Electronic devices

Abstract

The present application discloses an electronic device, belonging to the technical field of equipment. The electronic device comprises: a first bracket and a second bracket arranged opposite to each other, a circuit board, a speaker unit and an enclosure component located between the first bracket and the second bracket; the circuit board has a first notch, and the speaker unit is arranged in the first notch; the enclosure component is arranged around the first notch, and the enclosure component is sealed and connected with the first bracket, the second bracket and the circuit board; the first bracket, the second bracket, the circuit board and the enclosure component enclose the sound cavity of the speaker unit.

Description

Technical Field

[0001] The present application belongs to the field of equipment technology, and specifically relates to an electronic device. Background Art

[0002] At present, the sound cavity of a speaker unit (such as a speaker unit of an upper speaker unit) of an electronic device can be enclosed by a circuit board, such as a printed circuit board (PCB) and two circuit board covers arranged on both sides of the circuit board.

[0003] Specifically, a through hole for the speaker unit to pass through is provided in the area of ​​the circuit board facing the speaker unit, and two circuit board covers are respectively pressed and sealed with the circuit boards through sealing foam, so that the circuit board and the two circuit board covers arranged on both sides of the circuit board enclose the sound cavity of the speaker unit.

[0004] In this way, since the two circuit board covers are respectively pressed and sealed with the PCB board through the sealing foam, the sound outlet channel of the speaker unit is longer, resulting in poor electroacoustic performance of the speaker unit in the electronic device. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide an electronic device that can solve the problem of poor electroacoustic performance of a speaker unit in the electronic device due to a long sound output channel of the speaker unit.

[0006] An embodiment of the present application provides an electronic device, comprising: a first bracket and a second bracket arranged opposite to each other, a circuit board, a speaker unit and an enclosure component located between the first bracket and the second bracket; the circuit board has a first notch, and the speaker unit is arranged in the first notch; the enclosure component is arranged around the first notch, and the enclosure component is sealed and connected to the first bracket, the second bracket and the circuit board; the first bracket, the second bracket, the circuit board and the enclosure component enclose a sound cavity of the speaker unit.

[0007] In the embodiment of the present application, a first notch is provided on the circuit board, and the speaker unit is provided in the first notch, so that the speaker can be close to the edge of the circuit board, thereby shortening the sound output channel of the speaker unit, thereby improving the electroacoustic performance of the speaker unit in the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is one of the structural schematic diagrams of the electronic device provided in the embodiment of the present application;

[0009] Figure 2 is a schematic diagram of the structure of a sound outlet in an electronic device provided in an embodiment of the present application;

[0010] Figure 3is a schematic diagram comparing a circuit board in an electronic device provided in an embodiment of the present application with a circuit board in a related art;

[0011] Figure 4 This is the second structural diagram of the electronic device provided in the embodiment of the present application;

[0012] Figure 5 This is the third structural diagram of the electronic device provided in the embodiment of the present application;

[0013] Figure 6 This is the fourth structural diagram of the electronic device provided in the embodiment of the present application;

[0014] Figure 7 This is the fifth structural diagram of the electronic device provided in the embodiment of the present application;

[0015] Figure 8 This is the sixth structural diagram of the electronic device provided in the embodiment of the present application;

[0016] Fig. 9 This is the seventh structural diagram of the electronic device provided in the embodiment of the present application;

[0017] Fig.10 This is the eighth structural diagram of the electronic device provided in the embodiment of the present application;

[0018] Fig.11 This is a ninth structural diagram of an electronic device provided in an embodiment of the present application;

[0019] Fig.12 This is the tenth structural diagram of the electronic device provided in the embodiment of the present application;

[0020] Fig.13 is a schematic diagram of a first sealing structure in an electronic device provided in an embodiment of the present application;

[0021] in, Figures 1 to 13 The reference numerals in the figures are as follows:

[0022] 10-electronic device; 11-first bracket; 12-second bracket; 13-first enclosure; 14-second enclosure; 141-side opening of the second enclosure; 15-transition support foot; 151-extension portion; 152-vertical plate; 16-circuit board; 161-first notch; 17-speaker unit; 18-first sealing structure; 19-first gap; 20-second sealing structure; 201-sealing rib; 22-third sealing structure; 23-target sealing ring; 24-sound outlet; 25-enclosure assembly; 26-side wall of the frame. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0024] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0025] The electronic device provided in the embodiment of the present application is described in detail below through specific embodiments and application scenarios in conjunction with the accompanying drawings.

