mold device

Abstract

A strain sensor (54) for detecting the operating state of the mold, an amplifier (55) for amplifying the detection signal of the strain sensor (54), a wireless communication section (57) for transmitting the detection signal from the amplifier (55) as a transmission signal, and a battery (B) are provided in the fixed cavity (22) of the mold device (10). The mold device (10) has a clearance transmission path (27, 28) formed in the cavity (22) and the fixed mold (20) and transmitting the transmission signal from the amplifier (55) to an external device separate from the mold.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a mold device. BACKGROUND

[0002] In the past, various sensors are provided in a mold device, and detection signals of the sensors at the time of manufacturing of a cast product and a molded product of synthetic resin manufactured by the mold device are input to a management device or the like provided outside the mold device (Patent Documents 1 to 4).

[0003] In Patent Document 1, sensors are provided in a mold, and detection signals of the sensors are sent out to an amplifier unit provided on a side surface of the mold via a cable in the mold. Further, the amplifier unit sends out these detection signals to a server-side system via a gateway and the Internet.

[0004] In Patent Document 2, sensors are also provided in a mold insert, and each detection signal of the sensors is sent out to a transmitter module provided on a side surface of the mold insert via a cable in the mold. A receiver module provided on a base plate is provided opposite to the transmitter module, and is connected to an evaluation device via a connector.

[0005] In Patent Document 3, a linear sensor, a temperature sensor, and a sound sensor are provided in a mold, and detection signals of these sensors are output to a communication unit provided on an outer surface of the mold via a cable provided in the mold. Further, the detection signals are sent out from the communication unit to a controller via a wireless LAN.

[0006] In Patent Document 4, the content in which a pressure sensor is provided in a cavity is disclosed.

[0007] PRIOR ART DOCUMENTS

[0008] PATENT DOCUMENTS

[0009] Patent Document 1: Japanese Patent Application Publication No. 2018-128876

[0010] Patent Document 2: Japanese Patent Application Publication No. 2011-500375

[0011] Patent Document 3: Japanese Patent No. 5800289

[0012] Patent Document 4: Japanese Patent Application Publication No. H3-169520 SUMMARY

[0013] PROBLEMS TO BE SOLVED BY THE INVENTION

[0014] However, in the above Patent Literature 1 to Patent Literature 4, various sensors are arranged in the mold, and detection signals are electrically connected to an amplifier unit, a transmitter module, a communication unit, or the like external device provided outside the mold via a cable. However, in the case of a wired connection, there is a concern of disconnection. In addition, in the case of changing the mold, if it is wired, the step of connecting the cable extending from the sensor side arranged in the mold and the cable extending from the external device side needs to be performed again, and there is a problem of being time-consuming and laborious.

[0015] An object of the present disclosure is to provide a mold device that can transmit detection signals of sensors arranged in a mold to an external device without using a wired connection, without causing disconnection, and can smoothly perform a step when changing the mold.

[0016] Means for solving the problem

[0017] A mold device of one embodiment of the present disclosure includes a mold, a circuit portion including a sensor that detects an operation state or an environmental state of the mold, an amplifier that amplifies a detection signal of the sensor, and a wireless transmitter that transmits the detection signal from the amplifier as a transmission signal, and a battery that supplies power to the circuit portion, wherein the circuit portion and the battery are covered with the mold or an accessory member of the mold, at least one of the mold and the accessory member has a clearance transmission path that transmits the transmission signal to an external device separate from the mold or the accessory member.

[0018] According to the above structure, the detection signal of the sensor is amplified by the amplifier and output to the wireless transmitter, and the transmission signal from the wireless transmitter is transmitted to the external device via the clearance transmission path by wireless. As a result, the detection signal of the sensor can be transmitted to the external device without using a wired connection. In addition, according to the above structure, since a wired connection is not used, disconnection and wiring errors do not occur. In addition, the wireless transmitter covered with the mold or the accessory member does not interfere with the manufacturing of a molded product and the like.

[0019] In addition, at least two of the sensor, the amplifier, the wireless transmitter, and the battery can be integrated.

[0020] According to the above structure, at least two of the sensor, the amplifier, the wireless transmitter, and the battery are integrated, and thus can be easily assembled to the mold or the accessory member.

[0021] In addition, the detection signal can be an analog signal, and an AD converter that converts the analog signal to a digital signal can be provided between the amplifier and the wireless transmitter.

[0022] According to the above structure, the detection signal as an analog signal is converted into a digital signal resistant to noise by the AD converter. Also, the external device can receive the transmission signal as a digital signal. Thus, the external device can be transmitted with the transmission signal resistant to noise.

[0023] In addition, at least two of the sensor, the amplifier, the AD converter, the wireless transmission unit, and the battery can be integrated.

[0024] According to the above structure, at least two of the sensor, the amplifier, the AD converter, the wireless transmission unit, and the battery are integrated, so that the assembly to the mold or the auxiliary member is facilitated.

[0025] In addition, it is preferable that the void transmission path be configured such that a shape of a cross section orthogonal to an extending direction thereof is a quadrangle having long sides and short sides orthogonal to each other or a shape that can be inscribed at least in the quadrangle, and when a length of the long side is set as a and a wavelength of the transmission signal is set as λ, a ≥ λ / 4.

[0026] According to the above structure, the transmission signal from the wireless transmission unit can be favorably transmitted to the external device separate from the mold.

[0027] In addition, it is preferable that the void transmission path include a first transmission path, a bent portion, and a second transmission path connected to the first transmission path via the bent portion, and the bent portion be bent such that a bending angle θ of the second transmission path with respect to the first transmission path on a virtual plane including the long side is |θ| ≤ 90°.

[0028] According to the above structure, the bent portion is bent such that the bending angle θ of the second transmission path with respect to the first transmission path on the virtual plane including the long side is |θ| ≤ 90°, so that in the void transmission path having the bent portion, the transmission signal from the wireless transmission unit can be favorably transmitted to the external device separate from the mold.

