LED display structure, display module and LED display screen

Abstract

The present invention relates to an LED display structure, a display module and an LED display. The LED display structure includes a PCB lamp board and several all-in-one LED lamp beads; the all-in-one LED lamp beads include at least four LED pixels, and the LED pixels include: an R chip, a G chip and a B chip. In the all-in-one LED lamp bead, the common pole has at least four PIN pins at the vertical upper and lower edges of the LED lamp bead; including at least two LED pixels in the horizontal direction; the polarity PIN pins of the R chip, the G chip and the B chip of the at least two LED pixels in the horizontal direction are close to the two edges of the LED lamp bead; the two LED pixels in the horizontal direction do not share the RGB polarity. By completing the entire routing of the row power supply and the column signal on the lamp surface of the PCB lamp board in the TOP-type packaged LED, the purpose of PCB layer reduction and order reduction is achieved. By designing the internal connection method of the PIN pins of the all-in-one lamp bead, the difficulty of PCB lamp board design can be effectively reduced, and the uniformity and consistency of its display can be greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED display structures, and in particular to an LED display structure, a display module and an LED display screen. Background Art

[0002] LED lamp beads in the prior art are usually provided with 4 pins, namely R, G, B and C pins, where R, G, B pins correspond to R chip, G chip, B chip respectively, and C pin is a row signal pin. In the circuit layout of 1PCB board, there will be circuits that cross each other horizontally and vertically. In view of the intersection between the horizontal row signals between several C pins and the vertical color signals formed by several R, G, B pins, a technical solution of multi-layer PCB structure is required to reasonably solve the circuit layout.

[0003] Existing all-in-one packaged Mini LED lamp beads, such as four-in-one lamp beads, can be compatible with single lamp packages by setting 16 pins. For example, the four-in-one LED lamp bead package with a P1.25 spacing. This package uses a designed PCB lamp board, which can be mounted with SMD lamp beads or four-in-one LED lamp beads.

[0004] Existing all-in-one packaged Mini LED lamp beads, such as four-in-one lamp beads, can also share the common pole of the two horizontal left and right LED lamp beads, and the two vertical upper and lower LED lamp beads share R / G / B. In this way, for 2x2LED pixels, only 8 pins are needed to realize the individual control of each LED pixel.

[0005] The above-mentioned prior art common level can arrange multiple pins. For example, the first row of horizontal LED pixels can have two PIN pins in the common pole, and the vertical upper and lower LED pixels can share the RGB pin. In this way, the horizontal and vertical intersections will inevitably occur in the PCB circuit layout. Therefore, only LED lamp beads using CHIP packaging can achieve the requirements of the circuit layout in the prior art. Since the lamp beads using TOP packaging have a bowl-cup structure, the chip is encapsulated in the center of the bowl, and the LED lamp beads are set at the top to emit light. In addition, the electrode copper sheet in the TOP lamp bead is stamped from a whole piece of copper sheet, has multiple polarities, and cannot be crossed. Therefore, the lamp beads using TOP packaging cannot achieve the prior art solution in which the horizontal and vertical intersections appear in the PCB circuit layout, resulting in an increase in the number of PCB layers, which is not conducive to heat dissipation, affecting the display effect of large high-definition LED display screens, and affecting its uniformity, consistency and component life. The multi-layer PCB structure also brings difficulties to punching. Due to the different specifications of vias, the cost of large-scale small-pitch LED display screens for high-definition display remains high, and the display effect encounters technical bottlenecks. Summary of the invention

[0006] Based on this, it is necessary to provide an LED display structure and an LED display screen to address the problems of existing LED lamp beads, LED display structures and LED display screens.

