A micro-hole airflow device and etching method for optimizing the flatness of electronic glass etching processes.

Abstract

The present invention relates to the technical field of electronic glass etching, and in particular to a microporous airflow device and an etching method for optimizing the flatness of electronic glass etching processing, comprising an adsorption platform, an upper photoetcher, a lower photoetcher and two microporous airflow mechanisms, a photoetching cavity is provided in the middle of the adsorption platform, the upper photoetcher and the lower photoetcher are coaxially arranged relative to each other, the upper photoetcher and the lower photoetcher are respectively located at the upper and lower sides of the photoetching cavity, and the two microporous airflow mechanisms are distributed on both sides of the photoetcher. The present invention can realize double-sided etching of electronic glass, optimizes the flatness of the photoetching area of ​​the electronic glass during photoetching, improves the photoetching accuracy and quality of the electronic glass, and makes the middle of the adsorption platform hollow, and does not need to be provided with a crossbeam adsorption structure in the middle of the adsorption platform, thereby simplifying the structure of the adsorption platform.

Description

Technical Field

[0001] The invention relates to the technical field of electronic glass etching, and in particular to a microporous airflow device and an etching method for optimizing the flatness of electronic glass etching processing. Background Art

[0002] In the actual product manufacturing process in the 3C manufacturing field, new display industry, semiconductor industry, integrated circuit industry, etc., the application scope of electronic glass is getting wider and wider, such as: capacitive touch screen, flat panel display and other fields. In the actual processing application of electronic glass, the electronic glass is generally placed on the beam frame platform, and then vacuum adsorption is used to adsorb the electronic glass on the beam frame platform. For example, in the double-sided photoetching process of electronic glass, because both sides need to be etched at the same time, the electronic glass can only be suspended and placed on the surface of the beam frame platform. The electronic glass is vacuum adsorbed on the surface of the beam frame platform. During the adsorption process of the electronic glass or the electronic glass itself, micro deformation will occur, and the actual contour of the electronic glass will differ from the ideal flatness by a certain distance. In the photolithography process, the electronic glass produces micro deformation, which affects the flatness accuracy of the electronic glass and reduces the line quality and accuracy of the electronic glass etching.

[0003] The Chinese patent document with application number 201120434750.1 discloses a device for pulse laser etching a conductive film layer on double-sided ITO glass, wherein a set of pulse laser etching devices are arranged on the front and back sides of the film material, each set of pulse laser etching devices comprises a high-frequency short-pulse laser, a semi-transparent and semi-reflective mirror, a Glan prism and a total reflection mirror, an optical gate, a beam expander and a semi-transparent and semi-reflective mirror are arranged in sequence at the output end of the high-frequency short-pulse laser, a first 1 / 2 wave plate and a total reflection mirror are arranged at the output end of the semi-transparent and semi-reflective mirror, a first Glan prism and a first 3D dynamic focusing mirror are arranged in sequence at the output end of the first 1 / 2 wave plate, a first galvanometer is arranged at the output end of the first 3D dynamic focusing mirror, a second 1 / 2 wave plate is arranged at the output end of the total reflection mirror, a second Glan prism and a second 3D dynamic focusing mirror are arranged in sequence at the output end of the second 1 / 2 wave plate, a second galvanometer is arranged at the output end of the second 3D dynamic focusing mirror, and the output ends of the first galvanometer and the second galvanometer are both directly opposite to the surface of the film material. This patent document directly uses two sets of pulse laser etching devices to perform photolithography on the upper and lower sides of the glass respectively, and cannot solve the problem of poor line quality and accuracy of glass photolithography caused by the micro-deformation of the glass when it is clamped by the clamping cylinder.

[0004] Therefore, the defects are very obvious and a solution is urgently needed. Summary of the invention

[0005] In order to solve the above technical problems, the object of the present invention is to provide a microporous airflow device and an etching method for optimizing the flatness of electronic glass etching processing.

