Electroplating apparatus and electroplating method

Abstract

This invention discloses an electroplating apparatus and method for depositing metal on a substrate with a patterned structure. In one embodiment, the electroplating apparatus includes an electroplating tank for containing an electroplating solution, a substrate holding module for holding the substrate, and at least one driving device for driving the substrate holding module to vibrate horizontally and / or vertically together with the substrate during the electroplating process when the substrate is immersed in the electroplating solution. By vibrating the substrate holding module, this invention can enhance the mass transfer during the substrate electroplating process, thereby improving the electroplating rate and electroplating uniformity on the patterned structure.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device manufacturing, and more specifically to an electroplating apparatus and electroplating method with agitation of electroplating solution to improve electroplating rate. Background Technology

[0002] In the manufacture of semiconductor devices, electroplating is commonly used in the double damascene process to form metal films in interconnect structures (such as trenches, vias, and through-silicon vias), or to form structures such as bumps in advanced packaging processes. With rapid technological advancements, higher demands are being placed not only on plating quality but also on plating rates. Since higher plating rates translate to higher throughput, plating rates are becoming increasingly important in both the double damascene and advanced packaging processes.

[0003] Generally, the electroplating rate is related to several factors, such as the composition of the plating solution, the temperature of the plating solution, and the agitation of the plating solution. The agitation of the plating solution is further related to physical quantities such as the flow rate of the plating solution, the rotational speed of the substrate to be plated, and the vibration applied to the plating solution. Currently, there are several ways to increase the plating rate by enhancing the mass transfer during the plating process by increasing the agitation of the plating solution. One method is to use a flow forming plate combined with a flow deflector, which enhances the lateral flow at the flow port. While this method can control the hydrodynamics of the plating solution, thereby achieving effective mass transfer during the plating process and thus obtaining higher coating uniformity, if the flow of the plating solution from one side to the other on the substrate is too strong, the flow of the plating solution can affect the distribution of additives in the plating solution. Specifically, the flow rate of the plating solution is very fast on the side near the flow port and very slow on the side farther away from the flow port. Therefore, the flow rate of the plating solution from the center of the substrate to the edge region is uneven. More specifically, the flow rate of the plating solution is very strong at the flow port at the edge of the substrate, and becomes weaker as the solution flows away from the flow port from the center of the substrate. Many additives, especially plating leveling agents, are sensitive to the flow rate of the plating solution. If the flow rate of the plating solution is too strong and the flow rate distribution is uneven across the entire substrate, the leveling agent will more easily adhere to the substrate surface at the points where the flow rate is stronger, thus resulting in poor plating uniformity. Simultaneously, the morphology of microstructures on semiconductor devices, such as bump structures, will also be affected. Because the leveling agent is sensitive to the flow rate of the plating solution, the bump morphology will become tilted. Although rotating the substrate can compensate for the non-uniformity, the substrate rotation speed varies during the plating process (common in the industry), which will still lead to plating non-uniformity.

[0004] Another method to enhance the agitation of the electroplating solution is to use impellers, utilizing the vibration of the impellers to strengthen the agitation. The disadvantage of this method is that, because the impellers are positioned between the diffuser and the substrate to be electroplated, the high-speed movement of the impellers can generate bubbles in the electroplating solution. These bubbles can adhere to the substrate surface, preventing those areas from being electroplated, thus causing electroplating quality problems. Another issue caused by the impellers is that, due to the numerous openings on the impellers, the shape and size of these openings can affect the electric field distribution, leading to uneven electroplating on the substrate. Furthermore, when the impellers are used to agitate the fluid near the substrate surface, they create a "shadow" of the electric field within the electroplating solution, causing uneven plating on the substrate.

[0005] Furthermore, to achieve higher plating rates, high-plaquence plating solutions have different formulations compared to low-plaquence solutions. Taking copper plating as an example, the traditional plating rate is 2-5 ASD. For plating rates exceeding 8 ASD, especially 8-30 ASD, the copper ion concentration in the plating solution is higher and the additives are more complex. The higher the plating rate, the more difficult it is to control the morphology of the film or bumps. Moreover, as device structures become increasingly complex, such as a single die containing both trenches and large pad structures, higher concentrations of leveling agents are required. Similarly, controlling wafer-level uniformity is difficult with high-speed plating. To obtain good plating results both at the wafer level and within the die, additives in the plating solution, such as accelerators, leveling agents, and inhibitors, need to work synergistically.

[0006] Therefore, current electroplating solution agitation methods have various shortcomings. It is necessary to propose an electroplating solution agitation method that improves the electroplating rate and uniformity. Summary of the Invention

[0007] One object of the present invention is to provide an electroplating apparatus for depositing metal on a substrate having a patterned structure. The electroplating apparatus includes an electroplating tank for containing an electroplating solution, a substrate holding module for holding the substrate, and at least one driving device configured to drive the substrate holding module and the substrate to vibrate horizontally and / or vertically together during the process of the substrate being immersed in the electroplating solution for electroplating.

[0008] Another object of the present invention is to provide an electroplating method for depositing metal on a substrate having a patterned structure. The method includes the following steps: loading the substrate into a substrate holding module for being held therein; immersing the substrate in an electroplating solution in an electroplating bath; and driving the substrate holding module and the substrate to vibrate horizontally and / or vertically together during the process of electroplating the substrate in the electroplating solution.

[0009] Another object of the present invention is to provide an electroplating apparatus for depositing metal on a substrate having a patterned structure. The electroplating apparatus includes an electroplating tank for containing an electroplating solution, a substrate holding module for holding the substrate, a rotary actuator for driving the substrate holding module and the substrate to rotate together, and a controller configured to control the rotary actuator to rotate N times and then rotate in the opposite direction N times, the process being alternately executed in several cycles, where N is less than or equal to 3.0.

[0010] Another object of the present invention is to provide an electroplating method for depositing metal on a substrate with a patterned structure. The method includes the following steps: loading the substrate into a substrate holding module for holding; immersing the substrate in an electroplating bath; during the electroplating process, driving the substrate holding module and the substrate to rotate together via a rotary actuator, controlling the rotary actuator to rotate N times and then rotate in the opposite direction N times, this process is alternately executed several times, where N is less than or equal to 3.0.

