Lighting module and lighting device comprising the same

Abstract

Embodiments of the present application disclose a lighting device, comprising: a substrate including a recess; a light source disposed on the substrate; a resin layer disposed on the substrate; and a wavelength conversion layer on the resin layer. A portion of the resin layer is disposed within the recess of the substrate. A portion of the wavelength conversion layer is disposed on the recess of the substrate. An outermost surface of the portion of the resin layer disposed in the recess of the substrate can be located outside an inner surface of the wavelength conversion layer.

Description

Technical Field

[0001] The embodiments relate to a lighting module and lighting device including a light source and a resin layer. Embodiments of the present invention relate to a lighting module and lighting device for providing surface light through a resin having a colored surface. Embodiments of the present invention relate to a vehicle lamp having a lighting module or lighting device. Background Technology

[0002] Lighting applications include vehicle lights and backlighting for displays and signage. Compared to conventional light sources such as fluorescent and incandescent lamps, light-emitting diodes (LEDs) offer advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness. These LEDs are used in various display devices and lighting fixtures (e.g., indoor or outdoor lights). Recently, LED-based lights have been proposed as vehicle light sources. Compared to incandescent lamps, LEDs have the advantage of low power consumption. However, due to the small pointing angle of LEDs, the luminous area of ​​the lamp needs to be increased when LEDs are used as vehicle lights. The small size of LEDs increases design freedom and offers economic benefits due to their semi-permanent lifespan. Summary of the Invention

[0003] Technical issues

[0004] Embodiments of the present invention can provide an illumination module and illumination device that provide surface light through a colored surface. Embodiments of the present invention can provide an illumination module and illumination device having a resin layer covering a light source and a wavelength conversion layer covering the resin layer. Embodiments of the present invention can provide an illumination module and illumination device wherein a recess is provided in a substrate on which a light source is disposed, and at least one or both of a portion of the resin layer and a portion of the wavelength conversion layer are disposed in the recess. Embodiments of the present invention can provide an illumination module and illumination device wherein a recess is provided in a substrate on which a light source is disposed, and at least one or more of a portion of the resin layer, a portion of the phosphor layer, and a portion of the ink layer are disposed in the recess. Embodiments of the present invention can provide an illumination module and illumination device wherein a recess is provided in a substrate on which a light source is disposed, and the recess perpendicularly overlaps with a wavelength conversion layer having at least one of a phosphor layer and an ink layer. Embodiments of the present invention can provide an illumination module and illumination device wherein a recess is provided in a substrate on which a light source is disposed, and the outermost surface of the portion of the resin layer disposed in the recess is disposed outside the innermost or outermost surface of the wavelength conversion layer. Embodiments of the present invention provide a lighting module and a lighting device, wherein the recess in the substrate is a hole or groove extending from the upper surface to the lower surface of the substrate, and the recess is filled with different resin layers stacked on the substrate. Embodiments of the present invention can provide a lighting module for illuminating surface light and a lighting device having the lighting module, and can be applied to lamp units, liquid crystal display devices, or vehicle lights.

[0005] Technical solution

[0006] An illumination device according to an embodiment of the present invention includes: a substrate, the substrate including a recess; a light source disposed on the substrate; a resin layer disposed on the substrate; and a wavelength conversion layer disposed on the resin layer, wherein a portion of the resin layer is disposed in the recess of the substrate, and a portion of the wavelength conversion layer is disposed on the recess of the substrate, wherein the outermost surface of the portion of the resin layer disposed in the recess of the substrate may be located outside the inner surface of the wavelength conversion layer.

[0007] According to an embodiment of the present invention, the recess of the substrate may overlap with the side surfaces of the wavelength conversion layer and the resin layer in a vertical direction. An illumination device according to an embodiment of the present invention includes: a substrate including a recess; a light source disposed on the substrate; a resin layer disposed on the substrate; and a wavelength conversion layer disposed on the resin layer, wherein the light source includes a plurality of light-emitting devices arranged in N rows and M columns, the wavelength conversion layer includes an upper portion disposed on an upper surface of the resin layer and a side portion connected to the upper portion and disposed on a side surface of the resin layer, and the recess of the substrate may vertically overlap with a portion of the side portion of the wavelength conversion layer. According to an embodiment of the present invention, a portion of the recess of the substrate may be located outside the outer surface of the resin layer. Another portion of the recess of the substrate may be located inside the outer surface of the resin layer.

[0008] According to one embodiment of the present invention, the width of the recess in the substrate may be greater than the thickness of the wavelength conversion layer. The depth of the recess in the substrate may be less than or equal to the thickness of the substrate. The lower end of the wavelength conversion layer overlapping the recess in the substrate may be disposed in the recess in the substrate, or may be disposed on the same plane as the upper surface of the substrate. According to an embodiment of the present invention, the maximum height of a region of the wavelength conversion layer overlapping the recess in the substrate may be greater than or equal to the height of the wavelength conversion layer disposed on the substrate. According to an embodiment of the present invention, the recess may be a groove or a hole. The light-emitting device may include an LED chip and a resin component disposed on the LED chip. According to an embodiment of the present invention, the wavelength conversion layer may include a phosphor layer and an ink layer disposed on the phosphor layer. The wavelength conversion layer may be formed by mixing a colored phosphor and a colored ink. According to an embodiment of the present invention, the spacing between two adjacent light-emitting devices in the plurality of light-emitting devices may be 5 mm or more.

[0009] An illumination device according to an embodiment of the present invention includes: a substrate; a light source disposed on the substrate; a resin layer disposed on the substrate; and a wavelength conversion layer disposed on the resin layer, wherein the wavelength conversion layer includes a first side surface corresponding to a first side surface of the resin layer, and the first side surface of the wavelength conversion layer may include a first region overlapping a portion of the resin layer in a direction perpendicular to the substrate. According to an embodiment of the present invention, the first region of the wavelength conversion layer may be spaced apart from the substrate.

[0010] A portion of the resin layer may be disposed between the first region and the substrate. The wavelength conversion layer may include a hole, and the first region may be the region above the hole.