[0006] In order to achieve the above object, the present invention adopts the following technical solution:

[0007] A microporous airflow device for optimizing the flatness of electronic glass etching processing comprises an adsorption platform, an upper photoetcher, a lower photoetcher and two microporous airflow mechanisms. A photoetching cavity is opened in the middle of the adsorption platform. The upper photoetcher and the lower photoetcher are coaxially arranged opposite to each other. The upper photoetcher and the lower photoetcher are respectively located on the upper and lower sides of the photoetching cavity. The two microporous airflow mechanisms are distributed on both sides of the upper photoetcher. The adsorption platform is used to suck the edge of the electronic glass tightly. The two microporous airflow mechanisms are used to apply positive pressure micro-airflow to the electronic glass adsorbed by the adsorption platform. The upper photoetcher and the lower photoetcher respectively perform photoetching on the two side surfaces of the electronic glass.

[0008] Furthermore, the microporous airflow mechanism includes a mounting plate, a flatness adjustment module arranged on the mounting plate, an air pressure cavity arranged at the adjustment end of the flatness adjustment module, a microporous body connected to the bottom of the air pressure cavity, and an air supply component connected to the air pressure cavity, the air supply component is connected to the inner cavity of the air pressure cavity, the microporous body is provided with a plurality of micro air flow holes, and the plurality of micro air flow holes are all connected to the inner cavity of the air pressure cavity.

[0009] Furthermore, the air supply assembly includes an air supply pipe and a regulating valve arranged on the air supply pipe, and the air supply pipe is connected to the inner cavity of the air pressure cavity via the regulating valve.

[0010] Furthermore, the air pressure cavity is provided with a joint, the air supply pipe is connected to the joint, and the air supply pipe is communicated with the inner cavity of the air pressure cavity via the joint.

[0011] Furthermore, the inner cavity of the air pressure cavity is connected to a pressure gauge.

[0012] Furthermore, the microporous body is a microporous ceramic block, and the micro air flow pores are micron-sized through holes.

[0013] Furthermore, the flatness adjustment module includes a plurality of tension adjustment bolts and a plurality of thrust adjustment bolts which are respectively threaded through the mounting plate, the plurality of thrust adjustment bolts are evenly distributed on the outside of the plurality of tension adjustment bolts, the bottom ends of the tension adjustment bolts are rotatably connected to the top of the air pressure cavity, and the bottom ends of the thrust adjustment bolts are used to interfere with the top of the air pressure cavity.

[0014] Furthermore, the plurality of tension adjustment bolts are arranged in a straight line and are located in the middle of the air pressure cavity, and the plurality of thrust adjustment bolts are symmetrically distributed on both sides of the plurality of tension adjustment bolts.

[0015] Furthermore, it also includes a connecting plate, and the upper photoetcher, the lower photoetcher and the two microporous airflow mechanisms are all connected to the connecting plate.

[0016] An etching method based on the above-mentioned microporous airflow device comprises the following method steps:

[0017] A. Place the electronic glass on the adsorption platform, which tightly absorbs the edge of the electronic glass, and the photoetched area of ​​the electronic glass is exposed in the photoetched cavity of the adsorption platform;

[0018] B. The upper photoetcher and the lower photoetcher are respectively located at the upper and lower sides of the photoetching area of ​​the electronic glass, and the upper and lower sides of the electronic glass are photoetched by the upper and lower photoetchers respectively. At the same time, two microporous airflow mechanisms are distributed on both sides of the upper photoetcher, and the air pressure of the micro-airflow generated by the microporous airflow mechanism acts on the upper side of the electronic glass to optimize the microscopic deformation of the electronic glass and ensure the flatness of the photoetching area of ​​the electronic glass;

[0019] C. The upper photoetcher, the lower photoetcher and the two microporous airflow mechanisms move synchronously until the photoetching of the electronic glass is completed.