[0026] The present application embodiment provides an electronic device, Figure 1 A possible structural diagram of an electronic device provided in an embodiment of the present application is shown. Figure 1 As shown, the electronic device provided by the embodiment of the present application includes: a first bracket 11 and a second bracket 12 arranged opposite to each other, a circuit board 16, a speaker unit 17 and an enclosure component 25 located between the first bracket 11 and the second bracket 12. The circuit board 16 has a first notch 161, and the speaker unit 17 is arranged in the first notch 161; the enclosure component 25 is arranged around the first notch 161, and the enclosure component 25 is sealed and connected with the first bracket 11, the second bracket 12 and the circuit board 16; the first bracket 11, the second bracket 12, the circuit board 16 and the enclosure component enclose the sound cavity of the speaker unit 17.

[0027] Alternatively, if Figure 1 As shown, the circuit board 16 may be a main circuit board in an electronic device, and the circuit board may be a printed circuit board, or other possible circuit boards, which are not limited here.

[0028] In the embodiment of the present application, the enclosure assembly constitutes the side walls of the sound cavity, and the first bracket and the second bracket constitute the top wall and the bottom wall of the sound cavity.

[0029] The first bracket, the enclosure component and the circuit board form a first accommodating cavity, and the second bracket, the enclosure component and the circuit board form a second accommodating cavity; the first notch on the circuit board enables the first accommodating cavity to communicate with the second accommodating cavity.

[0030] It should be noted that the axis of the sound outlet of the speaker unit is parallel to the circuit board.

[0031] In the embodiment of the present application, compared with the solution of setting a through hole on the circuit board in the related art, the solution of setting a first notch on the circuit board in the embodiment of the present application removes the pressed narrow edge on the circuit board, so that the speaker unit can be set close to the edge of the circuit board. In this way, the length of the sound outlet hole of the speaker unit can be shortened, which can also be called the length of the sound outlet channel.

[0032] Optionally, the speaker unit may be disposed on the first bracket, or the speaker unit may be disposed on the second bracket.

[0033] It should be noted that for the speaker unit, when the speaker unit does not change, the main factors affecting the external sound effect of the speaker unit are the cavity volume of the speaker unit and the length of the sound output channel. The larger the sound cavity volume and the shorter the sound output channel, the better the electroacoustic performance.

[0034] Alternatively, if Figure 1 As shown, the enclosure assembly 25 may include: a first enclosure panel 13 , a second enclosure panel 14 and a transition support leg 15 .

[0035] The first enclosure 13 is disposed between the first bracket 11 and the circuit board 16, and the two ends of the first enclosure 13 are sealed and connected to the first bracket 11 and the circuit board 16. The second enclosure 14 is disposed between the second bracket 12 and the circuit board 16, and the two ends of the second enclosure 14 are sealed and connected to the second bracket 12 and the circuit board 16. The first enclosure 13 and the second enclosure 14 both have side openings facing the same direction as the first notch 161. The side of the transition leg 15 is sealed and connected to the side opening of the first enclosure 13, the side opening of the second enclosure 14 and the circuit board 16, and the two ends of the transition leg 15 are sealed and connected to the first bracket 11 and the second bracket 12.

[0036] The first notch 161 is located inside the projection area of ​​the first enclosure 13 and the second enclosure 14 on the circuit board 16 .

[0037] It can be understood that the shape of the projection area of ​​the first enclosure and the second enclosure in the embodiment of the present application on the circuit board can be any possible shape such as a "concave" shape, or a major arc (i.e., an arc greater than 180°).

[0038] In actual implementation, the shapes of the projection areas of the first enclosure and the second enclosure on the circuit board may be the same as the shape of the first notch.

[0039] In the embodiment of the present application, "the first notch is located on the inner side of the projection area of ​​the first enclosure and the second enclosure on the circuit board", thereby: it can be ensured that the first notch can connect the first accommodating cavity and the second accommodating cavity.

[0040] In the embodiment of the present application, "the transition support foot is sealedly connected to the side opening of the first enclosure and the side opening of the second enclosure" can be understood as: the side portion of the transition support foot is sealedly connected to the outer wall at the side opening of the first enclosure and the outer wall at the side opening of the first enclosure.

[0041] For example, Figure 2 As shown, the transition support foot 15 is integrally formed with the outer wall of the side opening of the second enclosure panel 14 .

[0042] Alternatively, if Figure 2 As shown, the second enclosure 14, the transition support leg 15 and the second bracket 12 can be formed in one piece.