[0007] An embodiment of the present application provides an LED display structure, wherein the LED display structure includes:

[0008] PCB light board, a plurality of all-in-one LED lamp beads; the all-in-one LED lamp beads include at least four LED pixels, the LED pixels include: an R chip, a G chip, and a B chip, the R chip is used to emit red light; the G chip is used to emit green light; the B chip is used to emit blue light; at least four LED pixels, at least two LED pixels are arranged in sequence horizontally, and at least two LED pixels are arranged in sequence vertically;

[0009] The all-in-one LED lamp bead includes at least two vertical LED pixels; the at least two vertical LED pixels share a common pole, the common pole has at least two common pole PIN pins on the upper edge of the LED lamp bead, and at least two common pole PIN pins on the lower edge; the number of common pole PIN pins on the upper edge is equal to the number of common pole PIN pins on the lower edge;

[0010] The multi-in-one LED lamp bead includes at least two LED pixels in the horizontal direction; the polarity PIN pins of the R chip, G chip, and B chip of the at least two LED pixels in the horizontal direction are arranged close to the left and right edges of the LED lamp bead; the two LED pixels in the horizontal direction do not share the RGB polarity.

[0011] The PCB lamp board has two end faces, a plurality of the all-in-one LED lamp beads are arranged on one end face of the PCB lamp board, and an IC is arranged on the other end face, and the end face arranged with the IC is the IC end face.

[0012] Preferably, the horizontal direction includes at least two LED pixels, and the R chip, G chip and B chip of the LED pixels are reversely bonded;

[0013] Preferably, a plurality of the LED lamp beads are arranged in an array on the lamp surface of the PCB lamp board, and the wiring of the PCB lamp board adopts horizontal wiring, and the wiring is used to lay out RGB signal lines;

[0014] Preferably, the row power supply has incomplete wiring, and the incomplete wiring connects the common poles corresponding to the upper and lower two LED lamp beads.

[0015] Preferably, the polarity PIN pins of each of the LED lamp bead R chip, G chip, and B chip are connected through the horizontal lines of the PCB lamp board;

[0016] The vertical common pole of each LED lamp bead and the row power supply are not completely wired, and only the common pole wiring between the LED lamp beads is required to allow the current to pass through the vertically directly connected common pole inside each LED lamp bead.

[0017] Preferably, black pigment is coated or sprayed on the end faces of some of the LED lamp beads and in some of the gaps of the LED lamp beads to increase the contrast; specifically, the black pigment includes but is not limited to black iron oxide, copper chromium black, iron chromium black, cobalt black, aniline black, and antimony sulfide.

[0018] Preferably, nanomaterials are sprayed or vapor deposited on the end faces where the LED lamp beads are located and on the outer surfaces of some of the LED lamp beads to prevent moisture; specifically, nanomaterials include but are not limited to inorganic silicates, active silicon dioxide, polyvinyl acetate emulsion, potassium silicate, lithium silicate, and potassium titanate.

[0019] Preferably, a graphene thermal conductive film is mounted or sprayed on the IC end face where the R chip, G chip and B chip of the LED lamp bead are located, so as to accelerate the heat dissipation of the IC.

[0020] Preferably, there are gaps between the LED pixels and between the LED lamp beads, and the gaps include rectangular grooves, triangular grooves or trapezoidal grooves.

[0021] Preferably, in some of the LED pixels, the R chip is a vertical structure chip; and the G chip and the B chip include flip-chip structure chips.

[0022] Preferably, in some of the LED pixels, the R chip is a flip-chip vertical structure chip; the G chip and the B chip are face-up structure chips.

[0023] In some embodiments, an LED display module is further provided, and the LED display module includes the LED display structure described in any one of the above embodiments.

[0024] In some embodiments, an LED display screen is further provided, and the LED display screen includes the LED display structure described in any one of the above embodiments.