[0011] In summary, this invention discloses a unique method of agitating the plating solution during substrate electroplating, namely, vibrating the substrate holding module together with the substrate. This enhances mass transfer, thereby improving the plating rate and uniformity. Furthermore, because the vibration of the substrate holding module is reciprocating at a high frequency, it ensures uniform distribution of additives within the patterned structure. The mass transfer boundary layer of the plating solution becomes thinner, and the exchange of additives absorbed into the patterned structure is very rapid and uniform. Therefore, the consistency of the plated metal in the patterned structure is improved, overcoming defects such as tilted columnar or bump formations, while simultaneously allowing for a higher plating rate. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a traditional electroplating apparatus;

[0013] Figure 2A-2C This is a schematic diagram showing the tilting of the metal columnar or bumpy structures deposited using a conventional electroplating apparatus.

[0014] Figures 3A-3C This is a schematic diagram showing the tilting of the metal columnar or bumpy structures deposited using a conventional electroplating apparatus.

[0015] Figure 4 This is a schematic diagram of an electroplating apparatus according to an optional embodiment of the present invention;

[0016] Figure 5A and Figure 5B This diagram illustrates how rapid changes in relative velocity can agitate the electroplating solution.

[0017] Figure 6 This is a schematic diagram of an electroplating apparatus according to another optional embodiment of the present invention;

[0018] Figures 7A-7B This is a schematic diagram of an electroplating apparatus according to yet another optional embodiment of the present invention;

[0019] Figures 8A-8B and Figures 9A-9B A schematic diagram showing the module maintaining horizontal vibration for the substrate of the electroplating apparatus;

[0020] Figures 10A-10B and Figure 11A-11B This is a schematic diagram of an electroplating apparatus according to yet another optional embodiment of the present invention;

[0021] Figure 12A-12B This is a schematic diagram of an electroplating apparatus according to an optional embodiment of the present invention;

[0022] Figures 13A-13B and Figures 14A-14B A schematic diagram showing the vertical vibration of the module that keeps the substrate of the electroplating apparatus vertical;

[0023] Figures 15A-15B and Figures 16A-16B This is a schematic diagram of an electroplating apparatus according to yet another optional embodiment of the present invention;

[0024] Figures 17A-17B This is a schematic diagram of an electroplating apparatus according to yet another optional embodiment of the present invention;

[0025] Figures 18A-18C This is a schematic diagram of an electroplating apparatus according to yet another optional embodiment of the present invention;

[0026] Figures 19A-19C and Figures 20A-20C A schematic diagram showing the simultaneous vibration of the substrate holding module in both the horizontal and vertical directions for the electroplating apparatus;

[0027] Figure 21 Vibration model diagram;

[0028] Figure 22 A schematic diagram of an electroplating apparatus according to yet another optional embodiment of the present invention; and

[0029] Figure 23 This is a schematic diagram of an electroplating apparatus according to another optional embodiment of the present invention. Detailed Implementation

[0030] Please refer to Figure 1This illustration shows a conventional electroplating apparatus 100 for metal deposition. The electroplating apparatus 100 includes an electroplating tank 110 for containing electroplating solution, a substrate holding module 120 for holding a substrate 130 and electrically connected to the conductive surface of the substrate 130, a rotary actuator 140 connected to the substrate holding module 120 and rotating the substrate holding module 120 along its axis, an anode 150 disposed in the electroplating tank 110 and facing the conductive surface of the substrate 130, and a power supply 160 electrically connected to the substrate holding module 120 and the anode 150. The electroplating apparatus 100 also includes a groove 170 disposed around the electroplating tank 110 for receiving electroplating solution overflowing from the electroplating tank 110. The electroplating apparatus 100 also includes a liquid storage tank 190, with a conduit 180 connecting the groove 170 and the liquid storage tank 190, and the liquid storage tank 190 connected to the electroplating tank 110 via another conduit 180.

[0031] When the electroplating apparatus 100 is used to deposit metal on a substrate 130 having a patterned structure 131, the rotary actuator 140 drives the substrate holding module 120 to rotate about its axis. The electroplating solution flows out from the center of the electroplating tank 110 and flows through the center of the substrate 130 to the edge of the substrate 130. Typically, various additives, such as leveling agents, accelerators, and inhibitors, are added to the electroplating solution to deposit metal on the substrate 130. Some of these additives are sensitive to the flow rate of the electroplating solution. For example, in an electroplating solution for copper, leveling agents tend to adhere more readily to areas of the substrate surface where the electroplating solution flows faster. Therefore, when the leveling agent plays a major role in electroplating, since the electroplating solution flows from the center of the substrate 130 to the edge, the leveling agent has a greater chance of remaining on one side of the patterned structure 131. This results in uneven distribution of the leveling agent within the patterned structure 131, causing uneven metal deposition within the patterned structure 131, ultimately leading to tilted metal pillars or bumps, such as... Figure 2A-2C As shown. For example, in a copper plating solution, the accelerator is more sensitive to the flow rate of the plating solution. The accelerator is more likely to adhere to areas on the substrate surface where the plating solution flows faster. In another embodiment, when the accelerator plays a major role in the plating process, because the plating solution flows from the center of the substrate 130' to the edge, the accelerator has a greater chance of remaining on one side of the pattern structure 131' on the substrate 130'. This can lead to uneven distribution of the accelerator in the pattern structure 131', causing uneven metal deposition in the pattern structure 131', ultimately resulting in tilted metal pillars or bumps, such as... Figures 3A-3C As shown, the tilt increases with higher plating speeds. A new technology is needed to achieve better bump morphology at high-speed plating.