[0043] In the embodiment of the present application, the transition support leg extends beyond the second enclosure plate, that is, the height of the transition support leg is greater than the height of the second enclosure plate.

[0044] Optionally, the first enclosure panel and the first bracket may be integrally formed.

[0045] Optionally, the height of the transition foot may be equal to the sum of the height of the first enclosure panel and the height of the second enclosure panel.

[0046] It should be noted that, in the embodiment of the present application, the height of a component (such as a transition leg) in the electronic device refers to the maximum dimension of the component along the line (such as a vertical line) connecting the first bracket and the circuit board.

[0047] In the embodiment of the present application, the height of the speaker unit is greater than the height of the first enclosure and the height of the second enclosure.

[0048] In the embodiment of the present application, both the first enclosure and the second enclosure have side openings facing the same direction as the first notch, thereby ensuring that the side of the transition leg can be sealed and connected to the circuit board (specifically the side wall of the circuit board).

[0049] In addition, both the first enclosure panel and the second enclosure panel have side openings, and the orientation of the side opening of the first enclosure panel and the side opening of the second enclosure panel is the same as the orientation of the first notch, both facing the transition foot, so that there is no need to reserve a narrow edge for pressing in the area of ​​the circuit board close to the transition foot, which provides a guarantee for setting the first notch on the circuit board.

[0050] It can be understood that in the embodiments of the present application, Figure 3 As shown, Figure 3 (a) is a schematic diagram of the layout of the speaker unit and the circuit board in the related art. Figure 3 As shown in (a), a pressed narrow edge is provided on the circuit board 16' in the related art, so that the distance between the speaker unit and the edge of the circuit board is at least greater than the width of the pressed narrow edge; Figure 3(b) is a schematic diagram of the layout of the speaker unit and the circuit board in the embodiment of the present application. It can be seen that: 1. The speaker unit in the electronic device provided in the embodiment of the present application can be arranged closer to the edge of the circuit board 16, so that the length of the sound output channel of the speaker unit can be shortened. 2. In the related art, the fabric space near the pressed narrow edge of the circuit board is small in size, resulting in a very low utilization rate. In this way, when the fabric demand remains unchanged, the related art requires increasing the effective fabric area of ​​the circuit board, which is conducive to the thinning of the electronic device. In the embodiment of the present application, since the circuit board does not need to reserve a pressed narrow edge, the part of the circuit board away from the first notch can have more layout space, so that the layout of the electronic components on the circuit board can be optimized, which is conducive to the thinning of the electronic device.

[0051] Optionally, Figure 4 FIG. 1 is a possible structural diagram of the transition support leg 15. Figure 4 As shown, the transition foot 15 includes oppositely arranged extensions 151 and a vertical plate 152 arranged between the two extensions 151 and perpendicular to the two extensions 151. The side of the transition foot 15 is composed of the two extensions. Since the transition foot includes the vertical plate, it can be ensured that the first bracket, the second bracket, the circuit board and the enclosure assembly can enclose a sealed cavity (i.e., a sound cavity).

[0052] Optionally, the side portion of the transition leg extends into the first notch 161 and is sealed and connected to the circuit board 16 .

[0053] It can be understood that in the embodiment of the present application, the side portion of the transition leg is specifically sealed and connected to the side wall of the circuit board corresponding to the first notch.

[0054] In the embodiment of the present application, since the side of the transition leg extends into the first notch and is sealed with the circuit board, the contact area between the transition leg and the circuit board can be increased, thereby improving the sealing reliability.

[0055] In the electronic device provided in the embodiment of the present application, a first notch is provided on the circuit board, and the speaker unit is provided in the first notch, so that the speaker can be close to the edge of the circuit board, thereby shortening the sound output channel of the speaker unit. In this way, the electroacoustic performance of the speaker unit in the electronic device can be improved.

[0056] Optionally, the electronic device may further include: a frame. The first bracket, the second bracket, the circuit board, the speaker unit and the enclosure component are arranged in the frame. Figure 1 As shown, the transition support 15 is arranged on the side wall 26 of the frame, and the sound cavity is enclosed by the first bracket 11, the second bracket 12, the circuit board 13, the enclosure component 25 and the side wall 26 of the frame.