[0025] In the LED display structure and LED display screen provided by the embodiment of the present application, by realizing the complete routing of row power supply and column signal on the lamp surface of the PCB lamp board in the TOP-type packaged LED, the purpose of PCB layer reduction and order reduction is achieved, and the PCB cost of high-density products is effectively reduced. In the multi-in-one LED lamp bead of the present application, the R chip, G chip, and B chip will not share a PIN pin output; the PIN pin of the common pole will have two PIN pin outputs. By setting different PIN pins on the LED lamp bead, the difficulty of PCB layout is effectively reduced, the number of PCB layers is reduced, and the PCB cost is reduced. By designing the internal connection method of the PIN pin of the multi-in-one lamp bead, the difficulty of PCB lamp board design can be effectively reduced. This four-in-one LED lamp bead PCB circuit layout scheme has the advantages of more convenient PCB wiring. By designing the PCB lamp board, the number of PCB layers can be reduced, the cost can be reduced, and heat dissipation can be facilitated, so that the display effect of the large-scale high-definition LED display screen is more prominent, and its display uniformity and consistency are greatly improved. It also has the beneficial effect of increasing the service life of all electronic components of the LED display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of an LED lamp bead according to an embodiment of the present application;

[0027] Figure 2 It is a partial schematic diagram of the LED display structure of several LED lamp beads according to an embodiment of the present application;

[0028] Figure 3a This is a schematic diagram of the structure of the rectangular grooves between several LED lamp beads according to an embodiment of the present application;

[0029] Figure 3b This is a schematic diagram of the structure of the triangular grooves between several LED lamp beads according to an embodiment of the present application;

[0030] Figure 3c This is a schematic diagram of the structure of the trapezoidal grooves between several LED lamp beads according to an embodiment of the present application;

[0031] Figure 4 A schematic diagram of a structure in which the R chip of an embodiment of the present application is a vertical structure chip, and the G chip and the B chip are flip chips;

[0032] Figure 5 This is a schematic structural diagram of an embodiment of the present application in which the R chip is a vertical structure chip, and the G chip and the B chip are upright chips. DETAILED DESCRIPTION

[0033] In order to more clearly understand the above-mentioned objectives, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0035] like Figure 1 As shown, an embodiment of the present application discloses an LED lamp bead, an LED display structure and an LED display screen, including a plurality of all-in-one LED lamp beads; the all-in-one LED lamp bead 14 includes at least four LED pixels 11, and the LED pixels 11 include: an R chip 10a, a G chip 10b, and a B chip 10c, wherein the R chip 10a is used to emit red light; the G chip 10b is used to emit green light; and the B chip 10c is used to emit blue light; at least four LED pixels 11 are arranged in sequence in a horizontal direction with at least two LED pixels 11 arranged in sequence in a vertical direction, and at least two LED pixels 11 are arranged in an array on the all-in-one LED lamp bead 14;

[0036] The multi-in-one LED lamp bead 14 includes at least two LED pixels 11 in the vertical direction; the at least two LED pixels 11 in the vertical direction share a common pole, and the common pole has at least four common pole PIN pins 12 at the upper and lower edges of the LED lamp bead 14; the vertical direction can also be expressed as up and down;

[0037] The multi-in-one LED lamp bead 14 includes at least two LED pixels 11 in the horizontal direction; the polarity PIN pins 13 of the R chip 10a, G chip 10b, and B chip 10c of the at least two LED pixels 11 in the horizontal direction are close to the two edges of the LED lamp bead; the two LED pixels 11 in the horizontal direction do not share the RGB polarity; the horizontal direction can also be expressed as left and right. The PCB lamp board 15a, 15b, and 15c have two end surfaces (reference Figure 1 , Figure 2 and Figure 3a-3c ), a plurality of the multi-in-one LED lamp beads 14 are arranged on one end surface of the PCB lamp boards 15a, 15b, 15c, and an IC is arranged on the other end surface.

[0038] In some embodiments, the at least two LED pixels 11 in the horizontal direction, the R chip 10a, the G chip 10b, and the B chip 10c are reversely die-bonded.

[0039] In some other optional embodiments, the chip in the LED pixel 11 is electrically connected to the common pole PIN pin and the polarity PIN pin through the pads 1 and 2 respectively.

[0040] In some embodiments, on the lamp surface of the PCB lamp board, the at least two LED pixels 11 are horizontally wired, and the wiring is to lay RGB signal lines.

