Optical element driving mechanism

By combining the carrier with the drive assembly and elastic element in the optical element drive mechanism, the problems of design difficulties and poor reliability in the miniaturization process are solved, and miniaturized autofocus and optical image stabilization with high drive force are realized.

CN114527548BActive Publication Date: 2026-04-10AITE TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
AITE TECHNOLOGY CO LTD
Filing Date
2021-11-09
Publication Date
2026-04-10

AI Technical Summary

Technical Problem

In the process of miniaturizing electronic devices, there are problems such as difficulty in designing optical component drive mechanisms, poor reliability, or insufficient lens driving force.

Method used

An optical element driving mechanism is designed, wherein the carrier can move relative to the fixed part, the optical element is connected by the driving component and the elastic element, the first circuit component is set inside the carrier to reduce magnetic interference between magnetic elements, and the automatic focus and optical image stabilization functions are realized by the sensing component.

Benefits of technology

This invention enables miniaturization of the optical element driving mechanism, while improving the magnetic interference problem between magnetic elements and enhancing driving force and reliability.

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Abstract

The present application provides an optical element driving mechanism, which comprises a carrier, a fixed part, a driving assembly and a first circuit assembly. The carrier is configured to connect an optical element. The carrier is movable relative to the fixed part. The driving assembly is configured to drive the carrier to move relative to the fixed part. The first circuit assembly is fixedly arranged on the carrier. The first circuit assembly is electrically connected to the driving assembly.
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Description

TECHNICAL FIELD

[0001] The present disclosure relates to an optical element driving mechanism, and more particularly to an optical element driving mechanism having a circuit assembly disposed on a carrier. BACKGROUND

[0002] With the development of technology, many electronic devices (e.g. smart phones) nowadays have the function of taking photos or videos. Through the camera module disposed on the electronic device, the user can operate the electronic device to extract various photos, bringing people rich visual enjoyment.

[0003] The aforementioned electronic device with the function of taking photos or videos usually has an optical element driving mechanism to drive the optical element to move along the optical axis, thereby achieving the function of autofocus (AF). However, under the demand of miniaturization of electronic devices, the design of the optical element driving mechanism often causes many problems such as poor reliability or insufficient lens driving force. Therefore, how to solve the aforementioned problems is an important challenge. SUMMARY

[0004] The present disclosure aims to provide an optical element driving mechanism to solve at least one of the above problems.

[0005] The present disclosure provides an optical element driving mechanism, which includes a carrier, a fixed part, a driving assembly, and a first circuit assembly. The carrier is configured to connect an optical element. The carrier is movable relative to the fixed part. The driving assembly is configured to drive the carrier to move relative to the fixed part. The first circuit assembly is fixedly disposed on the carrier. The first circuit assembly is electrically connected to the driving assembly.

[0006] According to some embodiments of the present disclosure, the optical element driving mechanism further includes a sensing assembly including a sensing element. The sensing assembly is configured to sense the movement of the carrier.

[0007] According to some embodiments of the present disclosure, the carrier includes a body, a first groove, a stop element, a first protruding platform, and a receiving space. The first groove has a groove structure to accommodate the sensing element. The stop element has a protruding structure configured to limit the movement range of the carrier. The first protruding platform has a protruding structure adjacent to the first groove. The receiving space is used to accommodate the optical element.

[0008] According to some embodiments of the present disclosure, the carrier further includes a driving assembly fixing part and a driving assembly holding part. The driving assembly fixing part protrudes outwardly from the body and is configured to fix the first coil of the driving assembly. The driving assembly holding part protrudes from the driving assembly fixing part and is configured to fix the first coil. The extension directions of the driving assembly fixing part and the driving assembly holding part are different, and the first coil is located between the driving assembly holding part and the body.

[0009] According to some embodiments of the disclosure, when the carrier is located at the limit position, the stop element directly contacts the fixed portion. The shortest distance between the stop element and the fixed portion is smaller than the shortest distance between the first protruding platform and the fixed portion.

[0010] According to some embodiments of the disclosure, the optical element driving mechanism further comprises a first elastic element. The first elastic element comprises a movable portion fixing end. The first elastic element has a plate-like structure perpendicular to the first axis. The carrier is movably connected to the fixed portion via the first elastic element. The movable portion fixing end is fixedly arranged on the first protruding platform.

[0011] According to some embodiments of the disclosure, the optical element driving mechanism further comprises a second elastic element. The second elastic element has a plate-like structure perpendicular to the first axis. The carrier is movably connected to the fixed portion via the second elastic element. The driving assembly is electrically connected to the second elastic element. The first circuit assembly is electrically connected to the driving assembly via the second elastic element. The first elastic element and the second elastic element are arranged along the first axis.

[0012] According to some embodiments of the disclosure, the first circuit assembly comprises a first circuit element. The first circuit element has a strip-like structure, a first segment, and a first circuit contact. The first circuit element is electrically connected to the sensing element. The thickness of the first circuit element is between 0.05 mm and 0.25 mm. The first circuit element is at least partially embedded and not exposed on the body. The first segment extends along a direction perpendicular to the first axis. The sensing assembly is electrically connected to the external circuit via the first circuit contact. The first circuit contact is arranged on the first protruding platform and is electrically connected to the first elastic element.

[0013] According to some embodiments of the disclosure, the first circuit assembly comprises a second circuit element. The second circuit element has a strip-like structure, a second segment, and a second circuit contact. The second circuit element is electrically connected to the sensing element. The thickness of the second circuit element is between 0.05 mm and 0.25 mm. The second circuit element is at least partially embedded and not exposed on the body. The second segment extends along a direction perpendicular to the first axis. When viewed along the first axis, the second segment at least partially overlaps the first coil. The second circuit contact is electrically connected to the first elastic element.

