Socket for ic inspection

Abstract

An IC inspection socket (10) includes a pin block (30) having a contact probe array (60), a guide plate (40) that guides an inspection object IC package (60) toward the contact probe array, and a cover (50) that presses the guide plate by engagement of an engagement portion with the pin block (30). The pin block (30) has a support portion (70) that supports the guide plate (40) in a detachable manner, and an engaged portion (36) that is engaged with the engagement portion by sliding movement of the cover (50) on the supported guide plate (40).

Description

Technical Field

[0001] This invention relates to a socket for IC (Integrated Circuit) inspection. Background Technology

[0002] IC inspection sockets are used in the inspection of IC packages (see, for example, Patent Document 1).

[0003] The IC testing socket has a pin block with multiple contact probes, each corresponding to one of the IC's electrode terminals, and a guide member located above the pin block. When the IC package to be tested is inserted into the guide member with its electrode terminals facing down, the IC package is guided into a predetermined position onto the contact probes. By appropriately pressing the IC package from top to bottom, the IC package's electrode terminals make contact with the contact probes, thereby ensuring a power path for testing.

[0004] As disclosed in Patent Document 2, the guide component of the conventional IC inspection socket is fixed to the pin block with screws.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2016-207511

[0008] Patent Document 2: Japanese Patent Application Publication No. 2004-325305 Summary of the Invention

[0009] Among the IC packages subject to inspection, there are types with identical electrode terminal configurations but different external shapes. When inspecting IC packages with identical electrode terminal configurations but different external shapes, the IC inspection socket presents the following problem: Although it's desirable to share a pin block due to the identical electrode terminal configuration, the different external shapes of the IC packages necessitate replacing the guide component. However, the problem is that this replacement operation is time-consuming. To replace the guide component, after removing the screws securing the guide component to the pin block and taking out the guide component, the guide component to be replaced is then secured to the pin block with screws; this time-consuming process is problematic.

[0010] For IC packaging, there is a desire for further miniaturization and enhanced functionality. There is a tendency to densify a large number of electrode terminals within smaller package sizes. For IC inspection sockets, there is also a need to increase the density of contact probes to accommodate the high-density electrode terminals. However, as a result, the screws used to secure guide components to the pin blocks in IC inspection sockets have become extremely small, making guide component replacement more laborious. Furthermore, it is becoming increasingly difficult to secure space for screw installation in IC inspection sockets.

[0011] One example of the object of the present invention is to make it easier to inspect IC packages with different package shapes in an IC inspection socket.

[0012] One aspect of the present invention is an IC inspection socket comprising: a pin having a contact probe array; a guide plate guiding an IC (Integrated Circuit) package to be inspected toward the contact probe array; and a cover having an engaging portion that engages with the pin and presses the guide plate by engaging the engaging portion. The pin has: a support portion that supports the guide plate in a detachable manner; and a engaged portion, wherein the engaging portion engages with the engaged portion by sliding the cover on the guide plate supported by the support portion.

[0013] According to the present invention, the cover is not fixed to the pin block by screws; the guide plate can be removed simply by sliding the cover. Therefore, the process of replacing the guide plate becomes easier when inspecting IC packages with different package shapes. Attached Figure Description

[0014] Figure 1 This is an external diagram showing an example of the configuration of an IC testing socket.

[0015] Figure 2 This is a top view showing an example of the structure of the socket body.

[0016] Figure 3 Viewed from the negative side of the Y-axis Figure 2 Longitudinal sectional view of section III-III.

[0017] Figure 4 This is a top view showing an example of the pin block's structure.

[0018] Figure 5 This is a top view showing an example of the configuration of a guide plate.

[0019] Figure 6 This is a top view showing an example of the structure of the cover.

[0020] Figure 7 This is a bottom view showing an example of the structure of the cover.

[0021] Figure 8 yes Figure 6 and Figure 7 Longitudinal sectional view of section VIII-VIII.

[0022] Figure 9 This is a diagram (one of) used to illustrate the assembly steps of the socket body.

[0023] Figure 10 This is a diagram (second one) illustrating the assembly steps of the socket body. Detailed Implementation

[0024] Examples of preferred embodiments of the present invention will be described, but the application of the invention is not limited to the following embodiments. Orthogonal triaxial axes are shown in the figures to represent common directions. The orthogonal triaxial axes are a right-handed coordinate system with the positive Z-axis as the upper direction.