[0057] Specifically, when the transition foot is disposed on the side wall of the frame, the transition foot may only include two extensions disposed opposite to each other, and the two extensions are directly disposed on the side wall of the frame. In this way, the first bracket, the second bracket, the circuit board, the enclosure assembly, and the side wall of the frame enclose the sound cavity of the speaker unit. In this way, since there is no need to set up a vertical plate, it can be ensured that the speaker unit can be disposed as close to the frame as possible, thereby shortening the size of the sound outlet channel of the speaker unit.

[0058] Further optionally, the side wall of the frame body close to the surface of the enclosure assembly may be subjected to a settlement treatment so that the portion subjected to the settlement treatment may be sealed and connected to the first bracket.

[0059] Optionally, the transition support leg and the frame body can be integrally formed. Alternatively, the transition support leg, the second enclosure plate and the frame body can be integrally formed.

[0060] In the embodiment of the present application, the sound cavity is enclosed by the first bracket, the second bracket, the circuit board, the enclosure assembly and the side walls of the frame, which can ensure that the speaker unit can be in direct contact with the side walls of the frame, thereby minimizing the size of the sound output channel of the speaker unit.

[0061] Alternatively, if Figure 2 As shown, the sound outlet 24 of the speaker is disposed on the side wall 26 of the frame, and the sound outlet 24 is parallel to the circuit board 16 .

[0062] Alternatively, if Figure 1 , Figure 5 , Figures 6 to 9 , Fig.11 and Fig.12 As shown, the electronic device 10 may further include: a first sealing structure 18, the first sealing structure 18 is in a step shape. The first sealing structure 18 may include a first sub-sealing ring, a second sub-sealing ring and two first climbing arms; the first sub-sealing ring and the second sub-sealing ring have openings facing each other, and the two ends of each first climbing arm are respectively connected to the first sub-sealing ring and the second sub-sealing ring.

[0063] Among them, the first sub-sealing ring is arranged between one end of the transition support foot 15 and the first bracket 11; the two first climbing arms are arranged between the side of the transition support foot 15 and the first enclosure 13, and the second sub-sealing ring is arranged between the first enclosure 13 and the circuit board 16.

[0064] It can be understood that in the embodiment of the present application, the two first climbing arms do not cross each other, so that the first sub-sealing ring, the second sub-sealing ring and the two first climbing arms form a step-shaped sealing ring.

[0065] In the embodiment of the present application, “two first climbing arms are arranged between the side of the transition support foot and the first enclosure” can be understood as that the two first climbing arms are arranged between the side of the transition support foot and the outer wall of the side opening of the first enclosure.

[0066] In the embodiment of the present application, the first climbing arm is perpendicular to the first sub-sealing ring and the second sub-sealing ring.

[0067] It can be understood that in the embodiment of the present application, the size of the second sub-sealing ring matches the size of the projection area of ​​the first enclosure on the circuit board.

[0068] Optionally, the material of the first sealing structure may be sealing foam or silicone.

[0069] Alternatively, if Fig.13 As shown, a sealing rib 201 is provided on the surface of the first sealing structure 18 facing away from the first bracket 11. This can avoid eccentricity errors between the first sealing structure and the second sealing structure during assembly, thereby further improving the sealing performance of the sound cavity in the electronic device.

[0070] In the embodiment of the present application, since the first sealing structure is step-shaped, that is, one sealing structure can be used to simultaneously achieve the sealing of the first enclosure and the transition support foot, and the transition support foot and the first bracket member, thereby reducing the sealing error and improving the sealing performance.

[0071] Alternatively, if Figure 1 , Figures 5 to 9 As shown, the electronic device 10 may further include: a target sealing ring 23 that matches the projection area of ​​the second enclosure 14 on the circuit board 16, and the target sealing ring 23 is arranged between the top surface of the second enclosure 14 and the bottom surface of the circuit board 16, so as to achieve sealing between the second enclosure 14 and the circuit board 16.

[0072] It can be seen that the target sealing ring has an opening, which matches the side opening of the second enclosure plate. Specifically, the opening of the target sealing ring and the side opening of the second enclosure plate have the same orientation and size.

[0073] Optionally, the target sealing ring may be made of sealing foam or silicone.

[0074] Alternatively, if Figure 5 As shown, when the first sealing structure 18 is used, a first gap 19 may exist between the circuit board 16 and the transition leg 15. The embodiment of the present application may adopt two possible implementations (ie, one possible implementation and another possible implementation described below) to achieve sealing of the first gap.

[0075] In a possible implementation, the electronic device may further include: a second sealing structure. The second sealing structure seals the first gap between the circuit board and the transition leg.