[0032] To address this problem and achieve uniform metal deposition on substrates with patterned structures, the electroplating apparatus and method disclosed in this invention, by driving a substrate holding module to vibrate together with the substrate during the electroplating process while the substrate is immersed in the electroplating solution, allows additives such as leveling agents, accelerators, and inhibitors to be evenly distributed within the patterned structure, preventing them from accumulating in one place. This reduces the tilt of the plated metal pillars or bumps and achieves uniform metal deposition within the patterned structure. High-frequency vibration can also reduce the thickness of the electroplating solution boundary layer. The thinner the boundary layer, the higher the mass transfer rate and the higher the metal deposition rate.

[0033] Reference Figure 4 This illustration depicts an electroplating apparatus for depositing metal on a substrate with a patterned structure according to an optional embodiment of the present invention. The electroplating apparatus 400 includes an electroplating tank 401 for containing an electroplating solution, a substrate holding module 402 for holding a substrate 403 and electrically connected to the conductive surface of the substrate 403, a rotary actuator 404 for driving the substrate holding module 402 to rotate about an axis of the substrate holding module 402, and at least one drive device 405 for driving the substrate holding module 402 to vibrate horizontally and / or vertically. The drive device 405 can be a motor, a cylinder, or a vibrator. The electroplating apparatus 400 also includes at least one anode 406 disposed in the electroplating tank 401 and facing the conductive surface of the substrate 403, and a power supply 407 electrically connected to the substrate holding module 402 and the anode 406. A groove 408 is provided around the electroplating tank 401 for receiving electroplating solution overflowing from the electroplating tank 401. The electroplating apparatus 400 also includes a liquid storage tank 410, a pipe 409 connecting the groove 408 and the liquid storage tank 410, and the liquid storage tank 410 being connected to the electroplating tank 401 via another pipe 409.

[0034] Combination Figure 5A and Figure 5BThe substrate 403 has a patterned structure 4031. When metal is deposited in the patterned structure 4031 using the electroplating apparatus 400, the substrate 403 is horizontally held by the substrate holding module 402, and then the substrate 403 is immersed in the electroplating solution for electroplating. At the same time, the driving device 405 drives the substrate holding module 402 and the substrate 403 to perform reciprocating motion to agitate the electroplating solution. The reciprocating motion includes horizontal vibration and / or vertical vibration, which can enhance mass transfer. Therefore, during the electroplating process when the substrate 403 is immersed in the electroplating solution, metal ions and additives (such as leveling agents, accelerators, and inhibitors) can be uniformly distributed in the patterned structure 4031 and no longer accumulate in one place. This can reduce the tilt of the electroplated metal pillars or bumps and obtain uniform metal deposition in the patterned structure 4031. Specifically, during the process of immersing the substrate 403 in the electroplating solution for electroplating, the rotary actuator 404 drives the substrate holding module 402 to rotate around its axis. The electroplating solution flows out from the center of the electroplating tank 401 at a flow rate V2 and flows through the center of the substrate 130 to its edge. The drive device 405 drives the substrate holding module 402 and the substrate 403 to vibrate horizontally at a vibration speed of V1. V1 is not less than 0.2V2. Preferably, V1 is greater than V2. More preferably, V1 is twice as large as V2. Figure 5A As shown, when the vibration direction is opposite to the electroplating solution flow direction, the relative velocity V is equal to V1 + V2. Figure 5B As shown, when the vibration direction is the same as the flow direction of the electroplating solution, the relative velocity V is equal to V1 - V2. Since the substrate maintains the horizontal vibration of the module 402, the relative velocity V changes rapidly, realizing the agitation of the electroplating solution, thereby improving mass transfer, improving the uniformity of additive distribution in the pattern structure 4031, and further improving the electroplating rate and electroplating uniformity.

[0035] Reference Figure 6 This illustration depicts an electroplating apparatus for depositing metal on a substrate with a patterned structure according to another optional embodiment of the present invention. The electroplating apparatus 600 includes an electroplating tank 601 for containing electroplating solution, a substrate holding module 602 for holding a substrate 603, and at least one drive device 605 for driving the substrate holding module 602 to vibrate horizontally and / or vertically. The drive device 605 can be a motor, a cylinder, or a vibrator. The electroplating apparatus 600 also includes at least one anode 606 disposed in the electroplating tank 601 and facing the conductive surface of the substrate 603, and a power supply 607 electrically connected to the conductive surface of the substrate 603 and the anode 606. A groove 608 is provided around the electroplating tank 601 for receiving electroplating solution overflowing from the electroplating tank 601. The electroplating apparatus 600 also includes a storage tank 610, with a conduit 609 connected to the groove 608 and the storage tank 610, and the storage tank 610 connected to the electroplating tank 601 via another conduit 609.

[0036] In this embodiment, a substrate 603 with a patterned structure is vertically held by a substrate holding module 602. The substrate holding module 602 and the substrate 603 are vertically immersed in an electroplating solution to deposit metal in the patterned structure. During the electroplating process, a driving device 605 drives the substrate holding module 602 and the substrate 603 to perform reciprocating motion to agitate the electroplating solution. The reciprocating motion includes horizontal vibration and / or vertical vibration, which can enhance mass transfer. Therefore, during the electroplating process when the substrate 603 is immersed in the electroplating solution, metal ions and additives (e.g., leveling agents, accelerators, inhibitors) can be uniformly distributed in the patterned structure and no longer accumulate in one place. This reduces the tilt of the electroplated metal pillars or bumps, resulting in uniform metal deposition in the patterned structure.

[0037] Reference Figure 7A-9B This illustration shows an electroplating apparatus for depositing metal on a substrate having a patterned structure according to another optional embodiment of the present invention. The electroplating apparatus 700 includes an electroplating tank 701, a substrate holding module, a vibrating plate 715, a mounting plate 716, a support base 717, and a drive device 705. The substrate holding module further includes a substrate clamp 702, a support column 712, a fixing member 713, a bracket 714, and a rotary actuator 704.