[0011] Beneficial effects

[0012] According to embodiments of the present invention, the uniformity of surface light can be improved by means of an illumination module or illumination device. According to embodiments of the present invention, light from a light source can be diffused in the illumination module or illumination device, and the diffused light can be wavelength-converted and emitted through a colored surface. According to embodiments of the present invention, hot spots can be suppressed and a colored image can be provided on the surface when the light is off due to the presence of a colored wavelength conversion layer in the illumination module or illumination device. According to embodiments of the present invention, a flexible illumination module can be provided by laminating multiple layers of resin material onto a substrate to a thin thickness. According to embodiments of the present invention, light leakage through the sides of the layers of resin material laminated on the substrate can be prevented. Therefore, the optical reliability of the illumination module or illumination device can be improved. Embodiments of the present invention can improve the luminous efficiency and light distribution characteristics of surface illumination and reduce the chromaticity difference between the external image and the luminous image. It can be applied to vehicle lights, backlight units, various types of display devices, surface light source illumination devices, or vehicle lights having illumination devices according to embodiments of the present invention. Attached Figure Description

[0013] Figure 1 This is an example showing a plan view of a lighting device according to an embodiment of the present invention;

[0014] Figure 2 It is along Figure 1 A sectional view of the lighting device taken from line AA;

[0015] Figure 3 yes Figure 2 A magnified view of a recess in the substrate;

[0016] Figure 4 yes Figure 2 The first modified example of the lighting device;

[0017] Figure 5 yes Figure 2 A second modified example of a lighting device;

[0018] Figure 6 yes Figure 2 The third modification example of the lighting device;

[0019] Figure 7 yes Figure 2 The fourth modification example of the lighting device;

[0020] Figure 8 yes Figure 2The fifth modification example of the lighting device;

[0021] Figure 9 yes Figure 2 The sixth modification example of the lighting device;

[0022] Figure 10 This is a side sectional view illustrating another example of a lighting device according to an embodiment of the present invention;

[0023] Figure 11 and 12 It is shown Figure 2 A view of the manufacturing process of the lighting device;

[0024] Figure 13 and Figure 14 yes Figure 1 Modification of the recessed portion of the substrate in the lighting device;

[0025] Figure 15 This is a plan view of a vehicle equipped with lamps having a lighting device according to an embodiment of the present invention;

[0026] Figure 16 It is shown Figure 15 A view showing the detailed configuration of the vehicle's taillights. Detailed Implementation

[0027] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. However, the spirit of the invention is not limited to the described embodiments, but can be implemented in various different forms, and one or more components can be selectively combined and substituted within the scope of the spirit of the invention. Furthermore, the terminology (including technical and scientific terms) used in the embodiments of the invention can be interpreted as meaning commonly understood by one of ordinary skill in the art, unless specifically defined and described, and can be interpreted in light of the context of related art, such as terms defined in a dictionary. Additionally, the terminology used in the embodiments of the invention is for describing embodiments and is not intended to limit the invention. In this specification, unless otherwise stated in the phrase, the singular form may also include the plural form, and when describing "at least one (or one or more) of A and (and) B, C", it may include one or more of all combinations that A, B, and C can be combined. Furthermore, when describing components of the embodiments of the invention, terms such as first, second, A, B, (a), (b), etc., may be used. These terms are only used to distinguish components from other components and are not determined by the nature, order, or procedure of the corresponding constituent elements. Furthermore, when describing a component as "connected," "coupled," or "joined" to another component, this description can include not only direct "connection," "coupling," or "joining" to the other component, but also being "connected," "coupled," or "joined" through another component located between the component and the other component. Additionally, when describing something as being formed or disposed "above" or "below" each component, this description can include not only two components in direct contact with each other, but also one or more other components formed or disposed between the two components. Moreover, when expressed as "above" or "below," it can include not only an upward direction relative to a single element, but also a downward direction relative to that single element.

[0028] The lighting device according to the present invention can be applied to various lighting devices requiring illumination, such as vehicle lights, household lighting devices, or industrial lighting devices. For example, when applied to vehicle lights, it can be used for headlights, sidelights, side mirrors, fog lights, taillights, brake lights, daytime running lights, interior lights, door sills, rear combination lights, reversing lights, etc. The lighting device of the present invention can be applied to various fields of indoor and outdoor advertising devices, display devices, and electric vehicles. Furthermore, it can be applied to all lighting-related or advertising-related fields that have been developed and commercialized or that can be realized according to future technological developments.

[0029] <First Embodiment>

[0030] Figure 1This is an example of a plan view of a lighting device according to an embodiment of the present invention. Figure 2 It is along Figure 1 An example of a sectional view of a lighting device taken from line AA. Figure 3 yes Figure 2 A magnified view of a recess in the substrate. (Reference) Figures 1 to 3 The lighting device 100 may include a substrate 11, a light source 21 disposed on the substrate 11, a resin layer 31 disposed on the substrate 11, and a wavelength conversion layer 60 disposed on the resin layer 31. The lighting device 100 can emit light emitted from the light source 21 as surface light. The lighting device 100 can emit light emitted from the light source 21 as surface light through colored resin.

[0031] Substrate 11 is disposed below light source 21 and resin layer 31 and can serve as a substrate or support member. Substrate 11 includes a printed circuit board (PCB). Substrate 11 may include at least one of, for example, resin-based PCB, metal-core PCB, flexible PCB, ceramic PCB, and FR-4 PCB. Substrate 11 may include, for example, a flexible PCB or a rigid PCB. Wiring layers (not shown) may be included on substrate 11, and the wiring layers may be electrically connected to light source 21. Substrate 11 may include a protective layer (not shown) for protecting the wiring layers. The protective layer may be a material that protects the wiring layers and reflects incident light. The protective layer may include a solder resist material. The top view shape of substrate 11 may be rectangular, square, or other polygonal, and may be a strip with a curved shape. A connector (not shown) for power supply may be disposed in a portion of substrate 11. As another example, substrate 11 may include a transparent material. Because substrate 11 is provided to be made of a transparent material, light emitted from light source 21 can be emitted toward the upper surface, side surface, and lower surface of substrate 11. The upper surface of substrate 11 may have X-axis and Y-axis planes, and the thickness of substrate 11 may be the height in the Z direction orthogonal to the X and Y directions. Here, the X direction may be a first direction, the Y direction may be a second direction orthogonal to the X direction, and the Z direction may be a third direction orthogonal to the X and Y directions. The length of substrate 11 in the first direction X and the length in the second direction Y may be the same as or different from each other; for example, the length in the first direction X may be smaller than the length in the second direction Y. The length in the second direction Y may be at least twice the length in the first direction X. The thickness of substrate 11 may be 0.5 mm or less, for example, in the range of 0.3 mm to 0.5 mm. Because the thickness of substrate 11 is set relatively thin, the thickness of the lighting device will not increase. Because substrate 11 has a thickness of 0.5 mm or less, it can support a flexible module.

[0032] The thickness of the lighting device 100 can be the distance from the lower surface of the substrate 11 to the upper surface of the wavelength conversion layer 60. The thickness of the lighting device 100 can be less than 1 / 3 of the shorter side length of the substrate 11 in the first and second directions, but is not limited to this. The thickness of the lighting device 100 can be less than 5.5 mm, or in the range of 4.5 mm to 5.5 mm, or in the range of 4.5 mm to 5 mm. The thickness of the lighting device 100 can be less than 220% of the thickness of the resin layer 31, for example, in the range of 180% to 220%. Because the lighting device 100 has a thickness of less than 5.5 mm, it can be provided as a flexible and thin surface-mount light module. When the thickness of the lighting device 100 is less than the above range, the light diffusion space is reduced, which may generate hot spots. Due to its thin thickness, the lighting device 100 can be provided as a module capable of having a curved structure. Therefore, the design freedom and space constraints of the lighting device can be reduced.