[0029] In addition, the mold can include a fixed mold and a movable mold, and the mold device can further include an ejector pin provided to either one of the fixed mold and the movable mold and configured to push out a molded product formed in a cavity of the mold from a wall surface of the cavity at mold opening, and a pressing member configured to press an ejector seat provided to a base end of the ejector pin at the mold opening, the pressing member being the auxiliary member, the circuit unit being covered by the pressing member, and the void transmission path being provided to the pressing member.

[0030] According to the above structure, by providing the gap transmission path in the pressing member, the detection signal of the sensor can be transmitted to the external device without using a wire, and since a wire is not used, wire breakage and wiring errors do not occur. Further, the wireless transmission portion covered by the attached member does not interfere with the manufacturing of the molded product and the like.

[0031] Further, the sensor included in the circuit portion can be integrated with the pressing pin, and the remaining components included in the circuit portion can be housed in a housing provided in parallel with the pressing seat and formed thinner than the thickness of the pressing seat.

[0032] As described above, the remaining components included in the circuit portion other than the sensor are housed in the housing formed thinner than the thickness of the pressing seat, and thus the pressing member can press the pressing pin through the pressing seat while avoiding the housing.

[0033] Effects of Invention

[0034] According to one embodiment of the present disclosure, the following effects can be achieved: the detection signal of the sensor disposed in the mold can be transmitted to the external device without using a wire, wire breakage does not occur, and the steps when changing the mold can be smoothly performed. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 (a) of FIG. 1 is a main part schematic cross-sectional view of a mold device of a first embodiment, (b) is an A-A line cross-sectional view of (a), (c) is a bottom view of a gap transmission path, and (d) is an electrical block diagram from a sensor to a wireless communication portion.

[0036] Figure 2 (a) of FIG. 2 is a main part schematic cross-sectional view of a mold device of a second embodiment, (b) is a B-B line cross-sectional view of (a), and (c) is a bottom view of a gap transmission path.

[0037] Figure 3 (a) of FIG. 3 is a main part schematic cross-sectional view of a mold device of a third embodiment, (b) is a C-C line cross-sectional view of (c), and (c) is a bottom view of a gap transmission path viewed from the bottom surface side of a cavity.

[0038] Figure 4 (a) of FIG. 4 is a bottom view of a gap transmission path of a comparative example.

[0039] Figure 5 (a) of FIG. 5 is a main part schematic cross-sectional view of a mold device at the time of closing the mold in a fourth embodiment.

[0040] Figure 6 (a) of FIG. 6 is a schematic explanatory view of a movable mold of the fourth embodiment viewed from the side, and (b) is a schematic explanatory view of the same movable mold viewed from the pressing plate side.

[0041] Figure 7 Fig. 4 is a schematic cross-sectional view of a main part of a mold device at the time of mold opening in the fourth embodiment.

[0042] Figure 8 Fig. 5 is a schematic cross-sectional view of a main part of a mold device showing a pressing operation of a press pin in the fourth embodiment.

[0043] Figure 9 Fig. 6 is a schematic perspective view of (a) a press pin and a housing of a circuit portion, and (b) a press pin omitting a housing.

[0044] Figure 10 Fig. 7 is a schematic cross-sectional view of a main part of a mold device at the time of mold closing in the fifth embodiment.

[0045] Figure 11 Fig. 8 is a schematic explanatory view of a configuration of a press pin of the fifth embodiment, viewed from a press plate 122 side. DETAILED DESCRIPTION

[0046] (First Embodiment)

[0047] Reference Signs Figure 1 (a) to Figure 1 (d), a mold device of the first embodiment will be described. The mold device of the present embodiment is a mold device used in injection molding of synthetic resin.

[0048] As shown in Figure 1 (a), the mold device 10 is provided with a stationary mold 20 and a movable mold 30. The stationary mold 20 and the movable mold 30 have: fixed main molds 21 and movable main molds 31 fixed to a stationary mold plate and a movable mold plate, not shown; and fixed cavities 22 and movable cavities 32 respectively fitted to receiving recesses 21a, 31a of the fixed main molds 21 and the movable main molds 31.

[0049] The fixed cavities 22 and the movable cavities 32 are roughly formed in a rectangular parallelepiped, and recesses 22a, 32a for cavity formation are formed in mutually opposed faces of the fixed cavities 22 and the movable cavities 32. When the stationary mold 20 and the movable mold 30 are closed, as shown in Figure 1 (a), a cavity 40 is formed by the recesses 22a, 32a of the fixed cavities 22 and the movable cavities 32. The fixed cavities 22 and the movable cavities 32, the fixed main molds 21 and the movable main molds 31 correspond to a mold.

[0050] At the time of closing the mold, the synthetic resin heated and melted is filled into the cavity 40 by being injected through a sprue not shown. When the synthetic resin filled into the cavity 40 cools and hardens, the movable mold 31 and the movable cavity 32 are demolded from the fixed mold 21 and the fixed cavity 22 at the time of opening the mold, and a molded product not shown formed in the cavity 40 is ejected by being pressed by a press pin not shown provided on the movable mold 30 side, so as to be taken out.

[0051] As shown in Figure 1 A sensor portion 50 is provided in the fixed cavity 22 as shown in (a). The sensor portion 50 is provided with a pin body 52 and a strain sensor 54. A receiving hole 24 is formed in the fixed cavity 22, one end of which is open to the cavity 40 and the other end of which extends to the bottom side of the fixed cavity 22. In addition, a receiving chamber 25 communicating with the receiving hole 24 is recessed in the bottom surface 22b of the fixed cavity 22.