[0014] According to some embodiments of the disclosure, the first circuit assembly comprises a third circuit element. The third circuit element has a strip-like structure, a third segment, and a third circuit contact. The third circuit element is electrically connected to the sensing element. The thickness of the third circuit element is between 0.05 mm and 0.25 mm. The third circuit element is at least partially embedded and not exposed on the body. The third segment extends along a direction perpendicular to the first axis. When viewed along the first axis, the third segment at least partially overlaps the first coil. The third circuit contact is electrically connected to the first elastic element.

[0015] According to some embodiments of the disclosure, the first circuit assembly includes a fourth circuit element. The fourth circuit element has a strip structure, a fourth segment, and a fourth circuit contact. The fourth circuit element is electrically connected to the sensing element. The fourth circuit element has a thickness between 0.05 mm and 0.25 mm. The fourth circuit element is at least partially embedded and not exposed on the body. The fourth segment extends along a direction perpendicular to the first axis. The fourth circuit contact is electrically connected to the first elastic element.

[0016] According to some embodiments of the disclosure, the positions of the first circuit contact, the second circuit contact, the third circuit contact, and the fourth circuit contact have rotational symmetry when viewed along the first axis.

[0017] According to some embodiments of the disclosure, the positions of the first circuit contact, the second circuit contact, the third circuit contact, and the fourth circuit contact have line symmetry when viewed along the first axis.

[0018] According to some embodiments of the disclosure, the first segment is at least partially located on the driving assembly fixing portion. The first segment at least partially overlaps the first coil when viewed along the first axis. The first segment and the second segment of the portion are substantially parallel to each other and side by side, and the third segment and the fourth segment of the portion are substantially parallel to each other and side by side when viewed along the first axis.

[0019] According to some embodiments of the disclosure, the third segment and the fourth segment at least partially overlap when viewed along the first axis.

[0020] According to some embodiments of the disclosure, the first circuit contact, the second circuit contact, the third circuit contact, and the fourth circuit contact are substantially at the same level when viewed along a second axis perpendicular to the first axis.

[0021] According to some embodiments of the disclosure, the first segment, the second segment, the third segment, and the fourth segment are substantially at the same level when viewed along a second axis perpendicular to the first axis.

[0022] According to some embodiments of the disclosure, the first circuit assembly includes a fifth circuit element. The fifth circuit element has a strip structure, a fifth segment. The fifth circuit element is electrically connected to the sensing element. The fifth circuit element has a thickness between 0.05 mm and 0.25 mm. The fifth circuit element is at least partially embedded and not exposed on the body. The fifth segment extends along the first axis. The fifth segment at least partially overlaps the first coil when viewed along a second axis perpendicular to the first axis. The first coil is electrically connected to the sensing element via the fifth circuit element.

[0023] According to some embodiments of the disclosure, the optical element is fixedly connected to the carrier via an adhesive element.

[0024] According to some embodiments of the present disclosure, each of the first circuit element, the second circuit element, the third circuit element, and the fifth circuit element includes a reinforcement portion. The reinforcement portion at least partially exposes the accommodation space. The adhesive element directly contacts the reinforcement portion.

[0025] The present disclosure is advantageous in that it discloses an optical element driving mechanism in which a carrier that supports an optical element can be driven to move along a first axis to achieve auto-focusing. In the present disclosure, unlike the known art in which a first circuit assembly is disposed on a base or a frame, the first circuit assembly is disposed inside the carrier. This configuration not only allows the optical element driving mechanism of the present disclosure to achieve miniaturization, but also improves the problem of magnetic interference between magnetic elements in the known art. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to make the above and other objects, features, and advantages of the present disclosure more comprehensible, preferred embodiments will be described below with reference to the accompanying drawings, in which:

[0027] Figure 1 An exploded view of an optical element driving mechanism according to some embodiments of the present disclosure.

[0028] Figure 2A A perspective view of a carrier and a first coil according to some embodiments of the present disclosure.

[0029] Figure 2B A top view of a carrier according to some embodiments of the present disclosure.

[0030] Figure 3 A partial perspective view of a carrier according to some embodiments of the present disclosure.

[0031] Figure 4 A partial side view of a carrier and a coil according to some embodiments of the present disclosure.

[0032] Figure 5 A schematic view of a carrier and a housing in a limit position according to some embodiments of the present disclosure.

[0033] Figure 6A A perspective view of a first circuit assembly according to some embodiments of the present disclosure.

[0034] Figure 6B A top view of a first circuit assembly and a carrier shown by a dashed line according to some embodiments of the present disclosure.

[0035] Figure 6C A top view of a first circuit assembly according to some embodiments of the present disclosure.

[0036] Figure 6D Partial top view of a portion of the third circuit element and a portion of the fourth circuit element shown according to some embodiments of the present disclosure.

[0037] Figure 6E Partial side view of a portion of the third circuit element and a portion of the fourth circuit element shown according to some embodiments of the present disclosure.

[0038] Figure 7A Perspective view of a portion of the receiving space of the carrier shown according to some embodiments of the present disclosure, showing the reinforcing portion exposing the receiving space.

[0039] Figure 7B Schematic view of the contact of the optical element, the reinforcing portion, and the adhesive element shown according to some embodiments of the present disclosure.

[0040] Figure 8 Top view of the first elastic element and the carrier shown according to some embodiments of the present disclosure.

[0041] Figure 9A Perspective view of the first circuit assembly shown according to some embodiments of the present disclosure.

[0042] Figure 9B Top view of the first circuit assembly and the carrier shown in dashed lines according to some embodiments of the present disclosure.

[0043] Figure 9C Top view of the first circuit assembly, the coil, and the carrier shown in dashed lines according to some embodiments of the present disclosure.

[0044] Figure 10A Perspective view of the first circuit assembly shown according to some embodiments of the present disclosure.

[0045] Figure 10B Top view of the first circuit assembly and the carrier shown in dashed lines according to some embodiments of the present disclosure.

[0046] Figure 11 Top view of the first elastic element and the carrier shown according to some embodiments of the present disclosure.

