Method and system for interconnecting electronic devices with fabrics
By using docking components and electrically conductive path networks in electronic fabric systems, the problem of interconnection integration between electronic components and fabrics is solved, and a robust electrical connection and adaptable design is achieved, meeting the requirements of comfort and aesthetics.
Patent Information
- Application Number
- CN202080053405.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-06-28
- Filing Date
- 2020-06-25
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2040-06-25
AI Technical Summary
The prior art is difficult to effectively integrate electronic components into fabrics seamlessly, and the electrical connection between the electrical conduction circuits of the fabric and the electronic components needs to adapt to the characteristics of the textiles, and the manufacturing infrastructure is different, which makes it difficult to achieve interconnect integration.
An electronic fabric system is provided, including a fabric substrate, an input device, a docking assembly and an electrically conductive path network. The docking assembly establishes electrical connections through magnet interaction and is adjustable to ensure reliable and adaptable connections.
The robust electrical connection between electronic components and fabrics is achieved, and the design of the docking assembly allows for removable installation of the electronic controller device and power recharge, meeting the requirements for comfort and aesthetics.