Active element substrate
By designing a dual-gate structure in a thin-film transistor, increasing the semiconductor structure thickness of the first active element and reducing the thickness of the second active element, the reliability and current deficiency problems of thin-film transistors during long-term operation are solved, and the reliability and current are improved.
Patent Information
- Application Number
- CN202211602600.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2022-07-27
- Filing Date
- 2022-12-13
- Publication Date
- 2026-07-24
- Estimated Expiration
- 2042-12-13
AI Technical Summary
Existing thin-film transistors (TFTs) suffer from reliability issues and insufficient turn-on current when on for extended periods. In particular, switching TFTs are prone to reliability problems during brief on-time operation, while the turn-on current of driving TFTs is insufficient.
By designing a dual-gate structure in a thin-film transistor, the semiconductor structure thickness of the first active element is increased to improve the turn-on current, while the semiconductor structure thickness of the second active element is reduced to improve leakage current. Different connection methods are used to improve reliability.
This improves the long-term turn-on reliability of thin-film transistors (TFTs) while increasing the turn-on current, thus addressing the short-term reliability issues of switching TFTs and the insufficient current for driving TFTs.