[0038] Electroplating tank 701 is used to contain electroplating solution. Electroplating tank 701 may include an anode chamber and a cathode chamber for electroplating. The anode chamber and cathode chamber are separated by an ion-exchange membrane disposed on an ion-exchange membrane framework. The anode chamber may be divided into multiple anode zones, each containing one anode, and each anode is connected to an independently controlled power supply. The anode may be made of materials such as copper, Ti, or a Pt-coated Ti plate. At least one diffuser disk 711 with several small holes is disposed in the cathode chamber to control the uniformity of the electric field and the uniformity of the electroplating solution. A groove 708 is provided around the cathode chamber to receive electroplating solution overflowing from the cathode chamber.

[0039] A substrate clamp 702 is used to hold a substrate. A support column 712 connects the substrate clamp 702 and the fixing member 713. A bracket 714 is fixed to one side of the fixing member 713. A vibrating plate 715 supports the substrate holding module. One end of the vibrating plate 715 is connected to the bracket 714, and the other end of the vibrating plate 715 is connected to a mounting plate 716. The mounting plate 716 is disposed on a support base 717. The mounting plate 716 can move up and down along the support base 717 under the drive of a vertical actuator, thereby driving the vibrating plate 715 to move up and down. The vibrating plate 715 has a natural frequency. A rotary actuator 704 is disposed on the fixing member 713 and is used to drive the substrate clamp 702 to rotate. A drive device 705 is disposed on the bracket 714 and is used to drive the substrate holding module to vibrate horizontally or resonate at the natural frequency of the vibrating plate 715. The drive device 705 can be a vibrator, such as an inertial vibrator.

[0040] like Figures 8A-8B and Figures 9A-9B As shown, when the substrate is immersed in the electroplating solution for electroplating, the drive device 705 can drive the substrate clamp 702 to vibrate horizontally. The substrate clamp 702 can perform reciprocating motion driven by the drive device 705. A pair of limiting members 718 are used to limit the amplitude of the substrate holding module to prevent the bracket 714 from colliding with the mounting plate 716. The pair of limiting members 718 can be made of soft rubber. In one embodiment, the pair of limiting members 718 are disposed on the bracket 714 and are located on both sides of the vibrating plate 715. In another embodiment, the pair of limiting members 718 are disposed on the mounting plate 716 and are located on both sides of the vibrating plate 715.

[0041] The amplitude of the substrate holding module is related to the size of the pattern structure. Preferably, the amplitude of the substrate holding module is larger than the size of the pattern structure, which can improve the vibration effect above the metal deposition in the pattern structure. The amplitude of the substrate holding module can be set between 25um and 2000um, preferably between 100um and 500um.

[0042] The vibration frequency of the substrate holding module is related to its amplitude and vibration velocity. Furthermore, the vibration velocity of the substrate holding module is related to the flow rate of the electroplating solution. Preferably, the vibration velocity of the substrate holding module is greater than the flow rate of the electroplating solution from the center to the edge. The flow rate of the electroplating solution is typically set between 0.01 m / s and 0.2 m / s, depending on the initial flow rate of the electroplating solution supplied. The vibration frequency of the substrate holding module can be calculated using the following formula: f = V1 / 4A, where f is the vibration frequency of the substrate holding module, V1 is the vibration velocity of the substrate holding module, and A is the amplitude of the substrate holding module. For example, if V1 is set to 0.02 m / s and A to 0.5 mm, the calculated result of f is 10 Hz. This frequency is the resonant frequency of the substrate holding module and the vibrating plate 715, and is also the natural frequency of the vibrating plate 715 and the initial frequency of the driving device 705. The vibrating plate 715 is specifically a cantilever structure. The operating frequency of the inertial vibrator can be set between 0.1Hz and 500Hz. Preferably, it is set to the resonant frequency of the vibrating plate 715, which minimizes the energy requirement for driving it.

[0043] Reference Figure 21 A vibration model is shown. Combining the vibration model with the following calculation formula, the dimensions of the vibrating plate 715 can be obtained.

[0044]

[0045] k = m * (2πf) 2 (2)

[0046]

[0047]

[0048] In the calculation formulas (1)-(4), f is the vibration frequency of the substrate holding module, m is the weight of the substrate holding module, k is the stiffness coefficient of the vibrating plate, E is the elastic modulus of the vibrating plate material, H is the cross-sectional width of the vibrating plate, B is the cross-sectional height of the vibrating plate, and L is the length of the vibrating plate.

[0049] The dimensions of the vibrating plate 715 can be obtained using calculation formulas (1)-(4). Some examples are given in the table below.

[0050] M(kg)= 30 30 30 30 30 30 f1(Hz)= 10 10 20 30 40 50 K1(N / m)= 118435.2528 118435.2528 473741.0113 1065917.275 1894964.045 2960881.32 π＝ 3.141592654 3.141592654 3.141592654 3.141592654 3.141592654 3.141592654 E(Pa)= 20600000000 20600000000 20600000000 2060000000 20600000000 20600000000 H(m)= 0.05 0.1 0.1 0.1 0.1 0.1 L(m)= 0.024 0.024 0.024 0.024 0.024 0.024 B1(m)= 0.001852589 0.001470401 0.002334116 0.003058558 0.003705179 0.004299479

[0051] Reference Figure 10A-11B This illustrates an electroplating apparatus for depositing metal on a substrate having a patterned structure, according to another optional embodiment of the present invention. Figure 7A-9B Compared to the electroplating apparatus in the previous embodiment, the driving device 705' in this embodiment can be a pair of motors or cylinders for driving the substrate to maintain the module's horizontal vibration and resonate with the vibrating plate 715. The pair of motors or cylinders can be mounted on the bracket 714 and positioned on both sides of the vibrating plate 715. Alternatively, the pair of motors or cylinders can be mounted on the mounting plate 716 and positioned on both sides of the vibrating plate 715.

[0052] Reference Figures 12A to 14B This illustration shows an electroplating apparatus for depositing metal on a substrate with a patterned structure according to another optional embodiment of the present invention. The electroplating apparatus 1200 includes an electroplating tank 1201, a substrate holding module, a pair of vibrating plates 1215, a mounting plate 1216, a support base 1217, and a drive device 1205. The substrate holding module further includes a substrate clamp 1202, a support column 1212, a fixing member 1213, a bracket 1214, a rotary actuator 1204, a vertical connecting member 1219, a horizontal connecting member 1220, a resilient connecting member 1221, and a frame 1222.