[0033] The lighting device 100 may include a reflective member 15 disposed on a substrate 11. The reflective member 15 may reflect light propagating toward the upper surface of the substrate 11 to the resin layer 31. The reflective member 15 may be attached to all or part of the upper surface of the substrate 11, for example, it may be attached between the substrate 11 and the resin layer 31. The reflective member 15 may have openings in which areas where the light source 21 is disposed are respectively opened. The reflective member 15 may be spaced apart from or in contact with the underside of the wavelength conversion layer 60. The reflective member 15 may have a single-layer or multi-layer structure. The reflective member 15 may include a material that reflects light, such as a metallic or non-metallic material. When the reflective member 15 is metallic, it may include a metal layer such as stainless steel, aluminum (Al), or silver (Ag), and in the case of a non-metallic material, it may be a white resin material, a resin material filled with metal oxides and / or air, or it may include a plastic material. For example, the reflective member 15 may include a white resin material or a polyester (PET) material. The reflective member 15 may include at least one of a low-reflection film, a high-reflection film, a diffuse reflection film, and a regular reflection film.

[0034] The light source 21 may include multiple light-emitting devices disposed on the substrate 11. The multiple light-emitting devices may be arranged in N rows and M columns, where N and M are integers equal to or greater than 1, and may have a relationship of N ≥ M. For example, N may be 5 or more rows, and M may be 2 or more columns. The multiple light-emitting devices may be connected in series, in parallel, or in a series-parallel connection via wiring layers of the substrate 11. Among the multiple light-emitting devices, groups of two or more may be connected in series or in parallel, or groups may be connected in series or in parallel. Light emitted from the light source 21 may be emitted through the resin layer 31. The light source 21 or the light-emitting devices may include LED chips. The light-emitting devices may include at least one of blue, green, or red LED chips. The light-emitting device may be configured as an LED chip, or a resin component with phosphors and / or an insulating component without phosphors may be disposed on the surface of the LED chip. For example, the light-emitting device may emit blue, red, or white light. As another example, the light-emitting device may be configured as an ultraviolet (UV) or infrared LED. The light-emitting device may emit light through its four side surfaces and top surface. The light-emitting devices can be disposed on the substrate 11 as flip-chip LEDs, or as horizontal or vertical LEDs that can be electrically connected via wiring. Since the light source 21 is configured as a flip-chip emitting light from at least five sides, the brightness distribution and beam angle distribution of the light emitted to the light source 21 can be improved. The light source 21 can have a thickness of 0.4 mm or less, for example, in the range of 0.2 mm to 0.4 mm. The light source 21 may include micro-LED chips. The micro-size can have a side length of 5 μm to 100 μm. The spacing between the light-emitting devices of the light source 21 can be equal to or greater than the thickness of the resin layer 31. The spacing can be, for example, 2.5 mm or greater, for example, in the range of 2.5 mm to 8 mm, or in the range of 5 mm to 7 mm. The spacing between the light-emitting devices can vary depending on the size of the LED chips. The light source 21 is disposed on the substrate 11 and can be sealed by the resin layer 31. The light source 21 can be in contact with the resin layer 31. The resin layer 31 can be disposed on the side and top surfaces of the light source 21. The resin layer 31 protects the light source 21 and can contact the upper surface of the substrate 11 and / or the reflective member 15. The resin layer 31 can be disposed in the area between the light-emitting devices and on each light-emitting device, and can guide and diffuse the incident light.

[0035] A resin layer 31 may be disposed on a substrate 11. The resin layer 31 may contact at least one of the upper surface of the substrate 11, the surface of the reflective member 15, and the surface of the light source 21, and may seal the light source 21. The resin layer 31 may be formed as a single layer or multiple layers. In the case of a single layer, it may be formed as a single layer of transparent resin material; in the case of multiple layers, it may include a first layer of transparent resin material and a second layer on the first layer having at least one of a diffusion layer, a phosphor layer, or an ink layer. As another example, impurities such as diffusing agents and / or phosphors may be contained in a single resin layer. For example, in embodiments of the invention, considering light transmission efficiency, the resin layer 31 may be a layer without impurities or a layer with a small amount of diffusing agent added (e.g., 3 wt% or less of diffusing agent). The dispersant may include at least one of the polymethyl methacrylate (PMMA) series, TiO2, SiO2, Al2O3, and silicon series. The phosphor may include at least one of red phosphors, green phosphors, blue phosphors, and yellow phosphors. The resin layer 31 may include resin or resin-based materials. The resin layer 31 can be made of a transparent resin material, such as UV (ultraviolet) resin, silicone resin, or epoxy resin. The thickness of the resin layer 31 can be greater than the thickness of the light source 21. The thickness of the resin layer 31 can be greater than the thickness of the substrate 11. The thickness of the resin layer 31 can be more than 5 times the thickness of the substrate 11, for example, in the range of 5 to 9 times. By setting the resin layer 31 to the aforementioned thickness, the light source 21 can be sealed onto the substrate 11, preventing moisture penetration and supporting the substrate 11. The resin layer 31 and the substrate 11 can be formed of a flexible sheet. The thickness of the resin layer 31 can be 4 mm or less, for example, in the range of 2 mm to 4 mm. When the thickness of the resin layer 31 is less than the aforementioned range, hot spots may increase, and when the thickness of the resin layer 31 is less than the aforementioned range, the luminous intensity may decrease or the ductility may be limited. The resin layer 31 is disposed between the substrate 11 and the wavelength conversion layer 60, guiding and diffusing the light emitted from the light source 21 and providing it as the wavelength conversion layer 60. When there are no impurities in the resin layer 31, the straightness of the light can be improved. When the material of the resin layer 31 has a refractive index of 1.4 or greater at the emission wavelength, the uniformity of the light can be improved. Therefore, the refractive index of the resin material can be 1.8 or less, for example, in the range of 1.1 to 1.8 or in the range of 1.4 to 1.6.

[0036] The resin layer 31 may have a polygonal top-view shape or a curved shape. The lower surface area of ​​the resin layer 31 may be set to be smaller than the upper surface area of ​​the substrate 11, for example, more than 60% of the upper surface area of ​​the substrate 11. The side surfaces of the resin layer 31 may be spaced apart from the outer surface of the substrate 11.

[0037] A wavelength conversion layer 60 may be disposed on the resin layer 31. The wavelength conversion layer 60 may be disposed on the upper surface of the resin layer 31, or on both the upper and side surfaces of the resin layer 31. For example, the wavelength conversion layer 60 may include an upper portion disposed on the upper surface of the resin layer 31 and a side portion extending from the upper edge toward the substrate 11. The side portion of the wavelength conversion layer 60 may cover the side surface of the resin layer 31. The upper and side portions of the wavelength conversion layer 60 may be in contact with the surface of the resin layer 31. The wavelength conversion layer 60 may comprise a single layer or multiple layers. When the wavelength conversion layer 60 is a single layer, it may be formed from layers of resin material with different impurities. When the wavelength conversion layer 60 is a multiple layer, it may be at least two or three layers, and may be formed from layers of resin material with different impurities, with each layer of resin material including at least one impurity.