[0025] Figure 1 This is an external view showing an example of the configuration of the IC testing socket 10 in this embodiment.

[0026] The IC inspection socket 10 has a cover 14 and a pressure mechanism 16 above the socket body 12.

[0027] The socket body 12 is mounted on the inspection device 5.

[0028] The cover 14 is supported by a cover swing shaft 18 along the X-axis in a swingable manner, and a pressure mechanism 16 is supported above the socket body 12.

[0029] The pressure mechanism 16 applies a load downwards to the IC package 9 being inspected and placed inside the socket body 12.

[0030] On the negative side of the Y-axis direction of the cover 14, opposite to the side where the cover swing shaft 18 is located (for... Figure 1 (To the right) It has a hook 20. The hook 20 is supported by a hook swing shaft 22 along the X-axis in a swinging manner, and a helical spring 24 applies a force at the hook swing shaft 22 in a clockwise direction when viewed from the negative side of the X-axis.

[0031] Hook 20 engages with socket body 12 via locking claw 21 to maintain cover 14 covering the top of socket body 12. When cover 14 is swung by removing hook 20, the interior of socket body 12 is exposed, allowing for the removal and insertion of IC package 9 for inspection.

[0032] Figure 2 This is a top view showing an example of the configuration of the socket body 12.

[0033] Figure 3Viewed from the negative side of the Y-axis Figure 2 Longitudinal sectional view of section III-III.

[0034] The socket body 12 has a pin block 30, a guide plate 40, and a cover 50.

[0035] Figure 4 This is a top view showing an example of the configuration of pin block 30.

[0036] The pin block 30 forms the base of the socket body 12. The pin block 30 has a receiving recess 32, which has a bottom surface along the XY plane, and a contact probe array 60 is provided at the center of the receiving recess 32. The pin block 30 has a suppressing elastic portion 82 that constitutes the displacement suppressing portion 80.

[0037] The contact probe array 60 is configured by arranging multiple contact probes along the XY plane in a manner corresponding to the configuration of the electrode terminals of the IC package 9 to be inspected. Each contact probe of the contact probe array 60 is vertically disposed in the receiving recess 32 with its length direction along the Z-axis.

[0038] The top view of the receiving recess 32 is set to be similar to or substantially similar to the top view of the guide plate 40. The guide plate 40 can be placed in the receiving recess 32 in a position substantially parallel to the XY plane and inserted into the recess from above. The receiving recess 32 functions as a guide and receiving mechanism that guides and receives the lower part (the part on the negative side in the Z-axis direction) of the guide plate 40 to a predetermined position.

[0039] The pin block 30 has multiple support portions 70 at both ends in the Y-axis direction of the receiving recess 32. Each support portion 70 has a spring 72 disposed inside the pin block 30, and a spring cap 74 covering the upper part of the spring 72 and exerting upward force by the spring 72 (see reference). Figure 3 The head (upper end) of the spring cap 74 protrudes from the bottom surface of the receiving recess 32. The support portion 70 elastically supports the guide plate 40 by abutting against the lower surface of the guide plate 40 through the head of the spring cap 74.

[0040] A parallel pin 34 is erected on the bottom surface of the receiving recess 32, parallel to the Z-axis direction. In this embodiment, two parallel pins 34 are erected. An insertion hole 42 is provided on the guide plate 40 for the parallel pins 34 to pass through. The guide plate 40, supported by the support portion 70, is elastically supported in a manner that allows it to move up and down along the Z-axis direction, through the configuration of the parallel pins 34 passing through the insertion hole 42 and the guide receiving mechanism of the receiving recess 32. Thus, the guide plate 40 is elastically supported in a manner that allows it to approach or separate from the contact probe array 60.

[0041] On the upper surface of the pin block 30, which corresponds to the outer edge of the receiving recess 32, there is a locking portion 36 for the cover 50 to be slidably engaged. Specifically, the locking portion 36 has a screw 36a, a threaded hole 36b provided on the upper surface of the pin block 30, and a protrusion 36c protruding from the outer periphery of the threaded hole 36b on the upper surface of the pin block 30.

