LED transparent display screen

Abstract

In order to overcome the problem of low transparency of the transparent LED display screen in the prior art, the present application provides a transparent LED display screen which can effectively improve the transparency of the LED transparent display screen. The transparent LED display screen provided by the present application comprises a transparent substrate and LED lamp beads; a circuit pattern is arranged on the transparent substrate; the circuit pattern comprises a power supply pad, a signal pad and a lamp bead welding area for mounting the LED lamp beads arranged in an array; the first electrode pin welding pad on at least part of the LED lamp beads is directly or indirectly bound and connected to the first power supply circuit through a power supply jumper; and the second electrode pin welding pad on at least part of the LED lamp beads is directly or indirectly bound and connected to the second power supply circuit through a power supply jumper. The transparent LED display screen provided by the present application adopts the binding connection mode, which is simple and easy to implement in process, and greatly improves the transparency of the transparent LED display screen.

Description

Technical Field

[0001] This invention relates to the field of LEDs, and more particularly to the field of transparent LED displays. Background Technology

[0002] Transparent LED displays are gradually gaining widespread application in the market and have developed into various product forms. A technology for transparent LED displays that uses an array of LED beads distributed on a transparent substrate has begun to emerge.

[0003] For example, such as Figure 1 As shown, an improved transparent LED display screen is provided, comprising a transparent substrate 1', on which a printed circuit layer 3' is provided, and an array of LED beads 2' encapsulated with chips is mounted on the transparent substrate 1'; then, a potting layer 5' is formed by potting adhesive on the surface of the transparent substrate 1' where the LED beads 2' are arranged; then, a protective cover plate 4' is covered on the surface of the potting layer; as shown. Figure 2 As shown, specifically, the printed circuit layer 3' includes LED chip soldering areas 31', power pads 32', and signal pads 33'. Each LED chip soldering area 31' has two signal pin pads and two electrode pin pads. The signal pin pads are connected in series through printed signal lines, while the two electrode pin pads with opposite polarities are connected to the power pads 32' through metal meshes 30' printed on the transparent substrate 1' for power supply. The pins of the LED chip 2' are soldered to the aforementioned signal pin pads and electrode pin pads.

[0004] This method has certain advantages, namely that the power supply metal grid 30' can be directly formed on the transparent substrate 1' through the printing process to serve as the power supply circuit; however, since the thickness of the printed pattern layer 3' is generally only about 35 micrometers, the current that each metal wire on the formed metal grid 30' can carry is very small. Therefore, the area of ​​the metal grid 30' must be widened to meet the power supply requirements of the LED beads 2', and the spacing between each LED bead 2' cannot be reduced, so the resolution of the transparent LED display screen cannot be improved; moreover, the metal grid 30' will reduce the transparency of the transparent substrate 1' to some extent.

[0005] like Figure 3 As shown, another type of transparent LED display screen uses power lines 6' to directly connect the LED beads 2' to the electrode pin pads of the bead soldering area for power supply. The LED beads are connected in series via signal lines 7'. Power line 6' is divided into a positive power line 6a' and a negative power line 6b'. Each row of LED beads 2' has one positive power line 6a' and one negative power line 6b' on each side. This method can reduce the gap between the LED beads 2' to some extent, but the transparency of the LED display screen remains relatively low. SUMMARY

[0006] In order to overcome the problem of low transparency of the transparent LED display screen in the prior art, the present application provides a transparent LED display screen which can effectively improve the transparency of the LED transparent display screen.

[0007] The present application provides a transparent LED display screen, comprising a transparent substrate and LED lamp beads; a circuit pattern is arranged on the transparent substrate; the circuit pattern comprises a power supply pad, a signal pad and lamp bead pads arranged in an array, and the LED lamp beads are welded on the lamp bead pads;

[0008] Each of the lamp bead pads is provided with a pin pad corresponding to the pin of the LED lamp bead; the pin pad comprises a signal pin pad and an electrode pin pad; the electrode pin pad comprises a first electrode pin pad and a second electrode pin pad with opposite polarities;

[0009] The circuit pattern further comprises a plurality of power supply lines and signal lines; the power supply lines comprise a first power supply line and a second power supply line with opposite polarities;

[0010] The signal lines are used to electrically connect the signal pad and the signal pin pads on the lamp bead pads, so as to realize the series connection of the LED lamp beads, so that the control signal for controlling the lighting and extinguishing of each LED lamp bead can be transmitted in sequence through each series-connected LED lamp bead after being input from the signal pad through the signal lines;

[0011] At least part of the first electrode pin pads on the LED lamp beads are directly or indirectly bound to the first power supply line through a power supply jumper; at least part of the second electrode pin pads on the LED lamp beads are directly or indirectly bound to the second power supply line through a power supply jumper.

[0012] The transparent LED display screen provided by the present application directly or indirectly electrically connects at least part of the LED lamp beads to the power supply line through the power supply jumper, the diameter of the power supply jumper is generally 20-100 μm, which is almost invisible to the naked eye and has little effect on the line of sight, so the effect on the transparency is very low. The binding connection method is simple in process and easy to implement, which greatly improves the transparency of the transparent LED display screen.