[0038] like Figure 1 and Figure 2 As shown, the wavelength conversion layer 60 may include a phosphor layer 41 and an ink layer 51. The phosphor layer 41 may be disposed between the resin layer 31 and the ink layer 51. The phosphor layer 41 may be formed on the surface of the resin layer 31. The phosphor layer 41 may extend from the upper surface of the resin layer 31 to the lower end of its side surface. The lower outer end of the phosphor layer 41 may contact the upper surface of the substrate 11 and / or the upper surface of the reflective member 15. The ink layer 51 may be formed on the outer surface of the phosphor layer 41 and may contact the upper portion 42 and the side portion 43 of the phosphor layer 41. Here, the upper portion 42 of the phosphor layer 41 and the upper portion 52 of the ink layer 51 are the upper portions of the wavelength conversion layer 60, and the side portions 43 of the phosphor layer 41 and the side portions 53 of the ink layer 51 may be the side portions of the wavelength conversion layer 60. The ink layer 51 may be the outermost layer of the wavelength conversion layer 60 and may provide the surface color of the illumination device. The color of the phosphor added to the phosphor layer 41 may not be exposed on the surface of the ink layer 51. The phosphor layer 41 can be made of a transparent resin material, such as silicone resin or epoxy resin, or UV (ultraviolet) resin. The phosphor layer 41 may include a colored phosphor in the transparent material, for example, at least one of red, blue, yellow, green, and white phosphors. The phosphor layer 41 may include a phosphor and a diffusing agent. The thickness of the phosphor layer 41 can be 1 mm or less, for example, in the range of 300 μm to 1 mm or in the range of 300 μm to 700 μm. Based on the weight of the phosphor layer 41, the phosphor content added to the phosphor layer 41 can be 40 wt% or less, for example, in the range of 10 wt% to 23 wt%, or in the range of 15 wt% to 30 wt%. When the thickness and phosphor content of the phosphor layer 41 exceed the above ranges, the light transmission efficiency may decrease; when the thickness and phosphor content are below the above ranges, the wavelength conversion efficiency may decrease.

[0039] Because the ink layer 51 is disposed on the surface of the phosphor layer 41, the phosphor content can be reduced. That is, light emitted from the light source 21 can be emitted after wavelength conversion by the phosphor layer 41, while light that has not undergone wavelength conversion can be blocked or reflected by the ink layer 51. When a diffusing agent is added to the phosphor layer 41, its content can be less than the phosphor content. Based on the weight of the phosphor layer 41, the diffusing agent content can be 3 wt% or less, for example, in the range of 1 wt% to 3 wt%. When the diffusing agent content exceeds the above range, the light transmission efficiency may decrease, while when the diffusing agent content is less than the above range, the light distribution may be uneven. In embodiments of the present invention, when removing the diffusing agent, hot spots can be reduced by using phosphors and ink particles.

[0040] The ink layer 51 can be made of a transparent resin material, such as silicone resin or epoxy resin, or UV (ultraviolet) resin. The ink layer 51 can have a thickness of 1 mm or less, for example, in the range of 300 μm to 1 mm or in the range of 300 μm to 700 μm. The ink layer 51 can include ink particles. Based on the weight of the ink layer 51, the ink particles can be added to the ink layer 51 in an amount of 20 wt% or less, for example, in the range of 4 wt% to 20 wt%, or in the range of 4 wt% to 15 wt%. By adjusting the amount of ink particles, the lighting device 100 can reduce color difference on the surface and reduce hot spots. The weight of the ink particles added to the ink layer 51 can be less than the weight of the phosphor added to the phosphor layer 41. The ink particles can be distributed on the surface of the wavelength conversion layer 60, rather than on the phosphor. Therefore, the color of the surface of the wavelength conversion layer 60 can be set to the color of the ink particles. These ink particles can suppress light transmission and reduce hot spots. The ink particles may include colored ink particles, for example, at least one of metallic inks, UV inks, and curable inks. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles may be any of green, red, yellow, and blue. Ink types may be selectively applied from PVC (polyvinyl chloride) inks, PC (polycarbonate) inks, ABS (acrylonitrile butadiene styrene copolymer) inks, UV resin inks, epoxy resin inks, silicone resin inks, PP (polypropylene) inks, water-based inks, plastic inks, PMMA (polymethyl methacrylate) inks, and PS (polystyrene) inks. Here, the width or diameter of the ink particles may be 5 μm or less, or in the range of 0.05 μm to 1 μm. At least one of the ink particles may be smaller than the wavelength of light. The color of the ink particles may include at least one of red, green, yellow, and blue. For example, the phosphor may emit a red wavelength, and the ink particles may include red. For example, the red of the ink particles may be darker than the color of the phosphor or the wavelength of light. The ink particles may have a color different from the color of the light emitted from light source 21. The ink particles may have the effect of blocking or preventing incident light.

[0041] The color of the surface of the wavelength conversion layer 60 can serve as the color perception of the ink particles, reducing color difference in the external image and preventing degradation of wavelength conversion efficiency depending on the on / off state of the light source 21. Light emitted from the light source 21 is wavelength-converted as it passes through the phosphor layer 41 of the wavelength conversion layer 60, and then emitted through the ink layer 51. Light that is not wavelength-converted can be blocked or reflected by the ink layer 51. Therefore, wavelength-converted light can be emitted as surface light through the surface of the wavelength conversion layer 60. Here, the upper portion 42 of the phosphor layer 41 can be formed to be the same as or thicker than the side portion 43 of the phosphor layer 41. Therefore, the wavelength conversion efficiency in the upper portion 42 of the phosphor layer 41 can be improved. Here, the upper portion 52 of the ink layer 51 can be formed to be the same as or thicker than the side portion 53 of the ink layer 51. Therefore, hot spots on the upper portion 52 of the ink layer 51 can be suppressed. The side portion 43 of the phosphor layer 41 can be formed in a vertical, inclined, or curved shape from the upper part of the substrate 11 to the upper part 42 of the phosphor layer 41. The side portion 53 of the ink layer 51 can be formed in a shape with a vertical, inclined, or curved surface from the upper part of the substrate 11 to the upper part 52 of the ink layer 51. The shapes of the phosphor layer 41 and the ink layer 51 can vary depending on the outer surface of the resin layer 31.