[0076] The second sealing structure is described in detail below.

[0077] Optionally, method 1, such as Figure 6 and Figure 7 As shown, the second sealing structure 20 may include: a first arm and a second arm intersecting each other; the first arm is arranged on the surface of the circuit board 16 facing the second enclosure 14, and the second arm is arranged between the circuit board 16 and the side of the transition leg 15, and between the first climbing arm and the side of the transition leg 15, so as to seal the first gap 19. In this way, the second sealing structure can not only seal the first gap between the circuit board and the transition leg, but also improve the sealing reliability because the first arm is attached to the surface of the circuit board facing the second enclosure.

[0078] Specifically, the first arm is connected to the second arm, and there is an angle between the first arm and the second arm, for example, 90°.

[0079] It can be seen that the first support arm and the second support arm are L-shaped. It can be understood that the second sealing structure having the first support arm and the second support arm can also be called an L-shaped sealing bracket.

[0080] It can be understood that in the embodiment of the present application, a portion of the second arm is located between the circuit board and the side of the transition foot, and another portion of the second arm is located between the first climbing arm and the transition foot.

[0081] Optionally, the first arm may be specifically arranged between the target sealing ring and the circuit board.

[0082] Optionally, the second support arm and the first climbing arm are interference fit, so that a gap between the first sealing structure and the second sealing structure can be avoided, thereby increasing the sealing performance of the sound cavity.

[0083] In the embodiment of the present application, since the first arm can be fitted with the bottom surface of the circuit board, the first arm fills the first gap between the circuit board and the side of the transition leg. Therefore, it can not only achieve sealing between the circuit board and the side of the transition leg, but also increase the connection strength of the second sealing structure and improve the sealing reliability.

[0084] Optionally, method 2, Figure 8 and Fig. 9 As shown, the second sealing structure 2020 may include a third arm and a fourth arm that are arranged opposite to each other, and a connecting arm that is arranged between the third arm and the fourth arm.

[0085] The third support arm and the fourth support arm are respectively arranged on opposite surfaces of the circuit board 16 , and the connecting arm is arranged between the circuit board 16 and the transition support leg 15 .

[0086] Optionally, assuming that the third arm is disposed on the surface of the circuit board facing the first enclosure, the second arm is disposed on the surface of the circuit board facing the second enclosure, and the connecting arm is disposed in the first gap (ie, the connecting arm fills the first gap).

[0087] It can be seen that the second sealing structure is clamped on the circuit board.

[0088] It can be understood that in the embodiment of the present application, the third arm can be arranged between the second sub-sealing ring and the circuit board, and have an interference fit with the second sub-sealing ring; the fourth arm can be arranged between the circuit board and the second enclosure plate, and have an interference fit with the target sealing ring.

[0089] In the embodiment of the present application, since the third arm and the fourth arm of the second sealing structure are respectively attached to two opposite surfaces of the circuit board, and the connecting arm of the second sealing structure fills the first gap between the circuit board and the transition leg, the sealing reliability between the circuit board and the transition leg can be improved.

[0090] In an embodiment of the present application, in the above-mentioned method 1 and method 2, the number of second sealing structures is 2, and the two first sealing structures are arranged on both sides of the first notch. For example, the two second sealing structures are arranged in the area adjacent to the circuit board and the first notch.

[0091] In the above-mentioned method 1 and method 2, there may be a gap between the first sealing structure and the second sealing structure.

[0092] For example, Figure 7 As shown, when the second sealing structure 20 includes a first branch arm and a second branch arm intersecting each other, the corner between the first sealing structure 18 and the second sealing structure 20, that is, between the second branch arm and the first climbing arm, specifically, Figure 7 There may be gaps in the area shown by the dotted box A in FIG.

[0093] For example, Fig. 9 As shown, when the second sealing structure 20 includes the third arm, the fourth arm and the connecting arm, the corner between the first sealing structure 18 and the second sealing structure 20, that is, between the third arm and the first climbing arm, is specifically Fig. 9 There may be gaps in the area shown in the dotted box B.

[0094] In order to seal the gap between the first sealing structure and the second sealing structure, the electronic device provided in the embodiment of the present application may further include: a first adhesive member. The first adhesive member is filled in the gap between the first sealing structure and the second sealing structure.

[0095] For example, Fig.10 As shown, the first sealing structure 18 and the second sealing structure 20 may correspond to each other. Fig.10 Dispense glue in the area indicated by the arrow.

