Replaceable module for a charged particle device

Abstract

Disclosed herein is a module for supporting an apparatus configured to manipulate a charged particle path in a charged particle device, the module comprising: a support arrangement configured to support the apparatus, wherein the apparatus is configured to manipulate a charged particle path within the charged particle device; and a support positioning system configured to move the support arrangement within the module; wherein the module is arranged to be field replaceable in the charged particle device.

Description

[0001] Cross-referencing of related patent applications

[0002] This application claims priority to U.S. Application 63 / 037,481, filed June 10, 2020, and EP Application 20197510.9, filed September 22, 2020, both of which are incorporated herein by reference in their entirety. Technical Field

[0003] The embodiments provided herein generally relate to providing an electro-optical assembly in a charged particle device. An electro-optical assembly is configured to manipulate one or more charged particle beams, such as by deflecting and / or focusing the charged particle beam. Embodiments provide electro-optical devices on replaceable modules within a charged particle device. Embodiments also provide techniques for properly aligning the electro-optical assembly with an incident source beam. Background Technology

[0004] When manufacturing semiconductor integrated circuit (IC) chips, undesirable pattern defects inevitably occur on the substrate (i.e., wafer) or mask during the manufacturing process due to factors such as optical effects and incident particles, thus reducing yield. Therefore, monitoring the extent of these undesirable pattern defects is a crucial process in IC chip manufacturing. More generally, the inspection and / or measurement of the substrate or other object / material surface is an important process during and / or after its manufacturing.

[0005] Pattern inspection tools with charged particle beams have been used to inspect objects, such as detecting pattern defects. These tools typically employ electron microscopy techniques, such as scanning electron microscopy (SEM). In SEM, a primary electron beam of electrons at relatively high energies targets a final deceleration step, thus landing on the sample at a relatively low landing energy. The electron beam is focused onto the sample as a probe spot. The interaction between the material structure at the probe spot and the landing electrons from the electron beam causes electrons to be emitted from the surface, such as secondary electrons, backscattered electrons, or Auger electrons. The generated secondary electrons can be emitted from the material structure of the sample. By scanning the primary electron beam as a probe spot across the sample surface, secondary electrons can be emitted across the sample surface. By collecting these emitted secondary electrons from the sample surface, the pattern inspection tool can obtain an image representing the material structure features of the sample surface.

[0006] Another application of charged particle beams is photolithography. The charged particle beam reacts with a resist layer on a substrate surface. A desired pattern in the resist can be created by controlling the position of the charged particle beam on the resist layer. A charged particle device can be a device for generating, irradiating, projecting, and / or detecting one or more charged particle beams. Within the charged particle device, one or more electro-optical devices are provided for manipulating one or more charged particle beams. Generally, improvements are needed to known techniques for providing electro-optical devices in charged particle devices. Summary of the Invention

[0007] The embodiments provided herein disclose a module including electro-optical devices. This module is replaceable in the field within the charged particle device. Therefore, the electro-optical devices can be easily replaced by removing the module from the charged particle device and reinstalling a module with different attached electro-optical devices. Alternatively, different modules including different electro-optical devices can be installed.

[0008] The embodiments also provide techniques for aligning electro-optical devices with other components of charged particle devices.

[0009] According to a first aspect of the invention, a module is provided for supporting an apparatus configured to manipulate charged particle paths within a charged particle device, the module comprising: a support arrangement configured to support the apparatus, wherein the apparatus is configured to manipulate charged particle paths within the charged particle device; and a support positioning system configured to move the support arrangement within the module; wherein the module is arranged to be field-replaceable within the charged particle device.

[0010] According to a second aspect of the invention, a module is provided for supporting means configured to manipulate the path of charged particles in a charged particle device, the module comprising: a module flange configured to be attached to and detached from a housing flange of the housing of the charged particle device, such that the module is field-replaceable in the charged particle device.

[0011] According to a third aspect of the invention, a charged particle device is provided, comprising a field-replaceable module according to either the first or second aspect.

[0012] According to a fourth aspect of the present invention, a method for mounting an electron optical device within a charged particle device is provided, the method comprising: attaching the electron optical device to a module; applying coarse adjustments to the Rx state, Ry state, and / or z position of the electron optical device relative to the body of the module; and securing the module to the charged particle device.

[0013] According to a fifth aspect of the invention, a method is provided for aligning an electro-optical device with a charged particle beam or multiple beams within a charged particle device, the method comprising: fixing a module including the electro-optical device to the charged particle device, thereby mounting the electro-optical device within the charged particle device; applying fine adjustments to the x-position, y-position, and / or Rz-state of the electro-optical device relative to the body of the module; and applying adjustments to the path of the charged particle beam or multiple beams within the charged particle device.

[0014] According to a sixth aspect of the invention, an electron optics tube configured to project an electron beam onto a sample is provided, the tube comprising: a frame configured to define a reference frame for the tube; a chamber for receiving a field-replaceable module including electron optics devices; a coupling arrangement configured to engage with the field-replaceable module to align the field-replaceable module with the frame; and an active positioning system configured to position the beam and devices relative to each other for fine alignment.

[0015] According to a seventh aspect of the invention, a field-replaceable module is provided, which is arranged to be removably inserted into an electro-optical tube, the field-replaceable module comprising: an electro-optical element configured to manipulate the path of an electron beam in the electro-optical tube; a support configured to support the electro-optical element; and a coupling arrangement configured to align the support with the frame of the electro-optical tube in all degrees of freedom.

[0016] Advantageously, the module according to the embodiment allows the electro-optical device to be easily replaceable without substantially disassembling the charged particle device.

[0017] Other advantages of the invention will become apparent from the following description taken in conjunction with the accompanying drawings, in which certain embodiments of the invention are illustrated by way of description and example. Attached Figure Description

[0018] The above and other aspects of this disclosure will become clearer from the description of exemplary embodiments in conjunction with the accompanying drawings.

[0019] Figure 1 This is a schematic diagram illustrating an exemplary charged particle beam inspection device.

[0020] Figure 2 It is illustrated as Figure 1 A schematic diagram of an exemplary multi-beam device, representing a portion of an exemplary charged particle beam inspection device.

[0021] Figure 3 This is a schematic diagram of an exemplary multi-beam device, illustrating... Figure 1 An exemplary configuration of the source conversion unit of an exemplary charged particle beam inspection device.

[0022] Figure 4A This is a schematic diagram of a portion of a charged particle device according to one embodiment.

[0023] Figure 4B This is a schematic diagram of a portion of a charged particle device according to one embodiment.

[0024] Figure 5 This is a schematic cross-sectional view of a module installed in a charged particle device according to one embodiment.

[0025] Figure 6 This is a schematic cross-sectional view of an electron optical device installed in a charged particle device according to one embodiment.

[0026] Figure 7 This is a schematic diagram of a cross-section of a module according to an embodiment during insertion into a charged particle device.

[0027] Figure 8 This is a schematic cross-sectional view of a portion of the module according to the first embodiment.

[0028] Figure 9 This is a schematic cross-sectional view of a portion of the module according to the first embodiment.

[0029] Figure 10A This is a schematic cross-sectional view of a portion of the module according to the second embodiment.

[0030] Figure 10B This is a schematic cross-sectional view of a portion of the module according to the second embodiment.

[0031] Figure 11A This is a schematic diagram of a cross-section of the module implemented in the third embodiment.

[0032] Figure 11B This is a schematic cross-sectional view of a portion of the module implemented according to the third embodiment.

[0033] Figure 11C , Figure 11D and Figure 11E This is a schematic plan view showing the stages of the operating state of the piezoelectric actuator implemented according to the third embodiment.

[0034] Figure 11F This is a schematic diagram of a cross-section of a module implemented according to the third embodiment.

[0035] Figure 11G , Figure 11H and Figure 11I This is a schematic plan view showing the stages of the operating state of the piezoelectric actuator implemented according to the third embodiment.

[0036] Figure 12A This is a schematic diagram of a cross-section of the module implemented according to the fourth embodiment.

[0037] Figure 12B This is a schematic cross-sectional view of a portion of the module implemented according to the fourth embodiment.

[0038] Figure 12C This is a schematic cross-sectional view of a portion of the module implemented according to the fourth embodiment.

[0039] Figure 12D This is a schematic cross-sectional view of a portion of the module implemented according to the fourth embodiment.

[0040] Figure 13 This is a schematic cross-sectional view of a portion of the module according to the fifth embodiment.

[0041] Figure 14A This is a schematic diagram of a module fixed to a charged particle device according to the sixth embodiment.

[0042] Figure 14B This is a schematic diagram of the flange of the charged particle device in the sixth embodiment.

[0043] Figure 15A This is a schematic diagram of a module portion in the charged particle device according to the seventh embodiment.

[0044] Figure 15B This is a schematic diagram of the locking bolt arrangement according to the seventh embodiment.

[0045] Figure 16 This is a schematic diagram of a charged particle device according to one embodiment.

[0046] Figure 17 This is a flowchart of a method according to one embodiment.

[0047] Figure 18 This is a flowchart of a method according to one embodiment.

[0048] Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings, wherein, unless otherwise stated, the same reference numerals in different drawings denote the same or similar elements. The implementations set forth in the following description of the exemplary embodiments do not represent all implementations consistent with the present invention. Rather, they are merely examples of devices and methods consistent with the aspects of the invention as described in the appended claims. Detailed Implementation

[0049] The reduction in the physical size of devices and the enhancement of the computing power of electronic devices can be achieved by significantly increasing the packaging density of circuit components such as transistors, capacitors, and diodes on IC chips. This can be achieved by increasing resolution, thereby enabling the manufacture of smaller structures. For example, the IC chip of a smartphone can include more than 2 billion transistors, each smaller than 1 / 1000th the size of a human hair, and the IC chip itself is the size of a thumbnail and was available in 2019 or earlier. Therefore, it is not surprising that semiconductor IC manufacturing is a complex and time-consuming process with hundreds of individual steps. Even an error in one step can significantly affect the functionality of the final product. A single “fatal defect” can cause a device to fail. The goal of a manufacturing process is to improve the overall process yield. For example, for a 50-step process (where steps can indicate the number of layers formed on the wafer), to achieve a 75% yield, each individual step must have a yield greater than 99.4%. If the yield of each individual step is 95%, the overall process yield will be as low as 7-8%.

[0050] While high process yields are required in IC chip manufacturing facilities, maintaining high substrate (i.e., wafer) yields (defined as the number of substrates processed per hour) is also essential. The presence of defects can impact both high process yields and high substrate yields, especially in situations requiring operator intervention to inspect for defects. Therefore, high-volume detection and identification of micron- and nanometer-scale defects using inspection tools such as scanning electron microscopy ('SEM') is necessary to maintain both high yields and low costs.

[0051] SEM comprises a scanning device and a detector device. The scanning device includes an illumination device comprising an electron source for displaying primary electrons, and a projection device for scanning a sample, such as a substrate, using one or more focused primary electron beams. Primary electrons interact with the sample and generate interaction products, such as secondary electrons and / or backscattered electrons. As the sample is scanned, the detector device captures secondary electrons and / or backscattered electrons from the sample, allowing the SEM to create an image of the scanned area of ​​the sample. For high-throughput inspection, some inspection devices use multiple focused beams, i.e., multi-beam primary electron inspection. The constituent beams of a multi-beam inspection can be referred to as sub-beams or small beams. Multi-beam inspection can scan different portions of the sample simultaneously. Therefore, multi-beam inspection devices can inspect samples at much higher speeds than single-beam inspection devices.

[0052] In multi-beam inspection equipment, some primary electron beams deviate from the central axis of the scanning apparatus, i.e., the midpoint of the primary electron optical axis (also referred to herein as the charged particle axis). To ensure that all electron beams reach the sample surface at substantially the same angle of incidence, sub-beam paths with a greater radial distance from the central axis need to be manipulated by moving through a larger angle compared to sub-beam paths with paths closer to the central axis. This stronger manipulation can lead to aberrations, resulting in blurred and out-of-focus images. One example is spherical aberration, which brings the focus of each sub-beam path into a different focal plane. In particular, for sub-beam paths not on the central axis, the variation in the focal plane within the sub-beam increases with radial displacement from the central axis. When secondary electrons from the target are detected, such aberrations and defocusing effects may still be associated with the secondary electrons from the target; for example, the shape and size of the spots formed by the sub-beams on the target will be affected. Therefore, such aberrations degrade the quality of the resulting image created during inspection.

[0053] The implementation of a known multi-beam inspection device is described below.

[0054] The accompanying drawings are schematic. Therefore, for clarity, the relative sizes of the components in the drawings are exaggerated. In the following description of the drawings, the same or similar reference numerals refer to the same or similar components or entities, and differences are described only with respect to the various embodiments. Although the description and drawings are directed to electro-optical devices, it should be understood that the embodiments are not intended to limit this disclosure to specific charged particles. Therefore, references to electrons throughout this document can be more generally considered as references to charged particles, which do not necessarily have to be electrons.

[0055] Now to Figure 1 For reference, Figure 1 This is a schematic diagram illustrating an exemplary charged particle beam inspection device 100. Figure 1 The charged particle beam inspection device 100 includes a main chamber 10, a loading and locking chamber 20, an electron beam tool 40, an equipment front-end module (EFEM) 30, and a controller 50.

[0056] EFEM 30 includes a first loading port 30a and a second loading port 30b. EFEM 30 may include additional loading ports(s). For example, the first loading port 30a and the second loading port 30b may receive a substrate (e.g., a semiconductor substrate or a substrate made of(s) other materials) or a sample to be inspected (substrate, wafer, and sample, hereinafter collectively referred to as "sample"). One or more robotic arms (not shown) in EFEM 30 transport the sample to the loading locking chamber 20.

[0057] Loading lock chamber 20 is used to remove gas surrounding the sample. This creates a vacuum, i.e., a local pressure lower than the ambient pressure. Loading lock chamber 20 can be connected to a loading lock vacuum pump system (not shown), which removes gas particles from loading lock chamber 20. Operation of the loading lock vacuum pump system enables the loading lock chamber to reach a first pressure below atmospheric pressure. After reaching the first pressure, one or more robotic arms (not shown) transport the sample from loading lock chamber 20 to main chamber 10. Main chamber 10 is connected to a main chamber vacuum pump system (not shown). The main chamber vacuum pump system removes gas molecules from main chamber 10, causing the pressure around the sample to reach a second pressure below the first pressure. After reaching the second pressure, the sample is transported to an electron beam tool for examination. Electron beam tool 40 may include single-beam or multi-beam electron optics.

[0058] The controller 50 is electrically connected to the electron beam tool 40. The controller 50 may be a processor (such as a computer) configured to control the charged particle beam inspection device 100. The controller 50 may also include a processing circuitry system configured to perform various signal and image processing functions. Although the controller 50 is... Figure 1 The device is shown outside the structure comprising the main chamber 10, the loading and locking chamber 20, and the EFEM 30; however, it should be understood that the controller 50 may be part of this structure. The controller 50 may be located in one of the components of the charged particle beam inspection apparatus, or it may be distributed across at least two of the components. While this disclosure provides an example of a main chamber 10 for housing an electron beam inspection tool, it should be noted that aspects of this disclosure are, in their broadest sense, not limited to the chamber for housing an electron beam inspection tool. More precisely, it should be understood that the foregoing principles can also be applied to other arrangements of the apparatus and other tools operating under a second pressure.

[0059] Now to Figure 2 For reference, Figure 2 This is a schematic diagram illustrating an exemplary electron beam tool 40, which includes, as... Figure 1This is a multi-beam inspection tool, a part of an exemplary charged particle beam inspection apparatus 100. The multi-beam electron beam tool 40 (also referred to herein as apparatus 40) includes an electron source 201, a bore plate 271, a focusing lens 210, a source conversion unit 220, a primary projection device 230, a motorized stage 209, and a sample holder 207. The electron source 201, bore plate 271, focusing lens 210, and source conversion unit 220 are components of the irradiation apparatus included in the multi-beam electron beam tool 40. The sample holder 207 is supported by the motorized stage 209 to hold a sample 208 (e.g., a substrate or mask) for inspection. The multi-beam electron beam tool 40 may also include a secondary projection device 250 and an associated electron detection device 240. The primary projection device 230 may include an objective lens 231. The electron detection device 240 may include a plurality of detection elements 241, 242, and 243. The beam splitter 233 and the deflection scanning unit 232 can be positioned inside the primary projection device 230.

[0060] The components used to generate the primary beam can be aligned with the primary electron optical axis of device 40. These components may include: an electron source 201, a bore plate 271, a focusing lens 210, a source conversion unit 220, a beam splitter 233, a deflection scanning unit 232, and a primary projection device 230. The secondary projection device 250 and its associated electronic detection device 240 can be aligned with the secondary electron optical axis 251 of device 40.

[0061] The primary electron optical axis 204 is constituted by the electron optical axis that is part of the electron beam tool 40 of the irradiation device. The secondary electron optical axis 251 is the electron optical axis that is part of the electron beam tool 40 of the detection device. The primary electron optical axis 204 may also be referred to herein as the primary optical axis (for ease of reference) or the charged particle optical axis. The secondary electron optical axis 251 may also be referred to herein as the secondary optical axis or the secondary charged particle optical axis.

[0062] The electron source 201 may include a cathode (not shown) and an extractor or anode (not shown). During operation, the electron source 201 is configured to emit electrons from the cathode as primary electrons. The primary electrons are extracted or accelerated by the extractor and / or the anode to form a primary electron beam 202, which forms a primary beam cross (virtual or real) 203. The primary electron beam 202 can be visualized as being emitted from the primary beam cross 203.

[0063] The formed primary electron beam 202 can be a single beam, and multiple beams can be generated from the single beam. At different locations along the beam path, the primary electron beam 202 can therefore be a single beam or a multiple beam. When it reaches the sample, and preferably before it reaches the projection device, the primary electron beam 202 is a multiple beam. Such multiple beams can be generated from the primary electron beam in many different ways. For example, multiple beams can be generated by a multiple beam array located before the cross 203, a multiple beam array located in the source conversion unit 220, or a multiple beam array located at any point between these locations. The multiple beam array can include multiple electron beam manipulation elements arranged in an array across the beam path. Each manipulation element can influence at least a portion of the primary electron beam to generate a sub-beam. Thus, the multiple beam array interacts with the incident primary beam path to generate a multiple beam path downstream of the beam of the multiple beam array. The interaction between the multi-beam array and the primary beam can include one or more aperture arrays, such as individual deflectors for each sub-beam, lenses, astigmatists, and, again, such as (aberration) correctors for each sub-beam.

[0064] In operation, the perforation plate 271 is configured to block peripheral electrons of the primary electron beam 202 to reduce the Coulomb effect. The Coulomb effect can increase the size of each probe spot 221, 222, and 223 of the primary sub-beams 211, 212, and 213, and thus degrade the inspection resolution. The perforation plate 271 may also include multiple openings for generating the primary sub-beams (not shown) even before the source conversion unit 220, and may be referred to as a Coulomb aperture array.

[0065] The focusing lens 210 is configured to focus (or collimate) the primary electron beam 202. In one embodiment, the focusing lens 210 may be designed to focus (or collimate) the primary electron beam 202 to become a substantially parallel beam and incident substantially perpendicularly onto the source conversion unit 220. The focusing lens 210 may be a movable focusing lens, which may be configured such that the position of its principal plane is movable. In one embodiment, the movable focusing lens may be configured to physically move, for example, physically move the optical axis 204. Alternatively, the movable focusing lens may consist of two or more electro-optic elements (lenses), wherein the principal plane of the focusing lens moves with changes in the intensity of the individual electro-optic elements. The (movable) focusing lens may be configured to be a magnetic, electrostatic, or a combination of magnetic and electrostatic lenses. In another embodiment, the focusing lens 210 may be an anti-rotation focusing lens. The anti-rotation focusing lens may be configured to maintain a constant rotation angle when the focusing capability (collimation capability) of the focusing lens 210 changes and / or when the principal plane of the focusing lens moves.

