuit structure 12 has an electronic circuit (not shown) for measuring heart rate and another electronic circuit (not shown) for transmitting the measurement result to another electronic device (not shown). The film member 14 completely accommodates the circuit structure 12 therein and protects the circuit structure 12 from the external environment. Therefore, the circuit structure 12 is enclosed in the film member 14.

[0030] Hereinafter, the structure of the device 10 of this embodiment will be described.

[0031] refer to Figure 2 , the circuit structure 12 of the present embodiment includes a first circuit member 40 and a second circuit member 50. The film member 14 of the present embodiment includes a first film 20 composed of an insulator and a second film 30 composed of an insulator. Therefore, the device 10 includes the first film 20, the second film 30, the first circuit member 40 and the second circuit member 50. The above four members, namely the first film 20, the second film 30, the first circuit member 40 and the second circuit member 50, are stacked and combined in the up-down direction (Z direction) to form one of the devices 10 (see Figure 1 ). The device 10 of this embodiment only includes the above four components. However, the present invention is not limited thereto, and in addition to the above four components, the device 10 may also include other components. For example, the device 10 may further include additional circuit components.

[0032] refer to Figure 2 and Figure 3 , the first circuit member 40 of the present embodiment has a first base 42 and a first conductive pattern 44. The first base 42 of the present embodiment is a rectangular sheet formed of an insulating film, and is bendable. The first base 42 extends parallel to a horizontal plane (sheet plane: XY plane) perpendicular to the Z direction. The first conductive pattern 44 is formed on the first base 42. Specifically, the first conductive pattern 44 is made of a conductor such as copper, and is formed on the lower surface (negative Z side surface) of the first base 42 by a formation method such as silver ink printing or etching.

[0033] The second circuit member 50 of the present embodiment has a second base 52 and a second conductive pattern 54. The second base 52 of the present embodiment is a thin and rectangular sheet formed of a film, and is bendable. The second base portion 52 extends parallel to the XY plane. The second conductive pattern 54 is formed on the second base 52. Specifically, the second conductive pattern 54 is made of a conductor such as copper, and is formed on the upper surface (positive Z side surface) of the second base 52 by a forming method such as silver ink printing or etching.

[0034] Each of the first circuit member 40 and the second circuit member 50 of the present embodiment has the aforementioned structure. However, the present invention is not limited thereto. For example, the shape of each of the first base 42 and the second base 52 is not limited to a rectangle, but may be modified as needed. Each of the first base 42 and the second base 52 may be a rigid circuit board. The formation method of each of the first conductive pattern 44 and the second conductive pattern 54 is not particularly limited as long as each of the first conductive pattern 44 and the second conductive pattern 54 is made of a conductor.

[0035] In this embodiment, the first conductive pattern 44 has a first contact point 48, and the second conductive pattern 54 has a second contact point 58. Therefore, the first circuit member 40 includes the first contact point 48, and the second conductive member includes the second contact point 58. Figure 1 ), the first contact point 48 and the second contact point 58 are in contact with each other (see Figure 3 ). Therefore, the first circuit member 40 and the second circuit member 50 are combined with each other so that the first contact point 48 and the second contact point 58 are in contact with each other. The first circuit member 40 and the second circuit member 50 combined as described above form the circuit structure 12. The first conductive pattern 44 and the second conductive pattern 54 of the circuit structure 12 are electrically connected to each other.

[0036] Figure 2 and Figure 3 The first conductive pattern 44 and the second conductive pattern 54 shown are abstract conductive patterns for simply explaining the present invention and have no specific function. In other words, even when the first contact point 48 shown in the figure and the second contact point 58 shown in the figure are in contact with each other, the device 10 (see Figure 1 ) cannot be used as an electronic device. The actual first conductive pattern 44 and the actual second conductive pattern 54 have, for example, Figure 4 The structure shown.

[0037] refer to Figure 4 , the first base 42 has a first circuit 43 formed on its lower surface, and the second base 52 has a second circuit 53 formed on its upper surface. The first circuit 43 has a button battery 46 and two first conductive patterns 44 respectively formed with first contact points 48. The second circuit 53 has a light emitting diode (LED) 56 and two second conductive patterns 54 respectively formed with second contact points 58. When the first contact points 48 are in contact with the second contact points 58, the button battery 46 supplies power to the LED 56, and the LED 56 emits light. The structures of the first circuit 43 and the second circuit 53 may be modified as shown in FIG. Figure 4 For example, the second circuit 53 may have a circuit for measuring the heart rate and another circuit for transmitting the measurement result, instead of the LED 56.

[0038] according to Figure 4 In the example of FIG. 1 , the number of the first contact points 48 and the number of the second contact points 58 are both two. However, the number of the first contact points 48 and the number of the second contact points 58 may be as follows: Figure 2 One as shown, or three or more. Figure 2 and Figure 3, the first circuit member 40 should have one or more first contact points 48, and the second circuit member 50 should have one or more second contact points 58 corresponding to the first contact points 48, respectively. Figure 1 ), each first contact point 48 should be in contact with the corresponding second contact point 58.