[0042] Screw 36a is a small screw with a flat head and a seat face that forms an approximately orthogonal plane with respect to the threaded portion. Screw 36a can also be a self-tapping screw. In this case, it is not necessary to form an internal thread in the threaded hole 36b.

[0043] The height of screw 36a is determined by the contact between the seat surface and the upper surface of protrusion 36c when screw 36a is screwed into threaded hole 36b.

[0044] Figure 5 This is a top view showing an example of the configuration of the guide plate 40.

[0045] The guide plate 40 is a plate-shaped guide component that guides the IC package 9 to the contact probe array 60 of the pin block 30. Because it is elastically supported by the support portion 70, it can also be called a floating plate.

[0046] The guide plate 40 has an outer edge 46, a window 44, a guide surface 48 that slopes from the upper end of the outer edge 46 toward the edge of the window 44, and a shelf-shaped positioning part 49.

[0047] The window 44 is a space located in the center of the guide plate 40 when viewed from above, so that the contact probe array 60 of the pin block 30 can be exposed when viewed from above.

[0048] The positioning part 49 has a vertical surface 49a that is recessed downward along the Z-axis compared to the lower end of the guide surface 48, and a shelf-like part 49b that extends along the XY plane toward the inner side of the window 44.

[0049] The IC package 9 to be inspected is inserted from above into the window 44 of the guide plate 40 with its electrode terminals facing downwards. The inserted IC package 9 slides down while maintaining approximately its insertion position as its outer edge abuts against the guide surface 48. It then stops in a state where its outer edge is embedded in the vertical surface 49a of the positioning portion 49, and its four corners are resting on the shelf-like portions 49b. Viewed from above, the IC package 9 in this state is positioned such that each contact probe of the corresponding contact probe array 60 is directly below each electrode terminal on the bottom surface.

[0050] Figure 6 This is a top view showing an example of the configuration of the cover 50.

[0051] Figure 7This is a bottom view showing an example of the configuration of the cover 50.

[0052] Figure 8 yes Figure 6 and Figure 7 Longitudinal sectional view of section VIII-VIII.

[0053] The cover 50 is a component that is elastically supported by pressing down on the guide plate 40 within the receiving recess 32 and placed on the support 70. Specifically, the cover 50 is a component that has a window 51 in the central part of the plate-shaped component that is larger than the window 44 of the guide plate 40 but smaller than the overall shape of the guide plate 40 in plan view. The cover 50 can be described as a frame with a relatively small thickness (thinner in the Z direction) and an opening in the center.

[0054] A recessed portion 52 is provided on the lower surface of the cover 50, which is opposite to and in contact with the upper surface of the guide plate 40. The recessed portion 52 is... Figure 7 The area shown by the shaded line is located on the lower surface of the cover 50, on the positive side of the window 51 and the negative side of the window 51.

[0055] Depth D1 of the layer difference relative to recess 52 (recess size: reference) Figure 8 The guide plate 40 is set to protrude upwards by an amount equal to or greater than the upper surface of the pin block 30 when it is elastically supported by the support portion 70.

[0056] The width of the recess 52 in the Y-axis direction is set to be slightly larger than that of the guide plate 40. Figure 7 The width of the double-dotted line in the Y-axis direction.

[0057] The width of the recess 52 in the X-axis direction is set to be slightly greater than the sum of the width of the guide plate 40 in the X-axis direction and the sliding distance of the cover 50 in the sliding operation described later.

[0058] Cover 50 is on the negative side of the X-axis (for...) Figure 6 , Figure 7 The end of the device (located on the lower side) has a first fixing part 53, and on the positive side of the X-axis (for...) Figure 6 , Figure 7 The upper end has a second fixing part 54.

[0059] Each of the top-view corner portions on the negative X-axis side of the cover 50 is provided with a first fixing part 53. The first fixing part 53 has an inlet opening 53a, a narrow part 53b, and a first engaging part 53c.

[0060] The inlet opening 53a is a notch that opens on the side of the cover 50 on the negative X-axis side. The opening width W3 of the inlet opening 53a in the Y-axis direction when viewed from above is slightly larger than the head shape of the screw 36a.