[0047] Reference signs are as follows:

[0048] 10: optical element driving mechanism

[0049] 100: fixed portion

[0050] 110: housing

[0051] 120: frame

[0052] 130: flat plate

[0053] 140: upper base

[0054] 145: lower base

[0055] 200: optical element

[0056] 300, 300A, 300B: carrier

[0057] 310: body

[0058] 320: upper portion

[0059] 325: lower portion

[0060] 330: first recess

[0061] 335: second recess

[0062] 340: stop element

[0063] 350, 350B: first ledge

[0064] 355: second ledge

[0065] 360: receiving space

[0066] 370: drive assembly fixing portion

[0067] 380: drive assembly gripping portion

[0068] 400: drive assembly

[0069] 410: first coil

[0070] 420: second coil

[0071] 430: magnetic element

[0072] 500, 500A, 500B: first circuit assembly

[0073] 510, 510A, 510B: first circuit element

[0074] 511, 511A, 511B: first segment

[0075] 512, 512A, 512B: first circuit contact

[0076] 513, 513A, 513B: first bent portion

[0077] 514, 524, 534, 554, 564: reinforcing portion

[0078] 520, 520A, 520B: second circuit element

[0079] 521, 521A, 521B: second segment

[0080] 522, 522A, 522B: second circuit contact

[0081] 523, 523A, 523B: second bend

[0082] 525, 535, 545: clamping portion

[0083] 530, 530A, 530B: third circuit element

[0084] 531, 531A, 531B: third segment

[0085] 532, 532A, 532B: third circuit contact

[0086] 533, 533A, 533B: third bend

[0087] 540, 540A, 540B: fourth circuit element

[0088] 541, 541A, 541B: fourth segment

[0089] 542, 542A, 542B: fourth circuit contact

[0090] 543, 543A, 543B: fourth bend

[0091] 550, 550A, 550B: fifth circuit element

[0092] 551, 551A, 551B: fifth segment

[0093] 552, 552A, 552B: fifth circuit contact

[0094] 560, 560A, 560B: sixth circuit element

[0095] 561, 561A, 561B: sixth segment

[0096] 562, 562A, 562B: sixth circuit contact

[0097] 590: second circuit assembly

[0098] 600: sensing assembly

[0099] 610: sensing element

[0100] 620: capacitor

[0101] 700, 700B: first elastic element

[0102] 710, 710B: active portion fixed end

[0103] 720, 720B: fixed portion fixed end

[0104] 730, 730B: first string

[0105] 740, 740B: connecting portion

[0106] 750B: second string

[0107] 760: second elastic element

[0108] 800: suspension element

[0109] 900: adhesive element

[0110] D1: first axis

[0111] D2: second axis

[0112] D3: third axis

[0113] L1: dotted line

[0114] T: thickness

[0115] W1, W2, W3: side width

[0116] O: optical axis DETAILED DESCRIPTION

[0117] In order to make the purposes, features and advantages of the present disclosure more apparent, embodiments are described below in detail with reference to the accompanying drawings. The configuration of each element in the embodiments is for illustration only and is not intended to limit the present disclosure. Some of the reference numerals are repeated in different drawings in the embodiments in order to simplify the description, and the relevance between different embodiments is not intended. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only the directions with reference to the accompanying drawings. Therefore, the directional terms used are for illustration and are not intended to limit the present disclosure.

[0118] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" can be used in the embodiments to describe one element's relationship to another element as illustrated in the drawings. It is understood that if the device is turned over, the element described as "lower" will then be "upper" and vice versa.

[0119] The following describes optical element driving mechanisms of embodiments of the present disclosure. However, it can be readily appreciated that embodiments of the present disclosure provide many suitable inventive concepts that can be implemented in a wide variety of specific contexts. The particular embodiments disclosed are merely intended for illustration in a particular manner of using the present disclosure, and are not intended to limit the scope of the present disclosure. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be understood that such terms, as for example terms defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0120] Referring to Figure 1 , Figure 1 FIG. 1 is an exploded view of an optical element driving mechanism 10 according to some embodiments of the present disclosure. The optical element driving mechanism 10 can be disposed, for example, inside an electronic device such as a camera, a tablet computer, or a cell phone, and has a housing or a carrier to carry an optical element such as an optical lens having one or more lens elements.

[0121] As shown in Figure 1 , the optical element driving mechanism 10 includes a fixed part 100, an optical element 200 Figure 7B , a carrier 300, a driving assembly 400, a first circuit assembly 500 Figure 2A , a second circuit assembly 590, a sensing assembly 600 Figure 2A , a first elastic element 700, a second elastic element 760, four suspension elements 800, and an adhesive element 900 Figure 7B .

[0122] The fixed part 100 includes a housing 110, a frame 120, a plate 130, an upper base 140, and a lower base 145. The housing 110 and the lower base 145 of the fixed part 100 are fixedly combined with each other to form a space, thereby providing a space for disposing and protecting the aforementioned elements.

[0123] The carrier 300 is a movable part that is movable relative to the fixed part. The carrier 300 includes an upper part 320 facing the housing 110 and a lower part 325 facing the lower base 145. The carrier 300 is configured to carry the optical element 200 and is movable relative to the fixed part 100 under the driving of the driving assembly 400. The structure of the carrier 300 will be described in more detail in Figures 2A to 3 .

[0124] The driving assembly 400 includes a first coil 410, two sets of second coils 420 (totaling four) and four magnetic elements 430. The first coil 410 is disposed on the carrier 300 and is configured to drive the carrier 300 to move relative to the fixed portion 100 along a first axis D1, so that the optical element driving mechanism 10 achieves auto focus (AF). The two sets of second coils 420 are disposed in the flat plate 130 and are configured to drive the carrier 300 to move relative to the fixed portion 100 along a second axis D2 and a third axis D3, so that the optical element driving mechanism 10 achieves optical image stabilization (OIS).