[0020] The beneficial effects of the present invention are as follows: in practical applications, the electronic glass is placed on an adsorption platform, which sucks the edge of the electronic glass tightly, and the portion of the electronic glass to be photoetched is exposed in the photoetching cavity of the adsorption platform. The external gas supply mechanism is connected to the two microporous airflow mechanisms and supplies positive-pressure gas to the two microporous airflow mechanisms. While the upper photoetcher and the lower photoetcher respectively photoetch the upper and lower sides of the electronic glass, the positive-pressure micro-airflows generated by the two microporous airflow mechanisms act on the upper and lower sides of the electronic glass respectively, and the external moving drive mechanism drives the upper photoetcher, the lower photoetcher and the two microporous airflow mechanisms to move synchronously to complete the photoetching of the electronic glass. Due to the micro-deformation of the electronic glass itself or when the adsorption platform adsorbs the edge of the electronic glass, the electronic glass will be micro-deformed. Therefore, two microporous airflow mechanisms are distributed on both sides of the upper photoetcher, which can not only protect the surface of the electronic glass, but also use air pressure to optimize the micro-deformation of the photoetching area of ​​the electronic glass, so as to optimize the micro-deformation of the middle part of the electronic glass, which is conducive to solving the problem of local breakpoints or deformation under conventional etching process conditions, thereby improving the processing flatness of the electronic glass during photoetching. The present invention can realize double-sided etching of the electronic glass, optimize the flatness of the photoetching area of ​​the electronic glass during photoetching, improve the photoetching accuracy and quality of the electronic glass, and make the middle part of the adsorption platform hollow, so that the middle part of the adsorption platform does not need to be provided with a crossbeam adsorption structure, which simplifies the structure of the adsorption platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the present invention.

[0022] Figure 2 It is a schematic diagram of the three-dimensional structure of two microporous airflow mechanisms of the present invention.

[0023] Description of reference numerals:

[0024] 1. Adsorption platform; 2. Upper photoetcher; 3. Lower photoetcher; 4. Microporous airflow mechanism; 5. Photoetching cavity; 6. Mounting plate; 7. Flatness adjustment module; 8. Air pressure cavity; 9. Microporous body; 10. Air supply assembly; 11. Micro airflow hole; 12. Air supply pipe; 13. Regulating valve; 14. Pressure gauge; 15. Tension adjustment bolt; 16. Thrust adjustment bolt; 17. Electronic glass; 18. Connector. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with embodiments and drawings. The contents mentioned in the implementation modes are not intended to limit the present invention.

[0026] like Figure 1 and Figure 2 As shown, the present invention provides a microporous airflow device for optimizing the flatness of etching processing of electronic glass 17, which includes an adsorption platform 1, an upper photoetcher 2, a lower photoetcher 3 and two microporous airflow mechanisms 4. A photoetching cavity 5 is opened in the middle of the adsorption platform 1, the upper photoetcher 2 and the lower photoetcher 3 are coaxially arranged opposite to each other, the upper photoetcher 2 and the lower photoetcher 3 are respectively located on the upper and lower sides of the photoetching cavity 5, the two microporous airflow mechanisms 4 are distributed on both sides of the upper photoetcher 2, the adsorption platform 1 is used to suck the edge of the electronic glass 17, the two microporous airflow mechanisms 4 are used to apply positive pressure micro-airflow to the electronic glass 17 adsorbed by the adsorption platform 1, and the upper photoetcher 2 and the lower photoetcher 3 respectively perform photoetching on the two side surfaces of the electronic glass 17.

[0027] An etching method based on the microporous airflow device for optimizing the flatness of electronic glass etching processing comprises the following method steps:

[0028] A. Place the electronic glass 17 on the adsorption platform 1. The adsorption platform 1 tightly absorbs the edge of the electronic glass 17. The photoetched area of ​​the electronic glass 17 is exposed in the photoetched cavity 5 of the adsorption platform 1.

[0029] B. The upper photoetcher 2 and the lower photoetcher 3 are respectively located at the upper and lower sides of the photoetching area of ​​the electronic glass 17, and the upper and lower sides of the electronic glass 17 are photoetched by the upper photoetcher 2 and the lower photoetcher 3 respectively. At the same time, two microporous airflow mechanisms 4 are distributed on both sides of the upper photoetcher 2, and the air pressure of the micro-airflow generated by the microporous airflow mechanism 4 acts on the upper side of the electronic glass 17 to optimize the microscopic deformation of the electronic glass 17 and ensure the flatness of the photoetching area of ​​the electronic glass 17;

[0030] C. The upper photoetcher 2, the lower photoetcher 3 and the two microporous airflow mechanisms 4 move synchronously until the photoetching of the electronic glass 17 is completed.