[0053] Electroplating tank 1201 is used to contain electroplating solution. Electroplating tank 1201 may include a cathode chamber and an anode chamber for electroplating. The anode chamber and cathode chamber are separated by an ion membrane disposed on an ion membrane framework. The anode chamber may be divided into multiple anode zones, each anode zone containing one anode, and each anode is connected to an independently controlled power supply. The anode may be made of materials such as copper, Ti, or Pt-coated Ti plates. At least one diffuser disk 1211 with several small holes is disposed in the cathode chamber to control the uniformity of the electric field and the uniformity of the electroplating solution. A groove 1208 is provided around the cathode chamber for receiving electroplating solution overflowing from the cathode chamber.

[0054] A substrate clamp 1202 is used to hold a substrate. A support column 1212 connects the substrate clamp 1202 and the fixing member 1213. A bracket 1214 is generally U-shaped, with two arms and a base. The two arms of the bracket 1214 are located on both sides of the fixing member 1213 and are each connected to a corresponding vibrating plate 1215. The pair of vibrating plates 1215 are connected to both sides of the fixing member 1213. The base of the bracket 1214 is connected to a mounting plate 1216. The mounting plate 1216 is mounted on a support base 1217. The mounting plate 1216 can be driven by a vertical actuator to move up and down along the support base 1217, thereby driving the substrate holding module to move up and down. To prevent the substrate holding module from sagging, a vertical connecting member 1219 is connected to the base of the bracket 1214 and a horizontal connecting member 1220, and the horizontal connecting member 1220 is connected to an elastic connecting member 1221, which is connected to a frame 1222 fixed to the fixing member 1213. The rotary actuator 1204 is mounted on the fixture 1213 and is used to drive the base plate clamp 1202 to rotate.

[0055] The driving device 1205 is mounted on the fixing member 1213 and is used to drive the substrate to maintain the vertical vibration of the module or to resonate at the natural frequency of the vibrating plate 1215 during the substrate electroplating process. Figures 13A-13B and Figures 14A-14B As shown. The drive unit 1205 can be a vibrator.

[0056] The high-frequency up-and-down movement of the substrate clamp 1202 generates a strong agitation effect in the space between the substrate and the diffuser plate 1211. When the substrate clamp 1202 moves downward at high speed, the hydraulic pressure in the aforementioned space increases sharply, and the electroplating solution is driven into the interior of the patterned structure by the pressure. Therefore, the microfluidic flow rate in the patterned structure is very fast, and the additives will penetrate the patterned structure uniformly, thereby helping to overcome the bump tilting problem. On the other hand, when the substrate clamp 1202 moves upward, the space becomes larger and larger, and the hydraulic pressure in it decreases rapidly, drawing out the liquid from the micro-patterned structure. During the high-speed up-and-down movement, the hydraulic pressure changes rapidly, and the mass transfer rate in the patterned structure is enhanced.

[0057] Reference Figure 15A-16B This illustrates an electroplating apparatus for depositing metal on a substrate having a patterned structure, according to another optional embodiment of the present invention. Figure 12A-14B Compared to the electroplating apparatus in the previous embodiment, the driving device 1205' in this embodiment can be a motor or a cylinder, used to drive the substrate to maintain the module's vertical vibration and resonate with the vibrating plate 1215. The motor or cylinder can be mounted on the horizontal connecting component 1220.

[0058] Reference Figures 17A-17BThis illustration depicts an electroplating apparatus for depositing metal on a substrate with a patterned structure, according to yet another optional embodiment of the present invention. The electroplating apparatus 1700 includes an electroplating tank 1701, a substrate holding module, a vibrating plate 1715, a mounting plate 1716, a support base 1717, and a vertical actuator. The substrate holding module further includes a substrate clamp 1702, a support column 1712, a fixing member 1713, and a rotary actuator 1704.

[0059] Electroplating tank 1701 is used to contain electroplating solution. Electroplating tank 1701 may include an anode chamber and a cathode chamber for electroplating. The anode chamber and cathode chamber are separated by an ion-exchange membrane disposed on an ion-exchange membrane framework. The anode chamber may be divided into multiple anode zones, each containing one anode, and each anode is connected to an independently controlled power supply. The anode may be made of materials such as copper, Ti, or Pt-coated Ti plates. At least one diffuser disk 1711 with several small holes is disposed in the cathode chamber to control the uniformity of the electric field and the uniformity of the electroplating solution. A groove 1708 is provided around the cathode chamber for receiving electroplating solution overflowing from the cathode chamber.

[0060] The substrate clamp 1702 is used to hold the substrate. A support column 1712 connects the substrate clamp 1702 and the fixing member 1713. A vibrating plate 1715 is connected to one side of the fixing member 1713 and a mounting plate 1716. The mounting plate 1716 is mounted on a support base 1717. The mounting plate 1716 can be driven by a vertical actuator to move up and down along the support base 1717, thereby causing the substrate holding module to move up and down. A rotary actuator 1704 is mounted on the fixing member 1713 and is used to drive the substrate clamp 1702 to rotate.

[0061] In this embodiment, the vertical actuator serves as a driving device, used to drive the substrate to maintain vertical vibration of the module or to resonate at the natural frequency of the vibrating plate 1715 during the substrate electroplating process.

[0062] Reference Figure 18A-20C This illustration shows an electroplating apparatus for depositing metal on a substrate with a patterned structure according to another optional embodiment of the present invention. The electroplating apparatus 1800 includes an electroplating tank 1801, a substrate holding module, a first vibrating plate 18151, a pair of second vibrating plates 18152, a mounting plate 1816, a support base 1817, and a first driving device 1805. The substrate holding module further includes a substrate clamp 1802, a support column 1812, a fixing member 1813, a bracket 1814, and a rotary actuator 1804.