[0066] In one embodiment of source conversion unit 220, source conversion unit 220 may include an image forming element array, an aberration compensator array, a beam limiting aperture array, and a pre-bent micro-deflector array. The pre-bent micro-deflector array may be optional and may be present in embodiments where the focusing lens cannot ensure that sub-beams originating from the Coulomb aperture array are substantially perpendicularly incident on, for example, the beam limiting aperture array, the image forming element array, and / or the aberration compensator array. The image forming element array may be configured to generate multiple sub-beams, i.e., primary sub-beams 211, 212, 213, in a multi-beam path. The image forming element array may, for example, include multiple electron beam manipulators, such as micro-deflector microlenses (or a combination of both), to influence the multiple primary sub-beams 211, 212, 213 of the primary electron beam 202 and form multiple parallel images (virtual or real) of the primary beam cross 203, one parallel image for each of the primary sub-beams 211, 212, and 213. The aberration compensator array may include, for example, a field curvature compensator array (not shown) and an astigmatism compensator array (not shown). The field curvature compensator array may include, for example, multiple microlenses to compensate for field curvature aberrations in the primary sub-beams 211, 212, and 213. The astigmatism compensator array may include multiple micro-astigmatists to compensate for astigmatic aberrations in the primary sub-beams 211, 212, and 213. The beam-limiting aperture array may be configured to define the diameters of the individual primary sub-beams 211, 212, and 213. Figure 2 Three primary sub-beams 211, 212, and 213 are shown as an example, and it should be understood that the source conversion unit 220 can be configured to form any number of primary sub-beams. The controller 50 can be connected to... Figure 1 The charged particle beam inspection equipment 100 comprises various components, such as the source conversion unit 220, the electronic detection device 240, the primary projection device 230, or the motorized worktable 209. As explained in further detail below, the controller 50 can perform various image and signal processing functions. The controller 50 can also generate various control signals to manage the operation of the charged particle beam inspection equipment (including charged particle multi-beam equipment).

[0067] The focusing lens 210 can also be configured to adjust the current of the primary sub-beams 211, 212, 213 downstream of the beam of the source conversion unit 220 by changing the focusing capability (collimation capability) of the focusing lens 210. Alternatively or additionally, the current of the primary sub-beams 211, 212, 213 can be changed by changing the radial dimension of the beam-limiting aperture within the beam-limiting aperture array corresponding to the individual primary sub-beams.

[0068] Objective lens 231 can be configured to focus sub-beams 211, 212 and 213 onto sample 208 for inspection, and in the current embodiment, three probe spots 221, 222 and 223 can be formed on the surface of sample 208.

[0069] The beam splitter 233 can be, for example, a Wien filter comprising an electrostatic dipole field and a magnetic dipole field. Figure 2 (Not shown in the image). In operation, beam splitter 233 can be configured to apply electrostatic forces to the respective electrons of primary sub-beams 211, 212, and 213 via an electrostatic dipole field. In one embodiment, the electrostatic force is equal in magnitude but opposite in direction to the magnetic force applied to the respective primary electrons of primary sub-beams 211, 212, and 213 by the magnetic dipole field of beam splitter 233. Primary sub-beams 211, 212, and 213 can therefore pass through beam splitter 233 at least substantially straight with a deflection angle of at least substantially zero. The direction of the magnetic force depends on the direction of electron motion, while the direction of the electrostatic force does not depend on the direction of electron motion. Therefore, since secondary electrons and backscattered electrons generally move in opposite directions compared to primary electrons, the magnetic force applied to secondary electrons and backscattered electrons will no longer cancel out the electrostatic force, and thus the secondary electrons and backscattered electrons moving through beam splitter 233 will deviate from the optical axis 204.

[0070] In operation, deflection scanning unit 232 is configured to deflect primary sub-beams 211, 212, and 213 to scan probe spots 221, 222, and 223 across various scanning regions in a portion of the surface of sample 208. In response to the incidence of primary sub-beams 211, 212, and 213 or probe spots 221, 222, and 223 on sample 208, electrons, including secondary electrons and backscattered electrons, are generated from sample 208. In the current embodiment, the secondary electrons propagate in three secondary electron beams 261, 262, and 263. Secondary electron beams 261, 262, and 263 typically contain secondary electrons (with electron energies ≤50 eV) and may also contain at least some backscattered electrons (with electron energies between the landing energies of primary sub-beams 211, 212, and 213 and 50 eV). Beam splitter 233 is arranged to deflect the paths of secondary electron beams 261, 262, and 263 toward secondary projection device 250. Secondary projection device 250 then focuses the paths of the secondary electron beams 261, 262, and 263 onto multiple detection regions 241, 242, and 243 of electron detection device 240. For example, the detection regions may be individual detection elements 241, 242, and 243 arranged to detect corresponding secondary electron beams 261, 262, and 263. The detection regions may generate corresponding signals, which may be sent, for example, to controller 50 or signal processing system (not shown), to construct images of corresponding scanned areas of sample 208.

[0071] Detection elements 241, 242, and 243 can detect corresponding secondary electron beams 261, 262, and 263. When the secondary electron beams are incident using detection elements 241, 242, and 243, these elements can generate corresponding intensity signal outputs (not shown). The outputs can be directed to an image processing system (e.g., controller 50). Each detection element 241, 242, and 243 can include one or more pixels. The intensity signal output of the detection element can be the sum of the signals generated by all pixels within the detection element.

[0072] The controller 50 may include an image processing system comprising an image acquirer (not shown) and a storage device (not shown). For example, the controller may include a processor, computer, server, mainframe, terminal, personal computer, any type of mobile computing device, etc., or combinations thereof. The image acquirer may include at least a portion of the controller's processing capabilities. Therefore, the image acquirer may include at least one or more processors. The image acquirer may be communicatively coupled to an electronic detection device 240 that allows signal communication, such as an electrical conductor, fiber optic cable, portable storage medium, IR, Bluetooth, the Internet, wireless network, radio, etc., or combinations thereof. The image acquirer may receive signals from the electronic detection device 240, process the data contained in the signals, and construct an image based on that data. The image acquirer can thus acquire an image of sample 208. The image acquirer may also perform various post-processing functions, such as generating contours, overlaying indicators on the acquired image, etc. The image acquirer may be configured to perform adjustments such as brightness and contrast on the acquired image. The storage device may be a storage medium such as a hard disk, flash drive, cloud storage, random access memory (RAM), other types of computer-readable storage, etc. The memory can be coupled to the image acquisition unit and can be used to store scanned raw image data as the initial image and post-processed images.

[0073] The image acquirer can acquire one or more images of a sample based on imaging signals received from the electronic detection device 240. The imaging signals may correspond to a scanning operation used to perform charged particle imaging. The acquired image may be a single image comprising multiple imaging regions. The single image may be stored in a storage device. The single image may be an original image that can be divided into multiple regions. Each region may include an imaging region containing features of sample 208. The acquired images may include multiple images of a single imaging region of sample 208 sampled multiple times over a period of time. Multiple images may be stored in a storage device. The controller 50 may be configured to perform image processing steps on multiple images of the same location of sample 208.

[0074] The controller 50 may include measurement circuitry (e.g., an analog-to-digital converter) to obtain the distribution of detected secondary electrons. The electron distribution data collected during the detection time window can be combined with corresponding scan path data of each primary sub-beam 211, 212, and 213 incident on the sample surface to reconstruct an image of the examined sample structure. The reconstructed image can be used to reveal various features of the internal or external structure of sample 208. The reconstructed image can thus be used to reveal any defects that may be present in the sample.

[0075] The controller 50 may, for example, further control the motorized stage 209 to move the sample 208 during, before, or after the inspection of the sample 208. In one embodiment, the controller 50 may enable the motorized stage 209 to move the sample 208 in one direction, for example, continuously, at a constant speed, at least during sample inspection. The controller 50 may control the movement of the motorized stage 209 such that the speed of movement of the sample 208 varies, for example, according to various parameters. For example, the controller may control the stage speed (including its direction) based on the characteristics of the inspection steps in the scanning process.

[0076] Although Figure 2 The device 40 is shown to use three primary electron sub-beams; however, it should be understood that the device 40 may use two or more primary electron sub-beams. This disclosure does not limit the number of primary electron sub-beams used in the device 40.

[0077] Now to Figure 3 For reference, this is a schematic diagram of an exemplary multi-beam device, illustrating... Figure 1 An exemplary configuration of the source conversion unit of an exemplary charged particle beam inspection apparatus. Apparatus 300 may include an electron source 301, a pre-beamforming aperture array 372 (also referred to as a coulomb aperture array 372), and a focusing lens 310 (similar to...). Figure 2 (Converging lens 210), source conversion unit 320, objective lens 331 (similar to) Figure 2 Objective 231) and sample 308 (similar to) Figure 2 (Sample 208). The electron source 301, coulomb aperture array 372, and focusing lens 310 can be components of the illumination device included in the device 300. The light source conversion unit 320 and objective lens 331 can be components of the projection device included in the device 300. The source conversion unit 320 can be similar to... Figure 2 The source conversion unit 220, wherein Figure 2 The image forming element array is an image forming element array 322. Figure 2 The aberration compensator array is an aberration compensator array 324. Figure 2 The beam limiting aperture array is beam limiting aperture array 321, and Figure 2The pre-bent micro-deflector array is a pre-bent micro-deflector array 323. An electron source 301, a coulomb aperture array 372, a focusing lens 310, a source conversion unit 320, and an objective lens 331 are aligned with the primary electron optical axis 304 of the device. The electron source 301 shows a primary electron beam 302 substantially along the primary electron optical axis 304 and having source crossovers (virtual or real) 301S. The coulomb aperture array 372 cuts off the peripheral electrons of the primary electron beam 302 to reduce the accompanying Coulomb effect. The primary electron beam 302 can be trimmed into a specified number of sub-beams, such as three sub-beams 311, 312, and 313, by the coulomb aperture array 372 of the pre-sub-beamforming mechanism. Although the three sub-beams and their paths are mentioned in the preceding and following descriptions, it should be understood that this description is intended for application to devices, tools, or systems with any number of sub-beams.

[0078] Source conversion unit 320 may include a small beam-limiting aperture array 321 having a beam-limiting aperture configured to define the outer size of sub-beams 311, 312, and 313 of the primary electron beam 302. Source conversion unit 320 may also include an image-forming element array 322 having image-forming micro-deflectors 322_1, 322_2, and 322_3. A corresponding micro-deflector is associated with the path of each sub-beam. Micro-deflectors 322_1, 322_2, and 322_3 are configured to deflect the paths of sub-beams 311, 312, and 313 toward the electron optical axis 304. The deflected sub-beams 311, 312, and 313 form a virtual image (not shown) of the source cross 301S. In the current embodiment, these virtual images are projected onto the sample 308 through objective lens 331, forming probe spots thereon, namely three probe spots 391, 392, and 393. Each probe spot corresponds to the incident position of the sub-beam path on the sample surface. The source conversion unit 320 may also include an aberration compensator array 324 configured to compensate for aberrations that may be present in each sub-beam. The aberration compensator array 324 may, for example, include an array of field curvature compensators (not shown) with microlenses. For example, the field curvature compensators and microlenses may be configured to compensate for the individual sub-beams for significant field curvature aberrations in probe spots 391, 392, and 393. The aberration compensator array 324 may include an astigmatism compensator array (not shown) with micro-astigmatism. For example, the micro-astigmatism may be controlled to operate on the sub-beams to compensate for astigmatic aberrations that may otherwise be present in probe spots 391, 392, and 393.

[0079] The source conversion unit 320 may further include a pre-bent micro-deflector array 323 having pre-bent micro-deflectors 323_1, 323_2, and 323_3 to bend sub-beams 311, 312, and 313, respectively. The pre-bent micro-deflectors 323_1, 323_2, and 323_3 can bend the path of the sub-beams onto the small beam limiting aperture array 321. In one embodiment, the pre-bent micro-deflector array 323 may be configured to orthogonally bend the sub-beam path of the sub-beams toward a plane on the small beam limiting aperture array 321. In an alternative embodiment, a focusing lens 310 can adjust the path direction of the sub-beams onto the small beam limiting aperture array 321. The focusing lens 310, for example, can focus (collimate) three sub-beams 311, 312, and 313 into substantially parallel beams along the primary electron optical axis 304, such that the three sub-beams 311, 312, and 313 are incident substantially perpendicularly onto the source conversion unit 320, which may correspond to the sub-beam limiting aperture array 321. In such an alternative embodiment, the pre-bent micro-deflector array 323 may not be necessary.

[0080] The image forming element array 322, the aberration compensator array 324, and the pre-bending micro-deflector array 323 may include multi-layer sub-beam manipulation devices, some of which may be in the form of, for example, micro-deflectors, microlenses, or micro-astigmatists, or arrays thereof.

[0081] In the current example of source conversion unit 320, sub-beams 311, 312, and 313 of the primary electron beam 302 are deflected toward the primary electron optical axis 304 by micro-deflectors 322_1, 322_2, and 322_3 of the image forming element array 322, respectively. It should be understood that the path of sub-beam 311 may already correspond to the electron optical axis 304 before reaching micro-deflector 322_1, and therefore the path of sub-beam 311 may not be deflected by micro-deflector 322_1.

[0082] Objective lens 331 focuses the sub-beams onto the surface of sample 308, projecting three virtual images onto the sample surface. The three images formed by the three sub-beams 311 to 313 on the sample surface form three detector spots 391, 392, and 393. In one embodiment, the deflection angles of the sub-beams 311 to 313 are adjusted so that they pass through or approach the front focal point of objective lens 331 to reduce or limit the off-axis aberrations of the three detector spots 391 to 393.

[0083] In such Figure 3 In the embodiment of the multi-beam inspection tool 300 shown, for clarity, the beam path of the secondary electrons, the beam splitter (similar to Wien filter 233), and the secondary projection optics (similar to...) have been omitted. Figure 2The secondary projection optics 250 and the electronic detection device (similar to the electronic detection device 240) are also present. However, it should be clear that similar beam splitters, secondary projection optics, and electronic detection devices can exist. Figure 3 In the current embodiment, secondary electrons or backscattered electrons are used to register and generate images of the sample surface.

[0084] Figure 2 and Figure 3 At least some of the aforementioned components may be referred to individually or in combination as a manipulator array or manipulator because they manipulate one or more beams or sub-beams of charged particles.

[0085] The above embodiments of the multi-beam inspection tool include a multi-beam charged particle device having a single charged particle source, which may be referred to as a multi-beam charged particle optical device. The multi-beam charged particle device includes an irradiation device and a projection device. The irradiation device can generate multi-beam charged particles from an electron beam from the source. The projection device projects the multi-beam of charged particles toward the sample. At least a portion of the sample's surface can be scanned using the multi-beam charged particles.

[0086] Multi-beam charged particle devices include one or more electro-optical devices for manipulating sub-beams of multi-beam charged particles. The applied manipulation may be, for example, deflection of the sub-beam path and / or focusing operations applied to the sub-beam. The one or more electro-optical devices may include MEMS.

[0087] Charged particle devices may include beam path manipulators located upstream of and optionally within the electro-optical apparatus. The beam path can be linearly manipulated in a direction perpendicular to the charged particle axis (i.e., the optical axis), for example, by two sets of electrostatic deflectors operating over the entire beam. The two sets of electrostatic deflectors can be configured to deflect the beam path in orthogonal directions. Each set of electrostatic deflectors may include two electrostatic deflectors positioned sequentially along the beam path. The first electrostatic deflector in each set applies a corrective deflection, and the second electrostatic deflector restores the beam to the correct angle of incidence on the electro-optical apparatus. The corrective deflection applied by the first electrostatic deflector may be an overcorrection, allowing the second electrostatic deflector to apply a deflection to ensure the desired angle of incidence on the MEMS. The electrostatic deflector sets may be located at several positions upstream of the electro-optical apparatus. The beam path can be rotatably manipulated. Rotational correction can be applied via magnetic lenses. Rotational correction can be additionally or alternatively implemented using existing magnetic lenses, such as a focusing lens arrangement.

[0088] It may be necessary to replace the electro-optics in charged particle equipment (such as multi-beam charged particle equipment). For example, specific applications may require different electro-optics, such as applications requiring different beam specifications from the charged particle equipment. Another example is if the electro-optics within the charged particle equipment malfunctions and needs to be replaced.

[0089] Known techniques for replacing electron optics in charged particle devices involve at least partially disassembling the charged particle device to allow for the installation of the replacement electron optics. The result of at least partial disassembly is the loss of vacuum conditions within the charged particle device. After the replacement electron optics are installed, reassembly of the charged particle device is necessary. The vacuum conditions within the charged particle device then need to be restored, and this process alone can take several hours. Therefore, known techniques for replacing electron optics in charged particle devices are complex and time-consuming.

[0090] The replacement electro-optical device also needs to be properly positioned within the charged particle device so that it is properly aligned with the beam or multiple beams of the charged particle path.

[0091] The embodiments improve upon known techniques for replacing electron optics in charged particle devices. The embodiments also provide coarse and / or fine positioning techniques for properly aligning the electron optics with the beam or multiple beams of the charged particle path in up to six degrees of freedom.

[0092] According to an embodiment, an electro-optical device is supported within a charged particle device, such as a multi-beam charged particle device, by a module. This module can be easily removed from and reinserted into the charged particle device. Therefore, the module is a field-replaceable component of the charged particle device. Field-replaceable means that the component can be replaced in the factory where the charged particle device is operated, without having to disassemble the charged particle device. A component can be easily and efficiently removed and replaced, thus minimizing tool downtime and simplifying the mechanical process as much as possible. Advantageously, this attempts to maximize operating time and reduce maintenance time and resources required for component replacement. Therefore, the process of replacing the electro-optical device in a charged particle device involves removing the module, replacing the electro-optical device supported by the module, and then reinserting the module into the charged particle device. Alternatively, different modules comprising different electro-optical devices can be inserted into the charged particle device. Advantageously, substantial disassembly and reassembly of at least a portion of the charged particle device is not required. If, for example, the electro-optical device needs to be replaced due to a change in the use of the charged particle device or a malfunction of the electro-optical device, the downtime of the charged particle device can be significantly reduced.

[0093] The electro-optical device supported by the module according to the embodiment may include a MEMS device and a PCB. The PCB may provide a stage for the MEMS device. The MEMS device of the electro-optical device can be used to manipulate one or more charged particle beams. The electro-optical device may be fixed to the stage in the module.

[0094] The embodiments include providing a vacuum lock in the charged particle device so that the portion of the charged particle device that houses the replaceable module can be isolated from the vacuum conditions in the rest of the charged particle device. Advantageously, the time required to establish vacuum conditions after module insertion is significantly less than the time required to establish vacuum conditions throughout the entire charged particle device.

[0095] The module according to the embodiment can be configured such that the electro-optical device can be moved relative to the main body of the module. This movement allows the electro-optical device to be repositioned after the module has been installed, so that the electro-optical device 404 can be properly aligned with a charged particle beam or multiple beams.

[0096] The embodiments are described in more detail below.

[0097] Figure 4A This is a schematic diagram of a portion of a charged particle device 401 according to one embodiment. Figure 4B yes Figure 4A A schematic diagram of a portion of the charged particle device 401 shown.

[0098] Charged particle device 401 includes a source 402. Source 402 emits a charged particle beam, referred to herein as a source beam. Similar to the optical axes 204 and 304 described earlier, a charged particle axis exists within charged particle device 401. A charged particle beam path 403, which may be a multi-beam path and is referred to herein as a charged particle path 403, may be substantially along the charged particle axis.

[0099] Electron optics 404 is provided in charged particle path 403. Electron optics 404 can be supported in charged particle path 403 by module 405. An opening 401 is present in the wall of the charged particle device, such that module 405 and the electron optics 404 supported therefrom are replaceable components of charged particle device 401. Charged particle device 401 includes a beam upstream vacuum lock 406. The beam upstream vacuum lock 406 is closer to source 402 than module 405. Charged particle device 401 also includes a beam downstream vacuum lock 407. The beam downstream vacuum lock 407 is further away from source 402 than module 405. In operation, sample / substrate 408 is irradiated by a charged particle beam or multiple beams emitted from charged particle device 401.

[0100] The embodiments include numerous techniques for ensuring proper alignment of the electro-optical device 404 with the charged particle path 403. Proper alignment may require positional adjustments of the electro-optical device 404 and / or the charged particle path 403 in several degrees of freedom. In particular, the charged particle path 403 may define the z-direction. Orthogonal x-directions and y-directions may be defined in a plane orthogonal to the charged particle path 403. Up to six degrees of freedom may be defined as linear positional adjustments in the x, y, and z directions, and rotational positional adjustments about the x-axis (i.e., Rx), y-axis (i.e., Ry), and z-axis (i.e., Rz). It may be noteworthy that some devices that can be mounted to field-replaceable modules may be planar or have a planar structure. In operation, this structure can be aligned with a plane orthogonal to the beam path; therefore, the planar structure can be along the x and y axes and can rotate about Rz.