[0013] Further, the circuit pattern is provided with N rows*M columns of lamp bead pads;

[0014] The circuit pattern is provided with M signal pads; the M signal pads and the signal pin pads in the N lamp bead pads in the same column are sequentially connected through signal lines;

[0015] Or, N signal pads are arranged on the circuit pattern; the N signal pads are sequentially connected in series through signal lines between the signal pin pads in the M lamp bead pads in the same row.

[0016] Further, M+1 power pads or N+1 power pads are arranged on the circuit pattern;

[0017] The M+1 power pads or N+1 power pads include first power pads and second power pads with opposite polarities and arranged at intervals;

[0018] The power supply lines include the first power supply lines and the second power supply lines arranged at intervals in columns or in rows; each first power pad is electrically connected to the first power supply line, and each second power pad is electrically connected to the second power supply line;

[0019] The first power supply lines and the second power supply lines arranged in columns are arranged at intervals side by side with each column of LED lamp beads, or the first power supply lines and the second power supply lines arranged in rows are arranged at intervals side by side with each row of LED lamp beads;

[0020] The first electrode pin pads on the lamp bead pads are connected to the nearest first power supply line through power jumpers, and the second electrode pin pads on the lamp bead pads are connected to the nearest second power supply line through power jumpers.

[0021] In this way, the transparency of the transparent LED display screen can be improved to a certain extent, and each LED lamp bead can be connected to the adjacent power supply line, and the connection process is simpler and more efficient.

[0022] Further, the first power supply lines and the second power supply lines arranged at intervals are metal layers printed on the transparent substrate;

[0023] Part of the first electrode pin pads on the lamp bead pads are integrally printed with the adjacent first power supply lines, and part of the first electrode pin pads on the lamp bead pads are connected to the first electrode pin pads on the adjacent lamp bead pads through power jumpers.

[0024] Part of the second electrode pin pads on the lamp bead pads are integrally printed with the adjacent second power supply lines, and part of the second electrode pin pads on the lamp bead pads are connected to the second electrode pin pads on the adjacent lamp bead pads through power jumpers.

[0025] By integrating part of the lamp bead pads and the power supply lines, the number of power jumpers can be reduced while ensuring the transparency.

[0026] Further, the first electrode pin pad and the second electrode pin pad on the lamp bead welding area on the adjacent row or the adjacent column are reversely arranged;

[0027] The LED lamp bead mounting angle on the lamp bead welding area on the adjacent row or the adjacent column is different by 180°. In this way, the first power supply circuit and the second power supply circuit can be more uniformly spaced.

[0028] Further, the first electrode pin pad and the second electrode pin pad on the lamp bead welding area on the adjacent row or the adjacent column are reversely arranged;

[0029] The first lamp bead and the second lamp bead reversely arranged on the electrode pin on the lamp bead welding area on the adjacent row or the adjacent column are respectively mounted. In this way, the position of the light emitting wafer in the specially designed first lamp bead and the second lamp bead is relatively fixed, and the color difference of each LED lamp bead caused by the change of the pin can be avoided.

[0030] Further, the power supply circuit includes one row or one column of the first power supply circuit and one row or one column of the second power supply circuit;

[0031] The first electrode pin pad on at least part of the lamp bead welding area is connected to the first power supply circuit through the power supply jumper binding, and the first electrode pin pad on part of the lamp bead welding area is connected to the first electrode pin pad on the adjacent lamp bead welding area through the power supply jumper binding;

[0032] The second electrode pin pad on at least part of the lamp bead welding area is connected to the second power supply circuit through the power supply jumper binding, and the second electrode pin pad on part of the lamp bead welding area is connected to the second electrode pin pad on the adjacent lamp bead welding area through the power supply jumper binding.

[0033] By using the above-mentioned optimized structure, the number of power supply circuits can be minimized, and the power supply jumper can be used to supply power to the LED lamp bead. In this way, the transparency can be further improved.

[0034] Further, the LED lamp bead includes a shell, a driving chip and a light emitting wafer; wherein the light emitting wafer includes a first light emitting wafer, a second light emitting wafer and a third light emitting wafer;

[0035] The shell is formed with a chip mounting surface, and a pin is led out from the chip mounting surface; the driving chip is mounted on the shell; the first light emitting wafer, the second light emitting wafer and the third light emitting wafer are mounted on the driving chip;

[0036] The first electrode pin and the second electrode pin are welded to the electrode pin pad on the lamp bead welding area; the input signal pin and the output signal pin are respectively welded to the signal pin pad on the lamp bead welding area.

[0037] Further, the signal pin pads include input signal pin pads and output signal pin pads;

[0038] The input signal pin pad of the first lamp bead welding area is connected to the signal pad through a signal line; the input signal pin pad of the next lamp bead welding area of the adjacent stringed lamp bead welding area is connected to the output signal pin pad of the previous lamp bead welding area.