[0042] like Figure 1 and Figure 3 As shown, the substrate 11 may include a recess 13 in a portion of its side surface. The recess 13 may be a groove recessed inward from the outer surface S1 of the substrate 11. The recess 13 may be a hole or groove extending from the upper surface to the lower surface of the substrate 11. When the recess 13 is a groove, a region of the substrate 11 may be located below the recess 13. The length of the recess 13 (W0, Figure 1 The length W0 in the second direction Y can be 500 μm or more, for example, within the range of 500 μm to 10 mm. When the length W0 of the recess 13 is narrower than the above range, the filling pressure during resin layer 31 injection may increase or the filling efficiency may decrease. The recess 13 formed in a portion of the outer surface S1 of the substrate 11 can be spaced from a corner of the substrate 11 by a predetermined distance K1, where K1 can be more than one time and less than three times the length W0 of the recess 13. Therefore, it is possible to prevent the rigidity of the substrate 11 from decreasing due to the space where the recess 13 is formed.

[0043] like Figure 3As shown, the width W1 of the recess 13 is the distance from the outer surface S1 of the substrate 11 in the inner direction (e.g., X) of the resin layer 31, and can be, for example, 0.3 mm or more, in the range of 0.3 mm to 10 mm or in the range of 0.3 mm to 5 mm. The width W1 of the recess 13 can vary depending on the distance D1 from the side surface S2 of the wavelength conversion layer 60 to the outer surface S1 of the substrate 11. The distance D1 between the outer surface of the recess 13 and the outer surface S2 of the wavelength conversion layer 60 can vary depending on the size of the exposed upper surface of the substrate 11, for example, 0.3 mm or more, in the range of 0.3 mm to 1 mm, or in the range of 0.3 mm to 0.8 mm. The distance D1 can be a distance that does not affect the modules during the cutting process between modules. The outer surface of the recess 13 can be on the same plane as the side surface of the substrate 11. The distance D2 between the inner surface of the wavelength conversion layer 60 and the inner surface of the recess 13 can be 0.1 mm or more, for example, in the range of 0.1 mm to 0.4 mm, or in the range of 0.1 mm to 0.3 mm. The distance D2 can vary depending on the thickness of the substrate 11, the depth of the groove 35A, or the tilt angles R1 and R2. When the width W1 of the recess 13 is narrower than the above range, the filling pressure may increase or the filling efficiency may decrease when injecting the resin layer 31.

[0044] The width W1 of the recess 13 can be greater than the thickness of the phosphor layer 41. The width W1 of the recess 13 can be greater than the thickness of the ink layer 51. The width W1 of the recess 13 can be greater than the thickness of the wavelength conversion layer 60. Therefore, one end of the side portion of the wavelength conversion layer 60 can be bonded to the recess 13. The width W1 and length W0 of the recess 13 can be equal to or different from each other. For example, the length W0 of the recess 13 can be set to be greater than the width W1, thereby improving the filling efficiency. The depth of the recess 13 can be equal to or less than the thickness of the substrate 11. When the depth of the recess 13 is equal to the thickness of the substrate 11, the lower surface of the end portion of the wavelength conversion layer 60 can be exposed to the lower surface of the substrate 11. When the depth of the recess 13 is less than the thickness of the substrate 11, the lower surface of the end portion of the wavelength conversion layer 60 is spaced apart from the lower surface of the substrate 11, or may not be exposed to the lower surface of the substrate 11. Alternatively, the lower end of the side portion of the wavelength conversion layer 60 may be disposed in the recess 13 of the substrate 11, or it may be located on the same plane as the upper surface of the substrate 11. The total height of the region or side portion of the wavelength conversion layer 60 that overlaps with the recess 13 of the substrate 11 is greater than or equal to the height of the wavelength conversion layer 60 disposed on the substrate 11.

[0045] A portion 35 of the resin layer 31 may be disposed in the recess 13. A portion 45 and 55 of the wavelength conversion layer 60 may be disposed in the recess 13. A portion 35 of the resin layer 31 and portions 45 and 55 of the wavelength conversion layer 60 may be disposed in the recess 13. The interior region of the recess 13 may overlap with the resin layer 31 in the vertical direction. The recess 13 may vertically overlap with the sides (e.g., 43 and 53) of the wavelength conversion layer 60. The recess 13 may vertically overlap with the side 43 of the phosphor layer 41 and the side 53 of the ink layer 51. At least one or both of the lower end portion 45 of the side 43 of the phosphor layer 41 and the lower end portion 55 of the side 53 of the ink layer 51 may be disposed in the recess 13.

[0046] A portion 35 of the resin layer 31 may be exposed on the outer surface of the recess 13 in the substrate 11. The outer surface of the portion 35 of the resin layer 31 may be positioned further outward than the outer surface S2 of the wavelength conversion layer 60. The outer surface of the portion 35 of the resin layer 31 may be positioned further outward than the outer surface of the side portion 53 of the ink layer 51. The portion 35 of the resin layer 31 is disposed below the upper surface of the substrate 11, and the outer surface of the resin layer 31 may protrude further outward than the outer surface of the wavelength conversion layer 60 through the recess 13. The portion 35 of the resin layer 31 may be a protrusion extending into the recess 13. The lower end of the portion 35 of the resin layer 31 may be exposed on the lower surface of the recess 13 in the substrate 11. At least one or both of the lower ends of the side portion 43 of the phosphor layer 41 and the lower ends of the side portion 53 of the ink layer 51 may be exposed on the lower surface of the recess 13 in the substrate 11. On the lower surface of the recess 13, the area of ​​the lower surface of the lower end of the side portion 53 of the ink layer 51 can be equal to or greater than the area of ​​the lower surface of the lower end of the side portion 43 of the phosphor layer 41.

[0047] A portion 35 of the resin layer 31 may include an inner portion 13A disposed inside the lower end portion (e.g., 45, 55) of the side portion of the wavelength conversion layer 60 and an outer portion exposed to the outside. The lower end portion of the side portion of the wavelength conversion layer 60 may extend between the inner portion 13A and the outer portion. The lower end portion 45 of the side portion 43 of the phosphor layer 41 may be disposed between the inner portion 13A and the outer portion, or the lower end portion 45 of the side portion 43 of the phosphor layer 41 and the lower end portion 55 of the side portion 53 of the ink layer 51 may be disposed between the inner portion 13A and the outer portion. The inner surfaces of the lower ends 45 and 55 of the wavelength conversion layer 60 disposed in the recess 13 may be inclined at a first angle R1. The first angle R1 may be formed at an acute angle relative to the horizontal lower surface of the substrate 11. The outer surface of the lower end portion of the wavelength conversion layer 60 disposed in the recess 13 may be inclined at a second angle R2. The second angle R2 may be formed at an acute angle relative to the horizontal lower surface of the substrate 11. The first angle R1 and the second angle R2 can be the same or different from each other, and can be in the range of 1 degree to 60 degrees or 5 degrees to 30 degrees. The first angle R1 and the second angle R2 can vary according to the angle of the groove 35A cut in the recess 13 of a portion 35 of the resin layer 31. Cutting can be made from the lower surface of a portion 35 of the resin layer 31 toward the upper part of the recess 13, and the cut groove 35A can be triangular or rectangular in the recess 13. The total area of ​​the cut groove 35A can be smaller than the area of ​​the recess 13. The lower surface area of ​​the groove 35A can be larger than the upper surface area. The inner surface of the lower end of the wavelength conversion layer 60 can contact the substrate 11, or can contact the surface or side surface of the recess 13. That is, the lower end 45 of the side portion 43 of the phosphor layer 41 can contact the inner surface and two side surfaces of the recess 13. The lower end 55 of the side portion 53 of the ink layer 51 can contact the two side surfaces of the recess 13. Therefore, since the lower end of the wavelength conversion layer 60 is in contact with the inner surface of the substrate 11 (i.e. the side surface of the recess 13), the space between the wavelength conversion layer 60 and the substrate 11 is reduced or eliminated, and light leakage can be blocked.