[0039] refer to Figure 2 , the first film 20 and the second film 30 of the present embodiment have structures similar to each other. More specifically, each of the first film 20 and the second film 30 is a rectangular thin sheet formed of an insulating film and is bendable. Each of the first film 20 and the second film 30 extends parallel to the XY plane. The first film 20 has a peripheral edge 29 on the XY plane. The second film 30 has a peripheral edge 39 on the XY plane.

[0040] refer to Figure 1 and Figure 2 , the first film 20 and the second film 30 of the present embodiment overlap each other so that the position of the peripheral edge 29 and the position of the peripheral edge 39 are aligned with each other on the XY plane. However, the present invention is not limited thereto. For example, the size of the first film 20 on the XY plane and the size of the second film 30 on the XY plane may be different from each other. The shape of each of the first film 20 and the second film 30 is not limited to a rectangle, but may be modified as needed.

[0041] refer to Figure 2 , the first film 20 has a first inner portion 22 and a first outer portion 24. The first inner portion 22 is located inside the first outer portion 24 on the XY plane. In other words, the first outer portion 24 is a portion of the first film 20 surrounding the first inner portion 22. The second film 30 has a second inner portion 32 and a second outer portion 34. The second inner portion 32 is located inside the second outer portion 34 on the XY plane. In other words, the second outer portion 34 is a portion of the second film 30 surrounding the second inner portion 32.

[0042] refer to Figure 1 , 2 5, the first inner portion 22 of the first film 20 of the device 10 and the second inner portion 32 of the second film 30 are portions for accommodating the circuit structure 12. According to the present embodiment, before the device 10 is formed, the first film 20 extends uniformly along the XY plane, and there is no visible boundary between the first inner portion 22 and the first outer portion 24. Before the device 10 is formed, the second film 30 extends uniformly along the XY plane, and there is no visible boundary between the second inner portion 32 and the second outer portion 34. However, the present invention is not limited thereto. For example, a visible boundary such as a depression may be formed between the first inner portion 22 and the first outer portion 24, and a visible boundary such as a depression may be formed between the second inner portion 32 and the second outer portion 34.

[0043] refer to Figure 2 The first outer portion 24 has a first sealing portion 26 and a first contact portion 28. The second outer portion 34 has a second sealing portion 36 and a second contact portion 38. Please refer to Figure 1 and Figure 2 , the first sealing portion 26 and the second sealing portion 36 are bonded together to form the sealing trace 16. According to the present embodiment, the first sealing portion 26 and the second sealing portion 36 are bonded together by heating. Therefore, the sealing trace 16 of the present embodiment is a trace in which the first sealing portion 26 and the second sealing portion 36 are welded to each other by heating. However, the present invention is not limited thereto, and the first sealing portion 26 and the second sealing portion 36 may be bonded together by various methods such as high frequency, ultrasound or laser.

[0044] refer to Figure 1 and Figure 2 , the sealing trace 16 of the present embodiment is formed on the entire edge of the first sealing portion 26 and the second sealing portion 36. In other words, the sealing trace 16 surrounds the entire edge of the first inner portion 22 and the second inner portion 32 on the XY plane. At the same time, a portion of the first sealing portion 26 and a portion of the second sealing portion 36, especially the outer periphery of the first sealing portion 26 and the second sealing portion 36 on the XY plane are not heat-sealed, so that the sealing trace 16 is not formed. However, the present invention is not limited to this, and the sealing trace 16 may be formed on the entire first sealing portion 26 and the second sealing portion 36.

[0045] refer to Figure 1 and Figure 5 As described later, the first sealing portion 26 and the second sealing portion 36 are combined together in a vacuum environment. When the first sealing portion 26 and the second sealing portion 36 are combined together, due to the air pressure difference, the first contact portion 28 and the second contact portion 38 contact each other in the contact area 17. The contact area 17 seamlessly surrounds the entire edge of the first inner portion 22 and the second inner portion 32 in the XY plane. As a result, the device 10 is formed with a closed space 18, which is surrounded by the first inner portion 22 and the second inner portion 32. In a state where the air pressure in the closed space 18 is set to a low pressure close to vacuum, the first sealing portion 26 and the second sealing portion 36 are joined together. In addition, the contact area 17 blocks the air that may flow between the inside and the outside of the closed space 18. Therefore, the air pressure in the closed space 18 is maintained at a low pressure lower than the atmospheric pressure.