[0052] The pin body 52 is inserted through the receiving hole 24 so as to be freely slidable in the axial direction. The pin body 52 is configured so that the end face of one end is exposed to the cavity 40 and the other end always abuts against the strain sensor 54 received in the receiving chamber 25. The pin body 52 is elastically pressed toward the cavity side by an elastic pressing member not shown such as a spring. When the synthetic resin heated and melted is filled into the cavity 40, the pin body 52 presses the strain sensor 54 according to the resin pressure thereof. The strain sensor 54 of the sensor portion 50 detects the resin pressure according to the pressing of the pin body 52. The resin pressure is a parameter that knows the operating state of the mold.

[0053] As shown in Figure 1 The strain sensor 54 is connected to a wireless communication portion 57 via an amplifier 55 and an AD converter 56 as shown in (d). The amplifier 55 amplifies an analog signal, that is, a detection signal, detected by the strain sensor 54. The AD converter 56 converts the detection signal into a digital signal and outputs it to the wireless communication portion 57. The wireless communication portion 57 transmits the digital signal as a transmission signal by wireless. The wireless communication portion 57 corresponds to a wireless transmission portion.

[0054] The amplifier 55, the AD converter 56, the wireless communication portion 57, and a battery B that supplies electric power to these are mounted on a common substrate not shown so as to be integrated and are received in a synthetic resin-made case 58 that is received in the receiving chamber 25. The synthetic resin-made case 58 can transmit the transmission signal of the wireless communication portion 57 to the outside. The battery B is, for example, a button cell, but is not limited to a button cell and can be another battery. In addition, the amplifier 55 is electrically connected to the strain sensor 54 via a lead wire not shown. In addition, the case 58 is provided with a communication hole 59 through which the transmission signal of the wireless communication portion 57 is transmitted to the outside. Figure 1 In (a), the substrate is not shown for the sake of convenience of explanation, and is illustrated in a state in which the inside of the case 58 is seen through.

[0055] The wireless communication section 57 corresponds to a wireless transmission section. In addition, the strain sensor 54, the amplifier 55, the AD converter 56, and the wireless communication section 57 correspond to a circuit section. The circuit section and the battery B are covered by the fixed cavity 22 and the fixed main mold 21.

[0056] As shown in Figure 1 (a) and Figure 1 (b), the bottom surface 22b of the fixed cavity 22 is a flat surface. A linearly extending groove 26a is formed in the bottom surface 22b. The extending direction of the groove 26a is orthogonal to the housing hole 24 and communicates with the housing chamber 25. The housing space of the housing recess 21a is partitioned by a quadrangular inner bottom surface 21b and four inner side surfaces 21c orthogonal to the inner bottom surface 21b.

[0057] In addition, the inner bottom surface 21b of the fixed main mold 21 is a flat surface. As shown in Figure 1 (b), the void transmission path 27 is partitioned by the inner bottom surface 21b and the groove 26a. In the void transmission path 27, a cross section orthogonal to the extending direction of the groove 26a is formed in a quadrangular shape, that is, a long rectangular shape. The long rectangular shape is a flat shape having a long side and a short side.

[0058] In the cross sectional shape of the void transmission path 27, when the length of the long side is a and the wavelength of the transmission signal is λ, a ≥ λ / 4 is satisfied. The length of the short side is not limited. For example, the short side can be very short with respect to the long side.

[0059] As shown in Figure 1 (a) and Figure 1 (c), the void transmission path 28 is formed in the fixed main mold 21, is located on the same line as the void transmission path 27, and communicates with the void transmission path 27. In the void transmission path 28, a cross section is formed in a quadrangular shape of a flat shape having a long side and a short side to form a cross section of the same shape as the void transmission path 27, and an outer end is open to the outside space of the mold device 10.

[0060] As shown in Figure 1 (d), the transmission signal transmitted by the wireless communication section 57 can communicate with the reception device 60 as an external device located in the outside space of the mold device 10 via the void transmission paths 27 and 28. The reception device 60 receives the transmission signal, that is, a detection signal, and saves data based on the detection signal as an action log or a tracking log in a recording device not shown as an external device.

[0061] (Action and effect of the embodiment)

[0062] In the present embodiment, the following action and effect are obtained.

[0063] (1) In the mold device 10 of the present embodiment, the strain sensor 54, the amplifier 55, the AD converter 56, and the wireless communication section 57 and the battery B included in the circuit section are covered by the fixed cavity 22 and the fixed main mold 21. Further, the fixed cavity 22 and the fixed main mold 21 have clearance transmission paths 27, 28 that transmit a transmission signal to a recording device separate from the fixed cavity 22 and the fixed main mold 21.

[0064] With the above structure, the transmission signal from the wireless communication section 57 is transmitted wirelessly via the clearance transmission paths 27, 28 to an external device separate from the mold. Therefore, the detection signal of the strain sensor 54 can be transmitted to an external device separate from the mold without using a wire. Further, according to the above structure, since a wire is not used, wire breakage and wiring errors do not occur. Further, the wireless transmission section covered by the mold or the auxiliary member does not interfere with the manufacturing of a molded product or work such as mold exchange.

[0065] Further, within the mold device, a cable and a power source for signal transmission between the sensor and the external device are not required, so the steps when changing the mold can be performed smoothly.

[0066] Further, according to the present embodiment, since the detection value detected by the strain sensor 54 can be saved as an action log or a tracking log in a not-shown log device provided outside the mold device 10, an external device does not need to be built in the mold device.

[0067] (2) In the present embodiment, the amplifier 55, the AD converter 56, the wireless communication section 57, and the battery B are mounted on a not-shown common substrate and integrated. As a result, the sensor, the amplifier, the AD converter, and the wireless transmission section that constitute the circuit section and the battery B are integrated, so they can be easily assembled to the mold.

[0068] (3) In the present embodiment, the detection signal is an analog signal, and the AD converter 56 that converts the analog signal to a digital signal is connected between the amplifier 55 and the wireless transmission section. With the above structure, the detection signal as an analog signal is converted to a digital signal that is resistant to noise by the AD converter 56. Further, the external device can receive the transmission signal as a digital signal. Thus, the transmission signal resistant to noise can be transmitted to the external device.