[0039] Further, the signal pin pads, the LED lamp beads and the signal jumpers are connected through the signal jumpers. In this way, the signal lines are also connected through jumpers, which can further improve the transparency.

[0040] Further, the transparent substrate on which the LED lamp beads are attached is provided with a glue filling layer, the glue filling layer fixes the transparent LED lamp beads therein; the upper surface of the glue filling layer is provided with a protective cover plate. BRIEF DESCRIPTION OF DRAWINGS

[0041] Figure 1 is a cross-sectional view of an LED transparent display screen provided in the prior art;

[0042] Figure 2 is a top view of an LED transparent display screen provided in the prior art;

[0043] Figure 3 is a top view of a second LED transparent display screen provided in the prior art;

[0044] Figure 4 is a cross-sectional view of an LED transparent display screen provided in the prior art;

[0045] Figure 5 is a top view of an LED transparent display screen (before the LED lamp beads are installed) provided in the embodiment of the present application;

[0046] Figure 6 is a top view of an LED transparent display screen (after the LED lamp beads are installed) provided in the embodiment of the present application;

[0047] Figure 7 is a top view of a second LED transparent display screen (after the LED lamp beads are installed) provided in the embodiment of the present application;

[0048] Figure 8 is a perspective view of an LED lamp bead provided in the embodiment of the present application;

[0049] Figure 9a is a top view of a first lamp bead provided in the embodiment of the present application;

[0050] Figure 9b is a top view schematic diagram of a second lamp bead provided in the specific embodiments of the present application;

[0051] Figure 10 is a top view schematic diagram of a third LED transparent display screen provided in the specific embodiments of the present application;

[0052] Figure 11 is a top view schematic diagram of a fourth LED transparent display screen provided in the specific embodiments of the present application;

[0053] Figure 12 is a top view schematic diagram of a fifth LED transparent display screen provided in the specific embodiments of the present application.

[0054] In the background art, the reference signs are as follows:

[0055] 1', transparent substrate; 2', LED lamp bead; 3', printed circuit layer; 4', protective cover plate; 5', glue filling layer; 6', power supply circuit; 7', signal circuit; 6a', positive power supply circuit; 6b', positive power supply circuit;

[0056] 30', metal mesh; 31', lamp bead welding area; 32', power supply pad; 33', signal pad;

[0057] In the specific embodiments, the reference signs are as follows:

[0058] 1, transparent substrate; 2, LED lamp bead; 3, circuit pattern; 4, protective cover plate; 5, glue filling layer; 2a, first lamp bead; 2b, second lamp bead; 20, light emitting wafer; 21, driving chip; 22, shell; 23, pin; 20r, red light emitting wafer; 20g, green light emitting wafer; 20b, blue light emitting wafer; 231, input signal pin; 232, output signal pin; 233, first electrode pin; 234, second electrode pin; 30, lamp bead welding area; 31, power supply circuit; 31a, first power supply circuit; 31b, second power supply circuit; 32, signal circuit; 33, signal pad; 311, power supply jumper; 321, signal jumper. Specific embodiments

[0059] In order to make the technical problems solved by the present application, technical solutions and beneficial effects more clearly understood, the present application will be further described in detail below with reference to the drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0060] In the description of this invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0061] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0062] Example

[0063] The transparent LED display screen disclosed in this invention will be explained in detail below with reference to the accompanying drawings, such as... Figure 4 As shown, it includes a transparent substrate 1 and LED beads 2; the transparent substrate 1 is provided with a circuit pattern 3; the circuit pattern 3 includes a power pad (not shown in the figure, but known to the public), a signal pad 33, and an array of LED bead soldering areas 30 for mounting the LED beads 2.

[0064] A potting layer 5 is provided on the transparent substrate 1 on which the LED beads 2 are arranged, and the potting layer 5 cures each transparent LED bead 2 therein; a protective cover plate 4 is provided on the upper surface of the potting layer 5. The above-mentioned potting encapsulation to form the potting layer 5 and the provision of the protective cover plate 4 are publicly known structures and will not be described in detail.

[0065] Each of the LED chip soldering areas 30 is provided with a pin pad corresponding to the pin 23 of the LED chip 2; the pin pad includes a signal pin pad and an electrode pin pad; the electrode pin pad includes a first electrode pin pad and a second electrode pin pad with opposite polarities.

[0066] The circuit pattern 3 further comprises a plurality of power supply lines 31 and signal lines 32; the power supply pads are divided into first power supply pads and second power supply pads according to polarity; the power supply lines 31 comprise first power supply lines 31a and second power supply lines 31b with opposite polarity; the first power supply lines 31a are connected to the first power supply pads; the second power supply lines 31b are connected to the second power supply pads. That is, the first power supply lines 31a and the first power supply pads have the same polarity, and the second power supply lines 31b and the second power supply pads have the same polarity. If the first power supply lines 31a and the first power supply pads are positive, the second power supply lines 31b and the second power supply pads are negative. Conversely, if the first power supply lines 31a and the first power supply pads are negative, the second power supply lines 31b and the second power supply pads are positive.