[0061] The narrow portion 53b is the part on the X-axis side (inside the notch) of the first fixing portion 53 where the opening width is narrower than that of the guide opening portion 53a. The opening width W4 of the narrow portion 53b in the Y-axis direction when viewed from above is smaller than the head shape of the screw 36a and slightly larger than the threaded portion of the screw 36a.

[0062] The first engaging portion 53c is a section that is one layer lower than the upper surface of the cover 50 surrounding the narrow portion 53b; in other words, it is a locally thinner section. The thickness T1 of the first engaging portion 53c (refer to...) Figure 8 The height of the protrusion 36c of the pin 30 is set to be slightly smaller than the height of the protrusion 36c of the pin 30. The height of the protrusion 36c of the pin 30 is greater than the thickness of the first engaging portion 53c. The height of the protrusion 36c of the pin 30 is smaller than the thickness of the cover 50.

[0063] A second fixing part 54 is provided at each of the top-view corners on the X-axis side of the cover 50. The second fixing part 54 has a through opening 54a and a second engaging part 54d.

[0064] The through opening 54a is a through hole through which the cover 50 passes vertically, and has an insertion portion 54b and a narrow portion 54c. When viewed from above, the through opening 54a forms a shape in which the narrow portion 54c connects and merges with the end of the circular insertion portion 54b on the positive X-axis side.

[0065] The opening diameter D4 (width in the Y-axis direction and width in the X-axis direction) of the interpenetrating portion 54b is slightly larger than the head of the screw 36a. The opening width D5 of the narrow portion 54c in the Y-axis direction (viewed from above) is smaller than the head of the screw 36a, but slightly larger than the threaded portion of the screw 36a.

[0066] The second engaging portion 54d is a portion that is one layer lower than the upper surface of the cover 50 surrounding the narrow portion 54c; in other words, it is a portion that is locally thinner. The thickness of the second engaging portion 54d is set to be the same as the thickness T1 of the first engaging portion 53c (see reference). Figure 8 The height of the protrusion 36c of the pin 30 is the same, but slightly smaller than the height of the protrusion 36c of the pin 30. The height of the protrusion 36c of the pin 30 is greater than the thickness of the second engaging portion 54d. The height of the protrusion 36c of the pin 30 is less than the thickness of the cover 50.

[0067] The displacement suppression part 80 has a suppression elastic part 82 that elastically protrudes upward compared to the upper surface of the pin block 30 (see reference). Figure 3 ), and through holes 84 provided on the cover 50, extending vertically (see reference). Figure 6 ).

[0068] The elastic restraint part 82 has a force-applied component 82b inside the positive X-axis side of the pin block 30, which is exerted upward by the spring 82a (for example, the force-applied component 82b is configured to cause the metal cylindrical material to fall down along the Y-axis direction).

[0069] When the cover 50 is installed onto the pin 30, the through hole 84 is located above the retaining elastic part 82. This is achieved by making the portion of the retaining elastic part 82 that protrudes beyond the upper surface of the pin 30 embedded / engaged within the through hole 84 (see reference). Figure 3 The displacement of the cover 50 in the X-axis direction is suppressed.

[0070] Next, the assembly steps of the socket body 12 will be explained.

[0071] First, such as Figure 9 As shown, the operator inserts the guide plate 40 into the receiving recess 32 of the pin block 30 from above. During insertion, the parallel pin 34 is inserted into the through hole 42. The lower surface of the guide plate 40 abuts against the upper surface of the support portion 70, so that the guide plate 40 is elastically supported by the support portion 70. The lower surface of the guide plate 40 (the side surface on the negative Z-axis) enters the inner side of the receiving recess 32, so that the guide plate 40 does not move relative to the pin block 30 along the XY plane. In this state, the upper surface of the guide plate 40 (the side surface on the positive Z-axis) does not completely enter the receiving recess 32, but is in a state that protrudes upward compared to the upper surface of the pin block 30. In addition, in this state, the guide plate 40 is able to be pressed down (in the negative Z-axis direction) against the elastic support force of the support portion 70.

[0072] Secondly, such as Figure 10 As shown, the operator places the cover 50 over the guide plate 40. Specifically, the operator positions the cover 50 with the through hole 84 on the positive side of the X-axis (for...). Figure 10 The engaging portion 36 (on the upper side) is inserted into the interpenetrating portion 54b of the second fixing portion 54 (see reference). Figure 6 ), thereby covering the cover 50 onto the guide plate 40.