[0046] refer to Figure 5, the first circuit member 40 and the second circuit member 50 are closed in the closed space 18 maintained with the above-mentioned low pressure. The first contact point 48 and the second contact point 58 are in contact with each other in the closed space 18. Specifically, the first contact point 48 and the second contact point 58 are pressed against each other due to the air pressure difference between the inside and the outside of the closed space 18. Therefore, even in the case where each of the first contact point 48 and the second contact point 58 is not plated with a material such as gold, the contact between the first contact point 48 and the second contact point 58 can be reliably maintained.

[0047] To summarize the above description, the first film 20 and the second film 30 of the device 10 of the present embodiment overlap each other to contact each other, and the first circuit member 40 and the second circuit member 50 (hereinafter, referred to as "circuit member") are sandwiched therebetween. Except that a contact such as a first contact 48 or a second contact 58 should be provided for each circuit member, the structure of each circuit member is not limited. Therefore, each circuit member of the present embodiment has a simple structure and can be formed of various materials. For example, each circuit member can be an insulating film formed with a conductive pattern having a contact point, for example, a first conductive pattern 44 or a second conductive pattern 54. In this case, the thickness of the entire device 10 can be made very thin. Therefore, the present embodiment provides a new device 10 that is new and can be made thinner.

[0048] refer to Figure 2 and Figure 5 , the first sealing portion 26 of the first film 20 and the second sealing portion 36 of the second film 30 are portions for firmly combining the first film 20 and the second film 30 together by sealing such as heat sealing. The first contact portion 28 of the first film 20 and the second contact portion 38 of the second film 30 are portions that contact each other under low pressure according to the combination of the first sealing portion 26 and the second sealing portion 36. According to the present embodiment, before sealing, there is no visible boundary between the first sealing portion 26 and the first contact portion 28. Similarly, before sealing, there is no visible boundary between the second sealing portion 36 and the second contact portion 38. However, the present invention is not limited thereto. For example, a visible boundary such as a depression may be formed between the first sealing portion 26 and the first contact portion 28, and a visible boundary such as a depression may be formed between the second sealing portion 36 and the second contact portion 38.

[0049] According to the present embodiment, the first contact portion 28 and the second contact portion 38 seamlessly surround the entire edge of the first inner portion 22 and the second inner portion 32 on the XY plane. The first sealing portion 26 and the second sealing portion 36 seamlessly surround the entire edge of the first contact portion 28 and the second contact portion 38 in the XY plane. According to this structure, the enclosed space 18 can be reliably maintained in an airtight state. In addition, by cutting off the first sealing portion 26 and the second sealing portion 36, the first circuit member 40 and the second circuit member 50 can be easily taken out from the enclosed space 18. Therefore, according to the present embodiment, it is easy to recycle the components separately and can be reused. However, the present invention is not limited to this. For example, the first sealing portion 26 and the second sealing portion 36 can partially surround the first contact portion 28 and the second contact portion 38 in the XY plane. In addition, the first sealing portion 26 and the second sealing portion 36 can be partially surrounded by the first contact portion 28 and the second contact portion 38.

[0050] refer to Figure 1 and Figure 8 , the first film 20 and the second film 30 of the present embodiment each include two layers, which are composed of a fusible layer 146 that can be melted by heat sealing and an infusible layer 148 that cannot be melted by heat sealing. In other words, the first film 20 and the second film 30 each have a two-layer structure formed by a fusible layer 146 and an infusible layer 148. For example, the fusible layer 146 is made of polyethylene, and the infusible layer 148 is made of nylon. According to this structure, while maintaining the infusible layer 148 of the first sealing portion 26 and the second sealing portion 36, the fusible layers 146 are melted to each other. According to this structure, the fusible layers 146 can be fused to each other while maintaining the infusible layers 148 of the first sealing portion 26 and the second sealing portion 36. However, the present invention is not limited thereto, but each of the first film 20 and the second film 30 may have a structure according to a sealing method. For example, each of the first film 20 and the second film 30 may include only one layer, or may include three or more layers.

[0051] Each of the first film 20 and the second film 30 of the present embodiment is formed so that a portion thereof other than the first sealing portion 26 and the second sealing portion 36 also includes a fusible layer 146 and a non-fusible layer 148. However, the present invention is not limited thereto. For example, the fusible layer 146 may be formed only in each of the first sealing portion 26 and the second sealing portion 36.

[0052] refer to Figure 1 , each of the first film 20 and the second film 30 preferably has a high barrier property to oxygen. More specifically, each of the first film 20 and the second film 30 preferably includes a layer made of a high oxygen barrier material, which is a material having a high barrier property to oxygen. According to this layer structure, oxidation of the metal member of the circuit structure 12 can be reduced.

[0053] For example, the high oxygen barrier material may be a linear low-density polyethylene (LLDPE). More specifically, the high oxygen barrier material may be PET / Al / PE formed by laminating polyethylene terephthalate, aluminum, and polyethylene; ON / PE formed by laminating biaxially stretched nylon and polyethylene; PET / EVOH / PE formed by laminating polyethylene terephthalate, polyvinyl chloride, and polyethylene; or may be formed by laminating a transparent high-barrier film and polyethylene. The transparent high-barrier film may be polyethylene terephthalate (PET) deposited with SiOx or alumina.