[0096] Optionally, the first adhesive member may be glue, that is, glue may be dispensed at the gap between the first sealing structure and the second sealing structure to seal the gap between the first sealing structure and the second sealing structure.

[0097] In the embodiment of the present application, since the gap between the first sealing structure and the second sealing structure can be sealed by the first sealing member, the sealing performance of the sound cavity of the speaker can be further improved.

[0098] Optionally, in mode 3, the second sealing structure 20 may include: a second adhesive member; the second adhesive member is filled in Figure 5 The circuit board 16 and the transition leg 15 are shown in the first gap 19 .

[0099] Optionally, the first adhesive member may be glue, that is, glue may be dispensed directly at the gap between the circuit board and the transition leg to achieve sealing between the circuit board and the transition leg.

[0100] In the embodiment of the present application, since the gap between the circuit board and the transition support can be bonded by the first adhesive, not only the sealing performance of the sound cavity in the electronic device can be improved, but also the difficulty of assembling the electronic device can be reduced.

[0101] In another possible implementation, Fig.12 As shown, the electronic device 10 may further include: a third sealing structure 22, which is in a step shape. The third sealing structure 22 may include a third sub-sealing ring, a fourth sub-sealing ring, and two second climbing arms disposed between the third sub-sealing ring and the fourth sub-sealing ring;

[0102] The third sub-sealing ring and the fourth sub-sealing ring have openings facing each other, and both ends of each second climbing arm are respectively connected to the third sub-sealing ring and the fourth sub-sealing ring.

[0103] Among them, the third sub-sealing ring is arranged between one end of the transition support foot 15 and the first sub-sealing ring, and the third sub-sealing ring is interference fit with the first sub-sealing ring, and the fourth sub-sealing ring is arranged between the second enclosure 14 and the circuit board 16; the two second climbing arms are arranged between the side of the transition support foot 15 and the circuit board 16, and between the side of the transition support foot 15 and the first climbing arm, and the second climbing arm is interference fit with the first climbing arm.

[0104] It can be understood that in the embodiment of the present application, the fourth sub-seal ring is equivalent to the target seal ring in the above embodiment. That is, in another possible implementation, two second climbing arms are respectively provided at the opening of the fourth sub-seal ring, and connected to the third sub-seal ring through the two second climbing arms to form a third sealing structure.

[0105] Further optionally, a sealing rib may be provided on the surface of the third sealing structure facing the first bracket, so as to avoid eccentricity error between the first sealing structure and the second sealing structure during assembly, thereby further improving the sealing performance of the sound cavity in the electronic device.

[0106] It can be understood that the sealing ribs on the third sealing structure and the sealing ribs on the first sealing structure can be arranged alternately, so that the first sealing structure and the third sealing structure can be engaged together through their respective sealing ribs.

[0107] For other descriptions of the third sealing structure, please refer to the relevant descriptions in the above embodiments.

[0108] In the embodiment of the present application, since the third sealing structure can seal the first gap between the circuit board and the side of the transition support while sealing the second enclosure and the circuit board, another possible implementation method can reduce the number of sealing structures, thereby avoiding the introduction of new installation errors (such as the gap between the first sealing structure and the second structure).

[0109] The electronic device provided in the embodiments of the present application is exemplarily described below.

[0110] In one possible implementation, Figure 6 and Figure 7 As shown, the speaker unit 17 is moved up to the side edge (i.e., the side wall) close to the frame, the pressed narrow edge at the corresponding position of the PCB board (i.e., the circuit board 16) is removed, and the side wall 26 of the frame is used as a gap for the transition leg 15 to extend into the PCB board; the first sealing structure 18 is made of silicone material, and the first sub-sealing ring in the first sealing structure 18 is pressed on the transition leg 15, and the second sub-sealing ring is pressed on the PCB board; an L-shaped silicone (i.e., the second sealing structure 20) is pasted on the step difference between the transition leg 15 and the PCB board, one side of the L-shaped silicone is pasted on the back of the PCB board, and the other side is climbed and pasted along the side (i.e., the side) of the transition leg 15 (in fact, it can be climbed and pasted along the first climbing arm) to fill the gap between the transition leg 15 and the PCB board; then the corners between the first sealing structure 18 and the second sealing structure 20 are sealed by dispensing glue to ensure a good sealing effect.