[0067] The number of the first power supply lines 31a and the second power supply lines 31b can be one or more, and the number of the first power supply lines 31a and the second power supply lines 31b can be the same or different. The number of the first power supply lines 31a and the second power supply lines 31b can be determined according to the specific number of the LED lamp beads 2. The power supply lines 31 can be in a straight line, a curve, or a snake shape. As a preferred mode, each power supply line 31 is arranged in a row or a column, and the implementation mode is not limited as long as it can provide power supply.

[0068] The signal lines 32 are arranged between the signal pads 33 and the signal pin pads on the lamp bead pads 30, and between the signal pin pads of adjacent lamp bead pads 30 in the same row or column, to realize the connection of the LED lamp beads 2, so that the control signal for controlling the on-off of each LED lamp bead 2 can be transmitted through the signal lines 32 from the signal pads 33 to each connected LED lamp bead 2 in turn.

[0069] In this example, the signal lines 32 are arranged between the signal pads 33 and the signal pin pads on the lamp bead pads 30, and between the signal pin pads of adjacent lamp bead pads 30 in the same row or column, to realize the connection of the LED lamp beads 2, so that the control signal for controlling the on-off of each LED lamp bead 2 can be transmitted through the signal lines 32 from the signal pads 33 to each connected LED lamp bead 2 in turn.

[0070] In this example, the signal line 32 can be implemented in a manner known to the public, and the most core concept in this application is to optimize the connection mode of the power supply line 31 of the LED lamp bead 2, that is, to optimize the power supply jumper 311 as follows, and the implementation mode of the signal line 32 is not limited. As for the mode of realizing binding connection by using a jumper, it can be realized by referring to the mode of realizing binding connection by using a jumper in the LED lamp bead 2, and it does not require further creative labor for those skilled in the art. The jumper, which can also be called a bonding wire or a binding wire, generally includes a gold wire, a copper wire, a palladium-plated copper wire, and an alloy wire.

[0071] Among them, the first electrode pin pad on at least part of the LED lamp beads 2 is directly or indirectly bound to the first power supply line 31a through the power supply jumper 311; the second electrode pin pad on at least part of the LED lamp beads 2 is directly or indirectly bound to the second power supply line 31b through the power supply jumper 311.

[0072] Among them, as shown in the figure, Figures 5-7 The circuit pattern 3 is provided with N rows*M columns of lamp bead pads 30; in this example, it is assumed that N=4 and M=4. Of course, this application is not limited to the regular LED lamp bead 2 arrangement mode, and it can also be a non-regular transparent LED display screen, as long as the core concept is that at least part of the LED lamp beads 2 are realized by using the power supply jumper 311 to supply power, so as to improve the transparency, which should fall within the protection scope of this application. In this example, it is only used for illustration.

[0073] The circuit pattern 3 is provided with M signal pads 33; the M signal pads 33 and the signal pin pads in the N lamp bead pads 30 in the same column are sequentially connected in series through the signal line 32;

[0074] Alternatively, the circuit pattern 3 is provided with N signal pads 33; the N signal pads 33 and the signal pin pads in the M lamp bead pads 30 in the same row are sequentially connected in series through the signal line 32.

[0075] Among them, the above mode is to apply one signal pad 33 to each row or each column, but it can also apply one signal pad 33 to multiple rows or multiple columns, and realize, for example, the snake-shaped connection of the LED lamp beads 2 in the row or column.

[0076] As shown in the figure, Figure 5 As an implementation mode, the power supply line 31 includes a column of the first power supply line 31a and a column of the second power supply line 31b;

[0077] At least part of the first electrode pin pads on the lamp bead welding area 30 is connected to the first power supply line 31a through the power jumpers 311, and part of the first electrode pin pads on the lamp bead welding area 30 is connected to the first electrode pin pads on the adjacent lamp bead welding area 30 through the power jumpers 311. For example, the first electrode pin pads on the first column of the four columns of lamp bead welding areas 30 shown in the figure are connected to the first power supply line 31a through the power jumpers 311, and the remaining second to fourth columns of lamp bead welding areas 30 are respectively connected to the first electrode pin pads on the previous column of lamp bead welding areas 30 through the power jumpers 311.

[0078] At least part of the second electrode pin pads on the lamp bead welding area 30 is connected to the second power supply line 31b through the power jumpers 311, and part of the second electrode pin pads on the lamp bead welding area 30 is connected to the second electrode pin pads on the adjacent lamp bead welding area 30 through the power jumpers 311. For example, the second electrode pin pads on the fourth column of the four columns of lamp bead welding areas 30 shown in the figure are connected to the second power supply line 31b through the power jumpers 311, and the remaining first to third columns of lamp bead welding areas 30 are respectively connected to the second electrode pin pads on the next column of lamp bead welding areas 30 through the power jumpers 311.

[0079] With the above-mentioned optimized structure, the number of power supply lines 31 can be minimized, and power jumpers 311 can be added to realize power supply to the LED lamp beads 2. This kind of mode can further improve the transparency.