[0125] When light from the outside enters the optical element driving mechanism 10 carrying the optical element 200, the incident light passes through the optical element 200 disposed in the optical element driving mechanism 10 from the light incident end (close to the housing 110) along an optical axis O of the optical element 200 to the light exit end (close to the lower base 145) and to a photosensitive element module (not shown) outside the optical element driving mechanism 10 to obtain an image.

[0126] The first circuit assembly 500 is fixedly disposed on the carrier 300. Part of the first circuit assembly 500 can be seen in Figures 2A to 2B , and its structure will be described in detail Figures 6A to 6E . The second circuit assembly 590 is disposed on the upper base 140. The sensing assembly 600 is disposed on the carrier 300 and is electrically connected to the first circuit assembly 500. The sensing assembly 600 will be described in detail Figure 2A .

[0127] The first elastic element 700 and the second elastic element 760 can be upper and lower leaf springs. The first elastic element 700 and the second elastic element 760 are arranged along the first axis D1. The first elastic element 700 and the second elastic element 760 have a plate-like structure perpendicular to the first axis D1, that is, the thickness of the first elastic element 700 and the second elastic element 760 in the first axis D1 is smaller than the length and width thereof in the second axis D2 and the third axis D3, and the structure is generally planar.

[0128] The first elastic element 700 is connected to the upper portion 320 of the carrier 300, and the second elastic element 760 is connected to the lower portion 325 of the carrier 300, so that the carrier 300 is movably disposed in the fixed portion 100.

[0129] The first elastic element 700 is electrically connected to the second circuit assembly 590 disposed on the upper base 140 via the suspension element 800. The second elastic element 760 is electrically connected to the first coil 410. The connection of the first elastic element 700 to the carrier 300 will be described in detail with reference to Figure 8 and Figure 11 the detailed description.

[0130] Please refer to Figures 2A to 2B , Figure 2A the perspective view of the carrier 300 and the first coil 410 in Figure 1 . Figure 2B The top view of the carrier 300 in Figure 2A is shown, and the first circuit assembly 500 partially exposed from the carrier 300 and the sensing assembly 600 disposed on the carrier 300 can be seen.

[0131] The first circuit assembly 500 is fixedly disposed on the carrier 300 and is electrically connected to the first coil 410 and the sensing assembly 600. The first circuit assembly 500 is connected to the first coil 410 via the second elastic element 760 Figure 1 . The structure of the first circuit assembly 500 will be described in detail in Figures 6A to 6E .

[0132] The sensing assembly 600 includes a sensing element 610 and a capacitor 620. The sensing element 610 is an all-in-one IC in which a sensing IC and a control IC are packaged in the same package. The sensing element 610 can sense the position of the carrier 300 and control the carrier 300 to move to a desired position to achieve closed-loop control.

[0133] Figure 3 The perspective view of the carrier 300 in Figure 2A is shown, and the sensing assembly 600 disposed on the carrier 300 and part of the first coil 410 can be seen. Please refer to Figures 2A to 3 , the carrier 300 has a body 310, a first recess 330, three second recesses 335, four stop elements 340, four first protrusions 350, four second protrusions 355, a receiving space 360, four drive assembly fixing portions 370, and four drive assembly holding portions 380.

[0134] The first groove 330 is a groove structure located at one corner of the support member 300, and the sensing component 600 is disposed therein. The second groove 335 is also a groove structure, located at the other three corners of the support member 300. The protruding structures surrounding the first groove 330 and the second groove 335 are respectively a stop element 340, a first protrusion 350, and a second protrusion 355. The first protrusion 350 and the second protrusion 355 are located on both sides of the stop element 340. The configuration of the stop element 340 will be related to... Figure 5 To describe in more detail.

[0135] The 360-degree space is used to accommodate optical components 200. Figure 7B Specifically, the optical element 200 is fixedly disposed in the receiving space 360 ​​via the adhesive element 900. The arrangement of the optical element 200 and the adhesive element 900 in the receiving space 360 ​​will be related to... Figure 7B To describe in more detail.

[0136] The drive assembly fixing portion 370 protrudes outward from the body 310. The drive assembly holding portion 380 protrudes from the drive assembly fixing portion 370. The drive assembly fixing portion 370 and the drive assembly holding portion 380 are used to fix the first coil 410. The drive assembly fixing portion 370 and the drive assembly holding portion 380 will be related to... Figure 4 To describe in more detail.

[0137] It should be noted that the number of components described above is not limited to this embodiment. That is, this disclosure may also include a different number of first groove 330, second groove 335, stop element 340, first protrusion 350, second protrusion 355, receiving space 360, drive component fixing part 370, and drive component gripping part 380 than in this embodiment.

[0138] Figure 4 for Figure 3 A partial cross-sectional view of the carrier 300 and the first coil 410. (See attached image.) Figure 4 As shown, the drive component fixing portion 370 and the drive component holding portion 380 extend in different directions. The drive component fixing portion 370 extends from the body 310 in a direction away from the first axis D1, while the drive component holding portion 380 extends from the drive component fixing portion 370 along the first axis D1. The first coil 410 is located between the drive component holding portion 380 and the body 310.

[0139] Figure 5A schematic view of the carrier 300 in an extreme position is shown, and the housing 110 is shown in dashed lines for illustrative purposes. The stop element 340 has a protruding structure to limit the range of motion of the carrier 300. The shortest distance between the stop element 340 and the housing 110 is smaller than the shortest distance between the first protrusion 350 or the second protrusion 355 and the housing 110.

[0140] As Figure 5 shown, when the carrier 300 moves relative to the fixed part 100 to an extreme position, the stop element 340 directly contacts the housing 110. This configuration prevents the carrier 300 from directly impacting the housing 110 when moving to an extreme position, which can cause damage to the optical element 200 (not shown) disposed in the carrier 300. Figure 7B ) of the carrier 300.

[0141] Figure 6A A perspective view of the first circuit assembly 500 is shown. In Figure 6A addition to the first circuit assembly 500, the sensing element 610 and the capacitor 620 can also be seen. The first circuit assembly 500 includes a first circuit element 510, a second circuit element 520, a third circuit element 530, a fourth circuit element 540, a fifth circuit element 550, and a sixth circuit element 560.