[0101] Examples include coarse alignment techniques and fine alignment techniques for applying position adjustments. Coarse alignment techniques may include pre-calibration techniques.

[0102] Coarse alignment techniques can position the electron optics device 404 in a known region relative to the physical structure of the charged particle device 401. For example, coarse alignment techniques can position the electron optics device 404 in a known region relative to the housing of the charged particle device 401 and / or the vacuum chamber within the charged particle device 401 used for receiving module 405. Coarse alignment technique 401 is provided via a connection between the flange 701 of module 405 and the charged particle device, such as... Figure 4B As indicated by 411 in [reference numeral name]. That is, the coarse alignment technique allows, for example, securing module 405 to charged particle device 401 via a frame (not shown) to fix the module in the reference frame of charged particle device 401. Alignment pins are used for the connection between flange 701 and charged particle device 401. Alignment pins allow the position of module 405 relative to charged particle device 401 in up to six degrees of freedom to be known. The position of module 405 is known, subject to the tolerances of the coarse alignment process. The coarse positioning technique will be described in more detail later in the sixth embodiment.

[0103] According to the embodiment, the pre-calibration technique can be applied before module 405 is inserted into charged particle device 401. The pre-calibration technique is... Figure 4B The 410 in the diagram indicates this. The pre-calibration technique adjusts the position of the electro-optical device 404, which has been fixed to module 405, relative to the body of module 405, and particularly relative to the flange 701 of module 405. The pre-calibration technique can adjust the position of the electro-optical device 404 relative to the flange 701 in up to six degrees of freedom. The pre-calibration technique will be described in more detail later in the seventh embodiment.

[0104] Fine alignment techniques are used to align the electro-optical device 404 with the charged particle path 403.

[0105] Fine alignment techniques may include mechanically adjusting the position of the electro-optical device 404 relative to the body of the module 405 when the module 405 is installed in the charged particle device 401, such as... Figure 4B As indicated by 409 in the document. The mechanical fine alignment technique can adjust the position of the electro-optical device 404 in up to six degrees of freedom. In a preferred implementation, the mechanical fine alignment technique can adjust the position of the electro-optical device 404 in three degrees of freedom (i.e., x, y, and Rz). The mechanical fine alignment technique is described in more detail in the first through fifth embodiments.

[0106] Fine alignment techniques may additionally or alternatively include electronically adjusting the position of the charged particle path 403 relative to the electro-optical device 404 when the electro-optical device 404 is mounted in the charged particle device 401, such as... Figure 4B As indicated by 412 in the document. Electronic fine alignment techniques can use, for example, electrostatic and magnetic manipulators and lenses to adjust the position of the charged particle path 403 in up to six degrees of freedom. In a preferred implementation, the electronic fine alignment technique can adjust the position of the electro-optical device 404 in four degrees of freedom (i.e., x, y, z, and Rz). Adjustment of the charged particle 403 in the z-direction can be performed by changing the focus of the charged particle beam or multiple beams. The electronic fine alignment technique is described in more detail in the eighth embodiment.

[0107] Coarse alignment and pre-calibration techniques are passive techniques because they are applied before and during the process of fixing the electron optics device 404 into the charged particle device 401. Fine alignment techniques are active techniques because they are applied mechanically or electronically after the electron optics device 404 has been installed in the charged particle device 401.

[0108] Despite Figure 4A and Figure 4B Not shown, but charged particle device 401 may include alternative and / or additional components on charged particle path 403, such as those referenced above. Figures 1 to 3The described lenses and other components. Specifically, embodiments also include a charged particle projection device that divides a beam of charged particles from a source into multiple sub-beams. Multiple corresponding objectives can project the sub-beams onto the sample. In some embodiments, multiple condenser lenses are provided upstream of the beam of the objectives. The condenser lenses focus each sub-beam to an intermediate focus upstream of the beam of the objectives. In some embodiments, a collimator is provided upstream of the beam of the objectives. Correctors may be provided to reduce focusing errors and / or aberrations. In some embodiments, such correctors are integrated into the objectives or positioned directly near the objectives. When condenser lenses are provided, such correctors may be additionally or alternatively integrated into the condenser lenses or positioned directly near the condenser lenses and / or positioned in or directly near the intermediate focus. A detector is provided to detect charged particles emitted by the sample. The detector may be integrated into the objectives. The detector may be on the bottom surface of the objectives so as to face the sample during use. The condenser lenses, objectives, and / or detectors may be formed as MEMS or CMOS devices.

[0109] like Figure 4A As shown, the upstream vacuum lock 406 and the downstream vacuum lock 407 allow the vacuum chamber in the charged particle device to be isolated from the vacuum conditions in the rest of the charged particle device 401.

[0110] The process of replacing module 405 may include the following steps: Power supply to the source may be cut off, thereby preventing the emission of charged particles. The upstream vacuum lock 406 and downstream vacuum lock 407 may be closed, allowing the area of ​​charged particle device 401 including module 405 to be isolated from the vacuum conditions in the rest of charged particle device 401. The area of ​​charged particle device 401 including module 405 may then be vented and module 405 removed from charged particle device 401. According to an embodiment, a pre-calibrated new module may then be inserted and secured to charged particle device 401 using a coarse positioning technique. A evacuation process may be performed to return the area of ​​charged particle device 401 including module 405 to vacuum conditions, and a baking process may also be performed. The upstream vacuum lock 406 and downstream vacuum lock 407 may then be opened. Power supply to the source may be turned on, allowing charged particles to be emitted. When the upstream vacuum lock 406 and downstream vacuum lock 407 are open, they do not obstruct the charged particle path 403. When both the upstream vacuum lock 406 and the downstream vacuum lock 407 are open, the charged particle path 403 can thus pass through both. A mechanical fine alignment process according to the embodiment can be performed. A high-voltage test can be performed. An electronic fine alignment process according to the embodiment can be performed. When it is determined that the electro-optical device is properly aligned with the charged particle path 403, the charged particle device 401 is ready for use.

[0111] Figure 5 and Figure 6 This is a schematic diagram of module 405 installed in charged particle device 401.

[0112] Figure 5 A schematic cross-sectional view is shown through module 405 and a portion of the charged particle device 401 including module 405. This cross-section lies in a plane that can be orthogonal to the charged particle path 403.

[0113] To make module 405 replaceable, it is preferable that module 405 can be moved out and inserted into charged particle device 401, while the main components of charged particle device 401 remain substantially unchanged. Figure 5 In this context, components 501, 502, and 504 represent components of the charged particle device 401. Component 504 may be a structure defining the volume in which a module needs to be assembled. For example, component 504 may be a vacuum chamber wall. Components 501 and 502 may be major components of the charged particle device, such as overflow columns or other major components that limit the maximum size of component 504.

[0114] The nearest spacing across component 504 can be, for example, in the range of 80mm to 120mm. The maximum width of module 405 should be less than or equal to the nearest spacing across component 504.

[0115] Module 405 includes an electro-optical device 404. The module may include a flange 701. Within the flange may be supporting circuitry and connections for the electro-optical device 404.

[0116] Figure 6 Another schematic cross-sectional view is shown through a portion of the charged particle device 401, including module 405. The cross-section lies in a plane that may include the charged particle path 403. Electro-optical devices supported by the module are shown, but the main body of the module is not shown.

[0117] exist Figure 6 In this configuration, components 601 and 602 are components of the charged particle device 401, and module 405 needs to be installed between them. Component 601 may be, for example, a component of an irradiation device, such as an upstream vacuum lock 406 or other components. Component 602 may be, for example, a downstream vacuum lock 407 or other components. Along the charged particle path 403, the minimum spacing between the portions of the charged particle device 401 where module 405 needs to be installed can be in the range of 40mm to 70mm. The maximum height of module 405 should be less than or equal to this minimum spacing along the charged particle path 403.

[0118] Figure 7Another schematic cross-sectional view is shown through module 405 and a portion of the charged particle device 401 including module 405. This cross-section is related to... Figure 6 The cross-sections shown are in the same plane. As indicated by the arrows, Figure 7 The module 405 is shown during the process of being installed into the charged particle device 401.

[0119] Module 405 includes a body 702 supporting the electro-optical device 404. Body 702 is a portion of module 405 that is inserted into charged particle device 401. Body 702 of module 405 can be inserted into a vacuum chamber to receive module 405 in charged particle device 401. Module 405 also includes a flange 701, referred to herein as module flange 701. Module flange 701 can be a portion of module 405 that is fixable to and detachable from charged particle device 401. Module flange 701 remains outside charged particle device 401 and is not inserted into charged particle device 401. Multiple electrical connectors may be provided between the electro-optical device 404 and the supporting circuitry in flange 701.

[0120] The positions of other components in the charged particle device 401 define the charged particle path 403. Module 405 can position the electro-optical device 404 within the charged particle device 401 such that the electro-optical device 404 can be located within the charged particle path 403. After module 405 has been fixed to the charged particle device 401, the positions of the charged particle path and / or the electro-optical device 404 can be finely adjusted so that the electro-optical device is properly aligned with the charged particle path 403.

[0121] The embodiments include a number of different techniques for applying fine adjustments to the position of the electron optics device 404 relative to the charged particle path 403 when the module 405 is fixed to the charged particle device 401.

[0122] Module 405 may include a support arrangement arranged to support the electro-optical device 404 within module 405. The electro-optical device 404 is held by the support arrangement to secure it to the support arrangement. The electro-optical device 404 may include a PCB / worktable secured to the support arrangement. Additionally or alternatively, the support arrangement may include a worktable to which the electro-optical device 404 is secured.

[0123] Module 405 may also include a support positioning system arranged to move the support arrangement relative to the body 702 of module 405. Electro-optical device 404 is fixed to the support arrangement and thus moves as the support positioning system moves the support arrangement.

[0124] Electron optics 404 can be a fundamental planar structure that is substantially perpendicular to the charged particle path 403. The plane of electron optics 404 can be referred to as the xy-plane. The charged particle axis can be referred to as the z-axis. This module can also be considered a fundamental planar structure that is substantially located in the xy-plane.

[0125] The support arrangement and support positioning system can also be a basic planar structure in the xy plane.

[0126] The support positioning system may include a position detection system for determining the movement and / or position of the support arrangement. The position detection system can be used to improve the accuracy of the movement and positioning of the support arrangement. The position detection system may use grid markings, such as encoders, to determine the position of the support arrangement. The position detection system may use features of the support arrangement and / or electro-optical device 404 to determine the movement and / or position of the support arrangement and / or electro-optical device 404. For example, the support arrangement and / or electro-optical device 404 may include features such as markings (e.g., references), alignment openings (e.g., for use in the manufacture of the electro-optical device 404), and functional features (e.g., openings through beam manipulators). Any of these features can be used to determine the movement and / or position of the support arrangement and / or electro-optical device 404, thereby determining the accuracy of the applied movement.

[0127] Figure 8 A schematic cross-sectional view of module 405 according to the first embodiment is shown. This cross-section lies in a plane including the charged particle path 403 and illustrates some details of the support positioning system 801 of the first embodiment.

[0128] Figure 9 A schematic cross-sectional view of module 405 according to the first embodiment is shown. This cross-section is located in a plane orthogonal to the charged particle path 403 and shows some additional details of the support positioning system 801 of the first embodiment.

[0129] A support arrangement 807 is configured to hold the electro-optical device 404. The support arrangement 807 is secured to a support positioning system 801. In this embodiment, the support arrangement 807 may be a separate component from and secured to the support positioning system 801. For example, the support arrangement may include a flexural arrangement to accommodate thermal expansion of the electro-optical device. Alternatively, the support arrangement 807 may be integrated with the support positioning system 801 such that the support arrangement 807 and the support positioning system 801 are part of the same structure.

[0130] The support positioning system 801 includes a substantial disk. The disk has a beam-up surface and a beam-down surface. The beam-up and beam-down surfaces are opposite to the main surface of the disk. In the current embodiment, the beam-up surface of the disk is the main surface of the disk closest to the electro-optics device 404. The beam-down surface of the disk is the main surface of the disk furthest from the electro-optics device 404 and facing the portion of the base 805 of the module 405. It should be understood that, although this is only a design choice in the current design, the electro-optics device 404 can be positioned closer to the beam-down surface of the disk.

[0131] The disk may be substantially annular and include a preferred central opening 806 for the charged particle path 403. The support arrangement 807 may also be substantially annular and include a central opening for the charged particle path 403. In plan view, the outer periphery of the disk may be substantially circular. However, embodiments also include disks whose outer periphery is not substantially circular in plan view. For example, the outer periphery of the disk may be substantially hexagonal or have an irregular shape.

[0132] In the current embodiment, the disk is supported within module 405 by a plurality of ball bearings 803, 804 or other types of rotatable bearings. One or more ball bearings 804 may contact the upstream surface of the disk's beam. For example, three ball bearings 804 may contact the upstream surface of the disk's beam. At least three ball bearings 803 may contact the downstream surface of the disk's beam. Alternatively, springs, instead of any ball bearings, may be provided to contact the upstream surface of the disk's beam. The springs may be arranged to apply force on the upstream surface of the beam pointing towards the base 805 of module 405.

[0133] Ball bearings 803, which contact the downstream surface of the beam, can each contact the base 805 of module 405. Ball bearings 804, which contact the upstream surface of the beam of the disk, can each contact a plate 808, which in turn contacts a spring 802, such as a leaf spring, compression spring, or other type of elastic member. Each spring 802 can be an axial spring. Each spring 802 can be fixed to the housing of module 405, which includes the base 805 of module 405. The springs 802 apply a force that presses all ball bearings 803, 804 against the disk. The ball bearings 803, which contact the downstream surface of the beam, are also pressed into the base of module 405. All ball bearings 803, 804 are thus held under compression by the springs 802.

[0134] While a corresponding spring may exist for each plate 808, the embodiment also includes a single annular axial spring acting on all plates. Alternatively, more than one spring may be used, and the number of springs used is not limited to the number of plates 808.

[0135] In the alternative implementation, an axial spring is provided in Figure 8 A rigid plate is provided at plate 808 as shown, and at the location where spring 802 is shown. The axial spring can be a compression spring or other type of elastic member, and similarly applies a force to press all ball bearings 803, 804 against the disc.

[0136] Multiple actuators 901, 902, and 903 are provided for moving a disk in the plane of module 405. Each actuator 901, 902, and 903 may include an actuator arm. Each actuator arm may be part of actuator 901, 902, and 903. Alternatively, each actuator arm may be a separate component of each actuator 901, 902, and 903, with each actuator arm connected to actuator 901, 902, and 903. Roller bearings or other devices may be present at the end of each actuator arm to allow the actuator to move along disk 801 while generating relatively low friction. For example, each actuator 901, 902, and 903 may be a linear actuator with a longitudinal axis, such that the actuator arm is configured to move along its longitudinal axis. Some or all of actuators 901, 902, and 903 may be operated, for example, manually and / or automatically. Alternatively, some or all of the actuators 901, 902, and 903 may be motorized, pneumatically controlled, or otherwise movable, allowing the actuator arms to move automatically. The disk in the current embodiment includes a plurality of receiving portions 906, 907, and 908 in the sidewall of the disk. Each receiving portion 906, 907, and 908 may be arranged to receive the end of one of the actuator arms, enabling the actuator arm to apply force to the disk. Each of the receiving portions 906 and 908 may be a substantially smooth surface of the cylindrical sidewall of the disk. Roller bearings on the end of each actuator arm allow movement along the sidewall. The receiving portion 907 may, for example, form a notch, recess, or other structural element in the sidewall of the disk. Alternatively, each receiving portion 906, 907, and 908 may, for example, form a notch, recess, or other structural element in the sidewall of the disk.

[0137] The first actuator 901 can be arranged to move the disk in a first linear direction, which can be in the xy plane. The second actuator 902 can be arranged to move the disk in a second direction orthogonal to the first direction and also in the xy plane. The third actuator 903 can be arranged, for example, to apply rotation to the disk in the xy plane, which can be an Rz rotation (i.e., movement of the disk about the z-axis).

[0138] In the current embodiment, the first actuator 901 can be oriented such that its longitudinal axis is aligned with the first direction and with the disk's Rz rotation center. Therefore, movement of the arm of the first actuator 901 along its longitudinal axis moves the disk only in the first direction and substantially does not rotate the disk. Movement of the arm in the first direction causes relative movement between the receiving portions 908, 907, and 906 and their respective rollers, allowing the rollers to roll over the surfaces of the receiving portions 908, 907, and 906.

[0139] In the current embodiment, the second actuator 902 can be oriented such that its longitudinal axis is aligned with the second direction and with the disk's Rz rotation center. Therefore, movement of the arm of the second actuator 902 along its longitudinal axis moves the disk only in the second direction and substantially does not rotate the disk. This movement of the arm in the second direction results in relative movement between the receiving portions 908, 907, and 906 and their respective rollers, allowing the rollers to roll over the surfaces of the receiving portions 908, 907, and 906.

[0140] The current embodiment also shows a third actuator 903, which can be oriented such that the longitudinal axis of the third actuator 903 is not aligned with the Rz rotation center of the disk. The receiving portion 907 of the longitudinal axis of the arm of the third actuator can be a protrusion projecting from the sidewall of the disk. Therefore, the movement of the arm of the third actuator 903 along its longitudinal axis causes the disk to rotate. The rotational movement of the disk results in relative rotational movement between the receiving portions 908, 907, 906 and their respective rollers, such that the rollers can roll over the surfaces of the receiving portions 908, 907, 906.

[0141] The support positioning system 801 may also include multiple planar springs 904, 905 or other force-applying devices or elastic components for biasing the position of the disk onto the actuator in the xy plane of module 405.

[0142] Each planar spring 904, 905 may be, for example, a linear spring, which is arranged to apply force in the direction of its longitudinal axis. One end of each planar spring 904, 905 may be fixed to the base 805 of module 405, and the opposite ends of each spring 904, 905 are fixed to or pressed against the sidewall of the disc.

[0143] The longitudinal axis of the xy-plane spring 905 can be aligned with the Rz rotation center of the disk, such as Figure 9As shown, the center will be located at the center of opening 806. For example, the xy-plane spring 905 can be described as being arranged on the side of the disk opposite to the receiving portion 908 of the actuator arm of the first actuator 901 and the receiving portion 906 of the actuator arm of the second actuator 902. That is, the connection of the xy-plane spring 905 can be arranged on the disk such that the xy-plane spring can resist the force applied to the disk 901 by the actuators 901, 902 at the first and second receiving portions 906, 908. For example, the xy-plane spring can be configured to help hold the disk under compression in the first and second directions.

[0144] In the current embodiment, the longitudinal axis of the rotary plane spring 904 is not aligned with the Rz rotation center of the disk. The rotary plane spring 904 can, for example, be fixed to a protrusion 909 in the side of the disk. The rotary plane spring can be arranged such that it extends when the actuator arm of the third actuator 903 extends to rotate the disk. In one embodiment, the third actuator arm operates on a third receiving surface 907 on the side of the disk. Figure 9 As shown, the actuator arm extends to cause the disk to rotate clockwise. A rotary plane spring 904 is attached to the disk, so it extends when the disk rotates clockwise and compresses when the disk rotates counterclockwise. The rotary plane spring 904 is thus biased to resist the rotation applied when the actuator arm of the third actuator 903 extends.

[0145] In an alternative implementation of this embodiment, a single planar spring is used to hold the disk under compression in the first and second directions and also bias it against rotation applied when the actuator arm of the third actuator 903 extends. One end of the planar spring may be fixed to the base 805 of module 405, and the opposite end of the spring may be fixed near the edge of the central opening in the disk. The spring may be arranged not to be aligned with the disk's Rz rotation center.

[0146] Actuators 901, 902, and 903 may be part of the charged particle device 401, and such actuators are not part of module 405. Actuator arms may extend through openings in module 405 to contact receiving portions 906, 907, and 908. Alternatively, actuators 901, 902, and 903 may be entirely contained within module 405 and may be integrated into module 405.