[0080] Figure 6 The schematic diagram shown is a schematic diagram of installing the LED lamp beads 2 on the lamp bead welding area 30. When the power jumpers 311 are connected, the power jumpers 311 can be connected first, and then the LED lamp beads 2 can be fixed and installed. As a preferred mode, the LED lamp beads 2 are installed first, and then the power jumpers 311 are connected. When the power jumpers 311 are connected, the connection points are above the power supply lines 31. At the same time, the connection points on the electrode pin pads cannot overlap with the projection of the LED lamp beads 2. The landing points of the connection are in the range of 0.1-0.5mm of the exposed part of the electrode pin pads, which can be connected and welded by a machine.

[0081] As a preferred mode, the power supply lines 31 can be arranged in a spaced manner. For example, several columns or rows of lamp bead welding areas 30 (i.e. several columns or rows of LED lamp beads 2) share one power supply line 31. The specific number of LED lamp beads 2 that can be driven by the power supply line 31 is determined.

[0082] As a preferred mode, as shown in the figure, Figure 7As shown, the circuit pattern 3 is arranged with M+1 power pads or N+1 power pads (not labeled in the figure); in this example, M=4, and a total of 5 columns of power pads are arranged.

[0083] The M+1 power pads or N+1 power pads include first power pads (not labeled in the figure) and second power pads (not labeled in the figure) of opposite polarity arranged at intervals; in this example, 3 first power pads and 2 second power pads are provided.

[0084] The power supply lines 31 include a plurality of first power supply lines 31a (for example, 3 columns) and second power supply lines 31b (for example, 2 columns) arranged at intervals in columns; each first power pad is electrically connected to the first power supply line 31a, and each second power pad is electrically connected to the second power supply line 31b.

[0085] The first power supply lines 31a and the second power supply lines 31b arranged in columns are arranged at intervals side by side with each column of LED lamp beads 2; (the first power supply lines 31a and the second power supply lines 31b arranged in rows can also be arranged at intervals side by side with each row of LED lamp beads 2).

[0086] The first electrode pin pad on the lamp bead welding area 30 is bound and connected to the nearest first power supply line 31a through the power jump line 311; the second electrode pin pad on the lamp bead welding area 30 is bound and connected to the nearest second power supply line 31b through the power jump line 311.

[0087] In this way, the transparency of the transparent LED display screen can be improved to some extent, and each LED lamp bead 2 can be bound and connected to the adjacent power supply line 31, and the binding and connecting process is simpler and more efficient. For example, for a transparent LED display screen with a pixel pitch of 10 mm, if the line width of the power supply line 31 is 1 mm, if the original column of LED lamp beads 2 is reduced from the original two power supply lines 31 of opposite polarity (as shown in Figure 3 ), to one power supply line 31, the transparency will be improved by 1 / 10, i.e. 10%, and if the pixel pitch is smaller, such as 5 mm, the transparency will be improved by 1 / 5, i.e. 20%, and the effect is very obvious.

[0088] As a preferred manner, as shown in Figure 7 , the first power supply lines 31a and the second power supply lines 31b arranged at intervals are both metal layers printed on the transparent substrate 1.

[0089] Among them, the first electrode pin pad on part of the lamp bead welding area 30 is integrally printed with the adjacent first power supply line 31a, and the first electrode pin pad on part of the lamp bead welding area 30 is bound and connected to the first electrode pin pad through the power jump line 311.

[0090] The second electrode pin pad on the partial lamp bead welding area 30 is integrally printed with the second power supply line 31b adjacent thereto, and the second electrode pin pad on the partial lamp bead welding area 30 is connected to the second electrode pin pad by the power supply jumper 311.

[0091] The first electrode pin pad on the first column of lamp bead welding areas 30 is integrally formed with the first power supply line 31a of the first column, the second electrode pin pad on the second column of lamp bead welding areas 30 is integrally formed with the second power supply line 31b of the second column, the first electrode pin pad on the third column of lamp bead welding areas 30 is integrally formed with the first power supply line 31a of the third column, the second electrode pin pad on the fourth column of lamp bead welding areas 30 is integrally formed with the second power supply line 31b of the fourth column, and the first electrode pin pad on the fourth column of lamp bead welding areas 30 is integrally formed with the first power supply line 31a of the fifth column. Among them, the second electrode pin pad on the first column of lamp bead welding areas 30 is connected to the second power supply line 31b of the second column by the power supply jumper 311; the first electrode pin pad on the second column of lamp bead welding areas 30 is connected to the first power supply line 31a of the third column by the power supply jumper 311; and the second electrode pin pad on the third column of lamp bead welding areas 30 is connected to the second power supply line 31b of the fourth column by the power supply jumper 311.