[0142] Figure 6B A top view of the first circuit assembly 500 and the carrier 300, shown in dashed lines, is shown. Figure 6C A top view of the first circuit assembly 500 is shown. Please refer to Figures 6A to 6C , the first circuit element 510, the second circuit element 520, the third circuit element 530, the fourth circuit element 540, the fifth circuit element 550, and the sixth circuit element 560 are in a strip-like structure, that is, their length is greater than their width and thickness, and their thickness T is between 0.05 mm and 0.25 mm.

[0143] The first circuit element 510, the second circuit element 520, the third circuit element 530, the fourth circuit element 540, the fifth circuit element 550, and the sixth circuit element 560 are at least partially embedded and not exposed on the body 310 of the carrier 300 (as shown in Figures 2A to 2B ), and are electrically connected to the sensing element 610.

[0144] That is, a portion of the first circuit element 510, the second circuit element 520, the third circuit element 530, the fourth circuit element 540, the fifth circuit element 550, and the sixth circuit element 560 are embedded in the carrier 300 and not exposed on the body 310. Therefore, the entire first circuit assembly 500 cannot be seen from the outside of the carrier 300.

[0145] The first circuit element 510 has a first section 511, a first circuit contact 512, a first bend 513, and a reinforcement 514. The first section 511 extends substantially along a third axis D3 perpendicular to the first axis Dl. The first section 511 connects the first circuit contact 512 via the first bend 513.

[0146] The first bend 513 extends along the first axis Dl.

[0147] The second circuit element 520 has a second section 521, a second circuit contact 522, a second bend 523, two reinforcements 524, and three clamps 525. The second section 521 extends along a direction perpendicular to the first axis Dl, in particular, the second section 521 extends in a plane parallel to the second axis D2 and the third axis D3. The second section 521 connects the second circuit contact 522 via the second bend 523. The second bend 523 extends along the first axis Dl.

[0148] The third circuit element 530 has a third section 531, a third circuit contact 532, a third bend 533, a reinforcement 534, and four clamps 535. The third section 531 extends along a direction perpendicular to the first axis Dl, in particular, the third section 531 extends in a plane parallel to the second axis D2 and the third axis D3. The third section 531 connects the third circuit contact 532 via the third bend 533. The third bend 533 extends along the first axis Dl.

[0149] The fourth circuit element 540 has a fourth section 541, a fourth bend 543, a fourth circuit contact 542, and two clamps 545. The fourth section 541 extends substantially along the second axis D2. The fourth section 541 connects the fourth circuit contact 542 via the fourth bend 543. The fourth bend 543 extends along the first axis Dl.

[0150] When viewed along the second axis D2, the first section 511, the second section 521, the third section 531, and the fourth section 541 are substantially located at the same level, that is, they have the same height along the second axis D2. When viewed along the second axis D2, the first circuit contact 512, the second circuit contact 522, the third circuit contact 532, and the fourth circuit contact 542 are substantially located at the same level, that is, they have the same height along the second axis D2.

[0151] The first circuit contact 512, the second circuit contact 522, the third circuit contact 532, and the fourth circuit contact 542 are respectively located at the four first protrusions 350 (as shown) of the carrier 300. Figures 2A to 2B

[0152] ​The sensing component 600 is electrically connected to the first elastic element 700 via the first circuit contact 512, the second circuit contact 522, the third circuit contact 532, and the fourth circuit contact 542 (e.g. Figure 1 ), and is electrically connected to an external circuit (not shown) by the first elastic element 700.

[0153] The positions of the first circuit contact 512, the second circuit contact 522, the third circuit contact 532, and the fourth circuit contact 542 have rotational symmetry when viewed along the first axis D1.

[0154] That is, when viewed along the first axis D1, with the optical axis O as the center point, after the four circuit contacts are rotated, the positions of the four circuit contacts can coincide with the original positions.

[0155] For example, after the four circuit contacts are rotated 90 degrees clockwise, the first circuit contact 512 can coincide with the original position of the second circuit contact 522 after rotation; the second circuit contact 522 can coincide with the original position of the third circuit contact 532 after rotation.

[0156] The fifth circuit element 550 and the sixth circuit element 560 are electrically connected to the sensing element 610. The sensing element 610 is electrically connected to the first coil 410 via the fifth circuit element 550 and the sixth circuit element 560.

[0157] The fifth circuit element 550 includes a fifth segment 551, a fifth circuit contact 552, and a reinforcing portion 554. The sixth circuit element 560 includes a sixth segment 561, a sixth circuit contact 562, and a reinforcing portion 564. The fifth segment 551 and the sixth segment 561 extend along the first axis D1. The fifth segment 551 is perpendicular to the fifth circuit contact 552. The sixth segment 561 is perpendicular to the sixth circuit contact 562.

[0158] The fifth segment 551 and the sixth segment 561 are partially embedded in the carrier 300. When viewed along a direction perpendicular to the first axis D1, the fifth segment 551 and the sixth segment 561 at least partially overlap the first coil 410 (e.g. Figure 4 The fifth segment 551 shown).

[0159] The presence of the reinforcing portions 514, 524, 534, 554, 564 increases the contact area for fixing the optical element 200 ( Figure 7B ) to the carrier 300. The arrangement of the reinforcing portions 514, 524, 534, 554, 564 can strengthen the fixing between the optical element 200 and the carrier 300, and can help to more firmly fix the optical element 200 to the carrier 300.

[0160] The configuration of the reinforcing portions 514, 524, 534, 554, 564 in the carrier 300 will be described in relation to Figure 7A When the assembly is in production, the clamping portions 525, 535, 545 are the terminals that can be used to clamp and position the components. The clamping portions 525, 535, 545 can partially expose the carrier 300.