[0048] Here, the thickness of the lower end portion 45 of the phosphor layer 41 can be equal to or less than the thickness of the side portion 43 of the phosphor layer 41. Since the lower end portion 45 of the phosphor layer 41 is formed along the inclined inner surface of the cutting groove 35A, the thickness of the phosphor layer 41 can be equal to or less than the thickness of the side portion 43 of the phosphor layer 41. Here, the thickness of the lower end portion 45 of the ink layer 51 can be equal to or greater than the thickness of the side portion 53 of the ink layer 51. Since the lower end portion 55 of the ink layer 51 fills the space between the inclined outer surface of the cutting groove 35A and the outer surface of the lower end portion 45 of the phosphor layer 41, the thickness of the lower end portion 55 of the ink layer 51 can be greater than the thickness of the side portion 53 of the ink layer 51. The outer upper surface of a portion 35 of the resin layer 31 disposed in the recess 13 can be configured as a stepped structure relative to the outer surface S2 of the wavelength conversion layer 60 or the outer surface of the ink layer 51.

[0049] refer to Figure 4 In a first modification, a portion of the resin layer 31 may extend or protrude from the recess 13 of the substrate 11. The lower end portion 50C of the wavelength conversion layer 50 may extend through a portion of the resin layer 31 disposed in the recess 13. The wavelength conversion layer 50 may include an upper portion 50A and a side portion 50B. The lower end portion 50C of the wavelength conversion layer 50 (e.g., the lower end portion 50C of the side portion 50B) extends into the recess 13 of the substrate 11, or may extend through a portion 35 of the resin layer 31. The wavelength conversion layer 50 may be formed as a single layer and may include phosphors and ink particles. The amount of phosphor added to the wavelength conversion layer 50 may be greater than the amount of ink particles. Based on the weight of the wavelength conversion layer 50, the amount of added phosphor may be less than 23 wt% or in the range of 10 wt% to 23 wt%, and based on the weight of the wavelength conversion layer 50, the amount of added ink particles may be less than 12 wt%, for example, in the range of 4 wt% to 12 wt%. Based on the weight of the wavelength conversion layer 50, the phosphor content in the wavelength conversion layer 50 can be 3 wt% or more higher than the ink particle content, or it can be added in the range of 3 wt% to 13 wt%. Since the ink particles weigh less than the phosphor, they can be distributed in regions closer to the surface of the wavelength conversion layer 50 than the phosphor. Therefore, the color of the surface of the wavelength conversion layer 50 can be set to the color of the ink particles. These ink particles can suppress light transmission and reduce hotspots.

[0050] The lower end portion 50C of the wavelength conversion layer 50 can have a larger width or thickness facing the lower surface of the recess 13. The lower end portion 50C of the wavelength conversion layer 50 is further spaced from the upper end to the lower end of the inner surface of the substrate 11, and can be closer to the outer surface of the substrate 11 from the upper end to the lower end of the outer surface. The recess 13 can be configured as a groove or a hole, and in the case of a groove, its depth formed on the upper surface of the substrate 11 can be less than the thickness of the substrate 11. The lower end portion of the wavelength conversion layer 50 disposed in the groove can be spaced from the lower surface of the substrate 11. In this structure, when the thickness of the substrate 11 is 1 mm or greater, a groove can be formed in the substrate 11. Since the outer surface of the lower end portion 50C of the wavelength conversion layer is covered by a portion 35 of the resin layer 31, it can be kept from being exposed to the outer surface of the substrate 11.

[0051] refer to Figure 5 In a second modification, the recess 13 of the substrate 11 may be disposed on a portion of a side surface S1. A portion 35 of the resin layer 31 may extend or protrude from the recess 13 of the substrate 11. Here, the lower end of the side portion (e.g., 43 and 53) of the wavelength conversion layer 60 may be disposed on the recess 13. The lower end of the side portion (e.g., 43 and 53) of the wavelength conversion layer 60 may contact the portion 35 of the resin layer 31 disposed in the recess 13. That is, at least one or both of the lower end of the side portion 43 of the phosphor layer 41 and the lower end of the side portion 53 of the ink layer 51 of the wavelength conversion layer 60 may contact the portion 35 of the resin layer 31 exposed on the surface of the recess 13. The portion 35 of the resin layer 31 disposed in the recess 13 may vertically overlap with the side portion (e.g., 43 and 53) of the wavelength conversion layer 60. A portion 35 of the resin layer 31 disposed in the recess 13 may overlap with the side portion 43 of the phosphor layer 41 and the side portion 53 of the ink layer 51 in the vertical direction.

[0052] The outer surface of a portion 35 of the resin layer 31 can be disposed on the same plane as the outer surface S1 of the substrate 11. The outer surface of the portion 35 of the resin layer 31 can be positioned further outward than the outer surface S2 of the wavelength conversion layer 60 or the outer surface of the ink layer 51. Here, since the lower end of the side portion of the wavelength conversion layer 60 contacts the surface of the portion 35 of the resin layer 31, the gap between the lower end of the side portion of the wavelength conversion layer 60 and the substrate 11 can be reduced. Therefore, light leakage occurring through the gap between the substrate 11 and the wavelength conversion layer 60 can be reduced.

[0053] refer to Figure 6In a third modification, a cutting groove 35A can be formed in the recess 13 of the substrate 11, and a light-shielding portion 37 can be formed through the cutting groove 35A. The light-shielding portion 37 can be formed in the groove 35A and can contact the inner surface of the substrate 11 or the surface of the recess 13. The light-shielding portion 37 can block light leakage in the recess 13. The light-shielding portion 37 can include organic fillers or inorganic fillers in the resin. The light-shielding portion 37 can include fillers that reflect or absorb light.

