A method for pulling a six-inch zone melting silicon single crystal and a heat shield used therein

By setting a heat screen in the zone melting single crystal furnace and controlling the cooling water pressure, the cooling heat dissipation problem during the growth of large-sized zone melting silicon single crystals is solved, the crystallization rate is improved, and the dislocation-free six-inch zone melting single crystal drawing is achieved.

CN114574940BActive Publication Date: 2025-03-18CHINA ELECTRONICS TECH GRP NO 46 RES INST
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Patent Information

Application Number
CN202210164175.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2022-02-23
Publication Date
2025-03-18
Estimated Expiration
2042-02-23

AI Technical Summary

Technical Problem

During the growth of single crystals in large-size areas, cooling and heat dissipation problems lead to single crystal explosion or remelting, which leads to crystallization failure.

Method used

A heat screen is designed, which is set below the heating coil in the middle furnace chamber of the melting single crystal furnace. By controlling the size of the heat screen and the cooling water pressure, the lower part of the single crystal is reflected by heat and controls the internal and external temperature gradient.

Benefits of technology

It effectively solves the problem of cooling and heat dissipation of single crystals in large-size areas during growth, improves the crystallization rate of single crystals, avoids explosion and melting, and realizes the drawing of six-inch dislocation-free melting silicon single crystals.

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Abstract

The present invention relates to a method for drawing a six-inch zone melting silicon single crystal and a heat shield used therein. A heat shield is arranged 40 mm below a heating coil in a middle furnace chamber of a zone melting single crystal furnace, the upper diameter of the heat shield cover is 90 mm, the lower diameter is 215 mm, the height is 40 mm, and the pressure of cooling water in the condensation pipeline is 3.2 bar; when performing shoulder expansion, shoulder rotation, equal diameter, and finishing processes, the silicon single crystal moves downward along the lower axis and enters the heat shield area, and the heat reflected by the heat shield cover acts on the lower part of the single crystal, avoiding the single crystal from bursting or remelting due to excessive or insufficient temperature gradient, resulting in crystallization failure.
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