[0161] Reference is made to Figures 6D to 6E , Figure 6D A top view showing the third segment portion 531 and the fourth segment portion 541 partially overlapping each other. Figure 6E A side view showing the third segment portion 531 and the fourth segment portion 541. The fourth circuit contact 542 and the fourth bending portion 543 of the fourth circuit component 540 can also be seen.

[0162] With the configuration of the first circuit assembly 500, the third segment portion 531 and the fourth segment portion 541 are partially overlapping. Therefore, each side of the carrier 300 in this embodiment only needs to accommodate the width of one circuit component, and thus the side width Wl of the carrier 300 can be designed to be smaller in size, achieving the function of miniaturization.

[0163] Reference is made to Figures 7A to 7B , Figure 7A A view showing the accommodation space 360 and the reinforcing portions 514, 554, 564 that are at least partially exposed in the accommodation space 360. Figure 7B A side view showing the optical element 200, the reinforcing portion 514, and the contact of the adhesive element 900.

[0164] As shown in Figure 7B , the optical element 200 is fixedly connected to the carrier 300 via the adhesive element 900, the adhesive element 900 directly contacts the reinforcing portion 514, and the reinforcing portion 514 and the adhesive element 900 contact the optical element 200 to fixedly dispose the optical element 200 in the accommodation space 360. The reinforcing portions 524, 534, 554, 564 also fixedly dispose the optical element 200 in the accommodation space 360 in the same way as the reinforcing portion 514 contacts the optical element 200.

[0165] Figure 8 A top view showing the first elastic element 700 and the carrier 300. The first elastic element 700 has four movable portion fixed ends 710, four fixed portion fixed ends 720, and four first string lines 730. The movable portion fixed ends 710 are connected to the fixed portion fixed ends 720 via the first string lines 730. The four movable portion fixed ends 710 of the first elastic element 700 respectively contact the first circuit contact 512, the second circuit contact 522, the third circuit contact 532, and the fourth circuit contact 542 (not shown) on the first ledge 350. Figure 2B).

[0166] Due to the rotational symmetry of the positions of the first circuit contact 512, the second circuit contact 522, the third circuit contact 532, and the fourth circuit contact 542 in the embodiment shown in Figure 6A and Figure 6B , the positions of the four active portion fixed ends 710 of the first elastic element 700 connected thereto also have rotational symmetry.

[0167] Figures 9A to 9C A perspective view of the carrier 300A and the first circuit assembly 500A according to another embodiment of the present disclosure is shown. In Figure 9A the first circuit assembly 500A and the sensing element 610 can be seen. Figures 9A to 9C The first circuit assembly 500A of Figures 6A to 6E is substantially similar to the first circuit assembly 500 of and has common features and functions, the details of which will be described below.

[0168] Figure 9A A perspective view of the first circuit assembly 500A and the sensing element 610 is shown. Figure 9B A top view of the first circuit assembly 500A and the carrier 300A shown in dashed lines is shown. Figure 9C A top view of the carrier 300A, the first coil 410, and the first circuit assembly 500A shown in dashed lines is shown.

[0169] Similar to the first circuit assembly 500 depicted in Figures 6A to 6E , the first circuit assembly 500A of Figures 9A to 9C has a first circuit element 510A, a second circuit element 520A, a third circuit element 530A, a fourth circuit element 540A, a fifth circuit element 550A, and a sixth circuit element 560A.

[0170] The first circuit element 510A has a first segment 511A, a first circuit contact 512A, and a first bent portion 513A. The second circuit element 520A has a second segment 521A, a second circuit contact 522A, and a second bent portion 523A. The third circuit element 530A has a third segment 531A, a third circuit contact 532A, and a third bent portion 533A. The fourth circuit element 540A has a fourth segment 541A, a fourth circuit contact 542A, and a fourth bent portion 543A.

[0171] The fifth circuit element 550A includes a fifth segment 551A and a fifth circuit contact 552A. The sixth circuit element 560A includes a sixth segment 561A and a sixth circuit contact 562A.

[0172] The first circuit element 510A, the second circuit element 520A, the third circuit element 530A, the fourth circuit element 540A, the fifth circuit element 550A, and the sixth circuit element 560A and Figures 6A to 6E The first circuit element 510, the second circuit element 520, the third circuit element 530, the fourth circuit element 540, the fifth circuit element 550, and the sixth circuit element 560 described have common features and functions.

[0173] Figures 9A to 9C The first circuit component 500A and Figures 6A to 6E The first circuit assembly 500 differs in that, when viewed along the first axis D1, the first segment 511A and the second segment 521A are approximately parallel and side-by-side, and the third segment 531A and the fourth segment 541A are approximately parallel and side-by-side. Without considering the lateral width W2 of the carrier 300A, the multiple segments can be arranged in a parallel and side-by-side configuration, making the first circuit assembly 500A easier to manufacture.

[0174] The positions of the first circuit contact 510A, the second circuit contact 520A, the third circuit contact 530A, and the fourth circuit contact 540A are similar. Figures 6A to 6E The illustrated embodiment has rotational symmetry.

[0175] like Figure 9C As shown, when viewed along the first axis D1, the first segment 511A, the second segment 521A, the third segment 531A, and the fourth segment 541A at least partially overlap the first coil 410. The first segment 511A is at least partially located at the drive assembly fixing portion 370. Figures 6A to 6E The second segment 521 and the third segment 531 described herein can also overlap the first coil 410 at least partially in a similar manner.

[0176] Figures 10A to 10B A perspective view showing a carrier 300B and a first circuit assembly 500B according to another embodiment of the present disclosure. Figure 10A The first circuit component 500B and the sensing component 600 can be seen in the image. Figures 10A to 10B The first circuit component 500B is roughly similar to Figures 6A to 6E The first circuit component 500, and has common features and functions, the details of which will be described below.

[0177] Figure 10A A perspective view showing the first circuit component 500B and the sensing component 600. Figure 10B A top view showing the first circuit assembly 500B and the carrier 300B, shown by dashed lines. Similar to Figures 6A to 6EThe depicted first circuit component 500, Figures 10A to 10B The first circuit component 500B has a first circuit element 510B, a second circuit element 520B, a third circuit element 530B, a fourth circuit element 540B, a fifth circuit element 550B, and a sixth circuit element 560B.