[0054] refer to Figure 7 and Figure 8 In the fourth and fifth modifications, a portion 35 of the resin layer 31 may extend or protrude from the recess 13 of the substrate 11. The lower end of the phosphor layer 41 or ink layer 51 of the wavelength conversion layer 60 may be disposed in the recess 13. Figure 7 As shown, the lower end portion 47 of the phosphor layer 41 can be disposed in the recess 13. Therefore, since the lower end portion 47 of the phosphor layer 41 is filled in the region of the recess 13, direct leakage of light from the light source 21 can be prevented. Here, the lower end of the side portion 53 of the ink layer 51 can contact the lower end portion 47 extending from the side portion 43 of the phosphor layer 41. The lower end of the side portion 53 of the ink layer 51 can vertically overlap with the lower end portion 57 of the side portion 43 of the phosphor layer 41. Figure 8 As shown, the lower end portion 57 of the ink layer 51 can be disposed in the recess 13. Therefore, since the lower end portion 57 of the ink layer 51 is filled in the area of ​​the recess 13, light leakage caused by ink particles can be prevented. Here, the lower end of the side portion 43 of the phosphor layer 41 can contact the lower end portion 57 extending from the side portion 53 of the ink layer 51. The lower end of the side portion 43 of the phosphor layer 41 can perpendicularly overlap with the lower end portion 57 of the side portion 53 of the ink layer 51. Figure 7 and Figure 8 As shown, since a portion 35 of the resin layer 31 and the lower end 47 of the phosphor layer 41 or the lower end 57 of the ink layer 51 are formed in the recess 13 of the substrate 11, moisture penetration and light leakage can be suppressed.

[0055] refer to Figure 9In a sixth modification, the resin layer 31 disposed on the substrate 11 and the light source 21 in the lighting device 100A may include a convex curved surface Ra extending from the upper surface of the side surface to the lower end. A wavelength conversion layer 60A may be stacked on the upper surface and the curved surface Ra of the resin layer 31. For example, the upper portion 42 and the side portion 43 of the phosphor layer 41A may extend on the upper surface and the curved surface Ra of the resin layer 31, and the upper portion 52 and the side portion 53 of the ink layer 51A may also extend therefrom. Therefore, the side portion 43 of the phosphor layer 41A and the side portion 53 of the ink layer 51A may be provided with convex curved surfaces. The curvature of the side portion 43 of the phosphor layer 41A and the side portion 53 of the ink layer 51A may be formed to be the same as the curvature of the curved surface Ra of the resin layer 31A. A portion 35 of the resin layer 31A may extend from or protrude from the recess 13 of the substrate 11. In the recess 13 of the substrate 11, the lower end portion 45 of the side portion 43 of the phosphor layer 41A and / or the lower end portion 55 of the side portion 53 of the ink layer 51 extend or protrude.

[0056] refer to Figure 10 In the seventh modification, the substrate 11 can be provided without the recess 13. A resin layer 31 is provided covering the substrate 11 and the light source 21, and a portion 36 of the side surface of the resin layer 31 is exposed or protrudes through the opening 63 of the wavelength conversion layer 60. The wavelength conversion layer 60 may include a first region 62 having a side surface corresponding to one side surface of the resin layer 31. The first region 62 of the wavelength conversion layer 60 and the portion 36 of the side surface of the resin layer 31 may overlap in the vertical direction. The portion 36 of the side surface of the resin layer 31 may contact the substrate 11 and / or the reflective member 15. The first region 62 is an end region of the side surface of the wavelength conversion layer 60, and may be, for example, the end of the side surface of the phosphor layer 41 and / or the end of the side surface of the ink layer 51. The wavelength conversion layer 60 may have holes 63 in the first region 62 and the substrate 11, and a portion 36 of the through hole 63 on the side surface of the resin layer 31 may be exposed or protruded. The first region 62 of the wavelength conversion layer 60 may be provided on the hole 63 of the wavelength conversion layer 60. The height of the hole 63 can be 0.5 mm or less, for example, in the range of 0.2 mm to 0.5 mm. Materials such as phosphor layer 41 and / or ink layer 51 can be formed on the side 36 of resin layer 31.

[0057] Reference Figure 11 and Figure 12 Describe the manufacturing process of the lighting device.

[0058] refer to Figure 11 (A) and Figure 11(B) A light source 21 having multiple light-emitting devices is disposed on a substrate 11. Each of the multiple light-emitting devices can be spaced apart by a predetermined spacing, thereby reducing light interference between them and improving heat dissipation efficiency. The spacing can be, for example, 2.5 mm or greater, in the range of 2.5 mm to 8 mm, or 5 mm or greater, in the range of 5 mm to 7 mm. The gap between the light-emitting devices can vary depending on the size of the LED chip. Recesses 13 extending from the upper surface to the lower surface of the substrate 11 can be respectively disposed in a portion of the substrate 11. Recesses 13 can be respectively disposed in the region between adjacent unit modules. A lower frame 91 is supported by the lower part of the recesses 13. The lower frame 91 is disposed below the substrate 11, and an upper frame 81 is attached to the upper part of the substrate 11. Resin injection holes 85 can be disposed in the upper frame 81, and the resin injection holes 85 can be connected to the recesses 13. Empty spaces 83 for covering the resin layer of the light source 21 can be respectively disposed in the upper frame 91.

[0059] like Figure 11 As shown in (C), liquid resin is injected through the resin injection hole 85. At this time, the resin injection pressure can fill the entire area of ​​the resin through the empty space 83 of the upper frame 81. In this case, the resin can fill the recess 13.

[0060] like Figure 11 (C) and Figure 12 As shown in (D), when the resin cures, the upper frame 81 and the lower frame 91 separate, and the resin layer 31 can be connected between adjacent modules via the recess 13. A portion of the resin layer 31 filling the recess 13 is cut to provide a groove 35A. The groove 35, where a portion of the resin layer 31 is cut, can be recessed from the lower surface of the recess 13 toward the upper surface and can open in the upward direction. Here, the groove 35 of the recess 13 is formed as a hole shape with a depth to the recess 13 on the lower surface of the recess 13, or it can be formed as a groove shape with a depth less than that of the recess 13.

[0061] like Figure 12 As shown in (E), a wavelength conversion layer 60 is formed on the surface of the resin layer 31. The wavelength conversion layer 60 may include at least one or both of a phosphor layer 41 and an ink layer 51. The wavelength conversion layer 60 can be formed by injection molding or a dispensing process. The phosphor layer 41 of the wavelength conversion layer 60 may be formed on the surface of the resin layer 31, and the ink layer 51 may be formed on the surface of the phosphor layer 41. A portion of the wavelength conversion layer 60 may extend into the recess 35A of the recess 13. Figure 12(F)). For example, a portion of the phosphor layer 41 extends into the recess 35A of the recess 13 and can contact a portion 35 of the resin layer 31 disposed in the recess 35A of the recess 13. A portion of the ink layer 51 extends into the recess 35A of the recess 13 and can contact a portion of the phosphor layer 41 disposed in the recess 35A of the recess 13. When the phosphor layer 41 and the ink layer 51 are stacked, the lower surfaces of portions of the phosphor layer 41 and the ink layer 51 can be exposed through the lower surface of the recess 13. Figure 12 As shown in (E) and (F), the unit module dimensions are cut. During the cutting process, each individual module can be manufactured by cutting the substrate 11 between the space cut recesses 13 between adjacent wavelength conversion layers 60.