[0063] Electroplating tank 1801 is used to contain electroplating solution. Electroplating tank 1801 may include an anode chamber and a cathode chamber for electroplating. The anode chamber and cathode chamber are separated by an ion-exchange membrane disposed on an ion-exchange membrane framework. The anode chamber may be divided into multiple anode zones, each containing one anode, and each anode is connected to an independently controlled power supply. The anode may be made of materials such as copper, Ti, or Pt-coated Ti plates. At least one diffuser disk 1811 with several small holes is disposed in the cathode chamber to control the uniformity of the electric field and the uniformity of the electroplating solution. A groove 1808 is provided around the cathode chamber to receive electroplating solution overflowing from the cathode chamber.

[0064] A substrate clamp 1802 is used to hold a substrate. A support column 1812 connects the substrate clamp 1802 and the fixing member 1813. A bracket 1814 is generally U-shaped, with two arms and a base. The two arms of the bracket 1814 are located on both sides of the fixing member 1813 and are each connected to a corresponding second vibrating plate 18152. The pair of second vibrating plates 18152 are connected to both sides of the fixing member 1813. The base of the bracket 1814 is connected to one end of a first vibrating plate 18151. The other end of the first vibrating plate 18151 is connected to a mounting plate 1816. The mounting plate 1816 is mounted on a support base 1817. The mounting plate 1816 can be driven by a vertical actuator to move up and down along the support base 1817, thereby driving the substrate holding module to move up and down. A rotary actuator 1804 is mounted on the fixing member 1813 and is used to drive the substrate clamp 1802 to rotate.

[0065] The first driving device 1805 is disposed at the base of the bracket 1814 and is used to drive the substrate holding module to vibrate horizontally or resonate at the natural frequency of the first vibrating plate 18151. The vertical actuator serves as the second driving device and is used to drive the substrate holding module to vibrate vertically or resonate at the natural frequencies of the two second vibrating plates 18152. In this embodiment, the substrate holding module can simultaneously vibrate horizontally and vertically under the drive of the first driving device 1805 and the vertical actuator during substrate electroplating.

[0066] Reference Figure 22 This illustration shows an electroplating apparatus for depositing metal on a substrate with a patterned structure according to another optional embodiment of the present invention. The electroplating apparatus 2200 includes an electroplating tank 2201, a substrate holding module, a mounting plate 2216, a support base 2217, and a drive device 2205. The substrate holding module further includes a substrate clamp 2202, a support column 2212, a connecting plate 2225, a fixing member 2213, a bracket 2214, a rotary actuator 2204, a shaft 2223, a bearing 2224, and a pair of elastic members 2226.

[0067] Electroplating tank 2201 is used to contain electroplating solution. Electroplating tank 2201 may include a cathode chamber and an anode chamber for electroplating. The anode chamber and cathode chamber are separated by an ion membrane disposed on an ion membrane framework. The anode chamber may be divided into multiple anode zones, each containing one anode, and each anode is connected to an independently controlled power supply. The anode may be made of materials such as copper, Ti, or Pt-coated Ti plates. At least one diffuser disk 2211 with several small holes is disposed in the cathode chamber to control the uniformity of the electric field and the uniformity of the electroplating solution. A groove 2208 is provided around the cathode chamber to receive electroplating solution overflowing from the cathode chamber.

[0068] A substrate clamp 2202 is used to hold the substrate. A support column 2212 connects the substrate clamp 2202 and the connecting plate 2225. A rotary actuator 2204 is mounted on a fixing member 2213. A shaft 2223 passes through the fixing member 2213. One end of the shaft 2223 is connected to the rotary actuator 2204, and the other end of the shaft 2223 is connected to the connecting plate 2225 via a bearing 2224. A pair of elastic members 2226 connect the shaft 2223 and the connecting plate 2225. A bracket 2214 is fixed to one side of the fixing member 2213 and connected to a mounting plate 2216. The mounting plate 2216 is mounted on a support base 2217. The mounting plate 2216 can move up and down along the support base 2217 under the drive of the vertical actuator, thereby driving the substrate holding module to move up and down. A drive device 2205 is mounted on the connecting plate 2225.

[0069] During electroplating, the rotary actuator 2204 drives the shaft 2223 to rotate at a speed of w1. Because a pair of elastic members 2226 connect the shaft 2223 and the connecting plate 2225, the substrate clamp 2202, support column 2212, and connecting plate 2225 also rotate together with the shaft 2223 at a speed of w1. When the substrate clamp 2202 rotates for electroplating, the drive device 2205 drives the substrate clamp 2202, support column 2212, and connecting plate 2225 to rotate clockwise and counterclockwise at a speed of w2. Preferably, w2 is greater than w1. Therefore, the rotational speed of the substrate clamp 2202 can be quickly changed to agitate the electroplating solution. Thus, the uniformity and rate of electroplating are improved.

[0070] As described above, in the process of immersing the substrate in the electroplating solution for electroplating, the present invention employs at least one driving device to drive the substrate to vibrate, thereby uniformly distributing the additives in the fine structure and improving the uniformity of the electroplated metal in the fine structure. Furthermore, compared to the prior art which uses paddles to agitate the electroplating solution, the present invention does not place paddles or similar obstructions between the substrate and the diffusion disk, resulting in a more uniform electric field distribution and eliminating the shadow problem.

[0071] The present invention also provides an electroplating method for depositing metal on a substrate having a patterned structure, comprising the following steps:

[0072] The substrate is loaded into the substrate holding module so that it is held by the substrate holding module;

[0073] The substrate is immersed in the electroplating solution in the electroplating tank;

[0074] During the process of immersing the substrate in the electroplating solution for electroplating, the drive substrate holding module vibrates horizontally and / or vertically together with the substrate.

[0075] In one embodiment, the substrate is held horizontally by a substrate holding module.

[0076] In one embodiment, the substrate is vertically held by a substrate holding module, and the substrate holding module and the substrate are vertically immersed in an electroplating solution.

[0077] In one embodiment, the flow rate of the electroplating solution is V2, and the substrate holding module and the substrate are driven to vibrate at a speed of V1, where V1 is not less than 0.2V2.