[0031] In actual application, the electronic glass 17 is placed on the adsorption platform 1, and the adsorption platform 1 sucks the edge of the electronic glass 17 tightly. The part of the electronic glass 17 to be photoetched (photoetching area) is exposed in the photoetching cavity 5 of the adsorption platform 1. The external gas supply mechanism is connected to the two microporous airflow mechanisms 4 and supplies positive pressure gas to the two microporous airflow mechanisms 4. While the upper photoetcher 2 and the lower photoetcher 3 respectively photoetch the upper and lower sides of the electronic glass 17, the positive pressure micro-airflows generated by the two microporous airflow mechanisms 4 act on the upper and lower sides of the electronic glass 17 respectively. The external moving drive mechanism drives the upper photoetcher 2, the lower photoetcher 3 and the two microporous airflow mechanisms 4 to move synchronously to complete the photoetching of the electronic glass 17. Since the electronic glass 17 itself generates micro deformation or the electronic glass 17 undergoes micro deformation when the adsorption platform 1 adsorbs the edge of the electronic glass 17, the two microporous airflow mechanisms 4 are distributed on both sides of the upper photoetcher 2, which can not only protect the surface of the electronic glass 17, but also optimize the micro deformation of the photoetching area of ​​the electronic glass 17 by using air pressure, so as to optimize the micro deformation of the middle part of the electronic glass 17, which is conducive to solving the problem of local breakpoints or deformation under conventional etching process conditions, thereby improving the processing flatness of the electronic glass 17 during photoetching. The present invention can realize double-sided etching of the electronic glass 17, optimize the flatness of the photoetching area of ​​the electronic glass 17 during photoetching, improve the precision and quality of the photoetching circuit of the electronic glass 17, and make the middle part of the adsorption platform 1 hollow, so that the middle part of the adsorption platform 1 does not need to be provided with a crossbeam adsorption structure, thereby simplifying the structure of the adsorption platform 1.

[0032] Specifically, both the upper photoetcher 2 and the lower photoetcher 3 can be laser etchers.

[0033] In this embodiment, the microporous airflow mechanism 4 includes a mounting plate 6, a flatness adjustment module 7 arranged on the mounting plate 6, an air pressure cavity 8 arranged at the adjustment end of the flatness adjustment module 7, a microporous body 9 connected to the bottom of the air pressure cavity 8, and an air supply component 10 connected to the air pressure cavity 8, the air supply component 10 is connected to the inner cavity of the air pressure cavity 8, the microporous body 9 is provided with a plurality of micro air flow holes 11, and the plurality of micro air flow holes 11 are all connected to the inner cavity of the air pressure cavity 8.

[0034] In actual application, the external gas supply mechanism supplies positive pressure gas to the air pressure cavity 8 via the gas supply component 10, and the positive pressure gas in the air pressure cavity 8 forms multiple micro-airflows via the multiple micro-airflow holes 11 of the microporous body 9, so that the micro-air pressure of the multiple micro-airflows acts on the upper side of the electronic glass 17 to improve the microscopic deformation of the middle part of the electronic glass 17, improve the flatness of the electronic glass 17 in photolithography, and thus improve the accuracy and quality of the photolithography of the electronic glass 17. In addition, the flatness of the air pressure cavity 8 and the microporous body 9 relative to the electronic glass 17 is adjusted by the flatness adjustment module 7 to adjust the relative flatness of the lower surface of the microporous body 9 and the upper side of the electronic glass 17, so that the lower surface of the microporous body 9 is parallel or nearly parallel to the upper side of the electronic glass 17, so that the micro-air pressure acts vertically or nearly vertically on the electronic glass 17, thereby improving the quality of the micro-air pressure to optimize the microscopic deformation of the electronic glass 17, and the flatness of the microporous body 9 is adjustable and controllable, and it is flexible and variable to use.

[0035] In this embodiment, the gas supply assembly 10 includes a gas supply pipe 12 and a regulating valve 13 disposed on the gas supply pipe 12. The gas supply pipe 12 is connected to the inner cavity of the air pressure cavity 8 via the regulating valve 13; the regulating valve 13 is a precision proportional valve. In actual applications, an external gas supply mechanism introduces positive pressure gas into the gas supply pipe 12. When the regulating valve 13 is in an open state, the positive pressure gas is introduced into the air pressure cavity 8 via the gas supply pipe 12; in this process, the regulating valve 13 can not only control the on and off of the positive pressure gas, but also adjust the pressure of the intake air to meet the requirements of the micro pressure of different electronic glasses 17 or products; the positive pressure gas is supplied to the microporous body 9 through the air pressure cavity 8, which can maintain uniform and stable pressure and stable airflow.