[0054] The first film 20 and the second film 30 of the present embodiment preferably have a high barrier property to water vapor in addition to a high barrier property to oxygen. More specifically, each of the first film 20 and the second film 30 preferably includes a layer made of a high water vapor barrier material, which is a material having a high barrier property to water vapor. According to the layer structure, the circuit structure 12 can be waterproof. For example, the high water vapor barrier material can be a sheet made of ON / PE, biaxially stretched polypropylene (OPP) or PET, and coated with a material of polyvinylidene chloride (PVDC).

[0055] Each of the first film 20 and the second film 30 may have various barrier properties such as barrier properties to nitrogen in addition to high barrier properties to oxygen and water vapor. Therefore, each of the first film 20 and the second film 30 preferably has high barrier properties according to its use.

[0056] refer to Figure 6 The device 10 of this embodiment is formed by three steps (see Figure 1 ), the three steps include a preparation step (step 1), an arrangement step (step 2) and a sealing step (step 3). However, the present invention is not limited thereto, and the method for forming the device 10 can be modified as needed. Hereinafter, the method for forming the device 10 of the present embodiment will be described.

[0057] refer to Figure 7 , in the preparation step (see Figure 6 ), a device material group 11 is prepared. The device material group 11 includes a first film 20, a second film 30, a first circuit member 40 and a second circuit member 50. Figure 8 As described above, the first circuit member 40 includes the first contact point 48, and the second circuit member 50 includes the second contact point 58. Therefore, the forming method of this embodiment includes preparing the first film 20, the second film 30, the first circuit member 40 and the second circuit member 50, the first circuit member 40 includes the first contact point 48, and the second circuit member 50 includes the second contact point 58.

[0058] Then, in the layout step (see Figure 6 ), the first film 20, the first circuit member 40, the second circuit member 50 and the second film 30 are stacked in sequence from top to bottom along the Z direction. At the same time, the first circuit member 40 and the second circuit member 50 are located in the middle of the first film 20 and the second film 30 on the XY plane. In addition, the first circuit member 40 and the second circuit member 50 are arranged so that the first contact point 48 and the second contact point 58 face each other in the Z direction. In addition, the first film 20 and the second film 30 are arranged so that their two fusible layers 146 face each other in the Z direction.

[0059] Then, refer to Fig. 9 , the device material group 11 arranged as described above is accommodated in the chamber 70. Therefore, the formation method of the present embodiment includes arranging the first film 20, the first circuit member 40, the second circuit member 50 and the second film 30 and then stacking these components in this order in the chamber 70 while the first contact point 48 and the second contact point 58 face each other.

[0060] The chamber 70 is a device that can make its internal space very close to vacuum. The chamber 70 of this embodiment includes a mold 74 and a heat sealing rod 78. The device material group 11 is placed on the mold 74. Thereafter, as the air pressure of the internal space of the chamber 70 decreases, the first film 20 and the second film 30 are sealed.

[0061] In detail, the heat sealing bar 78 of the present embodiment has a heating portion 782. According to the present embodiment, the heating portion 782 is heated to have a temperature higher than the melting point of the fusible layer 146 (see Figure 8 ). The heating portion 782 heated in this way is pressed against the first sealing portion 26 of the first film 20 and the second sealing portion 36 of the second film 30 which are vertically overlapped with each other, so that the first sealing portion 26 and the second sealing portion 36 are heat-sealed. As a result, the first circuit member 40 and the second circuit member 50 are in the closed space 18 (see FIG. 1 ) surrounded by the first film 20 and the second film 30. Figure 5 At the same time, the first contact point 48 and the second contact point 48 are in contact with each other.

[0062] Therefore, the forming method of this embodiment includes sealing the first film 20 and the second film 30 while the chamber 70 is evacuated, thereby enclosing the first circuit member 40 and the second circuit member 50 in the closed space 18 surrounded by the first film 20 and the second film 30 (refer to Figure 5 ), and the first contact point 48 and the second contact point 58 are in contact with each other.

[0063] According to the sealing step of the present embodiment, the first film 20 and the second film 30 are heat-sealed at a low pressure close to vacuum. According to this forming method, the first contact point 48 and the second contact point 58 are firmly in contact with each other without using a fixing member such as an adhesive. Therefore, when the device 10 (see FIG. 1 ) is no longer used, Figure 1 ), the device 10 can be disassembled by simply cutting off the first sealing portion 26 and the second sealing portion 36. In addition, the first circuit member 40 and the second circuit member 50 can be in a closed space 18 with a low pressure (see Figure 5 ) is closed, so that the degradation of metal parts caused by oxidation, for example, can be reduced. However, the present invention is not limited thereto, and the forming method and sealing method of the device 10 can be modified as needed.