[0078] In one embodiment, the vibration frequency of the substrate holding module is set between 0.1 Hz and 500 Hz.

[0079] In one embodiment, the amplitude of the substrate holding module is greater than the size of the patterned structure.

[0080] In one embodiment, the amplitude of the substrate holding module is set between 25µm and 2000µm.

[0081] In one embodiment, the method further includes the step of driving the substrate holding module and the substrate to rotate during the process of immersing the substrate in the electroplating solution for electroplating.

[0082] Reference Figure 23This illustration depicts an electroplating apparatus for depositing metal on a substrate with a patterned structure according to an optional embodiment of the present invention. The electroplating apparatus 2300 includes an electroplating tank 2301 for containing an electroplating solution, a substrate holding module 2302 for holding a substrate 2303 and electrically connected to the conductive surface of the substrate 2303, and a rotary actuator 2304 for driving the substrate holding module 2302 to rotate along its axis. The electroplating apparatus 2300 also includes a controller 2330 connected to the rotary actuator 2304 for controlling the rotary actuator 2304 to rotate N times and then rotate N times in the opposite direction, this rotation process being alternately performed several cycles. N is less than or equal to 3.0. Preferably, N is 0.5, 1.0, 1.5, 2.0, 2.5, and 3.0. The controller 2330 controls the rotational speed of the rotary actuator 2304 to be below 120 rpm. The electroplating apparatus 2300 further includes at least one anode 2306 disposed in the electroplating tank 2301 and facing the conductive surface of the substrate 2303, and a power supply 2307 electrically connected to the substrate holding module 2302 and the anode 2306. A groove 2308 is provided around the electroplating tank 2301 for receiving electroplating solution overflowing from the electroplating tank 2301. The electroplating apparatus 2300 also includes a liquid storage tank 2310, a pipe 2309 connecting the groove 2308 and the liquid storage tank 2310, and the liquid storage tank 2310 is also connected to the electroplating tank 2301 via another pipe 2309.

[0083] In the electroplating process of this embodiment, the present invention uses a controller 2330 to control a rotary actuator 2304 to rotate N times and then rotate in the opposite direction N times. This rotation process is alternately executed several cycles, where N is less than or equal to 3.0, which improves the uniformity of the electroplated metal in the patterned structure. The high-frequency oscillating motion of the substrate causes drastic changes in the electroplating solution on the substrate surface during the change of rotation direction. The drastic change of the rotary actuator from clockwise to counterclockwise can generate turbulent liquid movement, like a strong water flow, enhancing the agitation of the electroplating solution on the substrate surface. The rotary actuator adopts a point-to-point position control mode.

[0084] The present invention also provides an electroplating method for depositing metal on a substrate having a patterned structure, comprising the following steps:

[0085] The substrate is loaded into the substrate holding module and held by the substrate holding module;

[0086] The substrate is immersed in the electroplating solution in the electroplating bath;

[0087] During the process of immersing the substrate in the electroplating solution for electroplating, a rotary actuator drives the substrate holding module to rotate together with the substrate.

[0088] The rotary actuator is controlled to rotate N times and then rotate in the opposite direction N times. This rotation process is executed alternately in several cycles, where N is less than or equal to 3.0.

[0089] In one embodiment, N is 0.5, 1.0, 1.5, 2.0, 2.5, and 3.0. When N equals 0.5, the substrate holding module will rotate from 0° to 180° and then back. The rotation speed remains constant, resulting in a very high frequency. If the substrate holding module rotates less than 180°, there will be an asymmetrical plating rate on the substrate surface. Therefore, the number of rotations needs to be 0.5, 1.0, 1.5, 2.0, 2.5, and 3.0. If N is greater than 3.0, taking a rotation speed of 60 rpm as an example, it takes 3 seconds to rotate clockwise and then 3 seconds to rotate counterclockwise, resulting in a cycle of 6 seconds. If N is even larger, the cycle length will increase, thus weakening the agitation caused by the drastic changes.

[0090] In one embodiment, the rotational speed of the rotary actuator is controlled to be below 120 rpm.

[0091] All the embodiments of the present invention described above are applicable to non-electroplating methods, such as electroless plating, to uniformly deposit metal on a substrate with a patterned structure.

[0092] All the embodiments of the present invention described above are also applicable to the electrochemical removal of metals from a substrate to obtain a uniform morphology.

[0093] The foregoing description of the present invention is intended to explain the technical solutions. The technical solutions of the present invention are not limited to the specific forms disclosed in this embodiment. Obviously, various modifications and variations can be made based on the teachings given above. These modifications and variations, which are obvious to those skilled in the art, are all within the scope of protection of the claims of this invention.

Claims

1. An electroplating apparatus for depositing metal on a substrate with a patterned structure, characterized in that, include: Electroplating tank, used to hold electroplating solution; Substrate holding module, used to hold the substrate; as well as At least one driving device is used to drive the substrate holding module to vibrate horizontally and / or vertically together with the substrate during the process of the substrate being immersed in the electroplating solution for electroplating, wherein, during the process of the substrate being electroplated, the electroplating solution flows out from the center of the electroplating tank and flows through the center of the substrate to the edge of the substrate, the flow rate of the electroplating solution is V2, and the at least one driving device drives the substrate holding module and the substrate to vibrate at a speed of V1, where V1 is not less than 0.2V2.

2. The electroplating apparatus according to claim 1, characterized in that, The at least one driving device is a motor, a cylinder, or a vibrator.

3. The electroplating apparatus according to claim 1, characterized in that, The substrate holding module holds the substrate horizontally.

4. The electroplating apparatus according to claim 1, characterized in that, The substrate holding module vertically clamps the substrate, and the substrate holding module and the substrate are vertically immersed in the electroplating solution.

5. The electroplating apparatus according to claim 1, characterized in that, It also includes at least one vibrating plate, wherein the at least one driving device drives the substrate to maintain module vibration or resonance at the natural frequency of the at least one vibrating plate.