[0092] The partial lamp bead welding area 30 and the power supply line 31 are designed in an integrated manner, which can reduce the number of power supply jumpers 311 while ensuring transparency. The number of power supply jumpers 311 is related to the distance and power supply demand. If the distance between the LED lamp beads 2 is large, such as 10 mm, the current required for power supply of each column of LED lamp beads 2 is large, and the preferred mode is one column of LED lamp beads 2 with one power supply line 31 (as shown in Figure 7 ), which supplies the same polarity current to the adjacent two columns of LED lamp beads 2; if the distance between the LED lamp beads 2 is small, such as 6 mm, two power supply lines 31 with opposite polarities can supply power to more than one column of LED lamp beads 2, such as four columns of LED lamp beads 2 (as shown in Figure 10 , Figure 11 ), and then the electrode pin pads with the same polarity between the four columns can be connected to each other by the power supply jumper 311, so that the transparency is also relatively high.

[0093] For the above-mentioned interval setting power supply line 31 mode, in order to make the thread as short as possible, it is preferred to set the first electrode pin pad and the second electrode pin pad on the lamp bead welding area 30 on the adjacent column in opposite positions; and when installing the same LED lamp bead 2, it is necessary to install the LED lamp bead 2 on the lamp bead welding area 30 on the adjacent column at an angle of 180° difference. That is, each LED lamp bead 2 is installed by rotating 180 degrees. In this way, the first power supply line 31a and the second power supply line 31b can be more evenly spaced. However, this method also has a slight disadvantage.

[0094] As shown in Figure 8 The LED lamp bead 2 generally includes a shell 22, a driving chip 21 and a light-emitting wafer 20; wherein the light-emitting wafer 20 includes a first light-emitting wafer, a second light-emitting wafer and a third light-emitting wafer;

[0095] The shell 22 is formed with a chip mounting surface, and a pin 23 is led out from the chip mounting surface; the driving chip 21 is mounted on the shell 22; the first light-emitting wafer, the second light-emitting wafer and the third light-emitting wafer are mounted on the driving chip 21; the first electrode pin 233 and the second electrode pin 234 are welded to the electrode pin pads on the lamp bead welding area 30; the input signal pin 231 and the output signal pin 232 are respectively welded to the signal pin pads on the lamp bead welding area 30.

[0096] For example, in this example, the first light-emitting wafer is a red light-emitting wafer 20r, the second light-emitting wafer is a green light-emitting wafer 20g, and the third light-emitting wafer is a blue light-emitting wafer 20b. As shown in the figure, the red light-emitting wafer 20r, the green light-emitting wafer 20g and the blue light-emitting wafer 20b are sequentially mounted on the driving chip 21. At this time, if the LED lamp bead 2 is rotated by 180 degrees, the order of the light-emitting wafers in the LED lamp bead 2 will be changed to: blue light-emitting wafer 20b, green light-emitting wafer 20g and red light-emitting wafer 20r. This method will cause a slight color difference.

[0097] The LED lamp bead 2 in the example is a TOP type structure. The so-called TOP type structure refers to a structure in which a PLCC (Plastic Leaded Chip Carrier) plastic support is used as a housing (English name: housing, also referred to as support or base) 22, and the pins 23 of the PLCC plastic support packaging structure are bent inward at the bottom. Its process is known to the public, generally including metal strip punching, electroplating, PPA (polyphthalamide) injection molding, bending, five-face three-dimensional inkjet, etc. The core is to form a chip mounting surface (not marked in the figure) on the surface of the plastic support through a metal strip; and the pins 23 on the chip mounting surface are bent inward at the bottom and attached to the bottom of the plastic support, so as to be attached and welded later.

[0098] In the example, the chip mounting surface is used to mount the driving chip 21 and the light-emitting wafer; it includes isolation channels and pads isolated from each other through the isolation channels, and the pins 23 are led out on the pads; in the example, the pads are actually metal sheets of the same material as the pins 23, which are stamped into shape, and the hollow parts are filled with injection molding, which becomes isolation channels. The isolation channels are actually insulating plastic materials that separate the pins 23 respectively, while also serving to fix the housing 22. Specifically, the pads include electrode pads and input / output pads; the electrode pads include cathode pads and anode pads; the input / output pads include input pads and output pads; the pins 23 include electrode pins and signal pins, wherein the electrode pins include positive pins and negative pins; the signal pins include signal input pins and signal output pins; the positive pins are led out on the cathode pads; the negative pins are led out on the anode pads. The signal input pins are led out on the input pads, and the signal output pins are led out on the output pads. The electrode pins are welded to the electrode pin pads, and the signal pins are welded to the signal pin pads, so as to weld the LED lamp bead 2 on the lamp bead welding area 30.

[0099] The driving chip 21 is known to the public, generally with a driving circuit integrated inside the driving chip 21, and a passivation layer is provided on the driving chip 21. The passivation layer is a surface insulating layer formed when the driving chip 21 is manufactured. The driving chip 21 is provided with a plurality of pins (or terminals), and the pins on the driving chip 21 are electrically connected to the chip mounting surface and the light-emitting wafer through direct welding or through a bonding wire. The pins (English name: PAD) are generally provided on the passivation layer, and the pins are terminals inside the chip.