[0064] refer to Figures 6 to 9 According to the above-mentioned forming method, through the steps from the preparation step to the sealing step, one of the devices 10 is formed from one of the device material groups 11 (see Figure 1 ). However, the present invention is not limited thereto. For example, reference Fig.10 , a component including a plurality of device material groups 11 may be prepared and arranged. A sealing step may be performed on the entire component (see Figure 6 and 9 ).also, Fig.10 The member shown may be moved to chamber 70 (see FIG. Fig. 9 )middle.

[0065] In addition to the modifications already described, various modifications may be made to this embodiment. Two modifications will be described below.

[0066] refer to Fig.11 and Fig.12 , a device 10A according to a variation of the present embodiment is formed from a device material group 11A. Fig.11 The device material group 11A includes the same circuit structure 12 as the device material group 11, and includes a plate 14A made of an insulator to replace the device material group 11 (see Figure 7 ) of the first film 20 (see Figure 7 ) and the second film 30 (see Figure 7 ). The circuit structure 12 includes a first circuit component 40 and a second circuit component 50 .

[0067] The flat plate 14A is bent at its center, i.e., the predetermined portion 142A, in the front-rear direction (X direction), thereby forming a first film (sheet) 20A and a second film (sheet) 30A that overlap each other in the Z direction. Therefore, the first film 20A and the second film 30A are two sheets of a single film member 14A that overlap each other. The film member 14A is a single planar sheet. The film member 14A has a predetermined portion 142A and a cutting edge 144A. The cutting edge 144A is an edge of the film member 14A on the XY plane.

[0068] The device 10A of this modification can be connected to the device 10 (refer to Figure 1 ) is formed by the same forming method. For example, in the arrangement step (see Figure 6 ), the circuit structure 12 is arranged between the first film 20A and the second film 30A in the Z direction.

[0069] refer to Fig.12 , device 10A has similar features to device 10 (see Figure 1 ) structure. For example, the first sealing portion 26A and the second sealing portion 36A are combined to form a sealing trace 16A. The first contact portion 28A and the second contact portion 38A contact each other in the contact area 17A. The contact area 17A surrounds the entire edge of the first inner portion 22 and the second inner portion 32. The device 10A is formed with a closed space 18 surrounded by the first inner portion 22 and the second inner portion 32. The first circuit member 40 (see Fig.10 ) and the second circuit member 50 (see Fig.10 ) is enclosed in the enclosed space 18. The first contact point 48 (see Figure 3 ) and the second contact point 58 (see Figure 3 ) are in contact with each other.

[0070] However, device 10A differs from device 10 (see Figure 1 ). First, the first film 20A and the second film 30A are two sheets folded at the predetermined portion 142A to overlap each other. Therefore, the first film 20A and the second film 30A are connected to each other at the predetermined portion 142A. According to this structure, there is no need to seal the portion between the predetermined portion 142A and the contact area 17A. Therefore, only the portion between the contact area 17A and the cutting edge 144A is sealed. In other words, the sealing trace 16A is formed only between the contact area 17A and the cutting edge 144A. However, the present invention is not limited to this, but the portion between the predetermined portion 142A and the contact area 17A may be sealed. Therefore, the sealing trace 16A should be formed at least between the contact area 17A and the cutting edge 144A.

[0071] refer to Fig.13 and Fig.14, a device 10B according to another variation of the present embodiment is formed of a device material group 11B. Fig.13 , the device material group 11B includes the same circuit structure 12 as the device material group 11, and includes a folded sheet 14B made of an insulator instead of the device material group 11 (see Figure 7 ) of the first film 20 (see Figure 7 ) and the second film 30 (see Figure 7 ). The circuit structure 12 includes a first circuit component 40 and a second circuit component 50 .

[0072] The folded sheet 14B has three connection sides, i.e., a predetermined portion 142B, on the XY plane, and is open at its front end (X-side positive end). According to this structure, the folded sheet 14B is formed with a first film (sheet) 20B and a second film (sheet) 30B overlapping in the Z direction. Therefore, the first film 20B and the second film 30B are two pieces of a single film member 14B overlapping each other. The film member 14B is a single folded sheet. The film member 14B has a predetermined portion 142B and a cutting edge 144B. The cutting edge 144B is the edge of the opening of the film member 14B.

[0073] The device 10B of this modification can be connected to the device 10 (refer to Figure 1 ) is formed by the same forming method. For example, in the arrangement step (see Figure 6 ), the circuit structure 12 is placed in the film member 14B and arranged between the first film 20B and the second film 30B along the Z direction.