[0036] In this embodiment, the air pressure cavity 8 is equipped with a joint 18, the air supply pipe 12 is connected to the joint 18, and the air supply pipe 12 is connected to the inner cavity of the air pressure cavity 8 via the joint 18. This structural design facilitates the connection between the air supply pipe 12 and the joint 18, and is convenient for disassembly, assembly and maintenance.

[0037] In this embodiment, the inner cavity of the air pressure cavity 8 is connected to a pressure gauge 14; the precise pressure gauge 14 is installed in the air pressure cavity 8. In practical applications, the pressure gauge 14 is used to detect the air pressure value of the air pressure cavity 8, to ensure that the air pressure in the air pressure cavity 8 is maintained at a constant air pressure value, and to facilitate the adjustment of the air pressure in the air pressure cavity 8.

[0038] In this embodiment, the microporous body 9 is a microporous ceramic block, and the micro air flow pores 11 are micron-sized through holes. Specifically, the microporous ceramic block is mainly formed by sintering ceramic powder. After sintering, micron-sized through holes with different spacings and different pore sizes are formed on the microporous ceramic block, and the surface is ground to ensure precision-grade plane accuracy. Preferably, special ceramic powder can be used as the ceramic powder.

[0039] In this embodiment, the flatness adjustment module 7 includes a plurality of tension adjustment bolts 15 and a plurality of thrust adjustment bolts 16 respectively threaded through the mounting plate 6, the plurality of thrust adjustment bolts 16 are evenly distributed on the outside of the plurality of tension adjustment bolts 15, the bottom ends of the tension adjustment bolts 15 are rotatably connected to the top of the air pressure cavity 8, and the bottom ends of the thrust adjustment bolts 16 are used to contact the top of the air pressure cavity 8. Specifically, the plurality of tension adjustment bolts 15 are arranged in a straight line and located in the middle of the air pressure cavity 8, and the plurality of thrust adjustment bolts 16 are symmetrically distributed on both sides of the plurality of tension adjustment bolts 15.

[0040] In actual application, multiple tension adjustment bolts 15 are turned so that the multiple tension adjustment bolts 15 pull the middle part of the air pressure cavity 8 outward. At the same time, multiple thrust adjustment bolts 16 are turned so that the ends of the multiple thrust adjustment bolts 16 abut against the periphery of the air pressure cavity 8 to fine-tune the flatness of the air pressure cavity 8, thereby fine-tuning the flatness of the microporous body 9.

[0041] In this embodiment, a connecting plate is also included, and the upper photoetcher 2, the lower photoetcher 3 and the two microporous airflow mechanisms 4 are all connected to the connecting plate. This structural design facilitates the external moving drive mechanism to drive the connecting plate to move synchronously with the upper photoetcher 2, the lower photoetcher 3 and the two microporous airflow mechanisms 4, and the synchronous movement has good stability.

[0042] In this embodiment, a plurality of adsorption holes are provided on the edge of the adsorption platform 1; in practical applications, the electronic glass 17 is placed on the adsorption platform 1, and the plurality of adsorption holes adsorb the edge of the electronic glass 17 onto the adsorption platform 1, thereby improving the stability and position accuracy of the electronic glass 17 during photolithography.

[0043] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention may also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the protection scope of the present invention.

Claims

1. A microporous airflow device for optimizing the flatness of electronic glass etching processing, characterized in that: The invention comprises an adsorption platform (1), an upper photoetcher (2), a lower photoetcher (3) and two microporous airflow mechanisms (4); a photoetching cavity (5) is provided in the middle of the adsorption platform (1); the upper photoetcher (2) and the lower photoetcher (3) are coaxially arranged opposite to each other; the upper photoetcher (2) and the lower photoetcher (3) are respectively located on the upper and lower sides of the photoetching cavity (5); the two microporous airflow mechanisms (4) are distributed on both sides of the upper photoetcher (2); the adsorption platform (1) is used to firmly adsorb the edge of the electronic glass (17); the two microporous airflow mechanisms (4) are used to apply positive pressure micro-airflow to the electronic glass (17) adsorbed by the adsorption platform (1); the upper photoetcher (2 ) and the lower photoetcher (3) respectively perform photoetching on the two sides of the electronic glass (17); the microporous airflow mechanism (4) comprises a mounting plate (6), a flatness adjustment module (7) arranged on the mounting plate (6), an air pressure cavity (8) arranged at the adjustment end of the flatness adjustment module (7), a microporous body (9) connected to the bottom of the air pressure cavity (8), and an air supply component (10) connected to the air pressure cavity (8), the air supply component (10) is connected to the inner cavity of the air pressure cavity (8), the microporous body (9) is provided with a plurality of micro airflow holes (11), and the plurality of micro airflow holes (11) are all connected to the inner cavity of the air pressure cavity (8); the upper photoetcher (2) adopts a laser etcher.