[0100] The TOP-type package structure in this example can also be replaced with a CHIP-type package structure. Its outer shell 22 is formed by a circuit board (PCB). The copper foil on the front side of the PCB is etched to form the chip mounting surface; that is, after the PCB is etched, the etched areas form isolation channels, and the unetched areas form pads. Pins 23 are formed on its back side; these pins 23 are electrically connected to the chip mounting surface (i.e., the pads) through conductive vias. The circuit board typically uses insulating materials such as glass epoxy resin or polyimide as a substrate, forming conductive patterns and printed wiring on the surface and underside of the circuit board. The CHIP-type package structure is publicly known and will not be described further.

[0101] The applicant devised a method to solve the color difference of LED beads 2 by reversing the positions of the first electrode pin pads and the second electrode pin pads on the LED bead soldering areas 30 in adjacent rows or columns; simultaneously, installing first LED beads 2a and second LED beads 2b with opposite electrode pin arrangements on the LED bead soldering areas 30 in adjacent rows or columns. For example... Figure 9a , Figure 9b The example shown uses two types of LED beads 2. The difference between these two types of LED beads 2 is that their electrode pins are reversed, but the positions of the first, second, and third light-emitting chips remain unchanged. For example... Figure 9a As shown in the diagram, input signal pins 231 and output signal pins 232 are arranged vertically on the paper, a first electrode pin 233 is arranged on the left, and a second electrode pin 234 is arranged on the right; wherein, red light-emitting chip 20r, green light-emitting chip 20g, and blue light-emitting chip 20b are arranged sequentially from top to bottom. Figure 9b As shown in the diagram, input signal pins 231 and output signal pins 232 are arranged vertically on the paper, a second electrode pin 234 is arranged on the left, and a first electrode pin 233 is arranged on the right. The red light-emitting chip 20r, green light-emitting chip 20g, and blue light-emitting chip 20b are arranged sequentially from top to bottom. This structure ensures that the positions of the light-emitting chips in the specially designed first LED bead 2a and second LED bead 2b are relatively fixed, preventing color differences among the LED beads 2 due to pin variations.

[0102] like Figure 10 As shown, the signal pin pads include input signal pin pads and output signal pin pads;

[0103] The input signal pin pad of the first LED chip soldering area 30 is connected to the signal pad 33 via the signal line 32; the input signal pin pad on the next LED chip soldering area 30 of the adjacent series-connected LED chip soldering areas 30 is connected to the output signal pin pad on the previous LED chip soldering area 30.

[0104] As a further preferred method, such as Figure 10The connection of the signal line 32 can also be realized by the way of binding the jumper. For the sake of distinction, the jumper realizing the signal line 32 is called signal jumper 321, that is, the binding connection between the signal pin pad and each LED lamp bead 2 is realized by using the signal jumper 321. In this way, the signal line 32 is also realized by the way of jumper, which can further improve the transparency.

[0105] As shown in Figure 11 , as a preferred way, the above process is repeated on the basis of Figure 5 , several columns of LED lamp beads 2 share the same polarity of the power supply line 31, and the cyclic arrangement can make a large-area transparent LED display screen.

[0106] In addition to using the metal layer etched on the transparent substrate 1 as the power supply line 31, as an example, as shown in Figure 12 , a grid can also be used as the power supply line 31. The grid can be a metal grid or an ITO (English name: Indium Tin Oxides; Chinese name: Indium Tin Oxides) grid. In the figure, the dots are the binding lines and the binding points (electrical connection points) of the metal grid or ITO. The conductive capacity of the metal grid or ITO grid is relatively small, so a large area is needed to meet the current demand.

[0107] The transparent LED display screen provided in this example directly or indirectly electrically connects at least part of the LED lamp beads 2 to the power supply line 31 by using the power supply jumper 311. The diameter of the power supply jumper 311 is generally 10-100 μm, which is almost invisible to the naked eye and has little effect on the line of sight. Since the power supply jumper 311 occupies a very small area, its effect on transparency is very low. The binding connection method is simple in process and easy to implement, which greatly improves the transparency of the transparent LED display screen.