6. The electroplating apparatus according to claim 5, characterized in that, It also includes a mounting plate and a support base. The base plate holding module includes a bracket. One end of the vibrating plate is connected to the bracket, and the other end of the vibrating plate is connected to the mounting plate. The mounting plate is disposed on the support base.

7. The electroplating apparatus according to claim 6, characterized in that, The mounting plate can move up and down along the support base.

8. The electroplating apparatus according to claim 6, characterized in that, The driving device is mounted on the support and is a vibrator.

9. The electroplating apparatus according to claim 6, characterized in that, It also includes a pair of limiting components for limiting the amplitude of the vibration of the substrate holding module when driven.

10. The electroplating apparatus according to claim 9, characterized in that, The pair of limiting components are mounted on the bracket and located on both sides of the vibrating plate, or the pair of limiting components are mounted on the mounting plate and located on both sides of the vibrating plate.

11. The electroplating apparatus according to claim 6, characterized in that, The driving device is a pair of motors or a pair of cylinders, which are mounted on the bracket and located on both sides of the vibrating plate, or the pair of motors or a pair of cylinders are mounted on the mounting plate and located on both sides of the vibrating plate.

12. The electroplating apparatus according to claim 5, characterized in that, It also includes a mounting plate and a support base. The base plate holding module includes a fixing member and a bracket. The at least one vibrating plate includes a pair of vibrating plates. The bracket has two arms and a base. The two arms of the bracket are disposed on both sides of the fixing member and connected to the pair of vibrating plates. The pair of vibrating plates are connected to both sides of the fixing member. The base of the bracket is connected to the mounting plate. The mounting plate is disposed on the support base.

13. The electroplating apparatus according to claim 12, characterized in that, The mounting plate can move up and down along the support base.

14. The electroplating apparatus according to claim 12, characterized in that, The substrate holding module further includes a vertical connecting component, a horizontal connecting component, an elastic connecting component, and a frame. The vertical connecting component is connected to the base of the bracket and the horizontal connecting component. The horizontal connecting component is connected to the elastic connecting component. The elastic connecting component is connected to the frame. The frame is fixed to the fastener.

15. The electroplating apparatus according to claim 12, characterized in that, The driving device is mounted on the fixing member, and the driving device is a vibrator.

16. The electroplating apparatus according to claim 14, characterized in that, The drive device is mounted on the horizontal connecting component, and the drive device is a motor or a cylinder.

17. The electroplating apparatus according to claim 5, characterized in that, It also includes a mounting plate and a support base. The substrate holding module also includes a fixing member. The vibrating plate is connected to one side of the fixing member and the mounting plate. The mounting plate is disposed on the support base. The driving device is a vertical actuator used to drive the mounting plate to move up and down along the support base so that the substrate holding module vibrates vertically.

18. The electroplating apparatus according to claim 5, characterized in that, The at least one vibrating plate includes a first vibrating plate and a pair of second vibrating plates, and the at least one driving device includes a first driving device and a second driving device. The first driving device is used to drive the substrate to maintain the module to vibrate horizontally or to resonate at the natural frequency of the first vibrating plate, and the second driving device is used to drive the substrate to maintain the module to vibrate vertically or to resonate at the natural frequency of the pair of second vibrating plates.

19. The electroplating apparatus according to claim 18, characterized in that, The second driving device is a vertical actuator.

20. The electroplating apparatus according to claim 1, characterized in that, It also includes a rotary actuator for driving the substrate to rotate.

21. The electroplating apparatus according to claim 1, characterized in that, The substrate holding module includes a substrate clamp fixed on a connecting plate, a rotary actuator, a shaft, a bearing, and a pair of elastic components. The substrate clamp is used to hold the substrate. One end of the shaft is connected to the rotary actuator, and the other end of the shaft is connected to the connecting plate through the bearing. The pair of elastic components are connected to the shaft and the connecting plate. The rotary actuator drives the shaft to rotate and drives the substrate clamp to rotate at a speed of w1. When the substrate clamp rotates for electroplating, the driving device drives the substrate clamp to rotate clockwise and counterclockwise at a speed of w2.

22. The electroplating apparatus according to claim 21, characterized in that, The w2 > w1.

23. The electroplating apparatus according to claim 1, characterized in that, The vibration frequency of the substrate holding module is set to 0.1Hz to 500Hz.

24. The electroplating apparatus according to claim 1, characterized in that, The amplitude of the substrate holding module is greater than the size of the pattern structure on the substrate.

25. The electroplating apparatus according to claim 1, characterized in that, The amplitude of the substrate holding module is set to 25µm to 2000µm.

26. An electroplating method for depositing metal on a substrate with a patterned structure, characterized in that, include: The substrate is loaded into the substrate holding module so that it is held by the substrate holding module; The substrate is immersed in the electroplating solution in the electroplating tank; During the electroplating process of the substrate being immersed in the electroplating solution, the substrate holding module is driven to vibrate horizontally and / or vertically together with the substrate. During the electroplating process, the electroplating solution flows out from the center of the electroplating tank and flows through the center of the substrate to the edge of the substrate. The flow rate of the electroplating solution is V2. The substrate holding module and the substrate are driven to vibrate at a vibration speed of V1, where V1 is not less than 0.2V2.

27. The electroplating method according to claim 26, characterized in that, The substrate is held horizontally by the substrate holding module.

28. The electroplating method according to claim 26, characterized in that, The substrate is vertically held by a substrate holding module, and the substrate holding module and the substrate are vertically immersed in the electroplating solution.

29. The electroplating method according to claim 26, characterized in that, The vibration frequency of the substrate holding module is set to 0.1 Hz to 500 Hz.

30. The electroplating method according to claim 26, characterized in that, The amplitude of the substrate holding module is greater than the size of the pattern structure on the substrate.

31. The electroplating method according to claim 26, characterized in that, The amplitude of the substrate holding module is set to 25µm to 2000µm.

32. The electroplating method according to claim 26, characterized in that, Also includes: During the electroplating process, the substrate is driven to rotate while being immersed in the electroplating solution.

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