[0073] At this time, the upper surface of the guide plate 40 is positioned to be accommodated within the window portion 51 and the opposing recess 52 of the cover 50. Specifically, the guide plate 40 is located in Figure 7 The relative positions indicated by the double-dotted lines are such that they are contained within the relative recesses 52.

[0074] During this phase, the negative side of the X-axis (for) Figure 10The engaging portion 36 (on the lower side) did not enter the guide opening 53a of the first fixing portion 53. Furthermore, the through hole 84 of the displacement inhibiting portion 80 did not reach above the inhibiting elastic portion 82. The inhibiting elastic portion 82 is in a state where the lower surface of the cover 50 is pressed downwards by the operator covering the cover 50. In other words, the through hole 84 and the inhibiting elastic portion 82 did not engage, and the displacement inhibiting portion 80 did not function.

[0075] Next, if the operator slides the cover 50 from the positive side of the X-axis to the negative side of the X-axis, it becomes... Figure 2 The state. By sliding, at the first fixing part 53 of the cover 50 (refer to...) Figure 6 In ), the negative side of the X-axis (for Figure 10 The threaded portion of the screw 36a (located on the lower side) is guided into the narrow portion 53b, and stops sliding by abutting against the inner wall of the narrow portion 53b. During this process, the first engaging portion 53c engages with the gap between the seat surface of the screw 36a and the upper surface of the pin block 30. As a result, the end of the cover 50 on the negative X-axis side becomes difficult to move in the Z-axis direction (vertical direction).

[0076] Additionally, through this sliding movement, the second fixing part 54 of the cover 50 (see reference) Figure 6 In this configuration, the threaded portion of the screw 36a on the positive X-axis side is guided into the narrow portion 54c, and the second engaging portion 54d is inserted into the gap between the seat surface of the screw 36a and the upper surface of the pin block 30. As a result, the end of the cover 50 on the positive X-axis side becomes difficult to move in the Z-axis direction (vertical direction).

[0077] Furthermore, through this sliding movement, the damping elastic part 82 in the displacement damping part 80 is positioned directly below the through hole 84, and the force-applied component 82b enters the through hole 84. During this process, the operator will receive a tactile sensation to know that the cover 50 has slid to the correct position. Moreover, since the force-applied component 82b has entered the through hole 84, the damping function of the displacement damping part 80 will be activated.

[0078] The width W7 in the X-axis direction relative to the concave portion 52 (refer to) Figure 7 The guide plate 40 is set to a larger sliding range than the sliding range during the sliding movement, so that the guide plate 40 can slide relative to the cover 50 during the sliding movement. Therefore, the cover 50 can also slide smoothly on the guide plate 40 during the sliding movement.

[0079] Furthermore, in the bulge 55 of the cover 50 (see reference) Figure 6 ) Enters the recess 45 located on the upper surface of the positive Y-axis end and the upper surface of the negative Y-axis end of the guide plate 40 (refer to Figure 5The cover 50 slides smoothly on the guide plate 40 during the sliding movement. The bulge 55 is a protrusion formed by protruding from the inner side of the window portion 51 on the positive Y-axis side and the inner side of the window portion 51 on the negative Y-axis side towards the center of the window portion 51. Therefore, the cover 50 can also slide smoothly on the guide plate 40 during the sliding movement.

[0080] When the sliding movement ends, the guide plate 40 is covered by the cover 50 at both ends in the X-axis direction and both ends in the Y-axis direction in a manner that prevents it from falling off the receiving recess 32 of the pin block 30. If we focus on the guide plate 40 being elastically supported, the cover 50 prevents the guide plate 40 from moving in the XY plane direction, and determines the upper limit position of the elastic support in the Z-axis direction provided by the support part 70.

[0081] When the IC test socket 10 is to be compatible with other types of IC packages with the same electrode terminal configuration but different package shapes, a guide plate 40 for each IC package can be prepared separately.