[0074] refer to Fig.14 , device 10B has similar features to device 10 (see Figure 1 ) structure. For example, the first sealing portion 26B and the second sealing portion 36B are combined together to form a sealing trace 16B. The first contact portion 28B and the second contact portion 38B contact each other in the contact area 17B. The contact area 17B surrounds the entire edge of the first inner portion 22 and the second inner portion 32. The device 10B is formed with a closed space 18 surrounded by the first inner portion 22 and the second inner portion 32. The first circuit member 40 (see Fig.12 ) and the second circuit member 50 (see Fig.12 ) is enclosed in the enclosed space 18, and the first contact point 48 (see Figure 3 ) and the second contact point 58 (see Figure 3 ) are in contact with each other.

[0075] However, device 10B differs from device 10 (see Figure 1). First, the first film 20B and the second film 30B are two sheets connected to each other at the predetermined portion 142B. Therefore, the first film 20B and the second film 30B are connected to each other at the predetermined portion 142B. According to this structure, there is no need to seal the portion between the predetermined portion 142B and the contact area 17B. Therefore, only the portion between the contact area 17B and the cutting edge 144B is sealed. In other words, the sealing trace 16B is formed only between the contact area 17B and the cutting edge 144B. However, the present invention is not limited to this, but the portion between the predetermined portion 142B and the contact area 17B may be sealed. Therefore, the sealing trace 16B should be formed at least between the contact area 17B and the cutting edge 144B.

[0076] In the above two modifications, the film member is a flat sheet or a folded sheet. However, the film member according to the present invention is not limited thereto, but can be variously modified.

[0077] refer to Figure 1 In addition to the variations already described, various variations may be made to the device 10. For example, as previously described, the device 10 may include another component in addition to the four components of the first film 20, the second film 30, the first circuit member 40, and the second circuit member 50. A description will be given of variations in which the device 10 includes other components.

[0078] and Fig.15 and Figure 2 In comparison, the device 10C of the present modification includes two elastic members 60C, while the device 10 does not include the two elastic members 60C in addition to the first film 20, the second film 30, the first circuit member and the second circuit member 50. The second circuit member 50 and the second circuit member 50 in the present modification are the same as those of the device 10. The elastic member 60C of the present modification includes a first elastic member 62C and a second elastic member 64C. Figures 1 to 4 .like Fig.15 and Fig.16 As shown, the elastic member 60C is enclosed in the closed space 18 (see FIG. Figure 5 ). The first elastic member 62C is located between the first film 20 and the first contact point 48 in the Z direction. The second elastic member 64C is located between the second film 30 and the second contact point 58 in the Z direction.

[0079] refer to Fig.15, each elastic component 60C of this variant is a foamed cushioning material with elasticity. More specifically, each elastic component 60C of this variant is an open-cell structure such as a polyurethane sponge, a polyolefin sponge or a chloroprene rubber (CR) sponge. The open-cell structure of this variant is formed by an expandable and compressible elastomer and a large number of holes densely formed in the elastomer. The holes are interconnected to form an open hole. The open hole opens outward from the elastomer. When the open-cell structure is compressed, the open-cell structure contracts and the air in the hole is discharged. When the compression of the open-cell structure stops, the open-cell structure expands to return to the shape before compression, and the outside air is absorbed into the hole. Each elastic component 60C of this variant is an excellent cushioning material composed of such an open-cell structure.

[0080] like Fig.15 and Fig.16 As shown, each elastic member 60C of the present modification has a main body 602C and two main surfaces 604C. The two main surfaces 604C of each elastic member 60C are oriented in a predetermined direction or Fig.15 and Fig.16 They pass through the main body 602C and along a plane perpendicular to the predetermined direction or along Fig.15 and 16 For each elastic member 60C, when the body 602C is compressed so that the two main surfaces 604C approach each other in a predetermined direction, a portion of the air contained in the body 602C is discharged, and when the compression of the body 602C stops, the air flows into the body 602C.

[0081] and Figure 1 Reference together Fig.15 , a device 10C is formed similarly to the device 10. In detail, Figure 1 and Fig.15 Reference together Figure 6 , similar to the device 10, the device 10C is formed by three steps including a preparation step (step 1), a layout step (step 2) and a sealing step (step 3). Hereinafter, the method for forming the device 10C of this variation will be described, mainly focusing on the differences from the method for forming the device 10.

[0082] Will Fig.16 and Figure 8 In comparison, in the preparation steps of this variant (see Figure 6 ), a device material group 11C is prepared. In addition to the first film 20, the second film 30, the second circuit component 40 and the second circuit component 50 which are the same as those of the device material group 11, the device material group 11C further includes two elastic members 60C, which include a first elastic member 62C and a second elastic member 64C.

[0083] Then, in the arrangement step of this modification (see Figure 6 ), the first film 20, the first elastic member 62C, the first circuit member 40, the second circuit member 50, the second elastic member 64C and the second film 30 are sequentially stacked from top to bottom along the Z direction. At the same time, the first elastic member 62C is arranged between the first film 20 and the first circuit member 40 in the Z direction so as to be located just above the first contact point 48. In addition, the second elastic member 64C is arranged between the second film 30 and the second circuit member 50 in the Z direction so as to be located just below the second contact point 58.