[0147] A position detection system can be configured and arranged to determine the movement and / or position of each actuator arm. Alternatively or additionally, the position detection system can be configured and arranged to determine the movement and / or position of each roller bearing at the end of the actuator arm. Changes in position and / or movement can be determined by an encoder. This encoder can be located in the body of each actuator at the opposite end of the actuator and the roller bearing, in each actuator arm, and / or in each roller bearing. These position and / or movement determinations can be used to infer the movement and / or position of the support arrangement 807, and thereby infer the movement and / or position of the electro-optical device 404. Alternatively, the position detection system can be configured and arranged to determine the movement and / or position of the rotating disk including the support arrangement 807 to determine the movement and / or position of the electro-optical device 404.

[0148] Therefore, the operation of the first, second, and third actuators 901, 902, and 903 can cause the support arrangement to move in the xy direction relative to the body 702 of module 405 (and in particular the flange 701 of module 405) and apply an Rz rotation to the support arrangement.

[0149] According to a second embodiment, the support positioning system includes an Rz-flexure arrangement and an xy-flexure arrangement. The Rz-flexure arrangement and the xy-flexure arrangement can be arranged in a stacked manner. Each flexure arrangement can be a basic planar structure arranged in the xy plane. The support positioning system according to the second embodiment can be used instead of the support positioning system described in the first embodiment. In addition to those described in the first embodiment, the embodiment also includes elements of the support positioning system according to the second embodiment used.

[0150] Figure 10A A schematic diagram of a cross-sectional view of the Rz flexure arrangement according to the second embodiment is shown. This cross-section lies in a plane orthogonal to the charged particle path 403.

[0151] Figure 10B A schematic cross-sectional view of the xy-flexure arrangement according to the second embodiment is shown. This cross-section lies in a plane orthogonal to the charged particle path 403 and along the charged particle path is... Figure 10A The cross-sections shown are at different locations.

[0152] like Figure 10AAs shown, the Rz flexure arrangement includes a substantially circular structure 1005, preferably defining an opening 1017 at its center. The opening 1017 allows the charged particle path 403 to pass through the Rz flexure arrangement. In use, the Rz flexure arrangement can be positioned such that the center of the opening 1017 is preferably substantially aligned with the center of the charged particle path 403. The substantially circular structure can be circular in plan view and substantially cylindrical along the beam path.

[0153] In the current embodiment, the Rz flexural arrangement also includes crossbars arranged to form a cross shape. The cross is formed by a first crossbar and a second crossbar. The first and second crossbars intersect each other at the substantially circular structure 1005.

[0154] The first and second crossbars are preferably both in the xy plane. The first crossbar can be aligned in a first direction. The second crossbar can be aligned in a second direction. The first and second directions can be orthogonal to each other.

[0155] The first crossbar may include a first portion 1001 and a second portion 1003. A basic circular structure 1005 may be located between and supported by the first portion 1001 and the second portion 1003 of the first crossbar. The second crossbar may include a first portion 1004 and a second portion 1002. The basic circular structure 1005 may be located between and supported by the first portion 1004 and the second portion 1002 of the second crossbar. The basic circular structure 1005 may be a cylindrical structure that is circular in plan view.

[0156] The flexural element includes a flexural base 1011 and a movable body 1010. The flexural base 1011 is fixed to the body 702 of the module 405 and is substantially immobile relative to the body 702 of the module 405.

[0157] The movable body 1010 can be roughly C-shaped or crescent-shaped.

[0158] One end of the first portion 1001 of the first crossbar can be fixed to the flexural base 1011, and the other end of the first portion 1001 is fixed to the basic circular structure 1005. One end of the second portion 1003 of the first crossbar can be fixed to the movable body 1010, and the other end of the second portion 1003 is fixed to the basic circular structure 1005.

[0159] One end of the first portion 1004 of the second crossbar can be fixed to the flexible base 1011, and the other end of the first portion 1004 is fixed to the basic circular structure 1005. One end of the second portion 1002 of the second crossbar can be fixed to the movable body 1010, and the other end of the second portion 1002 is fixed to the basic circular structure 1005. Therefore, the movable body 1010 is attached to the flexible base 1011 via the first crossbar, the second crossbar, and the basic circular structure 1005.

[0160] The first and second crossbars can be bent, allowing the movable body 1010 to rotate within Rz. The center of rotation of the movable body 1010 within Rz can be close to or located at the center point of the basic circular structure 1005.

[0161] The support positioning system may include a spring 1006, or other force-applying devices or elastic members. One end of the spring 1006 may be fixed to a flexural base 1011, while the other end is fixed to one end of the movable portion 1010. One end of the spring 1006 fixed to the flexural base 1011 may be fixed at substantially the same position as the end of the first portion 1004 of the second crossbar fixed to the flexural base 1011. When the spring is compressed, the biasing force applied by the spring 1006 may be in a direction orthogonal to the sidewall of the flexural base, rather than in a straight line with the substantially circular structure 1005. Therefore, the force applied by the spring 1006 does not point towards the center of rotation of the movable body 1010. Thus, the function of the spring 1006 is to apply a biasing force that causes the movable body 1010 to rotate about the z-axis.

[0162] As described with respect to the first embodiment, a third linear actuator 1009 may be provided for rotating the Rz flexure arrangement. The third linear actuator 1009 may be operated manually or automatically. The Rz flexure arrangement includes a receiving portion 1018. The receiving portion 1018 is arranged to receive the end of the actuator arm of the third actuator 1009 such that the actuator arm can apply force for rotating the Rz flexure arrangement.

[0163] The movable body 1010 can be fixed to an xy flexural arrangement, such as by bolts.

[0164] like Figure 10B As shown, the xy flexural arrangement includes an external structure 1014 that can be fixed to the Rz flexural arrangement. The external structure 1014 may be substantially L-shaped. The external structure 1014 may be a rigid body.

[0165] The xy-flexure arrangement includes a central structure 1012, which includes a generally circular structure 1017 defining an opening within the xy-flexure arrangement. The central structure 1012 may be a rigid body. The opening allows a charged particle path 403 to pass through the xy-flexure arrangement. In use, the xy-flexure arrangement may be positioned such that the center of the opening is substantially aligned with the charged particle path 403.

[0166] As described with respect to the first embodiment, a first linear actuator 1007 and a second linear actuator 1008 are provided to move an xy-flexural arrangement in an orthogonal direction in the xy-plane. The first linear actuator 1007 and the second linear actuator 1008 can be operated manually or automatically. The xy-flexural arrangement includes a first receiving portion 1015 and a second receiving portion 1016. Each receiving portion 1015, 1016 is arranged to receive the end of one of the actuator arms such that the actuator arm can apply a force to the xy-flexural arrangement.

[0167] The xy-flexible arrangement includes an intermediate structure 1013. The intermediate structure 1013 may have a basic square outer perimeter surrounding a basic square opening. The intermediate structure 1013 may be a rigid body. A central structure 1012 may be provided in the opening of the intermediate structure 1013 such that the central structure 1012 is surrounded by the intermediate structure 1013 in the xy-plane. The intermediate structure 1013 may be at least partially surrounded by an outer structure 1014, a receiving portion 1015, and a receiving portion 1016.

[0168] The receiving portion 1015 can be directly connected to the central structure 1012 via a first connector (such as a rod or bar). It is substantially aligned with the longitudinal axis of the second linear actuator 1008, and on the opposite side of the connection point between the central structure and the first connector, a spring 1019 or other type of biasing device can be provided between the intermediate structure 1013 and the outer structure 1014.

[0169] The receiving portion 1016 can be directly connected to the central structure 1012 via a second connector (such as a rod or bar). It is substantially aligned with the longitudinal axis of the first linear actuator 1007, and a spring 1020 or other type of biasing device can be provided between the central structure 1012 and the outer structure 1014 on the opposite side of the connection point between the central structure and the second connector.

[0170] The xy flexural arrangement includes leaf springs 1021, 1022, 1023, and 1024. Leaf springs 1021, 1022, 1023, and 1024 may alternatively be other types of elastic members.

[0171] The intermediate structure 1013 can be connected to the outer structure 1014 via leaf springs 1021 and 1024. Leaf springs 1021 and 1024 can be arranged on opposite sides of the intermediate structure 1013. Leaf springs 1021 and 1024 can both be arranged such that they are substantially orthogonal to the longitudinal axis of the second linear actuator 1008.

[0172] The intermediate structure 1013 can be connected to the central structure 1012 via leaf springs 1022 and 1023. Leaf springs 1022 and 1023 can be arranged on opposite sides of the intermediate structure 1013. Leaf springs 1022 and 1023 can both be arranged such that they are substantially orthogonal to the longitudinal axis of the first linear actuator 1007.

[0173] Leaf springs 1022 and 1023 allow the central structure 1012 to move relative to the intermediate structure 1013. The central structure 1012 thus moves relative to the outer structure 1014. Therefore, linear extension of the arm of the first actuator 1007 can move the central structure 1012 against the bias of the spring 1020 in a second direction. Similarly, if the arm of the first actuator 1007 retracts, the bias of the spring 1020 can cause the central structure 1012 to move in the opposite direction.

[0174] Leaf springs 1021 and 1024 allow the intermediate structure 1013 to move, thereby allowing the central structure 1012 to move relative to the outer structure 1014. Therefore, linear extension of the arm of the second actuator 1008 can move the central structure 1012 against the bias of the spring 1019 in a second direction. Similarly, if the arm of the second actuator 1008 retracts, the bias of the spring 1019 can cause the central structure 1012 to move in the opposite direction.

[0175] Therefore, the first actuator 1007 and the second actuator 1008 can be arranged to move the central structure 1012 in an orthogonal direction in the xy plane.

[0176] As described above, the flexural arrangement in this embodiment can be a stack of Rz flexural arrangements and xy flexural arrangements. The Rz flexural arrangement can be fixed to the base of the module, while the xy flexural arrangement can be fixed upstream of, for example, the beam of the Rz flexural arrangement. The circular structure 1005 of the Rz flexural arrangement can be substantially aligned with the circular structure 1017 of the xy flexural arrangement.

[0177] The longitudinal axis of the arm of the first actuator 1007 can be substantially aligned with the longitudinal axis of the first crossbar arranged in an Rz flexural configuration and the Rz rotation center of the movable body 1010. The movement of the arm along its longitudinal axis thus moves the movable body 1010 only in the first direction and substantially does not rotate the movable body 1010.

[0178] The longitudinal axis of the arm of the second actuator 1008 can be substantially aligned with the longitudinal axis of the second crossbar arranged in an Rz flexural configuration and the Rz rotation center of the movable body 1010. The movement of the arm along its longitudinal axis thus moves the movable body 1010 only in the second direction and substantially does not rotate the movable body 1010.

[0179] The longitudinal axis of the arm of the third actuator 1009 is not aligned with the Rz rotation center of the movable body 1010. The receiving portion of the longitudinal axis of the arm of the third actuator 1009 may be a groove or notch in the side of the movable body 1010. The movement of the arm along its longitudinal axis thus causes the flexural arrangement to rotate in Rz. The Rz rotation applied by the extension of the arm of the third actuator 1009 can compress the spring 1006, so that the movable body 1010 is held under rotational compression.

[0180] The xy flexural arrangement is fixed to the movable body 1010 of the Rz flexural arrangement, and thus the entire xy flexural arrangement rotates when the movable body 1010 rotates.

[0181] The central structure 1012 of the xy-flexible arrangement may be a support arrangement and includes features for holding the electro-optical device 404.

[0182] Alternatively, the support arrangement can be with Figure 10B The structure shown is a separate structure and is fixed to the central structure 1012. The support arrangement can be fixed to the central structure 1012 such that there is essentially no relative movement between the support arrangement and the central structure 1012.

[0183] Therefore, the flexural arrangement includes a movable body 1010 capable of being moved in the xy plane and in the Rz plane by actuators 1007, 1008, 1009. As described with respect to the first embodiment, the position detection system can determine the movement and / or position of each actuator arm or movable body. These determinations can be used to infer the movement and / or position of the support arrangement and ultimately determine the movement and / or position of the electro-optical device 404 (not shown).

[0184] The xy-flexure arrangement can be a single structure. Alternatively, the xy-flexure arrangement can include multiple stacked flexures. For example, it can include a first flexure for movement in a first direction via a first actuator 1007 and a second linear flexure for movement in a second direction via a second actuator 1007.

[0185] In an alternative implementation of the xy-flexure arrangement, the receiving portion 1015 can be directly connected to the intermediate structure 1013 via the first connector, instead of via the first connector connected to the central structure 1012. Advantageously, the movement of the first actuator 1007 in the first direction applies a small force to the leaf spring 1022. The spring 1020 can also be arranged between the central structure 1012 and the intermediate structure 1013, instead of between the central structure 1012 and the outer structure 1014. Advantageously, the movement of the second actuator 1008 in the second direction applies a small force to the leaf spring 1021.

[0186] In a preferred implementation of the second embodiment, the Rz flexural arrangement is directly fixed to the body of the module, and the xy flexural arrangement is provided on and fixed only to the Rz flexural arrangement. In this implementation, the force applied by the first linear actuator 1007 and the second linear actuator 1008 is substantially along the longitudinal axis of the crossbar of the Rz flexural arrangement. However, the embodiment further includes: the xy flexural arrangement is directly fixed to the body of the module, and the Rz flexural arrangement is provided on and fixed only to the Rz flexural arrangement.

[0187] According to a third embodiment, the support positioning system includes an arrangement of multiple piezoelectric actuators configured to move a worktable. The support positioning system according to the third embodiment can be used instead of the support positioning systems described in the first and / or second embodiments. Unlike the first and second embodiments, the actuators can be included within a module. In addition to those described in the first and / or second embodiments, embodiments also include elements using the support positioning system according to the third embodiment. In such an arrangement, the actuators can be located both within and outside the module.

[0188] The third embodiment is shown in Figures 11A to 11I middle. Figure 11A A schematic plan view of the cross-section of module 405 in a plane perpendicular to the charged particle path 403 is shown. Figure 11B A schematic diagram of a cross-section of module 405 in a plane including the charged particle path 403 is shown. Figures 11C to 11E A schematic plan view of the workbench 1109 is shown, illustrating the operational state of the piezoelectric actuator arrangement in the first implementation of the third embodiment.

[0189] like Figures 11C to 11E As shown, three piezoelectric actuator arrangements 1101, 1102, and 1103 may exist, for example, equidistantly spaced around the perimeter of the stage 1109. All piezoelectric actuator arrangements 1101, 1102, and 1103 may contact the same main surface of the stage 1109, for example, as shown. Figure 11BThe main surface of the stage 1109 facing module 405 is shown in the diagram. In the plan view, all piezoelectric actuator arrangements 1101, 1102, and 1103 overlap with the stage 1109. For each piezoelectric actuator arrangement 1101, 1102, and 1103, a contact pad can be provided between the piezoelectric actuator and the stage 1109. The contact pad can be ceramic or a different material along with an insulating layer.

[0190] Each piezoelectric actuator arrangement 1101, 1102, 1103 could be, for example, a biaxial shear mode piezoelectric actuator. Figure 11B As shown, each piezoelectric actuator arrangement 1101, 1102, 1103 may include a stack of two piezoelectric actuators. Each piezoelectric actuator in each stack may be arranged to move the stage in two opposite directions. Each piezoelectric actuator arrangement 1101, 1102, 1103 may include multiple piezoelectric actuators arranged such that the movement of one piezoelectric actuator relative to the stage is orthogonal to the movement of the other piezoelectric actuator relative to the stage.

[0191] Each of the piezoelectric arrangements 1101, 1102, and 1103 can be acted upon by an elastic member, such as springs 1104 and 1105 or other force-applying devices. Although in Figure 11B Not shown, but each spring can be a helical spring. Each spring 1104, 1105 is arranged such that the opposing main surface of the worktable 1109 is in contact with the corresponding piezoelectric actuators 1101, 1102, 1103 acted upon by the springs 1104, 1105. The worktable 1109 is thus piezoelectrically pressed into the piezoelectric actuators 1101, 1102, 1103 by the springs 1104, 1105. Figure 11A and Figure 11B As shown, piezoelectric arrangement 1101 is acted upon by spring 1104, and piezoelectric arrangement 1102 is acted upon by spring 1105.

[0192] The piezoelectric arrangements 1101, 1102, and 1103 can be controlled to linearly move the worktable in a first direction (which may be the x-direction), linearly move the worktable in a second direction (which may be orthogonal to the first direction, i.e., the y-direction), and rotate the worktable 1109 in the plane of the worktable 1109, which may be a movement in Rz.

[0193] like Figure 11C As shown, all piezoelectric arrangements 1101, 1102, and 1103 can be manipulated to generate linear forces in different directions, the net effect of which is a force that rotates the worktable. The direction of rotation can be changed by altering the direction of all linear movements of the piezoelectric arrangements 1101, 1102, and 1103.

[0194] like Figure 11D As shown, all piezoelectric arrangements 1101, 1102, and 1103 can be manipulated to generate linear forces in different directions, the net effect of which is a force that linearly moves the stage in the x-direction. The direction of movement can be changed by altering the direction of all linear movements of the piezoelectric arrangements 1101, 1102, and 1103.

[0195] like Figure 11E As shown, all piezoelectric arrangements 1101 and 1102 can be manipulated to generate linear forces in different directions, the net effect of which is a force that linearly moves the stage in the y-direction. The direction of movement can be changed by altering the direction of linear movement of the piezoelectric arrangements 1101 and 1102.

[0196] The second implementation of the third embodiment is as follows: Figures 11F to 11I As shown in the diagram. The second implementation differs from the first implementation in that at least two piezoelectric actuator arrangements 1106, 1107, 1108 are triaxial shear-mode piezoelectric actuators. The stacked arrangement of three piezoelectric actuators can provide a greater degree of movement, thereby improving the accuracy of the movement exerted by the piezoelectric actuator arrangements 1106, 1107, 1108 in the x and y directions, as well as the rotational movement about Rz.

[0197] The second implementation may also differ from the first implementation in the way the piezoelectric actuator arrangements 1106, 1107, 1108 are oriented. In the second implementation, each piezoelectric arrangement 1101, 1102, 1103 may be preloaded by springs 1104, 1105 or other force-applying devices, as described for the first implementation.

[0198] Figure 11F A schematic plan view of the worktable 1109 is shown, which illustrates the orientation of the piezoelectric actuator arrangements 1106, 1107, and 1108 in the second implementation.

[0199] Figure 11G Possible operating states of the first piezoelectric actuator 1106a, the second piezoelectric actuator 1106b, and the third piezoelectric actuator 1106c in the piezoelectric actuator arrangement 1106 are shown. Each piezoelectric actuator is arranged to linearly move the stage 1109 in two opposite directions. The movement applied by the first piezoelectric actuator 1106a can be in the y-direction. The movement applied by the second piezoelectric actuator 1106b can be in the x-direction. The third piezoelectric actuator 1106c can apply a linear movement that is angular to the directions of movement applied by the first and second piezoelectric actuators, i.e., neither parallel nor orthogonal. The direction of movement applied by the third piezoelectric actuator 1106c can be substantially tangential to the nearest portion of the periphery of the stage 1109, thereby being arranged to apply rotation to the stage 1109.

[0200] Figure 11H Possible operating states of the first piezoelectric actuator 1107a, the second piezoelectric actuator 1107b, and the third piezoelectric actuator 1107c in the piezoelectric actuator arrangement 1107 are shown. Each piezoelectric actuator is arranged to linearly move the stage in two opposite directions. The movement applied by the first piezoelectric actuator 1107a can be in the y-direction. The movement applied by the second piezoelectric actuator 1107b can be in the x-direction. The third piezoelectric actuator 1107c can apply a linear movement that is angular to the directions of movement applied by the first and second piezoelectric actuators, i.e., neither parallel nor orthogonal. The direction of movement applied by the third piezoelectric actuator 1107c can be substantially tangential to the nearest portion of the periphery of the stage 1109, thereby being arranged to apply rotation to the stage 1109.

[0201] The piezoelectric actuator arrangement 1108 may consist of a stack of only two piezoelectric actuators. Figure 11I Possible operating states of the first piezoelectric actuator 1108a and the second piezoelectric actuator 1108b in the piezoelectric actuator arrangement 1108 are shown. Each piezoelectric actuator arrangement is configured to linearly move the stage in two opposite directions. The movement applied by the first piezoelectric actuator 1108a can be in the y-direction. The movement applied by the second piezoelectric actuator 1108b can be in the x-direction.

[0202] The stack may include spacers 1108c, i.e. blanks, so that it has the same height as other stacks.