[0108] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A transparent LED display screen, comprising a transparent substrate and LED lamp beads, wherein the transparent substrate is provided with a circuit pattern, the circuit pattern comprises a power supply pad, a signal pad and lamp bead pads arranged in an array, and the LED lamp beads are welded on the lamp bead pads; each of the lamp bead pads is provided with pin pads corresponding to pins of the LED lamp beads; the pin pads comprise signal pin pads and electrode pin pads; the electrode pin pads comprise first and second electrode pin pads with opposite polarities; the circuit pattern further comprises a plurality of power supply lines and signal lines; the power supply lines are connected to the power supply pad and comprise first and second power supply lines with opposite polarities; the first power supply line is connected to the first electrode pin pad, and the second power supply line is connected to the second electrode pin pad; the signal pad and the signal pin pads on the lamp bead pads are connected by the signal lines to realize the series connection of the LED lamp beads, so that a control signal for controlling the on-off of each LED lamp bead can be input from the signal pad through the signal lines and transmitted by the series connected LED lamp beads in turn; at least part of the first electrode pin pads on the LED lamp beads are directly or indirectly bound to the first power supply line by a power supply jumper; at least part of the second electrode pin pads on the LED lamp beads are directly or indirectly bound to the second power supply line by a power supply jumper; the power supply lines comprise one or more rows or columns of the first power supply lines; at least part of the first electrode pin pads on the lamp bead pads are bound to the first power supply line by a power supply jumper, and part of the first electrode pin pads on the lamp bead pads are bound to the first electrode pin pads on adjacent lamp bead pads by a power supply jumper; the first electrode pin pads and the second electrode pin pads on the lamp bead pads in adjacent rows or columns are oppositely arranged; first and second LED lamp beads with oppositely arranged electrode pins are respectively arranged on the lamp bead pads in adjacent rows or columns; the positions of first, second and third light emitting chips on the LED lamp beads are unchanged; the circuit pattern is provided with N rows*M columns of lamp bead pads; the circuit pattern is provided with M signal pads; the M signal pads and the signal pin pads in the N lamp bead pads in the same column are connected in series by signal lines; alternatively, the circuit pattern is provided with N signal pads; the N signal pads and the signal pin pads in the M lamp bead pads in the same row are connected in series by signal lines; the circuit pattern is provided with M+1 power supply pads or N+1 power supply pads; the M+1 power supply pads or N+1 power supply pads comprise first and second power supply pads with opposite polarities arranged at intervals; the power supply lines comprise a plurality of first and second power supply lines arranged in columns or rows at intervals; each first power supply pad is electrically connected to the first power supply line, and each second power supply pad is electrically connected to the second power supply line. characterized in that ​ ​ ​ ​ ​ ​ ​ ​ ​ 2. The transparent LED display of claim 1, wherein, ​ ​ ​ 3. The transparent LED display of claim 2, wherein, ​ ​ ​ ​ The first power supply line and the second power supply line arranged in columns are arranged in parallel with the LED lamp beads in each column; or the first power supply line and the second power supply line arranged in rows are arranged in parallel with the LED lamp beads in each row; The first electrode pin pad on the lamp bead welding area is connected to the nearest first power supply line through power jumpers; the second electrode pin pad on the lamp bead welding area is connected to the nearest second power supply line through power jumpers.

4. The transparent LED display of claim 3, wherein, The first power supply line and the second power supply line arranged in columns are arranged in parallel with the LED lamp beads in each column; or the first power supply line and the second power supply line arranged in rows are arranged in parallel with the LED lamp beads in each row; The first electrode pin pad on the lamp bead welding area is connected to the nearest first power supply line through power jumpers; the second electrode pin pad on the lamp bead welding area is connected to the nearest second power supply line through power jumpers. The first power supply line and the second power supply line arranged in columns are arranged in parallel with the LED lamp beads in each column; or the first power supply line and the second power supply line arranged in rows are arranged in parallel with the LED lamp beads in each row; 5. The transparent LED display of claim 4, wherein, The first electrode pin pad on the lamp bead welding area is connected to the nearest first power supply line through power jumpers; the second electrode pin pad on the lamp bead welding area is connected to the nearest second power supply line through power jumpers. The first power supply line and the second power supply line arranged in columns are arranged in parallel with the LED lamp beads in each column; or the first power supply line and the second power supply line arranged in rows are arranged in parallel with the LED lamp beads in each row; 6. The transparent LED display of claim 2, wherein, The second electrode pin pad on at least part of the lamp bead welding areas is connected to the second power supply line through power jumpers, and the second electrode pin pad on part of the lamp bead welding areas is connected to the second electrode pin pad on the adjacent lamp bead welding area through power jumpers. The LED lamp bead comprises a shell, a driving chip and a light emitting wafer; wherein the light emitting wafer comprises a first light emitting wafer, a second light emitting wafer and a third light emitting wafer; 7. The transparent LED display of claim 2, wherein, The shell is provided with a chip mounting surface, and a pin is led out from the chip mounting surface; the driving chip is mounted on the shell; the first light emitting wafer, the second light emitting wafer and the third light emitting wafer are mounted on the driving chip; The first electrode pin and the second electrode pin are welded to the electrode pin pad on the lamp bead welding area; the input signal pin and the output signal pin are respectively welded to the signal pin pad on the lamp bead welding area. The signal pin pad comprises an input signal pin pad and an output signal pin pad; 8. The transparent LED display of claim 1, wherein, The input signal pin pad of the first lamp bead welding area is connected to the signal pad through a signal line; the input signal pin pad on the next lamp bead welding area of the adjacent string-connected lamp bead welding area is connected to the output signal pin pad on the previous lamp bead welding area. The signal line is a signal jumper, and the binding connection between the signal pin pad and each LED lamp bead is realized through the signal jumper.

9. The transparent LED display of claim 8, wherein, The transparent substrate on which the LED lamp bead is arranged is provided with a glue filling layer, and the glue filling layer solidifies each transparent LED lamp bead therein; the upper surface of the glue filling layer is provided with a protective cover plate.

10. The transparent LED display of claim 9, wherein, ​

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