[0084] Then, with Fig.16 Reference together Fig. 9 The device material group 11C arranged as described above is accommodated in the chamber 70. The device material group 11C is placed on the mold 74. Thereafter, the device 10 (see Figure 1 ) Sealing steps (see Figure 6 ) is a similar sealing step. More specifically, while the air pressure of the inner space of the chamber 70 is reduced by vacuum suction, the first film 20 and the second film 30 are heat-sealed. As a result, the first circuit member 40, the second circuit member 50 and the elastic member 60C are enclosed in the closed space 18 surrounded by the first film 20 and the second film 30 (see Fig.16 At the same time, the first contact point 48 and the second contact point 58 are in contact with each other.

[0085] refer to Fig.16 , during the sealing step (see Figure 6 ) in the chamber 70 (see Fig. 9 ) is reduced, the first film 20 presses the first elastic member 62C against the portion of the first circuit member 40 located right behind the first contact point 48, and the second film 30 presses the second elastic member 64C against the portion of the second circuit member 50 located right behind the second contact point 58. As a result, while the air in the body 602C is exhausted, each elastic member 60C is compressed mainly in a predetermined direction (Z direction) (see Fig.16 (The position of the compressed main surface 604C in the enlarged view of FIG. 1 is indicated by a double-dashed line). Therefore, the thickness or dimension in the Z direction of each elastic member 60C of the device 10C is very thin. Therefore, the present variation provides a new device 10C that can be made thinner.

[0086] By the restoring force of the compressed first elastic member 62C, the first contact point 48 of the device 10C is pressed against the second contact point 58. The second contact point 58 is pressed against the first contact point 48 by the restoring force of the compressed second elastic member 64C. According to the present modification, the first contact point 48 and the second contact point 58 can be further stably connected to each other by the two elastic members 60C, which are arranged so that the first contact point 48 and the second contact point 58 are sandwiched and pressed therebetween.

[0087] Even if air flows into the closed space 18 of the device 10C during use, the air is absorbed into the elastic member 60C. In this case, since the restoring force of each elastic member 60C is only slightly reduced, the change in the contact force between the first contact point 48 and the second contact point 58 can be reduced. In addition, the device 10C including the elastic member 60C is hardly damaged even if it is bent. This modification provides a device 10C that can stably operate for a long time under various environments.

[0088] This modification example can be further modified in various ways as described below.

[0089] refer to Fig.15 , each elastic member 60C has a rectangular flat plate shape. The size of each elastic member 60C in the XY plane is approximately the same as the size of each of the first contact point 48 and the second contact point 58 in the XY plane. However, the present invention is not limited thereto. For example, the shape of each elastic member 60C is not particularly limited. The size of the elastic member 60C in the XY plane is not particularly limited as long as the elastic member 60C can be in the closed space 18 (see Figure 5 ) is closed so that the first contact point 48 and the second contact point are pressed against each other. Therefore, the first elastic member 62C should be at least partially located between the first film 20 and the first contact point 48, and the second elastic member 64C should be at least partially located between the second film 30 and the second contact point 58.

[0090] For example, the size of each elastic member 60C in the XY plane may be approximately the same as the size of the first circuit member 40 and the second circuit member 50 in the XY plane. As described above, in the case where the size of each elastic member 60C is made larger, even if air flows into the closed space 18, the expansion of the elastic member 60C can be reduced. In addition, in the arrangement step (see Figure 6 ), the elastic members 60C each having a large size can be easily arranged to correspond to the first contact points 48 and the second contact points 58. In particular, even when the number of the first contact points 48 and the second contact points 58 is two or more, respectively, the elastic members 60C each having a large size can be easily arranged in the arranging step without increasing the number of the elastic members 60C.

[0091] The elastic member 60C of this modification includes a first elastic member 62C and a second elastic member 64C. However, the present invention is not limited thereto. For example, the elastic member 60C may include only one of the first elastic member 62C and the second elastic member 64C. Alternatively, the number of the first elastic member 62C and the number of the second elastic member 64C may be more than two, respectively. Therefore, the device 10C should include one or more elastic members 60C. The elastic member 60C may include at least one of the first elastic member 62C and the second elastic member 64C.

[0092] Each elastic member 60C can be formed by a material different from an open-cell structure. For example, each elastic member 60C can be formed by a closed-cell structure, which includes a large number of holes independent of each other, so as to work similar to an open-cell structure. More specifically, the closed-cell structure can be formed by a hole that opens outward so that the air in the hole is discharged when compressed. Each elastic member 60C can be formed by two flat plates connected to each other by a large number of springs, so as to work similar to an open-cell structure. Moreover, each elastic member 60C can be formed by an elastomer such as rubber, which does not contain any open cells. However, when each elastic member 60C is formed by an elastomer that does not contain an open cell, the part that is elastically deformed may be unbalanced when compressed, so that the first contact point 48 or the second contact point 58 cannot be completely and evenly squeezed. Therefore, from the point of view of the stable connection between the first contact point 48 and the second contact point 58, each elastic member 60C is preferably formed by an open-cell structure.