[0069] (4) In the present embodiment, the cross section of the clearance transmission path 27, 28 orthogonal to the direction in which it extends is a quadrangle having a long side and a short side orthogonal to each other. Further, when the length of the long side of the quadrangle is a and the wavelength of the transmission signal is λ, a≥λ / 4 is satisfied. With the above structure, the transmission signal from the wireless communication section 57 can be favorably transmitted to an external device separate from the mold.

[0070] <Experiment 1>

[0071] Next, the results of Test 1 in which the size of the clearance transmission path 27, 28 of the mold device 10 of the above structure and the output of the wireless communication section 57 were made the following values are shown.

[0072] Total transmission path length of the clearance transmission path 27, 28: 200 mm

[0073] Long side of the clearance transmission path 27, 28:

[0074] 25, 26, 27, 28, 29, 30, 31, 32, 33 mm

[0075] Short side of the clearance transmission path 27, 28: 5 mm

[0076] Wireless output of the wireless communication section 57: 2.5 mW

[0077] Frequency of the transmission signal of the wireless communication section 57: 2.4 GHz

[0078] Wavelength of the transmission signal of the wireless communication section 57: 124.9 mm

[0079] The reception device 60 was arranged 2000 mm apart in straight-line distance from the wireless communication section 57, and in the case of any long side, was measured at the same reception sensitivity.

[0080] The reception condition of the transmission signal from the wireless communication section 57 by the reception device 60 was as follows. In addition, the evaluation "X" in each value of the long side was that reception was not possible, "Δ" indicated reception in a state in which noise was superimposed and reception was unstable, and "O" indicated that reception could be stably received.

[0081] (Results of Test 1)

[0082] 25, 26, 27, 28, 29, 30, 31, 32, 33

[0083] XXXXX Δ Δ O O

[0084] From the above results, it was confirmed that in the case of the long side 32 mm, the long side

[0085] / 124.9 = 0.256 and the long side was 1 / 4 (= 0.25) or more of the wavelength, so wireless transmission was possible.

[0086] <Test 2>

[0087] Next, the results of Test 2 in which the size of the clearance transmission path 27, 28 of the mold device 10 of the above structure and the output of the wireless communication section 57 were made the following values are shown.

[0088] Total length of the gap transmission path 27, 28: 200 mm

[0089] Long side of the gap transmission path 27, 28:

[0090] 65, 68, 69, 70, 72, 74, 77, 78, 80, 82 mm

[0091] Short side of the gap transmission path 27, 28: 5 mm

[0092] Wireless output of the wireless communication section 57: 2.5 mW

[0093] Frequency of the transmission signal of the wireless communication section 57: 920 MHz

[0094] Wavelength of the transmission signal of the wireless communication section 57: 325.86 mm

[0095] The reception device 60 is arranged at a linear distance of 2000 mm from the wireless communication section 57, and in the case of any long side, it is measured at the same reception sensitivity. The reception condition of the transmission signal from the wireless communication section 57 by the reception device 60 is as follows.

[0096] (Result of Experiment 2)

[0097] 65, 68, 69, 70, 72, 74, 77, 78, 80, 82

[0098] XXXXX X X X

[0099] From the above results, it can be confirmed that in the case of the long side 82 mm, the long side

[0100] / 325.86 = 0.252 and the long side is 1 / 4 (= 0.25) or more of the wavelength, so wireless transmission can be performed.

[0101] (2nd Embodiment)

[0102] Next, the mold device 10 of the 2nd embodiment will be described with reference to Figure 2 (a) ~ Figure 2 (c). In addition, in the following embodiments including the present embodiment, regarding the same structure or equivalent configuration as the 1st embodiment, the same symbol is attached and the description thereof is omitted, and the structure different from the 1st embodiment is described.

[0103] The mold device 10 of the 1st embodiment has the gap transmission paths 27, 28, but the mold device 10 of the present embodiment has the gap transmission paths 27, 28A, 29 at a position different from the 1st embodiment, and the other structure is the same as that of the 1st embodiment.

[0104] The void transmission path 29 has a groove 26b. As shown in Figure 2 As shown in (a), the groove 26b is formed in one side surface of the fixed cavity 22 so as to extend from the inner bottom surface 21b side to the cavity 32 side. The void transmission path 29 is formed by being partitioned by the groove 26b and the inner side surface 21c of the accommodation recess 21a opposite to the groove 26b. One end of the groove 26b communicates with the cavity 25 side end of the groove 26a, and the other end is closed. A cross section orthogonal to the extending direction of the void transmission path 29 is a quadrangle having long sides and short sides orthogonal to each other, and has the same size as the quadrangle of the cross section of the void transmission path 27.

[0105] Further, the void transmission path 29 and the end portion of the void transmission path 27 are arranged so that the short sides of the two void transmission paths are included in a common virtual plane and orthogonal to each other. In addition, one end of the void transmission path 28A is arranged so as to communicate with the closed end of the void transmission path 29 in such a manner that the short sides of the two void transmission paths are included in a common virtual plane and orthogonal to each other. The outer end of the void transmission path 28A opens to the outside space of the mold 20.

[0106] (Action and effect of the embodiment)

[0107] In the present embodiment, the same action and effect as described in (1) to (3) in the first embodiment are also obtained.

[0108] (Third embodiment)

[0109] Next, the mold device 10 of the third embodiment will be described with reference to Figure 3 (a) to Figure 3 (c).

[0110] In the mold device 10 of the first embodiment, the void transmission paths 27 and 28 are provided, but in the mold device 10 of the present embodiment, the void transmission paths 27, 28B, and 33 are provided, which is different from the first embodiment, and the other structures are configured similarly to the first embodiment.