[0111] In one possible implementation, Figure 8 and Fig. 9As shown, the speaker unit 17 is moved up to the side edge (i.e., the side wall) close to the frame, the pressed narrow edge at the corresponding position of the PCB board (i.e., the circuit board 16) is removed, and the side wall 26 of the frame is used as a transition leg 15 to extend into the gap of the PCB board; the first sealing structure 18 is made of silicone material, and the first sub-sealing ring in the first sealing structure 18 is pressed on the transition leg 15, and the second sub-sealing ring is pressed on the PCB board; a U-shaped silicone clip (i.e., the second sealing structure 20) is pasted on the discontinuity portion (i.e., the first gap 19) between the first sealing structure 18 and the PCB board, and the two long sides of the U-shaped silicone clip (i.e., the third arm and the fourth arm) are respectively pasted on the two sides of the PCB board, and the side edge (i.e., the connecting arm) of the U-shaped silicone clip is used to fill the gap between the transition leg 15 and the PCB board; then the corner between the first sealing structure 18 and the U-shaped silicone clip is sealed by dispensing glue to ensure that the sound cavity has a good sealing effect.

[0112] In one possible implementation, Figure 5 As shown, the speaker unit 17 is moved up to the side edge (i.e., the side wall) close to the frame, the pressed narrow edge at the corresponding position of the PCB board (i.e., the circuit board 16) is removed, and the side wall 26 of the frame is used as a transition leg 15 to extend into the gap of the PCB board; the first sealing structure 18 is made of silicone material, and the first sub-sealing ring in the first sealing structure 18 is pressed on the transition leg 15, the second sub-sealing ring is pressed on the PCB board, and the gap between the transition leg 15 and the PCB board (i.e., the first gap 19) is sealed by glue. Since the pressed narrow edge on the PCB is eliminated, the speaker unit 17 can be moved toward the frame, shortening the sound output channel and optimizing the PCB layout; at the same time, due to the adaptability of the silicone gasket (i.e., the first sealing structure 18) to glue sealing, the gap that is difficult to seal by interference fit at the original gap can be filled by glue to ensure the sealing of the entire upward cavity, and the interference fit of the silicone gasket at the non-break can also have a good sealing effect.

[0113] In another possible implementation, Fig.11 and Fig.12 As shown, the speaker unit 17 is moved up to the side edge (i.e., side wall) close to the frame, the pressed narrow edge at the corresponding position of the PCB board (i.e., circuit board 16) is removed, and the side wall 26 of the frame is used as a transition leg 15 to extend into the gap of the PCB board; the first sealing structure 18 is made of silicone material, and the first sub-sealing ring in the first sealing structure 18 is pressed between the transition leg 15 and the first bracket 11, and the second sub-sealing ring is pressed between the PCB board and the first enclosure 13;

[0114] The sealing foam (i.e., the target sealing ring 23) between the second bracket and the second enclosure 14 is changed into a stepped third sealing structure 22. The lower half of the third sealing structure 22 (i.e., the fourth sub-sealing ring) is laid between the second enclosure 14 and the PCB board, and the upper half of the third sealing structure 22 (i.e., the third sub-sealing ring) is laid at the break of the transition leg 15. Specifically, the third sub-sealing ring is arranged between one end of the transition leg 15 and the first sub-sealing ring, and the third sub-sealing ring is interference fit with the first sub-sealing ring.

[0115] Furthermore, a sealing convex rib 201 is provided on the surface of the first sealing structure 18 facing away from the first bracket 11. At this time, the sealing of the step difference between the transition leg 15 and the PCB board is completed by the interference fit of the first sealing structure 18 made of silicone material and the third sealing structure 22 made of sealing foam material. Both are soft structures, which can ensure the fit and sealing of the step difference and the corner of the transition leg 15. At the same time, the convex rib on the first sealing structure 18 can avoid the eccentric error generated during the assembly of the first sealing structure 18 and the third sealing structure 22, resulting in poor sealing.

[0116] Optionally, the electronic device in the embodiment of the present application may be a mobile electronic device or a non-mobile electronic device. For example, the mobile electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc., and the non-mobile electronic device may be a personal computer (PC), a television (TV), an intelligent speaker, a teller machine, or a self-service machine, etc., which is not specifically limited in the embodiment of the present application.

