Protective member forming device
CN114078736BActive Publication Date: 2026-10-16DISCO CORP
3 Cites 0 Cited by
Patent Information
- Application Number
- CN202110929720.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-08-21
- Filing Date
- 2021-08-13
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2041-08-13
AI Technical Summary
Technical Problem
但是，与将晶片单体定位于规定的位置的情况不同，在带片的晶片的状态下难以将晶片以0.1mm以下的精度定位于规定的位置，在仅将带片的晶片向进行切割的载台搬入的情况下，晶片的位置有可能发生偏移，在切断时有可能错误地使晶片破损
Benefits of technology
[0011] Preferably, the cutting unit has: a main body portion with a diameter smaller than that of the wafer; and a wafer holding portion spaced apart from the outer periphery of the main body portion to hold the wafer, the cutting portion including a cutting edge that cuts into the wafer from the cutting table side between the main body portion and the wafer holding portion.
✦ Generated by Eureka AI based on patent content.
Abstract
The present application provides a protective member forming device that can suppress breakage of a wafer and remove a protective member that protrudes from an outer edge of the wafer. The protective member forming device includes: an integration unit that integrates a resin sheet held by a chuck table with a wafer using resin; a conveyance unit that conveys the wafer; and a cutting unit that holds the wafer integrated with the resin sheet conveyed by the conveyance unit using a cutting table, and cuts the resin sheet along an outer edge of the wafer using a cutting portion. The cutting unit includes: a detection portion that detects a position of the outer edge of the wafer by photographing the wafer using a camera; and a control portion that causes the cutting portion to perform cutting of the resin sheet only in a case where the detected outer edge of the wafer coincides with a track of a cutting edge of the cutting portion at the time of cutting of the resin sheet that is set in advance.
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