[0041] like Figure 1 and Figure 2 As shown, in some embodiments, the lamp surface of the PCB lamp board, the at least two vertical LED lamp beads 14, adopt a vertically arranged row power supply, the row power supply has incomplete wiring, and the incomplete wiring connects the common pole PIN feet 25 corresponding to the upper and lower two LED lamp beads 14.

[0042] In some embodiments, the polarity PIN pins 13, 23 and 33 of the R chip 10a, the G chip 10b and the B chip 10c of each of the LED lamp beads 14 are connected through the horizontal lines of the PCB lamp board.

[0043] In some embodiments, the vertical common pole PIN pin 25 of each LED lamp bead 14 and the row power supply are not completely wired so that the current passes through the vertically directly connected common pole inside each LED lamp bead 14 .

[0044] Specifically, by applying this embodiment of the present invention, the circuit layout design and process optimization of some of the LED lamp beads are carried out, which has the beneficial effect of effectively reducing the number of circuit layers of the PCB lamp board and reducing the PCB cost without increasing the material cost of the LED lamp beads.

[0045] In some embodiments, black pigment is coated or sprayed on the end faces where some of the LED lamp beads 14 are located and in the gaps of some of the LED lamp beads 14 to increase the contrast. Specifically, the black pigment includes but is not limited to iron oxide black, copper chrome black, iron chrome black, cobalt black, aniline black, and antimony sulfide.

[0046] Specifically, by applying this embodiment of the present invention, it has the beneficial effect of greatly improving the display uniformity and contrast of the LED display screen and improving the display effect of the LED display screen.

[0047] In some embodiments, nanomaterials are sprayed or vapor deposited on the end surface where the LED lamp beads 14 are located, and on the outer surfaces of some of the LED lamp beads 14, for moisture resistance. Specifically, nanomaterials include but are not limited to inorganic silicates, active silicon dioxide, polyvinyl acetate emulsion, potassium silicate, lithium silicate, and potassium titanate.

[0048] Specifically, by applying this embodiment of the present invention, it has the beneficial effect of greatly improving the moisture-proof ability and moisture-proof level of the LED display screen, and improving the safety and life of various electronic components of the LED display screen.

[0049] In some embodiments, on the IC end surface where the R chip 10a, the G chip 10b, and the B chip 10c of the LED lamp bead 14 are located, a graphene thermal conductive film is mounted or sprayed on the IC surface to accelerate the heat dissipation of the IC.

[0050] Specifically, by applying this embodiment of the present invention, the heat on the surface of the IC with locally higher heat is more uniform, which solves the display color cast problem caused by wavelength drift of the lamp beads due to IC overheating, thereby greatly improving the uniformity and consistency of the LED display screen, especially improving the display effect of large-scale high-definition LED display screens.

[0051] like Figure 2 and 3a As shown in -3c, in some embodiments, there are gaps between the LED pixels 11a and between the LED lamp beads 14a, 14b, 14c, and the gaps include rectangular grooves 16a, triangular grooves 16b or trapezoidal grooves 16c;

[0052] like Figure 4 As shown, in some embodiments, in the LED lamp bead 24, in some of the LED pixels 21, the R chip 20a is a vertical structure chip; the G chip 20b and the B chip 20c are flip-chip structure chips, wherein the G chip 20b and the B chip 20c are fixed on the bracket 22.

[0053] like Figure 5 As shown, in some embodiments, in the LED lamp bead 34 , in some of the LED pixels 31 , the R chip 30a is a vertical structure chip; the G chip 30b and the B chip 30c are upright structure chips, and the G chip 30b and the B chip 30c are fixed on the bracket 32 ​​.

[0054] It can be understood that, in some embodiments, an LED display module is further provided, and the LED display module includes the LED display structure described in any one of the embodiments of the present application.

[0055] It can be understood that, in some embodiments, an LED display screen is further provided, and the LED display screen includes the LED display structure described in any one of the embodiments of the present application.

[0056] In the several specific embodiments provided by the present invention, it should be understood that the disclosed systems and methods can be implemented in other ways. For example, the system implementation described above is only illustrative, for example, the division of the components is only a logical function division, and there may be other division methods in actual implementation.