[0117] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0118] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a computer software product, which is stored in a storage medium (such as ROM / RAM, a disk, or an optical disk), and includes a number of instructions for a terminal (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0119] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: include: A first bracket and a second bracket arranged opposite to each other, a circuit board, a speaker unit and an enclosure component located between the first bracket and the second bracket; The circuit board has a first notch, and the speaker unit is arranged in the first notch; The enclosure component is arranged around the first notch, and the enclosure component is sealed and connected to the first bracket, the second bracket and the circuit board; The first bracket, the second bracket, the circuit board and the enclosure component enclose a sound cavity of the speaker unit; The enclosure assembly comprises: a first enclosure panel, a second enclosure panel, a transition support leg and a first side wall; The first enclosure is disposed between the first bracket and the circuit board, and both ends of the first enclosure are sealed and connected to the first bracket and the circuit board; The second enclosure plate is disposed between the second bracket and the circuit board, and both ends of the second enclosure plate are sealedly connected to the second bracket and the circuit board; The first enclosure plate and the second enclosure plate both have a side opening facing the same direction as the first notch; The side portion of the transition leg is sealedly connected to the side opening of the first enclosure plate, the side opening of the second enclosure plate and the circuit board, and the two ends of the transition leg are sealedly connected to the first bracket and the second bracket; Wherein, the first notch is located on the inner side of the projection area of ​​the first enclosure panel and the second enclosure panel on the circuit board.

2. The electronic device according to claim 1, characterized in that: The side portion of the transition leg extends into the first notch and is sealed and connected to the circuit board.

3. The electronic device according to claim 2, characterized in that: Also includes: Frame; The first bracket, the second bracket, the circuit board, the speaker unit and the enclosure component are arranged in the frame; Wherein, the transition support is arranged on the side wall of the frame, and the sound cavity is enclosed by the first bracket, the second bracket, the circuit board, the enclosure component and the side wall of the frame.

4. The electronic device according to claim 1, characterized in that: Also includes: A first sealing structure, wherein the first sealing structure is in a step shape; The first sealing structure includes a first sub-sealing ring, a second sub-sealing ring and two first climbing arms arranged between the first sub-sealing ring and the second sub-sealing ring; The first sub-sealing ring and the second sub-sealing ring have openings facing each other, and two ends of each of the first climbing arms are respectively connected to the first sub-sealing ring and the second sub-sealing ring; Among them, the first sub-sealing ring is arranged between one end of the transition support foot and the first bracket, the two first climbing arms are arranged between the side of the transition support foot and the first enclosure, and the second sub-sealing ring is arranged between the first enclosure and the circuit board.

5. The electronic device according to claim 4, characterized in that: A sealing rib is arranged on a surface of the first sealing structure facing away from the first bracket.

6. The electronic device according to claim 4, characterized in that: Also includes: The second sealing structure seals a first gap between the side of the transition leg and the circuit board.

7. The electronic device according to claim 6, characterized in that: The second sealing structure comprises: a first arm and a second arm intersecting each other; The first support arm is arranged on the surface of the circuit board facing the second enclosure plate, and the second support arm is arranged between the side of the transition support foot and the circuit board, and between the side of the transition support foot and the first climbing arm to seal the first gap.

8. The electronic device according to claim 6, characterized in that: The second sealing structure comprises: a third arm and a fourth arm arranged opposite to each other, and a connecting arm arranged between the third arm and the fourth arm; The third arm and the fourth arm are respectively arranged on opposite surfaces of the circuit board, and the connecting arm is arranged in the first gap.

9. The electronic device according to any one of claims 6 to 7, characterized in that: Also includes: The first adhesive is filled in the gap between the first sealing structure and the second sealing structure.

10. The electronic device according to claim 6, characterized in that: The second sealing structure includes: a second adhesive member filled in the first gap.

11. The electronic device according to claim 4, characterized in that: Also includes: a third sealing structure, wherein the third sealing structure is in a step shape; The third sealing structure includes a third sub-sealing ring, a fourth sub-sealing ring and two second climbing arms arranged between the third sub-sealing ring and the fourth sub-sealing ring; The third sub-sealing ring and the fourth sub-sealing ring have openings facing each other, and both ends of each second climbing arm are connected to the third sub-sealing ring and the fourth sub-sealing ring respectively; Wherein, the third sub-sealing ring is arranged between one end of the transition support foot and the first sub-sealing ring, and the third sub-sealing ring is interference fit with the first sub-sealing ring, and the fourth sub-sealing ring is arranged between the second enclosure plate and the circuit board; the two second climbing arms are arranged between the side of the transition support foot and the circuit board, and between the side of the transition support foot and the first climbing arm, and the second climbing arm is interference fit with the first climbing arm.

12. The electronic device according to claim 1, characterized in that: The speaker unit is arranged on the second bracket.

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