[0203] By activating only the piezoelectric actuators in each stack that are arranged to apply movement in the x and y directions, Figures 11F to 11I The embodiment shown allows the stage to move in the x and y directions. The stage can be rotated by movement applied by the third piezoelectric actuators 1106c and 1107c and by movement applied by the second piezoelectric actuator 1108b.

[0204] In the first and second implementations of this embodiment, one end of the preloaded spring can move above the surface of the stage 1009 when the stage moves. To avoid this, the first and second implementations of this embodiment can alternatively have corresponding piezoelectric actuator arrangements, both arranged to act on the upstream and downstream main surfaces of the stage. That is, the preloaded spring or other force-applying device can contact the first piezoelectric actuator arrangement, which contacts the upstream main surface stage 1009. The second piezoelectric actuator arrangement corresponds to the first piezoelectric actuator arrangement and is arranged in a straight line with the first piezoelectric actuator in the z-direction, and can contact the downstream main surface stage 1009 and the base of the module. Contact pads can be provided between each component.

[0205] In this embodiment, the support arrangement may be part of a stage 1109 configured to hold the electro-optical device 404. Alternatively, the support arrangement may be a separate component fixed to the stage 1109.

[0206] According to the fourth embodiment, such as Figures 12A to 12D As shown, the support positioning system includes a plurality of piezoelectric actuator arrangements 1201, 1202, 1205, 1206 configured to move a worktable. The support positioning system according to the fourth embodiment can be used instead of the support positioning systems described in the first, second, and / or third embodiments. In addition to those described in the first, second, and / or third embodiments, embodiments also include elements using the support positioning system according to the fourth embodiment.

[0207] Figure 12A A schematic plan view of module 405 is shown. The module includes piezoelectric arrangement 1205 and piezoelectric arrangement 1206. Piezoelectric arrangement 1205 can be arranged such that it can move bidirectionally in the x-direction. Piezoelectric arrangement 1206 can be arranged such that it can move bidirectionally in the y-direction of the portion of module 405 including the stage. Embodiments also include piezoelectric arrangement 1205 and piezoelectric arrangement 1206 alternately applying movement in the y-direction and in the x-direction, respectively. Module 405 also includes one or more piezoelectric arrangements for applying bidirectional rotation to the stage about Rz.

[0208] Figure 12B This is a schematic plan view of the portion of module 405 including the worktable and piezoelectric actuator arrangements 1201 and 1202.

[0209] like Figure 12B As shown, the support positioning system may include two piezoelectric arrangements 1201 and 1202. In the current embodiment, the piezoelectric arrangements 1201 and 1202 may be located on opposite sides of the worktable. That is, the piezoelectric actuator arrangement 1201 may contact the side wall of the worktable in a first position and the piezoelectric actuator arrangement 1202 may contact the side wall of the worktable in a second position, for example, completely opposite to the first position.

[0210] In the fourth embodiment, each piezoelectric arrangement 1201, 1202 may include (a plurality of) piezoelectric actuators arranged to move in any linear direction along a first axis, which may be the x-axis. Each piezoelectric actuator arrangement 1201, 1202 may also include a block that is movable by the piezoelectric actuator arrangement 1201, 1202 and is the portion of the piezoelectric actuator arrangement 1201, 1202 that presses against the sidewall of the worktable. As previously described with respect to the third embodiment, a contact pad may be provided between each piezoelectric actuator arrangement and the worktable.

[0211] Each piezoelectric actuator arrangement 1201, 1202 can be preloaded by springs 1203, 1204 or other force-applying devices. Spring 1203 is arranged on the side of piezoelectric actuator arrangement 1201 opposite to the worktable and is configured to press piezoelectric actuator arrangement 1201 into the worktable. Similarly, spring 1204 is arranged on the side of piezoelectric actuator arrangement 1202 opposite to the worktable and is configured to press piezoelectric actuator arrangement 1202 into the worktable. Thus, the worktable is held under compression by piezoelectric actuator arrangements 1201, 1202. Figure 12B As shown, piezoelectric actuator arrangement 1201 is preloaded by spring 1203 and piezoelectric arrangement 1202 is preloaded by spring 1204.

[0212] In the fourth embodiment, the worktable can be moved in the x-direction by piezoelectric actuator arrangement 1205. The worktable can be moved in the y-direction by piezoelectric actuator arrangement 1206.

[0213] When piezoelectric actuator arrangement 1201 and piezoelectric actuator arrangement 1202 are arranged to move by the same amount but in opposite directions, the stage will rotate around Rz.

[0214] like Figure 12C As shown, piezoelectric actuator arrangements 1201 and 1202 can be provided in the same plane as the worktable. Piezoelectric actuator arrangements 1201 and 1202 are arranged as bearings supporting the worktable and capable of applying rotation to the worktable.

[0215] Figure 12D It shows Figure 12C An alternative arrangement is shown. The worktable is provided on mechanical bearings for supporting the worktable. Piezoelectric actuator arrangements 1201 and 1202 can apply rotation to the worktable instead of the main support of the worktable.

[0216] The embodiments also include alternative support arrangements for the worktable using mechanical bearings. The worktable may include a circular recess located on a fixed support. One or more biasing members, such as leaf springs, may be provided to press the worktable into the support.

[0217] In this embodiment, the support arrangement may be part of a stage configured to hold the electro-optical device 404. Alternatively, the support arrangement may be a separate component fixed to the stage.

[0218] like Figure 13 The fifth embodiment shown differs from the fourth embodiment in that the support positioning system includes a single piezoelectric actuator arrangement 1302 configured as a rotary table.

[0219] Figure 13 A schematic plan view of a portion of module 405, including a worktable and a piezoelectric actuator arrangement 1302 for rotating the worktable, is shown.

[0220] The piezoelectric actuator arrangement 1302 can be the same as one of the piezoelectric actuator arrangements 1201, 1202 already described in the fifth embodiment. The piezoelectric actuator arrangement is therefore capable of linear movement.

[0221] In the plan view, the piezoelectric actuator arrangement 1302 is adjacent to and in contact with the worktable. The piezoelectric actuator arrangement 1302 may be preloaded by a spring 1301 or other force-applying device. The spring 1301 is arranged on the side of the piezoelectric actuator arrangement 1302 opposite to the worktable and is arranged to press the piezoelectric actuator arrangement 1302 against the worktable.

[0222] The linear movement of the piezoelectric actuator arrangement 1302 in a direction tangential to the worktable causes the worktable to rotate.

[0223] Linear movement of the worktable can be applied by piezoelectric actuator arrangements 1205, 1206, as already described with respect to the fourth embodiment.

[0224] The worktable can be provided on mechanical bearings used to support it, such as... Figure 12D As shown in the diagram. Alternatively, the worktable may include a circular recess, as already described with respect to the fourth embodiment.

[0225] In this embodiment, the support arrangement may be part of the worktable, configured to hold the electro-optical device 404. Alternatively, the support arrangement may be a separate component fixed to the worktable.

[0226] In all the third to fifth embodiments described above, a position detection system may be provided. The position detection system may include an encoder for determining the movement and / or position of each piezoelectric arrangement, thereby determining the worktable.

[0227] The first to fifth embodiments described above allow for repositioning of the support arrangement within module 405. The electro-optical device 404, fixed to the support arrangement, can thus be finely positioned as needed for proper alignment with other components of the charged particle device 401. The first to fifth embodiments described above can enable movement of the electro-optical device 404 in several degrees of freedom. In particular, the first to fifth embodiments described above can enable fine adjustment of the position of the electro-optical device 404 in the xy-plane and rotation about the z-axis. The embodiments are also adapted to the described first to fifth embodiments so that they apply fine alignment in only one or two degrees of freedom. For example, the embodiments include arrangements that only allow: fine position adjustment to be applied bidirectionally along a single axis in the xy-plane; fine position adjustment to be applied along an orthogonal direction in the xy-plane but not Rz movement; or only Rz movement.

[0228] The embodiments also include the techniques described below for positioning the electro-optical device 404 in module 405.

[0229] According to a sixth embodiment, a technique is provided for bonding module 405 to the housing of charged particle device 401. The technique of the sixth embodiment can be used in conjunction with any of the techniques described in the first to fifth embodiments above.

[0230] Figure 14A A schematic diagram of a module 405 fixed to a charged particle device 401 according to a sixth embodiment is shown.

[0231] As previously referenced Figure 7 As described, module 405 includes module flange 701 and body 702. (As...) Figure 14A and Figure 14B As shown, the charged particle device 401 also includes a flange 1401, referred to herein as the housing flange 1401. The process of securing the module 405 to the charged particle device 401 involves inserting the module 405 into the charged particle device 401 and engaging the module flange 701 with the housing flange 1401. After engagement of the module flange 701 with the housing flange 1401, the module flange 701 can be secured to the housing flange 1401 using any known technique. For example, the module flange 701 can be bolted to the housing flange 1401.

[0232] Module flange 701 and housing flange 1401 include corresponding mating surfaces that engage with each other. For example... Figure 14BAs shown, in the plane of the mating surface of the housing flange 1401, the shape of the mating surface can be the shape of a rectangular mating surface surrounding a rectangular opening. The mating surface of the module flange 701 can have a corresponding shape. The facing surfaces of the module flange 701 and the housing flange 1401 can correspond to each other to provide a seal when fixed together. The facing surfaces can be coplanar and flat. A vacuum seal can be provided, which ensures that the connection between the module flange 701 and the housing flange 1401 is hermetically tight when closed, allowing a vacuum to be generated in the portion of the charged particle device 401 including the module 405. The vacuum seal can be opened when the module is removed from the charged particle device 401.

[0233] Also Figure 14B As shown, the housing flange 1401 may include two or more alignment pins 1402, 1403 projecting from its surface. Preferably, two alignment pins are present, and the alignment pins are provided on opposite sides of the opening in the housing flange 1401. The module flange 701 may include corresponding recesses for receiving the alignment pins. When the module 405 is inserted into the charged particle device 401, the alignment pins can be inserted into the corresponding recesses. Inserting the alignment pins into the corresponding recesses advantageously allows for coarse positioning of the module 405 within the charged particle device 401. In particular, due to the direct engagement of the module flange 701 and the housing flange 1401, the module 405 is positioned along the charged particle path 403, which may be in the z-direction. In the current embodiment, the module 405 may also be partially and coarsely positioned in the direction between the alignment pins, which may be the y-direction. The module 405 may also be coarsely positioned relative to the direction in which the module 405 is inserted into the charged particle path 403, which may be the x-direction. Module 405 can also be roughly positioned relative to rotations about the x-direction (i.e., Rx), about the y-direction (i.e., Ry), and about the z-direction (i.e., Rz). Module 405 can therefore be roughly positioned in six degrees of freedom in a plane orthogonal to the path of charged particles in the charged particle device.

[0234] The embodiments also include alternative implementations in which the module flange 701 includes an alignment pin and the housing flange 1401 includes a corresponding groove. Alternatively, both the module flange 701 and the housing flange 1401 may include an alignment pin and a corresponding groove.

[0235] Both the alignment pin and the corresponding groove can have a circular cross-section. However, embodiments also include alignment pins with an elliptical cross-section. Alternatively or additionally, the groove can be slotted instead of circular. Using non-circular alignment pins and / or grooves allows alignment tolerances to be smaller than manufacturing tolerances.

[0236] According to the seventh embodiment, module 405 is configured such that the position of the support positioning system within module 405 can be adjusted.

[0237] Figure 15A A cross-section of a portion of the body 702 of module 405 is shown in a plane including the charged particle path 403. The support positioning system in module 405 is based on the above reference. Figure 8 and Figure 9 The first embodiment described.

[0238] The support positioning system is supported within the body 702 of module 405 by multiple adjustable supports 1501, 1502. The adjustable supports 1501, 1502 can be, for example, adjustable spring bolts or adjustable fasteners, such as pins with locking bolts. A corresponding adjustable support 1501, 1502 may be present for each of the ball bearings 804 that contact the upstream and / or downstream surfaces of the beam of the disk. For example, three equidistant adjustable supports may exist around the support positioning system.

[0239] Each adjustable support 1501, 1502 may include a hemispherical end and a longitudinal body. The longitudinal body may be a pinless assembly. The hemispherical end of each adjustable support 1501, 1502 may be received by a conical or V-shaped groove in the base plate 1505. The body 702 of module 405 may include portions 1503, 1504 having channels for receiving the longitudinal body of each adjustable support 1501, 1502. The degree to which each adjustable support 1501, 1502 is inserted into the channel may be adjustable. For example, the longitudinal body of each adjustable support 1501, 1502 may be moved to any position in the corresponding channel and then secured in place. The longitudinal body of each adjustable support 1501, 1502 may be secured in place in the channel by a locking bolt arrangement, such as... Figure 15B As shown in the image. Figure 15B The locking bolt arrangement shown includes a bolt 1506 and a clamping piece 1507. The bolt 1506 and clamping piece 1507 are arranged in a channel orthogonal to the channel of the longitudinal body of the adjustable support 1501. When the bolt is rotated, one end of the bolt is pressed against the clamping piece 1507, which in turn presses against the longitudinal body, thereby fixing the position of the longitudinal body in the channel. Rotation of the bolt 1506 in the opposite direction releases the force applied to the longitudinal body, allowing the longitudinal body to move along the channel.

[0240] Therefore, the separation of each part 1503, 1504 and the base plate 1505 in the z direction can be adjusted by adjusting the degree to which each adjustable support 1501, 1502 is inserted into the corresponding channel.

[0241] like Figure 15AAs shown, ball bearings 804 can contact the upstream surface of the disk's beam and module plates 802. Each module plate 802 is biased to apply force to the ball bearings 804, such that all ball bearings 804, the disk, and ball bearings 803 are held under compression between the module plates 802 and the base plate 1505. Therefore, the plane of the disk, and thus the entire support positioning system, can remain parallel and maintain a substantially fixed relationship with the upper surface of the base plate 1505.

[0242] Parts 1503 and 1502 can be fixedly connected to flange 701 of module 405, making them substantially immobile relative to flange 701. The base plate can be connected to the rest of the module solely via adjustable supports 1501 and 1502. Accordingly, the z-position of the base plate relative to flange 701 can be adjusted by adjusting the amount by which adjustable supports 1501 and 1502 are inserted into their corresponding parts 1503 and 1502. By applying different adjustments to all adjustable supports 1501 and 1502, the base plate, and thus the entire support positioning system, it can be tilted in the Rx and Ry directions, and adjusted in the z-direction.

[0243] Therefore, in the current embodiment, when module 405 is outside charged particle device 401, each adjustable support 1501, 1502 can be operated manually and / or automatically to adjust the position of the support positioning system relative to flange 701 of module 405. The z-position and tilt of the support positioning system—i.e., the Rx and Ry states, and thus the electro-optical device 404—can thereby be set by the adjustable supports 1501, 1502 before module 405 is inserted into charged particle device 401. Thus, the position of electro-optical device 404 and its support arrangement can be adjusted relative to flange 701 of module 405 in z, Rx, and Ry, and also relative to housing flange 1401 when the two flanges are secured together. Thus, the position of electro-optical device 404 can be pre-calibrated, i.e., pre-adjusted, relative to charged particle device, such as the frame of charged particle device (not shown), before module 405 is inserted into charged particle device 401. Therefore, after the module 405 is mounted on the charged particle device 401, the support arrangement and the supported electro-optical device 404 are roughly positioned in the desired location relative to the frame.

[0244] According to the seventh embodiment, the adjustment of the z-position and / or tilt (i.e., Rx and Ry states) of the electro-optical device 404 relative to the flange 701 of the module 405 can be referred to as a pre-calibration operation. In addition to the techniques of the sixth embodiment and any of the first to fifth embodiments, the techniques of the seventh embodiment can also be applied.

[0245] According to the eighth embodiment, further techniques are applied to align the electro-optical device 404 with the source beam. After the module 405, including the electro-optical device 404, has been attached to the charged particle device 401, electro-optical alignment techniques can be used to align the source beam with the electro-optical device 404. For example, electric and magnetic charged particle manipulators such as deflectors and lenses (not shown) can be used upstream of the beam in the module 405 to control the path of the source beam so that it is properly aligned with the electro-optical device 404. For example, manipulators such as deflectors in the form of multipole deflectors can be used to adjust the beam path on axes orthogonal to the beam path (such as on the x-axis and / or y-axis). A set of two deflectors can be used along the beam path to make adjustments on each axis. The first in each pair applies a correction to the path, and the second in each pair redirects the beam along a path corresponding to a desired angle of incidence on the device, which may correspond to the angle of incidence of the beam path to the first deflector in that set. Due to the reorientation of the second deflector in the group, the correction of the first deflector in each group is actually overcorrected. A micro-deflector array 323 can be used for this electrostatic correction, for example, if it is located upstream of the module's beam. A focusing lens arrangement, such as focusing lens 210 or 310, can be controlled to apply the correction in Rz to the beam path. Electric and magnetic charged particle manipulators, such as deflectors and lenses (not shown), can be additionally and / or alternatively used downstream of the beam from module 405 to control the path of the beam(s) output from module 405.

[0246] In addition to, or replacing, the techniques of one or more of the first to seventh embodiments, the electro-optical alignment technique of the eighth embodiment can be applied. Specifically, the alignment process of the electro-optical device 404 with a charged particle beam or multiple beams may include determining the positions of one or more beams that have passed through the electro-optical device and / or one or more beams that have been reflected by the electro-optical device, and then applying fine position adjustments based on the determined beam positions. Fine position adjustments may include the electro-optical alignment technique of the eighth embodiment and / or mechanical adjustments according to the techniques of the first to fifth embodiments.

[0247] The degree of repositioning provided by the pre-calibration technique in the seventh embodiment depends on the module design. Adjustments in the z-direction can range from less than 50 μm to greater than 200 μm. Adjustments to Rx and Ry can range from less than 0.1 mrad to greater than 1 mrad.

[0248] The sixth embodiment can be referred to as a coarse positioning technique. The sixth embodiment can be used to position the electron optical device 404 relative to the vacuum chamber of the module in the charged particle device within 50 μm to 200 μm in the x, y, and z axes. The position in Rx, Ry, and Rz can be between 1 mrad and 5 mrad relative to the vacuum chamber.

[0249] The techniques of the sixth and seventh embodiments can position the electro-optical device within a known range of locations relative to the vacuum chamber. However, due to the variation in the position of the charged particle beam path, the electro-optical device can be within 1 mm of the charged particle beam path in the x and / or y directions, and within 100 mrad of the charged particle beam path in Rz.

[0250] The first to fifth embodiments and the eighth embodiment can be referred to as fine positioning techniques. They can be used to align the electro-optical device 404 with a charged particle beam or multiple beams.

[0251] The first to fifth embodiments are capable of moving the electro-optical device from 0.5 μm to 100 μm in the x and / or y directions, and applying a rotation of up to 1 rad in Rz.

[0252] The eighth embodiment allows for movement of the charged particle beam path by up to 2 mm in the x and / or y directions, and application of a rotation of up to 1 rad in Rz. The eighth embodiment also allows for movement of the charged particle beam path in the z direction by changing the focusing of the charged particle beam or multiple beams.

[0253] The embodiments also include the application of manual and / or automatic repositioning techniques to other components in the charged particle device 401. For example, the source 402 and / or objective lens may be moved. For example, the source beam may first be aligned with the objective lens, and then techniques according to any of the embodiments described herein may be applied to align the charged particle beam or multiple beams with the electro-optical device 404.

[0254] The embodiment also includes a method for mounting an electron optics device 404 in a charged particle device 401. The method may include one or more of the following steps: attaching the electron optics device 404 to a module 405; performing a pre-calibration process to adjust the relative position of the electron optics device 404 and the module 405; applying a coarse adjustment to the Rx state of the electron optics device 404 relative to the body 702 of the module 405; applying a coarse adjustment to the Ry state of the electron optics device 404 relative to the body 702 of the module 405; applying a coarse adjustment to the z position of the electron optics device 404 relative to the body 702 of the module 405; and / or securing the module 405 to the charged particle device 401. The module 405 may be a module according to any of the first to fifth embodiments described above. The pre-calibration process may be according to the seventh embodiment described above. The coarse alignment process may be according to the sixth embodiment described above.