[0093] refer to Fig.15 as well as Figure 1 , Fig.12 and Fig.14 The device 10C of this modification can be modified in the same manner as the device 10, the device 10A, and the device 10B described above. For example, the film member 14 of the device 10C can be a flat sheet, or can be a folded sheet. The method for forming the device 10C can also be modified similarly to the method for forming the device 10 (for example, see Fig.10 ).

[0094] While there have been described what are considered to be preferred embodiments of the present invention, those skilled in the art will recognize that other and further modifications may be made therein without departing from the spirit of the invention, and it is intended to claim all embodiments that fall within the true scope of the invention.

Claims

1. A device comprising a first film, a second film, a first circuit member and a second circuit member, characterized in that: The first membrane has a first inner portion and a first outer portion; The first inner portion is located inside the first outer portion; The second membrane has a second inner portion and a second outer portion; The second inner portion is located on the inner side of the second outer portion; The first outer portion has a first sealing portion and a first contact portion; The second outer portion has a second sealing portion and a second contact portion; The first sealing portion and the second sealing portion are joined together to form a sealing trace; The first contact portion and the second contact portion contact each other in a contact region; The contact region surrounds the entire periphery of the first inner portion and the second inner portion; The device is formed with a closed space surrounded by a first interior and a second interior; The first circuit member and the second circuit member are enclosed in a closed space; The first circuit member includes a first contact point; The second circuit member includes a second contact point; as well as Due to the air pressure difference between the inside and the outside of the closed space, the first contact point and the second contact point are pressed against and contact each other.

2. The device according to claim 1, characterized in that The first sealing portion and the second sealing portion are bonded together by heat sealing.

3. The device according to claim 2, characterized in that The first film and the second film each include two layers consisting of a meltable layer that is meltable by heat sealing and a non-meltable layer that is not meltable by heat sealing.

4. The device according to claim 1, characterized in that: The first film and the second film are two sheets of a single film member that overlap each other; The membrane member has a predetermined portion and a cutting edge; The first film and the second film are connected to each other at a predetermined portion; as well as A sealing trace is formed at least between the contact portion and the cutting edge.

5. The device according to claim 4, characterized in that: The membrane member is a single planar sheet; and The first film and the second film are two sheets folded at predetermined portions to overlap each other.

6. The device according to claim 4, characterized in that: The membrane member is a single folded sheet; and The first film and the second film are two sheets connected to each other at a predetermined portion.

7. The device according to claim 1, characterized in that: The first circuit member has a first base and a first conductive pattern; The first base is formed of an insulating film; A first conductive pattern is formed on the first base and has a first contact point; The second circuit member has a second base and a second conductive pattern; The second base is formed of an insulating film; as well as The second conductive pattern is formed on the second base and has a second contact point.

8. The device according to claim 1, characterized in that Each of the first film and the second film has a high barrier property.

9. The device according to claim 8, characterized in that Each of the first film and the second film has a high barrier property to oxygen.

10. The device according to claim 8, characterized in that Each of the first film and the second film has a high barrier property to water vapor.

11. The device according to claim 1, characterized in that: The device comprises one or more elastic members; The elastic member is enclosed in the closed space; The elastic member includes at least one of a first elastic member and a second elastic member; a first elastic member at least partially located between the first membrane and the first contact point; as well as The second elastic member is at least partially located between the second membrane and the second contact point.

12. The device according to claim 11, characterized in that: Each resilient member has a body and two major surfaces; Two main surfaces of each elastic member are positioned on the body opposite to each other in a predetermined direction; as well as For each elastic member, when the body is compressed so that the two main surfaces approach each other in a predetermined direction, a part of the air contained in the body is discharged, and when the compression of the body stops, the air flows into the body.

13. The device according to claim 12, characterized in that Each elastic member is an open-cell structure.

14. A method for forming a device, characterized in that: The device includes a first film, a second film, a first circuit member and a second circuit member, and the forming method includes: preparing a first film, a second film, a first circuit member and a second circuit member, wherein the first circuit member includes a first contact point and the second circuit member includes a second contact point; placing the first film, the first circuit member, the second circuit member, and the second film in a chamber stacked in sequence with the first contact point and the second contact point facing each other; and The first film and the second film are sealed while the chamber is evacuated, thereby enclosing the first circuit member and the second circuit member in a closed space surrounded by the first film and the second film, and the first contact point and the second contact point contact each other due to the air pressure difference between the inside and the outside of the closed space.

15. The forming method according to claim 14, characterized in that: In the sealing, the first film and the second film are heat-sealed.

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