[0178] The first circuit element 510B has a first segment 511B, a first circuit contact 512B, and a first bend 513B. The second circuit element 520B has a second segment 521B, a second circuit contact 522B, and a second bend 523B. The third circuit element 530B has a third segment 531B, a third circuit contact 532B, and a third bend 533B. The fourth circuit element 540B has a fourth segment 541B, a fourth circuit contact 542B, and a fourth bend 543B.

[0179] The fifth circuit element 550B includes a fifth segment 551B and a fifth circuit contact 552B. The sixth circuit element 560B includes a sixth segment 561B and a sixth circuit contact 562B.

[0180] The first circuit element 510B, the second circuit element 520B, the third circuit element 530B, the fourth circuit element 540B, the fifth circuit element 550B, and the sixth circuit element 560B have common features and functions with Figures 6A to 6E The first circuit element 510B, the second circuit element 520B, the third circuit element 530B, the fourth circuit element 540B, the fifth circuit element 550B, and the sixth circuit element 560B have common features and functions with

[0181] Figures 10A to 10B The first circuit component 500B has a first circuit element 510B, a second circuit element 520B, a third circuit element 530B, a fourth circuit element 540B, a fifth circuit element 550B, and a sixth circuit element 560B. Figures 6A to 6E The first circuit component 500B has a first circuit element 510B, a second circuit element 520B, a third circuit element 530B, a fourth circuit element 540B, a fifth circuit element 550B, and a sixth circuit element 560B.

[0182] In other words, as shown by the dashed line L1 in Figure 10B In other words, as shown by the dashed line L1 in

[0183] With the configuration of the first circuit assembly 500B, the first circuit element 510B and the fourth circuit element 540B are both located closer to the sensing assembly 600. Therefore, each side of the carrier 300B in this embodiment only needs to accommodate the width of one circuit element. Thus, the side width W3 of the carrier 300B can also be designed to be smaller, thereby achieving the function of miniaturization.

[0184] Although Figures 9A to 10B In the shown embodiment, the first circuit assembly 500A and the first circuit assembly 500B do not include the reinforcing portion and the clamping portion, but the first circuit assembly 500A and the first circuit assembly 500B may selectively include the features of the reinforcing portion and the clamping portion.

[0185] Figure 11 This is a top view showing the first elastic element 700B and the support member 300B. The first elastic element 700B has four movable fixed ends 710B, four fixed fixed ends 720B, four first chords 730B, two connecting parts 740B, and two second chords 750B.

[0186] Reference Figure 11 When viewed along the first axis D1, the upper, lower, left, and right sides of the support member 300B are connected to the first elastic element 700B via movable fixed ends 710B. The movable fixed ends 710B located on the left and right sides of the support member 300B are connected to fixed ends 720B via first chord lines 730B. These two movable fixed ends 710B respectively contact the first circuit contact 512B and the third circuit contact 532B located on the first protrusion 350B. Figure 10B ).

[0187] Continue to refer to Figure 11 When viewed along the first axis D1, a pair of fixed ends 720B located diagonally to the upper right and lower left are connected to the connecting part 740B via a first chord 730B, and the connecting part 740B is connected to the movable fixed end 710B via a second chord 750B. These two movable fixed ends 710B respectively contact the second circuit contact 522B and the fourth circuit contact 542B located on the first protrusion 350B. Figure 10B ).

[0188] Because in Figure 10B In the illustrated embodiment, the positions of the first circuit contact 512B, the second circuit contact 522B, the third circuit contact 532B, and the fourth circuit contact 542B are linearly symmetrical, therefore... Figure 11 The positions of the two pairs of movable fixed ends 710B connected to it also have linear symmetry.

[0189] An optical element driving mechanism is disclosed, in which a carrier connecting an optical element is driven to move along a first axis to achieve auto-focusing. In the present disclosure, unlike the known art in which a first circuit assembly is disposed on a base or a frame, the first circuit assembly is disposed inside the carrier. This configuration not only allows the optical element driving mechanism of the present disclosure to be miniaturized, but also improves the problem of magnetic interference between magnetic elements in the known art.

[0190] The present disclosure also proposes three embodiments in which a first circuit element, a second circuit element, a third circuit element, and a fourth circuit element are arranged in different configurations according to different spatial restrictions of the carrier.

[0191] In the present specification and claims, ordinal numbers such as "first", "second", and the like do not have a sequential order relationship with each other, and are merely used to distinguish different elements having the same name.

[0192] Although the embodiments of the present disclosure and their advantages have been disclosed as above, it should be understood that those skilled in the art, without departing from the spirit and scope of the present disclosure, can make modifications, substitutions and refinements. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufacture, material composition, devices, methods and steps described in the specific embodiments described in the specification, and any person skilled in the art can understand the current or future developed processes, machines, manufacture, material composition, devices, methods and steps from the disclosure of the present disclosure, as long as they can substantially achieve the same function or obtain substantially the same results as in the embodiments described herein. Therefore, the scope of protection of the present disclosure includes the above processes, machines, manufacture, material composition, devices, methods and steps. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present disclosure also includes the combination of each claim and embodiment.

[0193] The above-described embodiments are described in sufficient detail to enable those skilled in the art to carry out the devices disclosed by the present disclosure based on the above description, and it must be understood that minor modifications and refinements can be made without departing from the spirit and scope of the present disclosure, therefore the scope of protection of the present invention is defined by the appended claims.