[0255] After the module 405, including the electron optics device 404, has been fixed to the charged particle device 401, the embodiment includes a method for aligning the electron optics device 404 with a charged particle beam or multiple beams within the charged particle device 401. This method may include one or more of the following steps: applying fine adjustment to the x-position of the electron optics device 404 relative to the body 702 of the module 405; applying fine adjustment to the y-position of the electron optics device 404 relative to the body 702 of the module 405; applying fine adjustment to the Rz state of the electron optics device 404 relative to the body 702 of the module 405; and / or applying adjustment to the path of the charged particle beam or multiple beams within the charged particle device 401. The module 405 may be any of the modules 405 described in the first to fifth embodiments above. The adjustments applied to the path of the charged particle beam or multiple beams within the charged particle device may be based on the technique described in the eighth embodiment above.

[0256] The method of mounting the electron optical device 404 in the charged particle device 401 described above can be used together with the method of aligning the electron optical device 404 with the charged particle beam or multiple beams in the charged particle device 401 described above.

[0257] A method for replacing the electro-optical device 404 in a charged particle device 401 may include: disconnecting the power supply to the source; closing the valve of the vacuum chamber that isolates the module 405; venting the vacuum chamber; opening the vacuum seal of the vacuum chamber; removing the module 405 from the charged particle device 401; inserting the replacement module 405 into the charged particle device 401; sealing the vacuum seal of the vacuum chamber; evacuating the vacuum chamber to restore it to a vacuum state and baking the module 405; opening the valve of the isolated vacuum chamber; performing mechanical fine alignment; turning on the power supply to the source; performing a high-voltage test; and performing electrical fine alignment of the electro-optical device 404 and the charged particle path 403.

[0258] Figure 17 A flowchart illustrating a method for mounting an electron optical device within a charged particle device according to one embodiment is shown.

[0259] In step 1701, the method begins.

[0260] In step 1703, the electro-optical device is attached to the module.

[0261] In step 1705, coarse adjustments are made to the Rx state, Ry state, and / or z position of the electro-optical device relative to the main body of the module.

[0262] In step 1707, the module is attached to the charged particle device.

[0263] In step 1709, the method ends.

[0264] Figure 18 A flowchart is shown of a method for aligning an electron optical device with a charged particle beam or multiple beams within a charged particle device, according to one embodiment.

[0265] In step 1801, the method begins.

[0266] In step 1803, the module including the electron optical device is fixed to the charged particle device, thereby installing the electron optical device in the charged particle device.

[0267] In step 1805, multiple fine adjustments are applied to the x position, y position, and / or Rz state of the electro-optical device relative to the main body of the module.

[0268] In step 1807, the path of the charged particle beam or multiple beams within the charged particle device is adjusted.

[0269] In step 1809, the method ends.

[0270] The embodiments include many modifications and variations of the above-described techniques.

[0271] In the above embodiment, the body 702 of module 405 is permanently fixed to module flange 701. The embodiment also includes features equivalent to the body of module 405, which are fixed and optionally permanently positioned within charged particle device 401. Equivalent features of the flange (not shown) are separate from the body and are essentially removable covers to access the equivalent features of the body. Electro-optical devices can be replaced by removing the flange, thereby obtaining electro-optical devices that closely approximate the equivalent features of the body. In this arrangement, where the flange is separate from and mechanically independent of the rest of the module (including supports and devices), the module has an engagement arrangement that interacts with engagement arrangements within the device (preferably, a lens barrel) to coarsely align the module and thus align the device relative to the frame of the device. The engagement arrangement of the device and module can take the form of a drawer, capable of aligning the module relative to the frame in all degrees of freedom, and can include flange and pin features applied to this arrangement and adapted from Embodiment Six.

[0272] Throughout the embodiments, techniques for positioning electro-optical devices are described.

[0273] Vacuum locks can also be provided at other locations, such as the charged particle device 401 and the tool including the charged particle device 401. For example, as Figure 16 As shown, a source vacuum lock (not shown) may exist between the upstream vacuum lock 406 and the source 402. The source vacuum lock allows the area of ​​the charged particle device 401 including the source 402 to be isolated from the rest of the charged particle device 401 and reduces the time required to replace the source 402. The source 402 may also be included by a replaceable module, making the source 402 field-replaceable.

[0274] like Figure 16 As shown, a vent / evacuation valve 1601 can be provided in module region 1607, isolated by upstream beam valve 406 and downstream beam valve 407. When module 405 is replaced, vent / evacuation valve 1601 can be used to vent and evacuate module region 1607. Vent / evacuation valve 1601 can also be used to vent and evacuate source region 1606, with upstream beam valve 406 open and downstream beam valve 407 closed. Module 405 can be removed as module region 1607 is vented.

[0275] With the source region vented and the upstream beam valve closed, the source module, including source 402 and source region 1606, can be removed from the device. In another arrangement, the source region may have designated vent / exhaust valves. The source region can operate independently of module region 1607. The source module may be field-replaceable.

[0276] like Figure 16As shown, the tool including the charged particle device 401 may also include a secondary tube 1605, which includes a detector (not shown) and a probe (not shown). The detector may be configured to detect electrons from the sample, such as secondary electrons. An upstream beam lock 1602 and a downstream beam lock 1603 may be provided upstream and downstream of the detector, providing an isolated detector region 1608 within the secondary tube. A vent / evacuation valve 1604 may be provided in the detector region 1608 isolated by the upstream beam valve 1602 and the downstream beam valve 1603. Therefore, the detector may also be field-replaceable. The vent / evacuation valve 1604 may also be used to vent and evacuate the probe region 1609, with the upstream beam valve 1602 closed and the downstream beam valve 1603 open.

[0277] In one arrangement, the device may include more than one module 405, which may be located in one or more isolated and / or independently operable module areas. The detector lens may have one or more modules in one or more isolated and / or independently operable module areas. Each additional module may be field-replaceable.

[0278] The embodiments also include devices supported by module 405, which are devices of a different type from electro-optical devices 404.

[0279] Charged particle device 401 can specifically be a multi-beam charged particle device. Charged particle devices may include those described in the above reference. Figure 1 , Figure 2 and Figure 3 Any component of the device described.

[0280] Multi-beam charged particle devices can be components of inspection (or metrological) tools or part of electron beam lithography tools. Multi-beam charged particle devices can be used in many different applications, generally including electron microscopy, not just SEM, as well as lithography.

[0281] A multi-beam charged particle device may include more than one charged particle source.

[0282] Throughout this embodiment, a charged particle axis is described. This axis describes the path of charged particles through and from sources 201 and 301. The sub-beams of the output multi-beam can all be substantially parallel to the charged particle optical axis 403. The charged particle optical axes 204 and 304 can be the same as or different from the mechanical axis of the irradiation device.

[0283] The embodiments include the following statements.

[0284] According to a first aspect of the invention, a module is provided for supporting an apparatus configured to manipulate charged particle paths within a charged particle device, the module comprising: a support arrangement configured to support the apparatus, wherein the apparatus is configured to manipulate charged particle paths within the charged particle device; and a support positioning system configured to move the support arrangement within the module; wherein the module is arranged to be field-replaceable within the charged particle device.

[0285] Preferably, when the module is used in a charged particle device and the device is held by a support arrangement: the charged particle path is substantially parallel to the charged particle axis of the charged particle device.

[0286] Preferably, the support positioning system is configured to move the support arrangement in at least three degrees of freedom of movement.

[0287] Preferably, the charged particle axis corresponds to the z-axis; the module is a basic planar structure in the xy-plane; and at least three degrees of freedom of movement include movement in the xy-plane and rotation about the z-axis (Rz).

[0288] Preferably, the support positioning system is a manual and / or automatic positioning system.

[0289] Preferably, the support positioning system is configured to: move the support arrangement to within approximately 0.5 μm to 100 μm of the desired location of the support arrangement; and / or apply a rotation of up to 1 rad on Rz to the support arrangement.

[0290] Preferably, the module further includes a position detection system configured to determine the movement and / or position of the support arrangement and / or the device held by the support arrangement.

[0291] Preferably, the position detection system includes grid markings, such as an encoder, for determining the movement and / or position of the support arrangement and / or the device held by the support arrangement.

[0292] Preferably, the position detection system is configured to determine the movement and / or position of the support arrangement and / or the device held by the support arrangement based on one or more characteristics of the device held by the support arrangement.

[0293] Preferably, one or more features of the device include: an array of openings; and / or one or more reference points.

[0294] Preferably, the aperture array is an aperture array used for aligning substrates in a substrate stack included in the device during the manufacture of the device.

[0295] Preferably, the aperture array is used for the path of charged particles through the beam manipulator included in the device.

[0296] Preferably, the module further includes a receiving portion configured to receive a corresponding end of the actuator arm.

[0297] Preferably, the actuator outside the module includes an actuator arm; and the support positioning system is configured to move via the actuator.

[0298] Preferably: a first receiving portion is arranged to receive the end of a first actuator arm for moving the support positioning system in a first direction; a second receiving portion is arranged to receive the end of a second actuator arm for moving the support arrangement in a second direction via the support positioning system, the second direction being orthogonal to the first direction; and a third receiving portion is arranged to receive the end of a third actuator arm for rotating the support arrangement.

[0299] Preferably, the first and second directions lie in the xy plane; and the rotation is about an axis orthogonal to the xy plane, such as the z-axis.

[0300] Preferably, the support positioning system includes: a disk; and a plurality of rotatable objects configured to support the disk within the module.

[0301] Preferably, the disk has an upstream surface and a downstream surface; a first group of one or more rotatable objects are arranged to contact the upstream surface of the disk; and a second group of multiple rotatable objects are arranged to contact the downstream surface of the disk.

[0302] Preferably, the first group of rotatable objects includes one, two, or three rotatable objects; and the second group of rotatable objects includes three rotatable objects.

[0303] Preferably, in the plan view, the disk is arranged such that when the module is installed in the charged particle device, the charged particle path passes through the opening defined in the disk.

[0304] Preferably, in a plan view, the disk is substantially annular.

[0305] Preferably, the disk has a basic planar structure, preferably in the xy plane.

[0306] Preferably, the disk includes a support arrangement.

[0307] Preferably, the module includes a first force-applying device arranged to apply a force to the disc, wherein the force is in a plane substantially the same as the disc and is used to move the disc in that plane; the module includes a second force-applying device arranged to apply a force to the disc, wherein the force is in a plane substantially the same as the disc and is used to rotate the disc.

[0308] Preferably, the first force-applying device is configured such that the force it applies is substantially in the direction passing through the rotation axis of the disk, such that the force does not substantially rotate the disk.

[0309] Preferably, during use, the disc is compressed by the following forces: a force from the first force-applying device; a force applied to the first receiving portion; and a force applied to the second receiving portion.

[0310] Preferably, in use, the second force-applying device is arranged to apply a force that presses the third receiving portion into the end of the third actuator arm.

[0311] Preferably, the second force-applying device is arranged to apply force from the sidewall of the disc to the first protrusion; and / or the third receiving portion includes a second protrusion from the sidewall of the disc.

[0312] Preferably, the module includes a force-applying device arranged to apply a force to the disk; the force is applied in a plane substantially the same as the disk; the applied force is used to move the disk linearly in the plane; and the applied force is used to rotate the disk.

[0313] Preferably, the module includes one or more axial force-applying devices arranged such that the disc is held under compression between the first and second sets of rotatable objects.

[0314] Preferably, each axial force-applying device includes a plate for contacting one of the rotatable objects; and / or one or more axial force-applying devices are elastic members, such as springs.

[0315] Preferably, the support positioning system includes a flexural arrangement.

[0316] Preferably, the flexural arrangement includes an Rz flexural arrangement and an xy flexural arrangement.

[0317] Preferably, both the Rz flexure arrangement and the xy flexure arrangement are basic planar structures, and preferably in the xy plane.

[0318] Preferably, the Rz flexure arrangement and the xy flexure arrangement are arranged in a stacked manner; and the Rz flexure arrangement is preferably downstream of the beam of the xy flexure arrangement.

[0319] Preferably, in the plan view, the Rz flexural arrangement includes a basic circular structure that defines an opening in the Rz flexural arrangement.

[0320] Preferably, the center of the basic circular structure is substantially aligned with the z-axis.

[0321] Preferably, in the plan view, the Rz flexural arrangement includes a cross; the cross includes first and second crossbars intersecting at the junction; the first crossbar is aligned in a first direction in the plane of the Rz flexural arrangement; the second crossbar is aligned in a second direction in the plane of the Rz flexural arrangement, wherein the second direction is orthogonal to the first direction.

[0322] Preferably, the circular structure is located at the junction of the first crossbar and the second crossbar; and the circular structure is supported between the first part and the second part of the first crossbar and between the first part and the second part of the second crossbar.

[0323] Preferably, the first crossbar is aligned with the first receiving portion; and the second crossbar is aligned with the second receiving portion.

[0324] Preferably, the Rz flexural arrangement includes a base and a movable body.

[0325] Preferably, the third receiving portion includes a groove in the sidewall of the Rz flexural arrangement.

[0326] Preferably, the Rz flexure arrangement includes a rotational force application device configured to apply a force for rotating the movable body.

[0327] Preferably, in use, the rotational force applied by the rotational force-applying device is configured to press the third receiving portion into the end of the third actuator arm.

[0328] Preferably, the xy-flex arrangement includes: an outer structure; an intermediate structure; a central structure; and a plurality of leaf springs; wherein in the plane of the xy-flex arrangement, the intermediate structure is substantially surrounded by the outer structure, the first receiving portion, and the first receiving portion; wherein in the plane of the xy-flex arrangement, the central structure is substantially surrounded by the intermediate structure; the outer structure is connected to the intermediate structure via at least one leaf spring; and the intermediate structure is connected to the central structure via at least one leaf spring.

[0329] Preferably, at least one leaf spring connecting the intermediate structure to the central structure is arranged such that the central structure is arranged to move relative to the outer structure in a first direction in response to a force applied to the first receiving portion; and at least one leaf spring connecting the outer structure to the intermediate structure is arranged such that the intermediate structure is arranged to move relative to the outer structure in a second direction in response to a force applied to the second receiving portion.

[0330] Preferably, the intermediate structure is connected to the central structure via two leaf springs arranged on opposite sides of the central structure; and the intermediate structure is connected to the outer structure via two leaf springs arranged on opposite sides of the intermediate structure.

[0331] Preferably, the module further includes: a first biasing device arranged to apply a force such that the intermediate structure and / or the central structure is held under compression in a first direction; and a second biasing device arranged to apply a force such that the intermediate structure and / or the central structure is held under compression in a second direction.

[0332] Preferably, the external structure of the xy flexural arrangement is fixed to the movable body of the Rz flexural arrangement.

[0333] Preferably, the first and / or second biasing device is an elastic member, such as a spring.

[0334] Preferably, the support positioning system includes one or more linear actuators.

[0335] Preferably, each actuator is a piezoelectric actuator arrangement.

[0336] Preferably, each piezoelectric actuator arrangement includes a biaxial shear-mode piezoelectric device.

[0337] Preferably, the support positioning system includes multiple actuators.

[0338] Preferably, the number of actuators included in the support positioning system is three.

[0339] Preferably, the support positioning system includes a worktable.

[0340] Preferably, in the plan view, the worktable is substantially circular.

[0341] Preferably, the actuators are spaced at substantially equal angular positions around the midpoint of the stage.

[0342] Preferably, the actuators are aligned such that the angle between the longitudinal axes of adjacent actuators is 60 degrees.

[0343] Preferably, the actuators are configured such that all actuators can operate together to rotate the worktable in the plane of the worktable.

[0344] Preferably, the actuators are configured such that all actuators can operate together to move the worktable in a first direction within the plane of the worktable.

[0345] Preferably, the actuators are configured such that all actuators can operate together to move the worktable in a second direction in the plane of the worktable, wherein the second direction is orthogonal to the first direction.

[0346] Preferably, the module further includes one or more force-applying devices, each of which is arranged to apply a force to press the actuator into the worktable.

[0347] Preferably, in the plan view, at least one actuator is arranged on the side of the worktable and configured such that linear movement of the actuator causes the worktable to rotate; and wherein, for each actuator on the side of the worktable, there is a force-applying device configured to apply a force to press the actuator into the worktable.

[0348] Preferably, there are two actuators on the side of the worktable; and the actuators are located on opposite sides of the worktable.

[0349] Preferably, the module further includes first and second linear actuators; wherein: the first linear actuator is arranged to move the second linear actuator in a first direction; and the second linear actuator is arranged to move at least one actuator disposed on the side of the worktable in a second direction orthogonal to the first direction.

[0350] According to a second aspect of the invention, a module is provided for supporting means configured to manipulate the path of charged particles in a charged particle device, the module comprising: a module flange configured to be attached to and detached from a housing flange of a charged particle device housing, such that the module is field-replaceable within the charged particle device.

[0351] Preferably, when the module is used in a charged particle device and the module support device is configured to manipulate a charged particle path substantially along the charged particle axis of the charged particle device.

[0352] Preferably, the charged particle axis corresponds to the z-axis; and the module is a basic planar structure in the xy plane.

[0353] Preferably, the module flange includes one or more holes for receiving alignment pins of the housing flange; and / or the module flange includes one or more alignment pins for insertion into the holes of the housing flange.

[0354] Preferably, the module flange includes one or more alignment pins for insertion into the housing flange.

[0355] Preferably, the module includes: a device support arrangement for supporting the device; and a mechanism for adjusting the position of the device support arrangement in at least one degree of freedom of movement.

[0356] Preferably, the device support system allows the position of the device support arrangement to be adjusted in three degrees of freedom; and the three degrees of freedom are preferably the z, Rx and Ry positions of the device support arrangement.

[0357] Preferably, the mechanism for adjusting the z, Rx, and Ry positions of the device support arrangement includes one or more adjustable supports, such as adjustable spring bolts, adjustable fasteners, or adjustable pins.

[0358] Preferably, the adjustable support is arranged around the support of the device.

[0359] Preferably, the adjustable supports are spaced at substantially equal angular positions around the midpoint of the device support arrangement.

[0360] Preferably, there are three adjustable support members.

[0361] Preferably, the adjustable support is independently adjustable.

[0362] Preferably, the mechanism for adjusting the z, Rx, and Ry positions of the device support arrangement is configured to operate when the module is outside the charged particle device.

[0363] Preferably, the module is a module according to any one of the first and / or second aspects.

[0364] Preferably, the device support arrangement includes a support positioning system and a support arrangement according to the first aspect.

[0365] According to a third aspect of the invention, a charged particle device is provided, comprising a field-replaceable module according to either the first or second aspect.

[0366] Preferably, the module includes means configured to manipulate the path of charged particles in a charged particle device.

[0367] Preferably, the charged particle device includes an actuator for use in a support positioning system for an actuation module; and wherein the actuator is a linear actuator.

[0368] Preferably, each actuator includes an actuator arm configured to engage with a corresponding receiving portion included in the module.

[0369] Preferably, the end of the actuator arm includes a roller bearing.

[0370] Preferably, the device includes a beam manipulator arranged to manipulate sub-beams of a multi-beam array of charged particles.

[0371] Preferably, the charged particle device includes a housing flange configured to be attachable to and detachable from the module flange.

[0372] Preferably, the housing flange includes one or more alignment pins for insertion into corresponding openings in the module flange.

[0373] Preferably, the module flange includes one or more alignment pins for insertion into a corresponding opening in the housing flange.

[0374] Preferably, the charged particle device further includes a position detection system configured to determine the movement and / or position of the device.

[0375] Preferably, the charged particle device further includes: a charged particle source; and one or more manipulator arrangements configured to manipulate charged particle paths upstream and / or downstream of the beam of the device.

[0376] Preferably, one or more manipulator arrangements are configured to adjust the charged particle path, and / or modules are configured to adjust the position of the device such that the charged particle path is aligned with the device.

[0377] Preferably, the charged particle system further includes a control system configured to control the arrangement of one or more manipulators.

[0378] Preferably, the first set of manipulators is provided upstream of the module's beam; and the second set of manipulators is provided downstream of the module's beam.

[0379] Preferably, one or more of the manipulator arrangements include electrostatic deflectors for deflecting the path of charged particles.

[0380] Preferably, one or more of the manipulator arrangements include magnetic lenses for deflecting the path of charged particles.

[0381] Preferably, the charged particle device further includes a source moving mechanism for adjusting the position of the source.

[0382] Preferably, the charged particle device further includes an objective lens; and the charged particle device further includes a lens moving mechanism for adjusting the position of the objective lens.

