Optimization design method and system for warp / weft laying direction of glass fiber cloth for PCB

By establishing geometric and mathematical models of PCB, using finite element simulation and experimental verification, the warp/weft layout direction of electronic glass fiber cloth is optimized, and the problem of large amount of warping and deformation of PCB is solved, and the flatness and reliability of the soldered chip are improved.

CN114282414BActive Publication Date: 2025-03-25SHANDONG UNIV
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Patent Information

Application Number
CN202111603889.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-12-24
Publication Date
2025-03-25
Estimated Expiration
2041-12-24

AI Technical Summary

Technical Problem

The prior art is difficult to effectively reduce the amount of warpage and deformation of printed circuit boards (PCBs) from press synthesis to soldering chips, and lacks a systematic optimization design method to control the warp/weft layout direction of electronic glass fiber cloth.

Method used

By establishing geometric and mathematical models of multi-layer PCBs, combining finite element simulation and experimental verification, the physical and chemical performance parameters of the material in the warp/weft laid direction of electronic glass fiber cloth are optimized to minimize or control the amount of warping and deformation of the PCB.

Benefits of technology

The amount of warpage and deformation is minimized or controlled as needed when the PCB is press-synthesised to the soldered chip, and the flatness and solder reliability of the soldered chip are improved.

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Abstract

The present invention discloses a method and system for optimizing the design of the warp / weft laying direction of glass fiber cloth for PCB, including: establishing a geometric model of a multi-layer PCB and a mathematical model of PCB press molding to welding chip; determining the material performance parameters and initial boundary conditions required for finite element simulation through experimental testing and actual processes; determining the corresponding relationship between the warp / weft laying direction and the material direction; respectively obtaining the simulation results and experimental results of the warping deformation of PCB when it is pressed and molded to the welding chip; continuously optimizing the material physical and chemical performance parameters corresponding to the warp / weft laying direction of the electronic glass fiber cloth, and obtaining an optimization scheme that minimizes the warping deformation of the PCB or controls the corresponding warp / weft laying direction of the electronic glass fiber cloth as needed. The present invention can conveniently perform numerical simulation of the influence of the warp / weft laying direction of the electronic glass fiber cloth for PCB on the warping deformation of PCB when it is pressed and molded to the welding chip.
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