Claims

1. An optical element driving mechanism, comprising: a carrier configured to connect an optical element; a fixed portion, the carrier being movable relative to the fixed portion; a driving assembly configured to drive the carrier to move relative to the fixed portion; and a first circuit assembly fixedly disposed on the carrier; wherein the first circuit assembly is electrically connected to the driving assembly; wherein the carrier comprises: a body; a driving assembly fixing portion protruding outwardly from the body and configured to fix a first coil of the driving assembly; and a driving assembly holding portion protruding from the driving assembly fixing portion and configured to fix the first coil; wherein the driving assembly fixing portion and the driving assembly holding portion have different extension directions, and the first coil is located between the driving assembly holding portion and the body.

2. The optical element driving mechanism of claim 1, further comprising a sensing assembly comprising a sensing element, wherein the sensing assembly is configured to sense a movement of the carrier.

3. The optical element driving mechanism of claim 2, wherein the carrier comprises: a first recess having a recess structure configured to accommodate the sensing element; a stop element having a protruding structure configured to limit a movement range of the carrier; a first protruding platform having a protruding structure adjacent to the first recess; and a receiving space configured to accommodate the optical element.

4. The optical element driving mechanism of claim 3, wherein when the carrier is located at a limit position, the stop element directly contacts the fixed portion, and a shortest distance between the stop element and the fixed portion is smaller than a shortest distance between the first protruding platform and the fixed portion.

5. The optical element driving mechanism of claim 4, further comprising a first elastic element comprising a movable portion fixed end, wherein the first elastic element has a plate structure perpendicular to a first axis, and the carrier is movably connected to the fixed portion via the first elastic element, and the movable portion fixed end is fixedly disposed on the first protruding platform.

6. The optical element driving mechanism of claim 5, further comprising a second elastic element having a plate structure perpendicular to the first axis, wherein the carrier is movably connected to the fixed portion via the second elastic element, the driving assembly is electrically connected to the second elastic element, the first circuit assembly is electrically connected to the driving assembly via the second elastic element, and the first elastic element and the second elastic element are arranged along the first axis.

7. The optical element driving mechanism of claim 6, wherein the first circuit assembly comprises a first circuit element having a strip structure, a first segment, and a first circuit contact, and the first circuit element is electrically connected to the sensing element, a thickness of the first circuit element is between 0.05 mm and 0.25 mm, the first circuit element is at least partially embedded and does not protrude from the body, the first segment extends along a direction perpendicular to the first axis, the sensing assembly is electrically connected to an external circuit via the first circuit contact, the first circuit contact is disposed on the first protruding platform and is electrically connected to the first elastic element. ​ ​ 8. The optical element driving mechanism according to claim 7, wherein the first circuit assembly includes a second circuit element having a strip shape, a second section, and a second circuit contact, and the second circuit element is electrically connected to the sensing element, a thickness of the second circuit element is between 0.05 mm and 0.25 mm, the second circuit element is at least partially embedded and does not protrude from the body, the second section extends in a direction perpendicular to the first axis, the second section at least partially overlaps the first coil when viewed along the first axis, and the second circuit contact is electrically connected to the first elastic element.

9. The optical element driving mechanism according to claim 8, wherein the first circuit assembly includes a third circuit element having a strip shape, a third section, and a third circuit contact, and the third circuit element is electrically connected to the sensing element, a thickness of the third circuit element is between 0.05 mm and 0.25 mm, the third circuit element is at least partially embedded and does not protrude from the body, the third section extends in a direction perpendicular to the first axis, the third section at least partially overlaps the first coil when viewed along the first axis, and the third circuit contact is electrically connected to the first elastic element.

10. The optical element driving mechanism according to claim 9, wherein the first circuit assembly includes a fourth circuit element having a strip shape, a fourth section, and a fourth circuit contact, and the fourth circuit element is electrically connected to the sensing element, a thickness of the fourth circuit element is between 0.05 mm and 0.25 mm, the fourth circuit element is at least partially embedded and does not protrude from the body, the fourth section extends in a direction perpendicular to the first axis, and the fourth circuit contact is electrically connected to the first elastic element.

11. The optical element driving mechanism according to claim 10, wherein positions of the first circuit contact, the second circuit contact, the third circuit contact, and the fourth circuit contact have rotational symmetry when viewed along the first axis.

12. The optical element driving mechanism according to claim 10, wherein positions of the first circuit contact, the second circuit contact, the third circuit contact, and the fourth circuit contact have line symmetry when viewed along the first axis.

13. The optical element driving mechanism according to claim 10, wherein the first section is at least partially located in the driving assembly fixing portion, and the first section at least partially overlaps the first coil when viewed along the first axis, the first section is parallel to part of the second section and is side by side with part of the second section when viewed along the first axis, and part of the third section is parallel to part of the fourth section and is side by side with part of the fourth section when viewed along the first axis.

14. The optical element driving mechanism according to claim 10, wherein the third section at least partially overlaps the fourth section when viewed along the first axis.

15. The optical element driving mechanism according to claim 10, wherein the first circuit contact, the second circuit contact, the third circuit contact, and the fourth circuit contact are located at the same level when viewed along a second axis perpendicular to the first axis.

16. The optical element driving mechanism according to claim 10, wherein the first section, the second section, the third section and the fourth section are located at the same level when viewed along a second axis perpendicular to the first axis.

17. The optical element driving mechanism according to claim 10, wherein the first circuit assembly comprises a fifth circuit element having a strip structure, a fifth section, and the fifth circuit element is electrically connected to the sensing element, a thickness of the fifth circuit element is between 0.05 mm and 0.25 mm, the fifth circuit element is at least partially embedded and does not protrude out of the body, the fifth section extends along the first axis, and the fifth section at least partially overlaps the first coil when viewed along a second axis perpendicular to the first axis, and the first coil electrically connects the sensing element via the fifth circuit element.

18. The optical element driving mechanism according to claim 17, wherein the optical element is fixedly connected to the carrier via an adhesive element.

19. The optical element driving mechanism according to claim 18, wherein each of the first circuit element, the second circuit element, the third circuit element and the fifth circuit element comprises a reinforcing portion, respectively, the reinforcing portion is at least partially exposed out of the accommodating space, and the adhesive element directly contacts the reinforcing portion.

Citation Information

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