[0383] Preferably, at least one of the manipulator arrangements is configured to be controllable in order to manipulate the path of charged particles from the source to align with the device and the objective lens.

[0384] Preferably, the charged particle device further includes: a beam upstream vacuum lock located on the beam upstream side of the module; and a beam downstream vacuum lock located on the beam downstream side of the module.

[0385] Preferably, the upstream and downstream vacuum locks are operable to isolate the region of the charged particle device including the module from the vacuum conditions in adjacent regions of the charged particle device.

[0386] Preferably, the charged particle system further includes source vacuum locking downstream of the source beam.

[0387] Preferably, the source vacuum lock is operable to isolate the region of the charged particle device including the source from the vacuum conditions in adjacent regions of the charged particle device.

[0388] Preferably, the field-replaceable module includes a source.

[0389] Preferably, the charged particle device further includes a secondary lens; and the secondary lens includes a detector configured to detect electrons from the sample.

[0390] Preferably, the secondary tube further includes one or more vacuum locks for isolating the region of the secondary tube including the detector from the vacuum conditions in the adjacent regions(s) of the secondary tube.

[0391] Preferably, the field-replaceable module includes a detector.

[0392] According to a fourth aspect of the present invention, a method for mounting an electron optical device within a charged particle device is provided, the method comprising: attaching the electron optical device to a module; applying coarse adjustments to the Rx state, Ry state, and / or z position of the electron optical device relative to the body of the module; and securing the module to the charged particle device.

[0393] Preferably, the module is a module according to the first and / or second aspects; and a charged particle device.

[0394] According to a fifth aspect of the invention, a method is provided for aligning an electro-optical device with a charged particle beam or multiple beams within a charged particle device, the method comprising: fixing a module including the electro-optical device to the charged particle device, thereby mounting the electro-optical device within the charged particle device; applying multiple fine adjustments to the x-position, y-position, and / or Rz state of the electro-optical device relative to the body of the module; and applying adjustments to the path of the charged particle beam or multiple beams within the charged particle device.

[0395] Preferably, before the electron optical device is installed in the charged particle device, the module receiving area of ​​the receiving module in the charged particle device is isolated from the basic vacuum conditions of the adjacent areas in the charged particle device by a closed internal vacuum seal, so that the module receiving area can be ventilated and is in the environmental conditions outside the charged particle device.

[0396] Preferably, the method further includes: after the module has been fixed to the charged particle device, closing the external vacuum seal for the module receiving area to isolate the module receiving area from the external environmental conditions of the charged particle device; evacuating the module receiving area to bring it to a near-vacuum state; baking the module; opening the internal vacuum seal; and activating the source of the charged particle device to create a charged particle beam or multiple beams within the charged particle device.

[0397] Preferably, the module is a module according to the first and / or second aspect; and the charged particle device is a charged particle device according to the third aspect.

[0398] According to a sixth aspect of the invention, an electron optics tube configured to project an electron beam onto a sample is provided, the tube comprising: a frame configured to define a reference frame for the tube; and a chamber for receiving a field-replaceable module including electron optics devices. The electron optics tube may include a coupling arrangement configured to engage with the field-replaceable module to align the field-replaceable module with the frame. The electron optics tube may include an active positioning system configured to position the beam and devices relative to each other for fine alignment.

[0399] Preferably, the active positioning system includes an electro-optical element upstream of the beam of the field-replaceable module, which is controllable to manipulate the path of the electron beam, such as a lens or deflector.

[0400] Preferably, the active positioning system includes an actuator configured to engage with a field-replaceable module and to be controllably movable with a certain degree of freedom relative to the path of the electron beam. This degree of freedom is preferably the degree of freedom of the device in a plane orthogonal to the path of the electron beam. Preferably, the device is a planar structure in a plane orthogonal to the path of the electron beam.

[0401] Preferably, the electron optical lens barrel further includes an upstream beam valve for sealing a chamber upstream of the lens barrel beam and a downstream beam valve for sealing the chamber from the downstream portion of the lens barrel beam, preferably such that the chamber is segmented from the rest of the lens barrel.

[0402] Preferably, the chamber defines an opening in the side of the endoscope tube, the opening being configured to receive a field-replaceable module, and the chamber being configured to be able to seal with the field-replaceable module.

[0403] According to a seventh aspect of the invention, a field-replaceable module is provided, arranged for removable insertion into an electro-optical tube. The field-replaceable module includes: an electro-optical element configured to manipulate the path of an electron beam within the electro-optical tube; and a support configured to support the electro-optical element. The field-replaceable module may include a mating arrangement configured to align the support with the frame of the electro-optical tube in all degrees of freedom.

[0404] Preferably, the field-replaceable module further includes a support positioning system configured to displace the element relative to the rest of the module so that the element can be positioned relative to the path of the electron beam passing through the lens barrel.

[0405] Preferably, the element is a planar structure arranged orthogonally to the path of the charged particle beam, wherein the support positioning system is configured to displace the support in at least one degree of freedom of the plane of the planar structure, preferably on the x-axis, on the y-axis and / or about the z-axis.

[0406] Preferably, the support positioning system is configured to engage with an actuator associated with the frame of the electro-optical lens barrel, the actuator being associated with the degree of freedom of the plane of the planar structure, and the support being controllably operable by the actuator to adjust the position of the support relative to the frame.

[0407] Preferably, the engagement arrangement includes a flat surface and two interlocking features, each of which is assigned an axial degree of freedom.

[0408] Preferably, the joining arrangement is configured to seal the side surface of the lens barrel.

[0409] Preferably, the field-replaceable module further includes a pre-calibration system configured to be adjustable to adjust the alignment of the support relative to the frame, preferably in degrees of freedom different from those adjusted by the support positioning system and / or preferably in degrees of freedom outside the plane of the device's planar structure.

[0410] While the invention has been described in conjunction with various embodiments, other embodiments of the invention will be apparent to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. The specification and examples are intended to be illustrative only, and the true scope and spirit of the invention are indicated by the appended claims.

[0411] The above description is illustrative, not restrictive. Therefore, it will be apparent to those skilled in the art that modifications can be made as described without departing from the scope of the appended claims.

[0412] Several terms were provided:

[0413] Clause 1: A module for supporting a means configured to manipulate a charged particle path in a charged particle device, the module comprising: a support arrangement configured to support the means, wherein the means is configured to manipulate a charged particle path within the charged particle device; and a support positioning system configured to move the support arrangement within the module; wherein the module is arranged to be field-replaceable within the charged particle device.

[0414] Clause 2: The module according to Clause 1, wherein when the module is used in a charged particle device and the device is held by a support arrangement: the charged particle path is substantially parallel to the charged particle axis of the charged particle device.

[0415] Clause 3: A module according to Clause 1 or 2, wherein the support positioning system is configured to move the support arrangement in at least three degrees of freedom of movement.

[0416] Clause 4: A module according to any one of the preceding clauses, wherein the charged particle axis corresponds to the z-axis; the module is a fundamental planar structure in the xy plane; and at least three degrees of freedom of movement include translation in the xy plane and rotation about the z-axis (Rz).

[0417] Clause 5: Modules according to any one of the preceding clauses, wherein the supporting positioning system is a manual and / or automatic positioning system.

[0418] Clause 6: The module according to any one of the preceding clauses, wherein the support positioning system is configured to: move the support arrangement to within approximately 0.5 μm to 100 μm of the desired location of the support arrangement; and / or apply a rotation of up to 1 rad on Rz to the support arrangement.

[0419] Clause 7: A module according to any one of the preceding clauses, wherein the module further comprises a position detection system configured to determine the movement and / or position of the support arrangement and / or the means held by the support arrangement.

[0420] Clause 8: The module described in Clause 7, wherein the position detection system includes a grid of markers, such as an encoder, for determining the movement and / or position of the support arrangement and / or the means held by the support arrangement.

[0421] Clause 9: The module according to Clause 7 or 8, wherein the position detection system is configured to: determine the movement and / or position of the support arrangement and / or the device held by the support arrangement based on one or more characteristics of the device held by the support arrangement.

[0422] Clause 10: A module according to Clause 9, wherein one or more features of the device include: an array of openings; and / or one or more reference points.

[0423] Clause 11: The module according to Clause 10, wherein the aperture array is an aperture array used during the manufacture of the device when aligning substrates in a substrate stack included in the device.

[0424] Clause 12: The module according to Clause 10, wherein the array of openings is used for the path of charged particles through the beam manipulator included in the device.

[0425] Clause 13: A module according to any one of the preceding clauses, wherein the module further includes a receiving portion configured to receive a corresponding end of the actuator arm.

[0426] Clause 14: The module as described in Clause 13, wherein the actuator outside the module includes an actuator arm; and the support positioning system is configured to move by means of the actuator.

[0427] Clause 15: The module according to Clause 14, wherein: a first receiving portion is arranged to receive the end of a first actuator arm for moving the support positioning system in a first direction; a second receiving portion is arranged to receive the end of a second actuator arm for moving the support arrangement in a second direction via the support positioning system, the second direction being orthogonal to the first direction; and a third receiving portion is arranged to receive the end of a third actuator arm for rotating the support arrangement.

[0428] Clause 16: The module according to Clause 15, wherein the first direction and the second direction are in the xy plane; and the rotation is about an axis such as the z-axis orthogonal to the xy plane.

[0429] Clause 17: A module according to any one of the preceding clauses, wherein the support positioning system comprises: a disk; and a plurality of rotatable objects configured to support the disk within the module.

[0430] Clause 18: The module according to Clause 17, wherein: the disk has a beam upstream surface and a beam downstream surface; a first group of one or more rotatable objects is arranged to contact the beam upstream surface of the disk; and a second group of multiple rotatable objects is arranged to contact the beam downstream surface of the disk.

[0431] Clause 19: The module described in Clause 17 or 18, wherein the first group of rotatable objects comprises one, two, or three rotatable objects; and the second group of rotatable objects comprises three rotatable objects.

[0432] Clause 20: A module according to any one of Clauses 17 to 19, wherein in a plan view, the disk is arranged such that when the module is installed within a charged particle device, the charged particle path passes through an opening defined in the disk.

[0433] Clause 21: A module according to any one of Clauses 17 to 20, wherein the disk is substantially annular in a plan view.

[0434] Clause 22: A module according to any one of Clauses 17 to 21, wherein the disk is a basic planar structure, preferably in the xy plane.

[0435] Clause 23: A module according to any one of Clauses 17 to 22, wherein the disk includes a support arrangement.

[0436] Clause 24: A module according to any one of Clauses 17 to 23, wherein: the module includes a first force-applying device arranged to apply a force to a disc, wherein the force is in a plane substantially the same as the disc and is used to move the disc in the plane; the module includes a second force-applying device arranged to apply a force to a disc, wherein the force is in a plane substantially the same as the disc and is used to rotate the disc.

[0437] Clause 25: The module according to Clause 24, wherein the first force-applying device is configured such that the force it applies is substantially in the direction passing through the rotation axis of the disk, such that the force substantially does not rotate the disk.

[0438] Clause 26: A module according to Clause 24 or 25, wherein in use, the disc is compressed by the following forces: a force from a first force-applying device; a force applied to a first receiving portion; and a force applied to a second receiving portion.

[0439] Clause 27: A module according to any one of Clauses 24 to 26, wherein, in use, the second force-applying device is arranged to apply a force that presses the third receiving portion into the end of the third actuator arm.

[0440] Clause 28: A module according to any one of Clauses 24 to 27, wherein the second force-applying device is arranged to apply force from the sidewall of the disk to the first protrusion; and / or the third receiving portion includes a second protrusion from the sidewall of the disk.

[0441] Clause 29: A module according to any one of Clauses 17 to 23, wherein: the module includes a force-applying device arranged to apply a force to a disk; the force applied in a plane substantially the same as the disk; the applied force being used to move the disk linearly in the plane; and the applied force being used to rotate the disk.

[0442] Clause 30: A module according to any one of Clauses 17 to 29, wherein the module includes one or more axial force-applying devices arranged such that the disc is held under compression between the first and second sets of rotatable objects.

[0443] Clause 31: The module according to Clause 30, wherein: each axial force-applying device includes a plate for contacting one of the rotatable objects; and / or one or more axial force-applying devices are elastic members, such as springs.

[0444] Clause 32: A module according to any one of Clauses 1 to 16, wherein the support positioning system includes a flexural arrangement.

[0445] Clause 33: The module described in Clause 32, wherein the flexural arrangement includes an Rz flexural arrangement and an xy flexural arrangement.

[0446] Clause 34: The module according to Clause 33, wherein the Rz flexure arrangement and the xy flexure arrangement are both basic planar structures, preferably in the xy plane.

[0447] Clause 35: A module according to any one of Clauses 33 or 34, wherein the Rz flexure arrangement and the xy flexure arrangement are arranged in a stacked manner; and the Rz flexure arrangement is preferably downstream of the beam of the xy flexure arrangement.

[0448] Clause 36: A module according to any one of Clauses 33 to 35, wherein, in a plan view, the Rz flexural arrangement includes a basic circular structure defining an opening in the Rz flexural arrangement.

[0449] Clause 37: The module as described in Clause 36, wherein the center of the basic circular structure is substantially aligned with the z-axis.

[0450] Clause 38: A module according to any one of Clauses 36 or 37, wherein in a plan view, the Rz flexural arrangement includes a cross; the cross includes first and second crossbars intersecting at an intersection; the first crossbar is aligned in a first direction in the plane of the Rz flexural arrangement; the second crossbar is aligned in a second direction in the plane of the Rz flexural arrangement, wherein the second direction is orthogonal to the first direction.

[0451] Clause 39: A module according to any one of Clauses 36 to 38, wherein: a circular structure is located at the junction of the first crossbar and the second crossbar; and the circular structure is supported between the first portion and the second portion of the first crossbar and between the first portion and the second portion of the second crossbar.

[0452] Clause 40: The module according to Clause 39, wherein: the first crossbar is aligned with the first receiving portion; and the second crossbar is aligned with the second receiving portion.

[0453] Clause 41: A module according to any one of Clauses 33 to 40, wherein the Rz flexural arrangement includes a base and a movable body.

[0454] Clause 42: The module according to Clause 41, wherein the third receiving portion includes a groove in the sidewall of the Rz flexural arrangement.

[0455] Clause 43: A module according to any one of Clauses 41 or 42, wherein the Rz flexure arrangement includes a rotational force-applying device configured to apply a force for rotating the movable body.

[0456] Clause 44: The module according to Clause 43, wherein, in use, the rotational force applied by the rotational force-applying device is configured to press the third receiving portion into the end of the third actuator arm.

[0457] Clause 45: A module according to any one of Clauses 33 to 44, wherein the xy flexural arrangement comprises: an outer structure; an intermediate structure; a central structure; and a plurality of leaf springs; wherein in the plane of the xy flexural arrangement, the intermediate structure is substantially surrounded by the outer structure, the first receiving portion, and the first receiving portion; wherein in the plane of the xy flexural arrangement, the central structure is substantially surrounded by the intermediate structure; the outer structure is connected to the intermediate structure by at least one leaf spring; and the intermediate structure is connected to the central structure by at least one leaf spring.

[0458] Clause 46: The module according to Clause 45, wherein: at least one leaf spring connecting the intermediate structure to the central structure is arranged such that the central structure is arranged to move relative to the outer structure in a first direction in response to a force applied to the first receiving portion; and at least one leaf spring connecting the outer structure to the intermediate structure is arranged such that the intermediate structure is arranged to move relative to the outer structure in a second direction in response to a force applied to the second receiving portion.

[0459] Clause 47: The module according to Clause 46, wherein: the intermediate structure is connected to the central structure by two leaf springs arranged on opposite sides of the central structure; and the intermediate structure is connected to the outer structure by two leaf springs arranged on opposite sides of the intermediate structure.

[0460] Clause 48: The module according to any one of Clauses 45 to 47 further comprises: a first biasing device arranged to apply a force such that the intermediate structure and / or the central structure is held under compression in a first direction; and a second biasing device arranged to apply a force such that the intermediate structure and / or the central structure is held under compression in a second direction.

[0461] Clause 49: A module according to any one of Clauses 45 to 48 which are subordinate to Clause 41, wherein the external structure of the xy flexural arrangement is fixed to the movable body of the Rz flexural arrangement.

[0462] Clause 50: A module according to any one of Clauses 32 to 49, wherein the first and / or second biasing device is an elastic member, such as a spring.

[0463] Clause 51: A module according to any one of Clauses 1 to 16, wherein the support positioning system comprises one or more linear actuators or actuator arrangements.

[0464] Clause 52: The module as described in Clause 51, wherein each actuator is a piezoelectric actuator arrangement.

[0465] Clause 53: The module as described in Clause 52, wherein each piezoelectric actuator arrangement includes a biaxial shear-mode piezoelectric device.

[0466] Clause 54: A module according to any one of Clauses 51 to 53, wherein the supporting positioning system includes a plurality of actuators.

[0467] Clause 55: The module described in Clause 54, wherein the number of actuators included in the supporting positioning system is three.

[0468] Clause 56: A module pursuant to any one of Clauses 51 to 55, wherein the support positioning system includes a worktable.

[0469] Clause 57: The module described in Clause 56, wherein the worktable is substantially circular in the plan view.

[0470] Clause 58: A module according to any one of Clauses 56 or 57, wherein the actuators are spaced apart at substantially equal angular positions around the midpoint of the stage.

[0471] Clause 59: The module according to Clause 58, wherein the actuators are aligned such that the angle between the longitudinal axes of adjacent actuators is 60 degrees.

[0472] Clause 60: A module according to any one of Clauses 51 to 59, wherein the actuators are configured such that all actuators or actuator arrangements can operate together to rotate the worktable in the plane of the worktable.

[0473] Clause 61: A module according to any one of Clauses 51 to 60, wherein the actuators are configured such that all actuators can operate together to move the worktable in a first direction in the plane of the worktable.

[0474] Clause 62: A module according to any one of Clauses 51 to 61, wherein the actuators are configured such that all actuators can operate together to move the worktable in a second direction in the plane of the worktable, wherein the second direction is orthogonal to the first direction.

[0475] Clause 63: The module according to any one of Clauses 51 to 62 further includes one or more force-applying devices, wherein each force-applying device is arranged to apply a force to press the actuator into the worktable.

[0476] Clause 64: A module according to any one of Clauses 51 to 57, wherein in a plan view, at least one actuator is arranged on the side of the worktable and configured such that linear movement of the actuator causes the worktable to rotate; and wherein for each actuator on the side of the worktable, there is a force-applying device configured to apply a force pressing the actuator into the worktable.

[0477] Clause 65: The module according to Clause 64, wherein two actuators are present on the side of the worktable; and the actuators are located on opposite sides of the worktable.

[0478] Clause 66: The module according to any one of Clauses 64 or 65 further includes first and second linear actuators; wherein: the first linear actuator is arranged to move the second linear actuator in a first direction; and the second linear actuator is arranged to move at least one actuator disposed on the side of the worktable in a second direction orthogonal to the first direction.

[0479] Clause 67: A module for supporting means configured to manipulate the path of charged particles in a charged particle device, the module comprising: a module flange configured to be attached to and detached from a housing flange of the charged particle device housing, such that the module is field-replaceable in the charged particle device.

[0480] Clause 68: The module according to Clause 67, wherein when the module is used in a charged particle device and the module supports a device, the device is configured to manipulate a charged particle path substantially along the charged particle axis of the charged particle device.

[0481] Clause 69: A module as described in Clause 68, wherein the charged particle axis corresponds to the z-axis; and the module is a fundamental planar structure in the xy plane.

[0482] Clause 70: A module according to any one of Clauses 67 to 69, wherein: the module flange includes one or more holes for receiving alignment pins of the housing flange; and / or the module flange includes one or more alignment pins for insertion into the holes of the housing flange.

[0483] Clause 71: A module as described in Clause 70, wherein the module flange includes one or more alignment pins for insertion into the housing flange.

[0484] Clause 72: A module according to any one of Clauses 67 to 71, wherein the module comprises: a device support arrangement for supporting the device; and a mechanism for adjusting the position of the device support arrangement in at least one degree of movement freedom.

[0485] Clause 73: The module according to Clause 72, wherein the device support system allows the position of the device support arrangement to be adjusted in three degrees of freedom of movement; and the three degrees of freedom of movement are preferably the z, Rx and Ry positions of the device support arrangement.