[0057] In addition, each functional module / component in each embodiment of the present invention may be integrated into the same processing module / component, or each module / component may exist physically separately, or two or more modules / components may be integrated into the same module / component. The above-mentioned integrated modules / components may be implemented in the form of hardware or in the form of hardware plus software functional modules / components.

[0058] It is obvious to those skilled in the art that the embodiments of the present invention are not limited to the details of the above exemplary embodiments, and that the embodiments of the present invention can be implemented in other specific forms without departing from the spirit or basic features of the embodiments of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the embodiments of the present invention is limited by the attached claims rather than the above description, so it is intended to include all changes that fall within the meaning and scope of the equivalent elements of the claims in the embodiments of the present invention. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is obvious that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units, modules or devices stated in the system, device or terminal claims can also be implemented by the same unit, module or device through software or hardware. The words first, second, etc. are used to indicate names, and do not indicate any particular order.

[0059] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An LED display structure, characterized in that: The LED display structure includes: A plurality of LED lamp beads and a PCB lamp board, wherein the PCB lamp board has two end faces, the LED lamp beads are arranged on one end face of the PCB lamp board, and an IC is arranged on the other end face, and the end face on which the IC is arranged is the IC end face; The LED lamp beads include at least two vertical LED chip groups and at least two horizontal LED chip groups, and the LED chip groups include an R chip, a G chip, and a B chip. The R chip is used to emit red light; the G chip is used to emit green light; and the B chip is used to emit blue light. The at least two vertical LED chip groups share a common pole, and the common pole has at least two common pole PIN pins on the upper edge of the LED lamp bead and at least two common pole PIN pins on the lower edge; the number of common pole PIN pins on the upper edge is equal to the number of common pole PIN pins on the lower edge; the polarity PIN pins of the R chip, G chip, and B chip of the at least two horizontal LED chip groups are arranged close to the left and right edges of the LED lamp bead; the two horizontal LED chip groups do not share the RGB polarity; the R chip, G chip, and B chip of the LED chip group are reversely bonded; the LED lamp beads are arranged in an array on the lamp surface of the PCB lamp board, and the wiring of the PCB lamp board adopts horizontal wiring, and the wiring is used to lay RGB signal lines; On the lamp surface of the PCB lamp board, a row power supply is arranged vertically, and the row power supply is incompletely wired, and the incomplete wiring connects the common poles corresponding to the upper and lower two LED lamp beads; The polarity PIN pins of the R chip, G chip, and B chip of each LED chip group must be connected through the horizontal lines of the PCB light board; The vertical common pole of each LED lamp bead and the row power supply are not fully wired, and only the common pole wiring between the LED lamp beads is required to allow current to pass through the vertically directly connected common pole inside each LED lamp bead; black pigment is coated or sprayed on the end faces of some of the LED lamp beads and in some of the gaps of the LED lamp beads to increase the contrast; nanomaterials are sprayed or vapor deposited on the end faces where the LED lamp beads are located and on the outer surfaces of some of the LED lamp beads to prevent moisture; a graphene thermal conductive film is mounted or sprayed on the end faces of the IC where the R chip, G chip, and B chip are located to accelerate the heat dissipation of the IC; there are gaps between some of the LED chip groups and between some of the LED lamp beads, and the gaps include rectangular grooves, triangular grooves, or trapezoidal grooves.

2. The LED display structure according to claim 1, characterized in that: In some of the LED chip groups, the R chip is a vertical structure chip; the G chip and the B chip include flip-chip structure chips.

3. The LED display structure according to claim 1, characterized in that: In some of the LED chip groups, the R chip is a flip-chip vertical structure chip; the G chip and the B chip are face-up structure chips.

4. An LED display module, characterized in that: The LED display module comprises the LED display structure according to any one of claims 1 to 3.

5. An LED display screen, characterized in that: The LED display screen comprises the LED display structure according to any one of claims 1 to 3.

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