[0062] like Figure 13 As shown, recesses 13 and 13C of substrate 11 can be formed on opposite side surfaces S1a and S1b of substrate 11, respectively. Recesses 13 and 13C of substrate 11 can be spaced apart from each other in a second direction by a distance greater than the width of wavelength conversion layer 60. The first recess 13 is recessed from the first side surface S1a of substrate 11 towards the second side surface S2b, and can overlap with the first side surface S2a of wavelength conversion layer 60 in the vertical direction. The second recess 13C is recessed from the second side surface S1b of substrate 11 towards the first side surface S1a, and can overlap with the second side surface S2b of wavelength conversion layer 60 in the vertical direction. Therefore, since the recesses 13 and 13C of substrate 11 are spaced apart from each other, the resin filling efficiency can be improved. Each of recesses 13 and 13C can be selected from... Figures 1 to 10 The structure.

[0063] refer to Figure 14 The recesses 13 and 13C of the substrate 11 can be formed on the same first side surface S1a of the substrate 11. The recesses 13 and 13C of the substrate 11 can be spaced apart from each other in the first direction X by 1 / 2 or more of the length of the wavelength conversion layer 60. The first recess 13 and the second recess 13C are recessed in a direction from the first side surface S1a of the substrate 11 toward the second side surface S1b, and can overlap with the first side surface S2a of the wavelength conversion layer 60 in the vertical direction. The first recess 13 and the second recess 13C can be located at the same distance from the center of the first side surface S1a of the substrate 11 in the second direction Y. Therefore, since the recesses 13 and 13C of the substrate 11 are located in different regions, the resin filling efficiency can be improved. Each of the recesses 13 and 13C can be selected from... Figures 1 to 10 The structure.

[0064] Figure 15 This is a plan view of a vehicle to which the vehicle lights of the lighting device according to the embodiment are applied. Figure 16This is a view showing a lighting device or a vehicle lamp having the lighting device disclosed in the embodiments.

[0065] refer to Figure 15 and Figure 16 The headlights 850 in the moving object or vehicle 900 may include one or more lighting modules, and the driving timing of these lighting modules may be individually controlled to function as typical headlights and to provide additional functions such as welcome lights or celebratory effects when the driver opens a door. The light may be used as daytime running lights, high beams, low beams, fog lights, or turn signals. In the vehicle 900, the taillights 800 may be arranged with multiple lamp units 810, 812, 814, and 816 supported by a housing 801. For example, lamp units 810, 812, 814, and 816 may include a first lamp unit 810 disposed on the outer side, a second lamp unit 814 disposed around the inner circumference of the first lamp unit 810, and a third lamp unit 814 and a fourth lamp unit 816 disposed inside the second lamp unit 814, respectively. The first to fourth lamp units 810, 812, 814, and 816 may selectively employ the lighting device disclosed in the embodiments, and may be fitted with red or white lens covers for the lighting characteristics of the lamp units 810, 812, 814, and 816 on the outside of the lighting device. The lighting device disclosed in the embodiments applied to lamp units 810, 812, 814, and 816 can emit uniformly distributed surface light. The first lamp unit 810 and the second lamp unit 812 may be configured as at least one of curved, straight, angular, inclined, and planar shapes or a mixture thereof. One or more first lamp units 810 and second lamp units 812 may be provided in each taillight. The first lamp unit 810 may be configured as a taillight, the second lamp unit 812 may be configured as a brake light, the third lamp unit 814 may be configured as a reverse indicator light, and the fourth lamp unit 816 may be configured as a turn signal. The structure and position of these lighting lamps may be changed.

[0066] The features, structures, effects, etc., described in the above embodiments are included in at least one embodiment of the present invention, but are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc., shown in each embodiment can be combined or modified by those skilled in the art for other embodiments. Therefore, content related to these combinations and modifications should be interpreted as being included within the scope of the present invention. Additionally, although embodiments have been described above, these are merely examples and do not limit the present invention. The present invention has been illustrated to those skilled in the art without departing from the basic characteristics of these embodiments. It can be seen that various modifications and applications that have not yet been made are possible. For example, each component specifically shown in this embodiment can be implemented by modification. And the differences related to these modifications and applications should be understood as being included within the scope of the present invention as defined by the appended claims.

Claims

1. A lighting device, comprising: a base plate, the base plate including a recess; A light source, wherein the light source is disposed on the substrate; A resin layer disposed on the substrate; as well as A wavelength conversion layer is disposed on the resin layer. The light source and the edge of the recess are spaced apart in the horizontal direction, so that the light source and the recess do not overlap in the vertical direction. The recess extends horizontally from the side surface of the substrate to a predetermined depth, and the vertical length of the recess is equal to the thickness of the substrate. A portion of the resin layer is disposed in the recess of the substrate. A portion of the wavelength conversion layer is disposed in the recess of the substrate, and Wherein, the outermost surface of the portion of the resin layer disposed in the recess of the substrate is located outside the inner surface of the wavelength conversion layer.

2. The lighting device according to claim 1, wherein, The recess in the substrate overlaps with the side surfaces of the wavelength conversion layer and the resin layer in the vertical direction.

3. The lighting device according to claim 1 or 2, wherein, A portion of the recess in the substrate is located on the outer side of the outer surface of the resin layer.

4. The lighting device according to claim 3, wherein, Another portion of the recess in the substrate is located inside the outer surface of the resin layer.

5. The lighting device according to claim 1 or 2, wherein, The width of the recess in the substrate is greater than the thickness of the wavelength conversion layer.

6. The lighting device according to claim 1 or 2, wherein, The lower end of the wavelength conversion layer disposed in the recess is exposed on the lower surface of the substrate.

7. The lighting device according to claim 1 or 2, wherein, The lower end of the wavelength conversion layer, which overlaps with the recess of the substrate, is disposed in the recess of the substrate.

8. The lighting device according to claim 1 or 2, wherein, The maximum height of the region where the wavelength conversion layer overlaps with the recess of the substrate is greater than the height of the wavelength conversion layer disposed on the substrate.

9. The lighting device according to claim 1 or 2, wherein, The light source comprises multiple light-emitting devices arranged in N rows and M columns, where N is an integer greater than or equal to 1 and M is greater than or equal to 2. The wavelength conversion layer includes an upper portion disposed on the upper surface of the resin layer and a side portion connected to the upper portion and disposed on the side surface of the resin layer. The recess in the substrate overlaps with a portion of the side portion of the wavelength conversion layer in the vertical direction.

10. The lighting device according to claim 9, wherein, A portion of the recess in the substrate is located outside the outer surface of the resin layer, and In this embodiment, another portion of the recess in the substrate is located inside the outer surface of the resin layer.

11. The lighting device according to claim 9, wherein, The light-emitting device includes an LED chip and a resin component disposed on the LED chip.

12. The lighting device according to claim 1 or 2, wherein, The wavelength conversion layer includes a phosphor layer and an ink layer disposed on the phosphor layer.

13. The lighting device according to claim 1 or 2, wherein, The wavelength conversion layer is formed by mixing colored phosphors and colored inks.

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