[0082] In the separately prepared new guide plate, the positioning part 49 is configured in a shape that is compatible with the shape of the corresponding other types of IC packages. Specifically, in the new guide plate, the positions of the four corners, the window part 44, the guide surface 48, etc., are configured to be compatible with other types of IC packages.

[0083] When replacing the guide plate 40, the user removes the installed guide plate 40 from the pin block 30 by reversing the assembly steps described above. Then, the user reinstalls another guide plate 40 onto the pin block 30 following the same assembly steps.

[0084] Unlike traditional IC testing sockets, there's no need to remove or install screws. The guide plate 40 was never secured with screws. Not only are tools unnecessary, but the operation is also extremely simple. Furthermore, eliminating the need for fixing screws facilitates the miniaturization of the IC testing socket.

[0085] As described above, the IC inspection socket 10 according to this embodiment makes it easier to inspect IC packages with different package shapes.

[0086] Since the support portion 70 elastically supports the guide plate in the vertical direction (Z-axis direction) that intersects with the sliding movement direction of the cover 50, the guide plate 40 can function as a floating plate.

[0087] The cover 50 has a recess 52 that contacts the opposing surface of the guide plate 40. The recess 52 is sized to allow sliding along the direction of sliding movement on the opposing surface of the guide plate 40. Therefore, during assembly and disassembly operations, it is not necessary to expend effort to continue pushing the guide plate 40, which is elastically supported and protrudes upwards compared to the upper surface of the pin 30 (the sliding surface that allows the cover 50 to slide), providing excellent workability.

[0088] The engaging portion 36 is a shaft with a head (specifically, a screw 36a), and the cover 50 has an insert portion 54b for the shaft to pass through. The second engaging portion 54d of the second fixing portion 54 engages with the lower surface of the head of the shaft (the seat surface of the screw). The presence of the insert portion 54b serves as a standard for adjusting the starting position and starting posture of the cover 50 for correct installation, making the assembly operation easier to understand.

[0089] The pin block 30 has a threaded hole 36b corresponding to the screw 36a and a protrusion 36c that contacts the lower surface of the head of the screw 36a inserted into the threaded hole 36b. The height of the protrusion 36c is greater than the thickness of the first engaging portion 53c and the second engaging portion 54d (see reference). Figure 6 , Figure 8 Large. When screw 36a is screwed into threaded hole 36b, the screw seat surface will abut against protrusion 36c, thus preventing further screwing. Protrusion 36c allows for precise determination of the height from the upper surface of pin block 30 to screw seat surface.

[0090] The pin block 30 has a displacement suppression part 80, which suppresses the cover 50 from moving in the sliding direction when the first engaging part 53c and the second engaging part 54d are engaged with the engaging part 36, thus preventing the cover 50 from falling off.

[0091] Although one example of the implementation method has been described, the application of the present invention is not limited to the above-described method, but rather the constituent elements can be appropriately added, omitted, or modified.

[0092] Furthermore, the disclosure of this embodiment can be summarized as follows.

[0093] The present invention provides an IC inspection socket comprising: a pin having a contact probe array; a guide plate guiding an IC package to be inspected toward the contact probe array; and a cover having a locking portion that engages with the pin and presses the guide plate by engaging the locking portion. The pin has: a support portion that supports the guide plate in a detachable manner; and a locked portion, wherein the locking portion engages with the locked portion by sliding the cover on the guide plate supported by the support portion.

[0094] According to this method, the cover is not fixed to the pin block with screws; the guide plate can be removed simply by sliding the cover. Therefore, the task of replacing the guide plate becomes easier when inspecting IC packages with different package shapes.

[0095] Alternatively, the support portion may elastically support the guide plate in a direction opposite to the direction in which the cover presses down on the guide plate.

[0096] In this situation, the cover becomes difficult to move in the direction that connects the cover to the guide plate.

[0097] Alternatively, the cover may have a recess that contacts the opposite surface of the guide plate, the recess being sized to allow it to slide along the direction of the sliding movement on the opposite surface.

[0098] In this case, the cover can also slide smoothly on the guide plate during the sliding movement.

[0099] Alternatively, the engaging portion may be a shaft with a head, and the cover may have an insertion portion for the shaft to pass through at a position continuous with the engaging portion, wherein the engaging portion engages with the lower surface of the head.