[0111] The void transmission path 33 has a groove 26c. As shown in Figure 3 (c), the groove 26c is formed in the bottom surface 22b of the fixed cavity 22, one end of which communicates with the groove 26a of the void transmission path 27 and the other end of which extends to the outer side surface of the fixed cavity 22 as an open end and is open. The void transmission path 33 is formed by being partitioned by the groove 26c and the inner bottom surface 21b of the accommodation recess 21a opposite to the groove 26c

[0112] A cross section orthogonal to the extending direction of the void transmission path 33 is a quadrangle having long sides and short sides orthogonal to each other, and has the same size as the quadrangle of the cross section of the void transmission path 27.

[0113] Also, the end portions of the gap transmission path 33 and the gap transmission path 27 are connected to each other such that the long sides of the two gap transmission paths are included in a common virtual plane, and in the present embodiment, as shown in (c), the bending angle |0| is made to be 90° or less. That is, the axis Oi of the gap transmission path 27 and the axis O2 of the gap transmission path 33 are connected with a bending angle |0|. With respect to 0, the case of bending in the counterclockwise direction is made to be "+", and the case of bending in the clockwise direction is made to be "-". Figure 3 (c) shown, to be a bending angle of |0|≤90°. That is, the axis Oi of the gap transmission path 27 and the axis O2 of the gap transmission path 33 are connected with a bending angle |0|. With respect to 0, the case of bending in the counterclockwise direction is made to be "+", and the case of bending in the clockwise direction is made to be "-".

[0114] Figure 4 (c) is a view of the gap transmission path as viewed from the bottom surface side of the cavity, and in this view, the bending direction of the gap transmission path 33 is such that the gap transmission path 33 bends in the counterclockwise direction with respect to the gap transmission path 27, but is not limited to bending in this direction, and can also bend in the opposite direction, the clockwise direction. Figure 3 (c) shown, to be a bending angle of |0|≤90°. That is, the axis Oi of the gap transmission path 27 and the axis O2 of the gap transmission path 33 are connected with a bending angle |0|. With respect to 0, the case of bending in the counterclockwise direction is made to be "+", and the case of bending in the clockwise direction is made to be "-".

[0115] Here, the portion at which the gap transmission path 33 and the gap transmission path 27 are connected to each other corresponds to a bending portion. Also, the gap transmission path 27 corresponds to the first gap transmission path on the side corresponding to the wireless transmission portion (the closer side), and the gap transmission path 33 corresponds to the second gap transmission path. Also, the gap transmission path 28B is disposed such that the direction of extension thereof and the direction of extension of the gap transmission path 33 are in the same direction, and is in communication with the opening end of the gap transmission path 33. Although not shown, the outer end of the gap transmission path 28B is open to the outside space of the mold 20.

[0116] (Action and effects of the embodiment)

[0117] In the present embodiment, the same action and effects as described in (1) to (3) in the first embodiment are also obtained, and the following action and effects are also obtained.

[0118] (1) In the present embodiment, the gap transmission path includes the gap transmission path 27, which is the first gap transmission path on the side corresponding to the wireless transmission portion (the closer side), and the gap transmission path 33, which is the second gap transmission path connected to the gap transmission path 27 via a bending portion. Also, the bending portion is bent such that the bending angle 0 of the gap transmission path 33 with respect to the gap transmission path 27 is |0|≤90° on a virtual plane including the long side.

[0119] With the above structure, in the gap transmission path having the bending portion, it is possible to transmit a transmission signal from the wireless communication portion 57, which is the wireless transmission portion, to an external device that is separate from the mold.

[0120] <Experiment 3>

[0121] Next, the results of Test 3 in which the size of the void transmission path 27, 33, 28B, the bending angle θ, and the output of the wireless communication section 57 of the mold device 10 described above were made the following values are shown.

[0122] Total transmission path length of the void transmission path 27, 33, 28B: 200 mm

[0123] Long side of the void transmission path 27, 33, 28B: 33 mm

[0124] Short side of the void transmission path 27, 33, 28B: 5 mm

[0125] Bending angle θ: 30°, 60°, 89°, 90°, 91°, 120°, 150°

[0126] Wireless output of the wireless communication section 57: 2.5 mW

[0127] Frequency of the transmission signal of the wireless communication section 57: 2.4 GHz

[0128] Wavelength of the transmission signal of the wireless communication section 57: 124.9 mm

[0129] The receiving device 60 was disposed 2000 mm apart in a straight line from the opening of the void transmission path 28B along the axial direction, and in the case of any bending angle, the reception sensitivity was measured to be the same.

[0130] The results of normal reception of the transmission signal from the wireless communication section 57 by the receiving device 60 are as follows. In addition, the evaluation "X" in each value of the long side means that reception is not possible, "0" indicates reception in an unstable state, and "0" indicates stable reception.

[0131] (Results of Test 3)

[0132] 30°, 60°, 89°, 90°, 91°, 120°, 150°

[0133] OOOOOOOXX

[0134] From the above results, it can be confirmed that wireless transmission is possible when the bending angle θ is |θ|≤ 90°.

[0135] (4th Embodiment)

[0136] Next, referring to Figures 5 to 9 , the die casting mold device of the 4th embodiment will be described. The die casting mold device has the same structure as the mold device for resin molding.

[0137] As Figure 5As shown, the die casting mold device 100 (hereinafter, referred to as the mold device 100) is provided with a fixed main mold 104 in which a fixed cavity 102 is installed, and a movable main mold 108 in which a movable cavity 106 is installed. The fixed main mold 104 and the movable main mold 108 are integrally fixed to a fixed plate 105 and a movable plate 118. The fixed cavity 102 and the fixed main mold 104 correspond to a stationary mold. The movable cavity 106 and the movable main mold 108 correspond to a movable mold.

[0138] At the time of closing the mold, a cavity 109 is formed between the fixed cavity 102 and the movable cavity 106 in the inside of the mold device 100. Further, molten metal pressed from a sleeve (not shown) provided to the fixed main mold 104 is injected into the cavity 109 through a molten metal passage (not shown). A space 112 is provided near the inner side of the movable cavity 106. In the space 112, a pressing plate 120, 122 as a pressing member in which a pressing pin 114, 116 is installed is accommodated. The pressing pin 114, 116 is composed of a metal such as steel. In addition, the pressing member is not limited to a plate, but can be a block. The pressing plate 120, 122 corresponds to an accessory member of the mold.