[0486] Clause 74: A module according to any one of Clauses 72 or 73, wherein the mechanism for adjusting the z, Rx, and Ry positions of the device support arrangement comprises one or more adjustable supports, such as adjustable spring bolts, adjustable fasteners, or adjustable pins.

[0487] Clause 75: The module according to Clause 74, wherein the adjustable support is arranged around the device support arrangement.

[0488] Clause 76: A module according to Clause 74 or 75, wherein adjustable supports are spaced at substantially equal angular positions around the midpoint of the device support arrangement.

[0489] Clause 77: A module pursuant to any one of Clauses 74 to 76, wherein there are three adjustable supports.

[0490] Clause 78: A module pursuant to any one of Clauses 74 to 76, wherein the adjustable support is independently adjustable.

[0491] Clause 79: A module according to any one of Clauses 72 to 78, wherein the mechanism for adjusting the z, Rx, and Ry positions of the device support arrangement is configured to operate when the module is outside the charged particle device.

[0492] Clause 80: A module pursuant to any one of Clauses 67 to 79, wherein the module is a module pursuant to any one of Clauses 1 to 66.

[0493] Clause 81: The module according to Clause 80, wherein the device support arrangement includes the support positioning system and support arrangement according to any one of Clauses 1 to 67.

[0494] Clause 82: A charged particle device comprising a field-replaceable module according to any one of Clauses 1 to 81.

[0495] Clause 83: A charged particle device as described in Clause 82, wherein the module includes means configured to manipulate the path of charged particles in the charged particle device.

[0496] Clause 84: The charged particle device according to Clause 83, wherein the charged particle device includes an actuator for a support positioning system for actuating the module; and wherein the actuator is a linear actuator.

[0497] Clause 85: The charged particle device according to Clause 84, wherein each actuator includes an actuator arm configured to engage with a corresponding receiving portion included in the module.

[0498] Clause 86: The charged particle device as described in Clause 85, wherein the end of the actuator arm includes a roller bearing.

[0499] Clause 87: A charged particle device according to any one of Clauses 83 to 86, wherein the apparatus includes a beam manipulator arranged to manipulate sub-beams of a multi-beam array of charged particles.

[0500] Clause 88: A charged particle device according to any one of Clauses 82 to 86, wherein the charged particle device includes a housing flange configured to be attachable to and detachable from a module flange.

[0501] Clause 89: The charged particle device as described in Clause 88, wherein the housing flange includes one or more alignment pins for insertion into corresponding openings in the module flange.

[0502] Clause 90: Charged particle device as described in Clause 88 or 89, wherein the module flange includes one or more alignment pins for insertion into a corresponding opening in the housing flange.

[0503] Clause 91: A charged particle device according to any one of Clauses 83 to 90, wherein the charged particle device further includes a position detection system configured to determine the movement and / or position of the device.

[0504] Clause 92: A charged particle device according to any one of Clauses 83 to 91, wherein the charged particle device further comprises: a charged particle source; and one or more manipulator arrangements configured to manipulate charged particle paths upstream and / or downstream of the beam of the device.

[0505] Clause 93: A charged particle device according to Clause 92, wherein one or more manipulators are configured to adjust the charged particle path, and / or modules are configured to adjust the position of the device such that the charged particle path is aligned with the device.

[0506] Clause 94: A charged particle device according to any one of Clauses 92 or 93, wherein the charged particle system further includes a control system configured to control one or more manipulator arrangements.

[0507] Clause 95: A charged particle device according to any one of Clauses 92 to 94, wherein a first set of manipulator arrangements is provided upstream of the beam of the module; and a second set of manipulator arrangements is provided downstream of the beam of the module.

[0508] Clause 96: A charged particle device pursuant to any of Clauses 92 to 95, wherein one or more of the manipulator arrangements include an electrostatic deflector for deflecting the path of the charged particle.

[0509] Clause 97: A charged particle device pursuant to any of Clauses 92 to 96, wherein one or more manipulator arrangements in the manipulator arrangement include a magnetic lens for deflecting the path of the charged particle.

[0510] Clause 98: A charged particle device according to any one of Clauses 92 to 97, wherein the charged particle device further includes a source moving mechanism for adjusting the position of the source.

[0511] Clause 99: A charged particle device according to any one of Clauses 92 to 98, wherein the charged particle device further includes an objective lens; and the charged particle device further includes a lens moving mechanism for adjusting the position of the objective lens.

[0512] Clause 100: A charged particle device according to Clause 99, wherein at least one of the manipulator arrangements is configured to be controllable in order to manipulate the path of charged particles from the source to align with the device and the objective lens.

[0513] Clause 101: A charged particle device according to any one of Clauses 92 to 100, wherein the charged particle device further comprises: a beam upstream vacuum lock located on the beam upstream side of the module; and a beam downstream vacuum lock located on the beam downstream side of the module.

[0514] Clause 102: The charged particle device according to Clause 101, wherein the upstream vacuum lock and the downstream vacuum lock are operable to isolate the region of the charged particle device including the module from the vacuum conditions in the adjacent region of the charged particle device.

[0515] Clause 103: A charged particle device according to any one of Clauses 92 to 102, wherein the charged particle system further includes source vacuum locking downstream of the source beam.

[0516] Clause 104: A charged particle device according to Clause 103, wherein a source vacuum lock is operable to isolate the region of the charged particle device including the source from the vacuum conditions in an adjacent region of the charged particle device.

[0517] Clause 105: Charged particle device as described in Clause 104, wherein the field-replaceable module includes a source.

[0518] Clause 106: A charged particle device according to any one of Clauses 92 to 105, wherein the charged particle device further includes a secondary lens; and the secondary lens includes a detector configured to detect electrons from the sample.

[0519] Clause 107: The charged particle device according to Clause 106, wherein the secondary tube further includes one or more vacuum locks for isolating the region of the secondary tube including the detector from the vacuum conditions in the adjacent regions(s) of the secondary tube.

[0520] Clause 108: Charged particle device as described in Clause 107, wherein the field-replaceable module includes a detector.

[0521] Clause 109: A method of mounting an electron optical device within a charged particle device, the method comprising: attaching the electron optical device to a module; applying coarse adjustments to the Rx state, Ry state, and / or z position of the electron optical device relative to the body of the module; and securing the module to the charged particle device.

[0522] Clause 110: The method described in accordance with Clause 109, wherein the module is a module pursuant to any one of Clauses 1 to 81; and the charged particle device is a charged particle device pursuant to any one of Clauses 82 to 108.

[0523] Clause 111: A method for aligning an electron optical device with a charged particle beam or multiple beams within a charged particle device, the method comprising: securing a module including the electron optical device to the charged particle device, thereby mounting the electron optical device within the charged particle device; applying multiple fine adjustments to the x-position, y-position, and / or Rz-state of the electron optical device relative to the body of the module; and applying adjustments to the path of the charged particle beam or multiple beams within the charged particle device.

[0524] Clause 112: The method according to Clause 111, wherein before the electron optical device is installed in the charged particle device, the module receiving area of ​​the receiving module in the charged particle device is isolated from the basic vacuum conditions of the adjacent area within the charged particle device by a closed internal vacuum seal, such that the module receiving area can be ventilated and is subject to the environmental conditions outside the charged particle device.

[0525] Clause 113: The method according to Clause 112 further includes: after the module has been fixed to the charged particle device, closing the external vacuum seal for the module receiving area to isolate the module receiving area from the external environmental conditions of the charged particle device; evacuating the module receiving area to bring it to a substantially vacuum state; baking the module; opening the internal vacuum seal; activating the source of the charged particle device to enable the presence of a charged particle beam or multiple beams within the charged particle device.

[0526] Clause 114: The method according to Clauses 111 to 113, wherein the module is a module according to any one of Clauses 1 to 81; and the charged particle device is a charged particle device according to any one of Clauses 82 to 108.

[0527] Clause 115: An electron optics tube configured to project an electron beam onto a sample, the tube comprising: a frame configured to define a reference frame for the tube; a chamber for receiving a field-replaceable module including electron optics devices; a coupling arrangement configured to engage with the field-replaceable module to align the field-replaceable module with the frame; and an active positioning system configured to position the beam and devices relative to each other for fine alignment.

[0528] Clause 116: The electro-optical tube as described in Clause 115, wherein the active positioning system includes an electro-optical element upstream of the beam of the field-replaceable module, which is controllable to manipulate the path of the electron beam, such as a lens or deflecting electron beam path.

[0529] Clause 117: An electro-optical tube as described in Clause 115 or 116, wherein the active positioning system includes an actuator configured to engage with a field-replaceable module and to be controllably movable with a certain degree of freedom relative to the path of the electron beam, the degree of freedom preferably being the degree of freedom of the device in a plane orthogonal to the path of the electron beam, preferably the device being a planar structure in a plane orthogonal to the path of the electron beam.

[0530] Clause 118: An electro-optical tube according to any one of Clauses 115 to 117 further includes a beam-up valve for sealing a chamber upstream of the tube beam and a beam-down valve for sealing the chamber from a portion downstream of the tube beam, preferably such that the chamber is segmented from the remainder of the tube beam.

[0531] Clause 119: An electro-optical tube according to any one of Clauses 115 to 118, wherein a chamber defines an opening in the side of the tube, the opening being configured to receive a field-replaceable module, and the chamber being configured to be sealable with the field-replaceable module.

[0532] Clause 120: A field-replaceable module arranged to be removably inserted into an electro-optical tube, the field-replaceable module comprising: a) an electro-optical element configured to manipulate an electron beam path within the electro-optical tube; b) a support configured to support the electro-optical element; and c) a coupling arrangement configured to align the support with the frame of the electro-optical tube in all degrees of freedom.

[0533] Clause 121: The field-replaceable module according to Clause 120 also includes a support positioning system configured to displace the element relative to the rest of the module so that the element can be positioned relative to the path of the electron beam passing through the lens barrel.

[0534] Clause 122: The field-replaceable module according to Clause 121, wherein the element is a planar structure arranged orthogonally to the path of the charged particle beam, wherein the support positioning system is configured to displace the support in at least one degree of freedom in the plane of the planar structure, preferably on the x-axis, on the y-axis and / or about the z-axis.

[0535] Clause 123: The field-replaceable module according to Clause 121 or 122, wherein the support positioning system is configured to engage with an actuator associated with the frame of the electro-optical tube, the actuator being associated with the degree of freedom of the plane of the planar structure, the support being controllably operable by the actuator to adjust the position of the support relative to the frame.

[0536] Clause 124: Field replaceable module according to any one of Clauses 120 to 123, wherein the engagement arrangement comprises: a flat surface and two interlocking features, each interlocking feature being assigned an axial degree of freedom.

[0537] Clause 125: Field replaceable module according to any one of Clauses 120 to 124, wherein the engagement arrangement is configured to seal the side surface of the lens barrel.

[0538] Clause 126: The field-replaceable module according to any one of Clauses 120 to 125 further includes a pre-calibration system configured to be adjustable to adjust the alignment of the support relative to the frame, preferably in degrees of freedom different from those adjusted by the support positioning system and / or preferably in degrees of freedom outside the plane of the planar structure of the device.

Claims

1. A module for supporting a means configured to manipulate the path of charged particles in a charged particle device, the module comprising: The device is configured to manipulate the path of charged particles in the charged particle device; A support arrangement, the support arrangement being configured to support the device; A support positioning system configured to move the support arrangement within the module, and at least configured to rotate the support arrangement about the charged particle path in order to align the device with the charged particle path; as well as A module flange, configured to be attached to and detached from the housing flange of the charged particle device, such that the module is arranged to be field-replaceable within the charged particle device. The module includes: A mechanism for adjusting the position of the support arrangement of the device in at least one degree of mobility. The mechanism for adjusting the position of the device support arrangement includes one or more adjustable supports and is configured to operate when the module is outside the charged particle device, wherein one or more of the adjustable supports are configured to be located inside the charged particle device when the module is inside the charged particle device.

2. The module of claim 1, wherein the support positioning system is configured to move the support arrangement in at least three degrees of freedom of movement.

3. The module of claim 1, wherein the module further comprises a position detection system configured to determine the movement and / or position of the support arrangement and / or the device held by the support arrangement, wherein the position detection system includes grid markings for determining the movement and / or position of the support arrangement and / or the device held by the support arrangement.

4. The module of claim 1, wherein the module further comprises a receiving portion configured to receive a corresponding end of an actuator arm of a charged particle device, wherein an actuator outside the module includes the actuator arm; and the support positioning system is configured to move via the actuator.

5. The module according to claim 1, wherein the support positioning system comprises: plate; as well as Multiple rotatable objects are configured to support the disk within the module.

6. The module according to claim 1, wherein the support positioning system includes a flexural arrangement.

7. The module of claim 6, wherein the flexural arrangement comprises an xy flexural arrangement and an Rz flexural arrangement for rotational movement about the z-axis, wherein the Rz flexural arrangement and the xy flexural arrangement are arranged in a stacked manner; and the Rz flexural arrangement is downstream of the xy flexural arrangement.

8. The module of claim 1, wherein the support positioning system comprises one or more linear actuators.

9. The module of claim 8, wherein each actuator is a piezoelectric actuator arrangement.

10. The module of claim 9, wherein each piezoelectric actuator arrangement includes a biaxial shear-mode piezoelectric device.

11. The module according to claim 8, wherein the number of linear actuators included in the support positioning system is three.

12. The module of claim 8, wherein the support positioning system includes a worktable, wherein the actuators are configured such that all actuators in the actuators can operate together to move the worktable in a first direction in the plane of the worktable.

13. The module of claim 12, wherein the actuators are configured such that all actuators in the actuators can operate together to move the worktable in a second direction in the plane of the worktable, wherein the second direction is orthogonal to the first direction.

14. The module according to claim 1, wherein the charged particle device includes a source and an objective lens, and the charged particle path in the charged particle device is between the source and the objective lens.

15. A module for supporting a means configured to manipulate the path of charged particles in a charged particle device, the module comprising: A module flange, configured to attach to and detach from the housing flange of the charged particle device, such that the module is field-replaceable within the charged particle device, wherein when the module is used in the charged particle device and the module support device is configured to manipulate the charged particle path along the charged particle axis of the charged particle device, and The charged particle axis corresponds to the z-axis; and the module is a planar structure in the xy-plane. The module includes: Device support for supporting the device; as well as A mechanism for adjusting the position of the device support in at least one degree of movement freedom. The mechanism for adjusting the position of the device support includes one or more adjustable supports and is configured to operate when the module is outside the charged particle device, wherein one or more of the adjustable supports are configured to be located inside the charged particle device when the module is inside the charged particle device.

16. A charged particle device comprising a field-replaceable module according to any one of claims 1 to 15.

17. The charged particle device of claim 16, wherein one or more manipulator arrangements are configured to adjust the charged particle path, and / or the module is configured to adjust the position of the device such that the charged particle path is aligned with the device.

18. The charged particle device according to claim 16 or 17, wherein the charged particle device further comprises: A beam upstream vacuum lock located on the beam upstream side of the module; as well as A downstream vacuum lock is located on the downstream side of the beam of the module.

19. A method for aligning an electron optical device with a charged particle beam or multiple beams within a charged particle device, the method employing the modules described in any one of claims 1 to 15, the method comprising: The module, which includes an electro-optical device, is fixed to the charged particle device in a field-replaceable manner, thereby installing the electro-optical device in the charged particle device. Fine adjustments are applied to the x-position, y-position, and / or Rz-state of the electro-optical device relative to the body of the module, wherein applying fine adjustments to the Rz-state of the electro-optical device includes rotating the electro-optical device around the path of the charged particle; and Adjustments are applied to the paths of the charged particle beams or multiple beams within the charged particle device.

20. A module for supporting a means configured to manipulate the path of charged particles in a charged particle device, the module comprising: A module flange, configured to attach to and detach from the housing flange of the charged particle device, allows the module to be field-replaceable within the charged particle device. Wherein, when the module is used in the charged particle device and the module supports a charged particle optical device, the charged particle optical device is configured to manipulate charged particle paths along the charged particle axis of the charged particle device. The charged particle axis corresponds to the z-axis; and the module is a planar structure in the xy-plane. The module includes: A mechanism for adjusting the position of the support arrangement in at least one degree of mobility. The mechanism for adjusting the position of the support arrangement includes one or more adjustable supports and is configured to operate when the module is outside the charged particle device, wherein one or more of the adjustable supports are configured to be located inside the charged particle device when the module is inside the charged particle device.

21. The module of claim 20, wherein the device support system allows the position of the device support arrangement to be adjusted in three degrees of freedom; and the three degrees of freedom are the z, Rx and Ry positions of the device support arrangement.

22. The module of claim 21, wherein the mechanism for adjusting the z, Rx, and Ry positions of the device support arrangement comprises one or more adjustable supports.

23. The module of claim 22, wherein the adjustable support is arranged around the device support arrangement.

24. The module according to claim 22 or 23, wherein the adjustable supports are spaced at equal angular positions around the midpoint of the device support arrangement.

25. The module according to claim 22, wherein the adjustable support is independently adjustable.

26. The module of claim 20, wherein the mechanism for adjusting the z, Rx, and Ry positions of the device support arrangement is configured to operate when the module is outside the charged particle device.

27. A charged particle device, the charged particle device including a field-replaceable module for supporting means configured to manipulate the path of charged particles in the charged particle device, the module comprising: A module flange, configured to attach to and detach from the housing flange of the charged particle device, allows the module to be field-replaceable within the charged particle device. Wherein, when the module is used in the charged particle device and the module includes and supports a charged particle optical device, the charged particle optical device is configured to manipulate the charged particle path along the charged particle axis of the charged particle device, and The charged particle axis corresponds to the z-axis; and the module is a planar structure in the xy-plane, wherein the module comprises: A device support for supporting the charged particle optical device; and A mechanism for adjusting the position of the device support in at least one degree of movement freedom. The mechanism for adjusting the position of the device support includes one or more adjustable supports and is configured to operate when the module is outside the charged particle device, wherein one or more of the adjustable supports are configured to be located inside the charged particle device when the module is inside the charged particle device.

28. The charged particle device of claim 27, wherein the charged particle device includes an actuator for actuating the support positioning system of the module; and wherein the actuator is a linear actuator.

29. The charged particle device of claim 28, wherein each actuator includes an actuator arm configured to engage with a corresponding receiving portion included in the module.

30. The charged particle device according to any one of claims 27 to 29, wherein the device includes a beam manipulator arranged to manipulate sub-beams of a multi-beam array of charged particles.

31. The charged particle device of claim 30, wherein the housing flange includes one or more alignment pins for insertion into a corresponding opening in the module flange, and / or the module flange includes one or more alignment pins for insertion into a corresponding opening in the housing flange.

32. The charged particle device of claim 27, wherein the charged particle device further comprises a position detection system configured to determine the movement and / or position of the device.

33. The charged particle device of claim 27, wherein the charged particle device further comprises: Charged particle source; And one or more manipulator arrangements configured to manipulate charged particle paths upstream and / or downstream of the beam of the device.

34. The charged particle device of claim 33, wherein the charged particle device further includes an objective lens; and the charged particle device further includes a lens moving mechanism for adjusting the position of the objective lens, wherein at least one of the manipulator arrangements is configured to be controllable to manipulate the path of charged particles from the source to align with the device and the objective lens.

35. The charged particle device according to claim 33 or 34, wherein the charged particle device further comprises: A beam upstream vacuum lock located on the beam upstream side of the module; And a downstream vacuum lock located on the downstream side of the beam of the module.

36. The charged particle device of claim 33, wherein the charged particle device further comprises a secondary lens; and the secondary lens includes a detector configured to detect electrons from the sample, wherein the field-replaceable module includes the detector.

37. A method for aligning an electron optical device with a charged particle beam or multiple beams within a charged particle device as claimed in any one of claims 27 to 36, the method comprising: A module including an electro-optical device is attached to a charged particle device, thereby mounting the electro-optical device in the charged particle device; Fine adjustments are made to the x-position, y-position, and / or Rz-state of the electro-optical device relative to the main body of the module; and The path of the charged particle beam or multiple beams within the charged particle device is adjusted.

38. The method according to claim 37, wherein, Before the electro-optical device is installed in the charged particle device, the module receiving area in the charged particle device for receiving the module is isolated from the vacuum conditions in the adjacent areas within the charged particle device by a closed internal vacuum seal, so that the module receiving area is ventilated and is in the environmental conditions outside the charged particle device.

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