[0100] In this situation, the cover becomes difficult to move in the direction that connects the cover to the guide plate.

[0101] Alternatively, the shaft may be a screw, and the pin block may have a threaded hole corresponding to the screw and a protrusion that contacts the lower surface of the head of the screw inserted into the threaded hole, the height of the protrusion being greater than the thickness of the engaging portion.

[0102] In this situation, the cover becomes difficult to move in the direction that connects the cover to the guide plate.

[0103] Alternatively, the pin block may have a displacement suppression part that suppresses the cover from displacing in the sliding direction when the engaging part is engaged with the locked part.

[0104] In this case, the cover becomes difficult to move in the direction of sliding movement.

[0105] Explanation of reference numerals in the attached figures

[0106] 5… Inspection device

[0107] 9…Inspect the IC package

[0108] 10…IC Test Socket

[0109] 12…Socket body

[0110] 30… Pin blocks

[0111] 32…accommodating recess

[0112] 36… was stuck in the middle.

[0113] 36a… screw

[0114] 36b… threaded hole

[0115] 36c…protrusion

[0116] 40…guideboard

[0117] 48…Guiding surface

[0118] 49… Positioning Department

[0119] 50…cover

[0120] 52… Relative concave portion

[0121] 53…First Fixed Part

[0122] 53c…First Card Combination Part

[0123] 54…Second Fixing Part

[0124] 54b…Intersection

[0125] 54d…Second Card Combination

[0126] 60…Contact Probe Array

[0127] 70… Support section

[0128] 80… Displacement suppression section.

Claims

1. A socket for IC testing, characterized in that, have: Pin block, which has a contact probe array; A guide board, which guides the IC package to be inspected toward the contact probe array; and The cover has a locking portion that engages with the pin block, and the guide plate is pressed down by the engagement of this locking portion. The pin block has: A support portion that detachably supports the guide plate; and The engaging portion engages with the cover by causing the cover to slide on the guide plate supported by the support portion. The cover has a recess that contacts the opposite surface of the guide plate. The recess is sized such that it can slide along the direction of the sliding movement on the opposite surface. The recesses are recessed on the upper surfaces of both ends of the guide plate in the direction of sliding movement, and are located on both sides of the window portion of the cover in the direction of sliding movement.

2. The IC testing socket according to claim 1, characterized in that, The support portion elastically supports the guide plate in a direction opposite to the direction in which the cover presses down on the guide plate.

3. The IC testing socket according to claim 1, characterized in that, The engaging part is a shaft with a head. The cover has an insertion portion for the shaft to pass through at a position continuous with the engaging portion. The engaging portion engages with the lower surface of the head.

4. The IC testing socket according to claim 3, characterized in that, The shaft is a screw. The pin block has: The threaded hole corresponding to the screw; and A protrusion that contacts the lower surface of the head of the screw inserted into the threaded hole. The height of the protrusion is greater than the thickness of the engaging portion.

5. A socket for IC testing, characterized in that, have: Pin block, which has a contact probe array; A guide board, which guides the IC package to be inspected toward the contact probe array; and The cover has a locking portion that engages with the pin block, and the guide plate is pressed down by the engagement of this locking portion. The pin block has: A support portion that detachably supports the guide plate; The engaging portion engages with the cover by sliding it on the guide plate supported by the support portion; and The displacement suppression part suppresses bidirectional upward displacement of the cover in the sliding movement direction when the engaging part is engaged with the locked part. The displacement suppression part has a suppression elastic part that elastically protrudes upward compared to the upper surface of the pin block. The damping elastic part has a force-applied component that is subjected to upward force by a spring.

6. The IC testing socket according to claim 5, characterized in that, The support portion elastically supports the guide plate in a direction opposite to the direction in which the cover presses down on the guide plate.

7. The IC testing socket according to claim 5, characterized in that, The engaging part is a shaft with a head. The cover has an insertion portion for the shaft to pass through at a position continuous with the engaging portion. The engaging portion engages with the lower surface of the head.

8. The IC testing socket according to claim 7, characterized in that, The shaft is a screw. The pin block has: The threaded hole corresponding to the screw; and A protrusion that contacts the lower surface of the head of the screw inserted into the threaded hole. The height of the protrusion is greater than the thickness of the engaging portion.

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