[0139] A plurality of the pressing pins 114, 116 are installed at right angles to the pressing plate 120, 122. The pressing pin 114, 116 is a pin for pressing a cast product as a molded product from the movable cavity 106 after casting.

[0140] As shown in Figure 5 The pressing plate 120, 122 is joined in an integrated manner in an overlapping state with the pressing seat 115, 117 to which the base end of the pressing pin 114, 116 is integrally joined being interposed therebetween. The diameter of the pressing seat 115, 117 is larger than that of the pressing pin 114, 116 and the pressing seat 115, 117 is formed in a low cylindrical shape.

[0141] As shown in Figure 9 (b), a receiving hole 114a is formed in the pressing pin 114 from the base end to the axial direction thereof. The receiving hole 114a communicates with a groove 115a which is recessed and extends in the radial direction on the bottom surface of the pressing seat 115.

[0142] A strain sensor 124 is accommodated in the receiving hole 114a and is fixed to be integrated with the pressing pin 114 by an adhesive. In the case where the pressing pin 114 is stretched and contracted in the axial direction according to the pressure applied to the top end, the strain sensor 124 integrated with the pressing pin 114 detects the pressure according to the amount of the stretching and contraction.

[0143] A synthetic resin-made housing 126 is integrally joined to the pressing seat 115 of the strain sensor 124. As shown in Figure 9(a) shown, the housing 126 accommodates an amplifier 155, an AD converter 156, a wireless communication section 157, and a substrate 154 on which a battery B is mounted. The housing 126 made of synthetic resin is capable of transmitting a transmission signal of the wireless communication section 157 to the outside. The strain sensor 124, the amplifier 155, the AD converter 156, and the wireless communication section 157 constitute a circuit section. The wireless communication section 157 corresponds to a wireless transmission section. The substrate 154 is integrated with the housing 126 by a screw or the like not shown. The housing 126 is configured so that its bottom surface is aligned with the bottom surface of the pressing seat 115. In addition, the height of the pressing seat 115 is higher than the height of the housing 126, and no load is applied to the housing 126 when the pressing plate 120 is pressed. As shown in Figure 9 (b) shown, the strain sensor 124 is electrically connected to the amplifier 155 via the lead wire 152

[0144] In the pressing plate 122, on the mating surface with the pressing plate 120, the pressing seat 115, the housing 126, and the accommodation recesses 121, 123 that accommodate the pressing seats 117 are formed. The accommodation recesses can be provided on the pressing plate 120 side, or can be provided on both sides, respectively. The heights of the accommodation recesses 121, 123 are the same as the heights of the pressing seats 115, 117.

[0145] In addition, in the pressing plate 122, on the mating surface with the pressing plate 120, a groove that communicates with the accommodation recess 121 is provided, and they are made as the clearance transmission path 129. The groove can be provided on the pressing plate 120 side, or can be provided on both sides, respectively.

[0146] In the cross-sectional shape of the clearance transmission path 129, when the length of the long side is a and the wavelength of the transmission signal of the wireless communication section 157 is λ, a≥λ / 4 is satisfied. The length of the short side is not limited. For example, it can be very short.

[0147] The clearance transmission path 129 is open on the outer side surface of the pressing plate 122.

[0148] The pressing pins 114, 116 are inserted through the penetration holes 110 of the movable main die 108 and the movable cavity 106 in a manner that they can move in the axial direction in a horizontal state. In addition, as shown in Figure 6 (a), Figure 6 (b) shown, the space 112 is formed by the movable main die 108 being fixed with respect to the movable plate 118 by the die seat 107. The pressing lever 111 that performs the pressing operation of the pressing plate 120 is mounted to a hydraulic cylinder not shown. Thus, at the time of mold opening, the pressing plate 120 is pressed to the left limit position in the drawing by the pressing force of the hydraulic cylinder not shown, and the protruding amount of the pressing pins 114, 116 from the movable cavity 106 is increased.

[0149] (Action of the 4th Embodiment)

[0150] The operation of the die-casting mold apparatus 100 of this embodiment will be explained. For example... Figure 5 As shown, during mold closing, molten metal is pressed into cavity 109 through a sleeve (not shown) and a molten metal channel for casting. During this casting process, as the molten metal is pressed into cavity 109, the molten metal presses against extrusion pin 114, causing the extrusion pin 114 to compress due to the high pressure at this time. Strain sensor 124 detects this pressure. The detection signal from strain sensor 124 is amplified by amplifier 155. The amplified detection signal is converted into a digital signal by AD converter 156 and output to wireless communication unit 157. Furthermore, the transmission signal from wireless communication unit 57 is wirelessly transmitted to an external device via receiving recess 121 and gap transmission path 129.

[0151] Furthermore, during mold opening after casting, when the movable main mold 108 separates from the fixed main mold 104, the extrusion plate 120 moves in the direction of separation from the movable plate 118 by the spring force of a hydraulic cylinder (not shown). As a result, the extrusion pins 114 and 116 protrude from the cavity wall of the movable cavity 106, as... Figure 7 , Figure 8 As shown, the cast product S is pushed away from the wall of cavity 109.

[0152] At this time, the force during extrusion can be measured by the strain sensor 124 installed on the extrusion pin 114. Thus, although the die-cast product may deform during extrusion due to sintering in the mold or scratches on the mold, by measuring the extrusion, malfunctions or product deformation during extrusion can be prevented.

[0153] In this embodiment, the following functions and effects are achieved.