2. A microporous airflow device for optimizing the flatness of electronic glass etching processing according to claim 1, characterized in that: The air supply assembly (10) comprises an air supply pipe (12) and a regulating valve (13) arranged on the air supply pipe (12); the air supply pipe (12) is connected to the inner cavity of the air pressure cavity (8) via the regulating valve (13).

3. The microporous airflow device for optimizing the flatness of electronic glass etching processing according to claim 2, characterized in that: The air pressure cavity (8) is provided with a joint (18), the air supply pipe (12) is connected to the joint (18), and the air supply pipe (12) is communicated with the inner cavity of the air pressure cavity (8) via the joint (18).

4. The microporous airflow device for optimizing the flatness of electronic glass etching processing according to claim 1, characterized in that: The inner cavity of the air pressure cavity (8) is connected to a pressure gauge (14).

5. The microporous airflow device for optimizing the flatness of electronic glass etching processing according to claim 1, characterized in that: The microporous body (9) is a microporous ceramic block, and the micro air flow holes (11) are micron-sized through holes.

6. The microporous airflow device for optimizing the flatness of electronic glass etching processing according to claim 1, characterized in that: The flatness adjustment module (7) comprises a plurality of tension adjustment bolts (15) and a plurality of thrust adjustment bolts (16) which are respectively threadedly penetrated through the mounting plate (6); the plurality of thrust adjustment bolts (16) are evenly distributed on the outer sides of the plurality of tension adjustment bolts (15); the bottom ends of the tension adjustment bolts (15) are rotatably connected to the top of the air pressure cavity (8); and the bottom ends of the thrust adjustment bolts (16) are used to contact the top of the air pressure cavity (8).

7. The microporous airflow device for optimizing the flatness of electronic glass etching processing according to claim 6, characterized in that: The plurality of tension adjustment bolts (15) are arranged in a straight line and are located in the middle of the air pressure cavity (8), and the plurality of thrust adjustment bolts (16) are symmetrically distributed on both sides of the plurality of tension adjustment bolts (15).

8. A microporous airflow device for optimizing the flatness of electronic glass etching processing according to any one of claims 1 to 7, characterized in that: It also comprises a connecting plate, to which the upper photoetcher (2), the lower photoetcher (3) and the two microporous airflow mechanisms (4) are all connected.

9. An etching method for the microporous gas flow device according to any one of claims 1 to 8, characterized in that: The method comprises the following steps: A. placing the electronic glass (17) on the adsorption platform (1), the adsorption platform (1) adsorbing the edge of the electronic glass (17) tightly, and the photoetched area of ​​the electronic glass (17) is exposed in the photoetched cavity (5) of the adsorption platform (1); B. The upper photoetcher (2) and the lower photoetcher (3) are respectively located on the upper and lower sides of the photoetching area of ​​the electronic glass (17), and the upper and lower sides of the electronic glass (17) are photoetched by the upper photoetcher (2) and the lower photoetcher (3). At the same time, two microporous airflow mechanisms (4) are distributed on both sides of the upper photoetcher (2), and the air pressure of the micro-airflow generated by the microporous airflow mechanism (4) acts on the upper side of the electronic glass (17) to optimize the microscopic deformation of the electronic glass (17) and ensure the flatness of the photoetching area of ​​the electronic glass (17); C. The upper photoetcher (2), the lower photoetcher (3) and the two microporous airflow mechanisms (4) move synchronously until the photoetching of the electronic glass (17) is completed.

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