[0154] (1) The mold apparatus 100 of this embodiment has a movable cavity 106 and a movable main mold 108, including: an extrusion pin 114 for pushing out the casting product S formed in the cavity 109 from the cavity wall surface; and extrusion plates 120 and 122 for pressing the extrusion seats 115 and 117 provided at the base end of the extrusion pin 114 when the mold is opened. The strain sensor 124, amplifier 155, AD converter 156, wireless communication unit 157 and battery B constituting the circuit section are covered by the extrusion plates 120 and 122 as auxiliary components, and a gap transmission path 129 is provided in the extrusion plates 120 and 122.

[0155] According to the above structure, the detection signal of the strain sensor 124 can be transmitted to the external device without using a wire by covering the circuit portion and the battery B with the pressing plates 120, 122, and since a wire is not used, wire breakage and wiring errors do not occur. Further, the wireless transmission portion covered with the pressing plates 120, 122 does not interfere with the manufacturing of the molded product and the like.

[0156] (2) The mold device 100 of the present embodiment can also be such that the strain sensor 124 is integrated with the pressing pin 114, and the remaining amplifier 155, the AD converter 156, and the wireless communication portion 157 of the circuit portion are housed in the housing 126 formed thinner than the thickness of the pressing seat 115, while being arranged side by side with the pressing seat 115. As a result, the pressing member can press the pressing pin 114 through the pressing seat 115 while avoiding the housing 126.

[0157] In particular, the pressing pin 114 is structured so as to be pressed by the rod 111 and slide in the through-hole 110 at the time of each injection. This is greatly different from the pin body 52 of the first embodiment. With the pin body 52, the pin body 52 is pressed by the resin pressure and moved at the time of filling the cavity 40 with resin, and returns to the original position by the elastic pressing member such as a spring after the molded product is separated from the mold.

[0158] However, in resin molding and die casting, a burr of a mold releasing agent, resin as a material filled into a cavity, or aluminum or the like as a material of a cast product invades the gap between the pin body 52 and the housing hole 24 and the gap between the pressing pin 114 and the through-hole 110. In the first embodiment, there is a problem that the pin body 52 is adhered by the invaded mold releasing agent or resin. When the adhesion force at this time is greater than the elastic pressing force of the elastic pressing member, the pin body cannot move, and there is a problem that the pressure cannot be transmitted.

[0159] In contrast, in the present embodiment, even in the case where the mold releasing agent or metal invades the gap between the pressing pin 114 and the through-hole 110, the pressing pin 114 slides by the pressing rod 111, and thus the pressing pin is not adhered to the circumferential surface of the through-hole 110. Therefore, the pressure detection based on the strain sensor integrated with the pressing pin 114 can be performed without failure.

[0160] (5th Embodiment)

[0161] Next, the mold device of the 5th embodiment will be described with reference to Figure 10 and Figure 11 The mold device of the 5th embodiment will be described. In addition, the mold device of the 5th embodiment is different from the mold device 100 of the 4th embodiment only in a part, and thus the different structure will be described, and the same symbol will be attached to the structure the same as or equivalent to the mold device 100 of the 4th embodiment, and the description thereof will be omitted.

[0162] In the mold device 100 of the fourth embodiment, although the structure in which the pressing plate 120 and the pressing plate 122 overlap each other, in the present embodiment, as shown in FIG. 12, the difference is that the pressing plate 120 and the pressing plate 122 are arranged separately. That is, the pressing plate 122 and the pressing plate 120 are arranged separately by the spacer 134, and are joined and fixed as one body by the bolt 132 inserted through the spacer 134. Figure 10

[0163] Also, between the pressing plates 120, 122 arranged separately by the spacer 134, a space opened to four sides is formed, and the space becomes the clearance transmission path 130. In addition, as shown in FIG. 12, a plurality of pressing pins 116 are provided, and a part of the pressing pins 116 are arranged close to each other with respect to the pressing pin 114. Also, in the present embodiment, the housing 126 provided to the pressing pin 114 is not arranged to point to the receiving device 60 side in order to avoid interference with the pressing seat 117 of the other pressing pin 116 close thereto. Therefore, in the present embodiment, as shown in FIG. 12, in the clearance transmission path 130 between the pressing plates 120, 122, a pair of reflection plates 160 are fixed to the pressing plate 122. The reflection plate 160 is arranged to reflect the transmission signal from the wireless communication section 157 to the receiving device 60 side as shown by an arrow. Figure 11 Figure 11 Figure 11

[0164] The pressing seats 115, 117 of the pressing pins 114, 116 are sandwiched between the pressing plates 120, 122. In addition, the housing 126 is lower in height than the pressing seat 115 and abuts against the pressing plate 120, but is arranged separately from the pressing plate 122.

[0165] In the present embodiment configured as described above, the same effects as those of the fourth embodiment can be obtained.

[0166] Furthermore, by merely replacing the conventional pressing pin with the sensor-embedded pressing pin with the housing with the wireless communication section attached thereto, it is possible to measure the pressure and the extrusion force at an arbitrary pressing pin site without modifying the mold. As a result, it is not necessary to perform the preparation for measurement.

[0167] The present embodiment can be implemented by being changed as described below. The present embodiment and the following modified examples can be implemented in combination with each other within a range in which there is no technical contradiction.

[0168] ​​​​• In the embodiment, although the sensor is a pressure sensor, the sensor is not limited to a pressure sensor. There are various sensors configured to the mold, such as a temperature sensor that detects the temperature of the mold or the like, an acceleration sensor for vibration detection, a position sensor that detects the position of the movable side of the mold, and the like. For example, the temperature is a detection value that knows the environmental state of the mold. In addition, the acceleration for vibration detection is a detection value that knows the operating state of the mold. The position of the mold is a detection value that knows the operating state of the mold.

[0169] • In the embodiment, although there is one sensor, a plurality of sensors can also be provided to the mold. In this case, although there is a problem that a connection error occurs between the cable and the external device when each sensor is connected to the external device by a cable, in the embodiment, a connection error does not occur.

[0170] • In each of the embodiments, although the transmission signal is made a digital signal, the AD converter 56 can also be omitted to transmit an analog signal as the transmission signal.

[0171] • In the first embodiment, although it is concretized as a mold device for injection molding, it is not limited to a mold device for injection molding, and can be concretized as a press mold, a blow mold, a compression molding mold, a vacuum molding mold, or other mold devices.

[0172] • In addition, regarding the gap transmission path of the embodiment, for example, in the first embodiment, the cross-sectional shape of the gap transmission path 27 is a quadrilateral, that is, a rectangle, but the cross-sectional shape is not limited to this shape. For example, the rectangle can be at least a cross-sectional shape that can be inscribed, such as a circular shape, an elliptical shape, a triangular shape, a polygonal shape, a star shape, or other shapes.

[0173] • In the first, fourth, and fifth embodiments, although the amplifier 55, the AD converter 56, and the wireless communication section 57 are integrated, two of them can also be integrated. In addition, at least two including the sensor can also be integrated. Furthermore, in the case where the AD converter 56 in the circuit section is omitted, at least two of the remaining sensor, the amplifier, and the wireless communication section can also be integrated. In addition, the sensor, the amplifier, the AD converter, and the wireless communication section that constitute the circuit section do not necessarily have to be integrated, and can be separately provided. In addition, the method of integration is not limited to the method of integration by a substrate, and can be performed by molding.

[0174] In addition, in the embodiment in which the AD converter is not included in the circuit section, at least two of the strain sensor, the amplifier, and the wireless communication section can also be integrated.

[0175] • In the fourth embodiment, although the ejector pin is provided in the movable die, the ejector pin can be provided in the fixed die, or the ejector pin can be provided in each of the two dies.

[0176] • In the fifth embodiment, although the reflection plate 160 is provided, the reflection plate 160 can be omitted in a case where the wireless communication section 157 can be configured to be directed toward the reception device 60.

[0177] • In the die apparatuses of the fourth and fifth embodiments, the structures of the ejector pin 116 and the ejector plates 120 and 122 are the same as those of the conventional structure. Therefore, in the conventional die apparatus, by changing at least one of the plurality of or one ejector pin 116 to the ejector pin 114 provided with the housing 120 having the circuit section and the battery, the effects of the fourth or fifth embodiment can be easily achieved.

[0178] Explanation of Reference Numerals

[0179] 10 … Die apparatus

[0180] 20 … Fixed die

[0181] 21 … Fixed main die

[0182] 21a … Accommodation recess

[0183] 21b … Inner bottom surface

[0184] 21c … Inner side surface

[0185] 22 … Fixed cavity

[0186] 22a … Recess

[0187] 24 … Accommodation hole

[0188] 26a, 26b, 26c … Grooves

[0189] 27, 28A, 28B, 29 … Void transmission path

[0190] 30 … Movable die

[0191] 31 … Movable main die

[0192] 31a … Accommodation recess

[0193] 32 … Movable cavity

[0194] 32a … Recess

[0195] 40 … Cavity

[0196] 50 … Sensor section

[0197] 54 … Strain sensor

[0198] 100 … mold device

[0199] 102 … fixed cavity

[0200] 104 … fixed master mold

[0201] 106 … movable cavity

[0202] 108 … movable master mold

[0203] 109 … cavity

[0204] 110 … through hole

[0205] 112 … space

[0206] 114, 116 … press-in pin

[0207] 115, 117 … press-in seat

[0208] 120, 122 … press-in plate

[0209] 121 … housing recess

[0210] 124 … strain sensor

[0211] 126 … housing

[0212] 154 … substrate

[0213] 155 … amplifier

[0214] 156 … AD converter

[0215] 157 … wireless communication section

[0216] battery … B

Claims

1. A mold apparatus comprising: a mold including a fixed mold and a movable mold; a sensor that detects an operation state or an environmental state of the mold; an amplifier that amplifies a detection signal of the sensor; a wireless transmission unit that wirelessly transmits the detection signal from the amplifier as a transmission signal; a battery that supplies power to the circuit unit; a push pin that is provided to either one of the fixed mold and the movable mold and pushes a molded product formed in a cavity of the mold out from a wall surface of the cavity at mold opening; and a pressing member that presses a push pin seat provided to a base end of the push pin at the mold opening, wherein the sensor is integrated with the push pin, wherein the circuit unit and the battery are covered by the pressing member, and wherein the pressing member has a clearance transmission path that wirelessly transmits the transmission signal to an external device separate from the pressing member.

2. The mold apparatus according to claim 1, wherein at least two of the sensor, the amplifier, the wireless transmission unit, and the battery are integrated. Circuitry comprising:

3. The mold apparatus according to claim 1, wherein the detection signal is an analog signal, and wherein the circuit unit further includes an AD converter that is provided between the amplifier and the wireless transmission unit and converts the analog signal into a digital signal.

4. The mold apparatus according to claim 3, wherein at least two of the sensor, the amplifier, the AD converter, the wireless transmission unit, and the battery are integrated.

5. The mold apparatus according to any one of claims 1 to 4, wherein a shape of a cross section orthogonal to an extending direction of the clearance transmission path is a quadrangle having long sides and short sides orthogonal to each other or a shape that can be inscribed in the quadrangle at least, and a length of the long side is set to a and a wavelength of the transmission signal is set to λ, and a > λ / 4.

6. The mold apparatus according to claim 5, wherein the clearance transmission path includes a first transmission path, a bent portion, and a second transmission path that is connected to the first transmission path via the bent portion, and the bent portion is bent so that a bending angle θ of the second transmission path with respect to the first transmission path is |θ|≤ 90° in a virtual plane including the long side.

7. The mold apparatus according to claim 1, wherein a component included in the circuit unit other than the sensor is housed in a housing that is provided in parallel with the push pin seat and is thinner than a thickness of the push pin seat.

8. The mold apparatus according to claim 1, wherein the pressing member includes two pressing plates that are separate from each other, and a space between the two pressing plates forms the clearance transmission path. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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