A rapid transfer device for silicon wafer after etching and a method of using the same

Abstract

The application relates to a silicon wafer fast transfer device after etching and a use method thereof. The device comprises an etching tank and a water tank located at one side of the etching tank. A power driving mechanism is arranged between the etching tank and the water tank. The power driving mechanism comprises a power output mechanism and a turnover swing box. The power output mechanism is drivingly connected with the turnover swing box through a transmission mechanism. The bottom of the turnover swing box is provided with a silicon wafer to be transferred. The power output mechanism drives the turnover movement of the silicon wafer to be transferred at the bottom of the turnover swing box through the transmission mechanism, and the silicon wafer to be transferred is transferred from the etching tank to the water tank. The device has the advantages of reasonable structure design, reliable and stable operation, etc. The silicon wafer can be fast transferred between tank bodies, the transfer time is within a specified range, and the silicon wafer can be cleaned in all directions.

Description

Technical Field

[0001] This invention relates to the field of semiconductor silicon wafer acid etching technology, and in particular to a rapid transfer device for silicon wafers after etching and its usage method. Background Technology

[0002] In traditional silicon wafer acid etching and cleaning processes, after acid etching, the silicon wafers need to be transferred to a cleaning tank for cleaning within a very short time. If the transfer time exceeds the specified limit, the surface of the silicon wafer will oxidize, resulting in economic losses. This invention is proposed based on the above research background, aiming to provide a rapid transfer device for silicon wafers after etching and its usage method to ensure a stable and reliable transfer process. Summary of the Invention

[0003] In view of the above-mentioned shortcomings of the silicon wafer acid etching cleaning process, the purpose of this invention is to provide a rapid transfer device for silicon wafers after etching and its usage method. It has the advantages of reasonable structural design and reliable and stable operation. It can realize the extremely rapid transfer of silicon wafers between tanks, so that the transfer time is within the specified range, and can perform all-round cleaning of silicon wafers.

[0004] To achieve the above objectives, the present invention employs the following technical solution:

[0005] A rapid transfer device for silicon wafers after etching includes an etching tank and a water tank located on one side of the etching tank. A power drive mechanism is provided between the etching tank and the water tank. The power drive mechanism includes a power output mechanism and a tilting swing box. The power output mechanism is driven to the tilting swing box via a transmission mechanism. The silicon wafer to be transferred is placed at the bottom of the tilting swing box. The power output mechanism drives the silicon wafer to be transferred at the bottom of the tilting swing box to tilt and transfer it from the etching tank to the water tank via the transmission mechanism.

[0006] As a further optimization of the above solution, the power output mechanism includes a mounting base, a drive motor fixedly mounted on the mounting base, a drive gear located on the output shaft of the drive motor, and a driven gear meshing with the drive gear. The driven gear is rotatably mounted on the mounting base through a rotating shaft, one end of which is connected to the driven gear and the other end is connected to the transmission mechanism.

[0007] As a further optimization of the above solution, the transmission mechanism includes a swing arm, and the flipping swing box includes an inverted "U"-shaped flipping swing frame. At least one side arm of the left and right arms of the flipping swing frame is provided with a sliding plate. One end of the swing arm is splinedly connected to the rotating shaft, and the other end is hingedly connected to the sliding plate. When the swing arm rotates, it can drive the flipping swing frame to make a circular motion around the rotating shaft.

[0008] As a further optimization of the above solution, a silicon wafer placement etching cage is provided at the slot of the flipping swing frame.

[0009] As a further optimization of the above scheme, the number of power output mechanisms is two, and they are symmetrically arranged between the corrosion tank and the water tank.

[0010] As a further optimization of the above solution, a limiting arm is also provided on the top of the sliding plate to limit the movement stroke of the sliding plate.

[0011] As a further optimization of the above solution, a guide pin is provided at the hinge of the sliding plate and the swing arm, and the limiting arm includes a limiting frame body, with limiting guide wheels that roll and cooperate with the guide pin on the left and right sides of the limiting frame body.

[0012] As a further optimization of the above scheme, the swing range of the swing arm is 0-180°.

[0013] As a further optimization of the above solution, the device also includes an automatic control system. The automatic control system includes a programmable controller (PLC), a sensor assembly connected to the PLC via data signals, and a power output drive circuit connected to the PLC. The power output drive circuit is connected to the drive motor. The sensor assembly includes a current sensor mounted on the output shaft of the drive motor for real-time detection of the drive motor current, and an angle sensor mounted on the swing arm's rotation shaft for real-time detection of the swing arm's rotation angle. The current sensor and angle sensor send the real-time detected data values ​​to the PLC. The PLC compares the received data values ​​with preset threshold values ​​and controls the on / off state of the power output drive circuit based on the comparison result. When the real-time current value is equal to or higher than the preset current threshold, the power output drive circuit is controlled to be in an open circuit state; otherwise, it is controlled to be in a closed circuit state. Similarly, when the real-time angle value is equal to or greater than the preset angle threshold, the power output drive circuit is controlled to be in an open circuit state; otherwise, it is controlled to be in a closed circuit state.

[0014] As a further optimization of the above solution, the automatic control system also includes a wireless communication module connected to the programmable controller, and the wireless communication module is also connected to a remote intelligent terminal or monitoring center.

[0015] The method of using the rapid transfer device for silicon wafer etching of the present invention includes the following steps:

[0016] 1) Silicon wafer etching: The silicon wafer to be transported is first placed in the silicon wafer placement etching cage, and the silicon wafer placement etching cage is flipped into the etching tank by controlling the power output mechanism for etching;

[0017] 2) After corrosion is completed, the power output mechanism drives the drive gear to rotate, which in turn drives the driven gear to rotate, causing the connected tilting swing box to move. The limit arm limits the tilting swing box to rotate half a circle according to the set route until it enters the water tank to immerse and clean the silicon wafer in all directions.

[0018] The rapid transfer device for silicon wafers after etching and its method of use according to the present invention have the following beneficial effects:

[0019] The structure is rationally designed. The driven gear is connected to the output shaft inside the tilting swing box, transmitting the rotational force from the driving gear to the tilting swing box. The tilting swing box is embedded in the limiting arm, and the sliding plate is lined in the groove on the limiting guide wheel, ensuring that the tilting swing box does not deviate left, right, or forward and backward when sliding up and down within the limiting arm. The tilting swing box performs circumferential displacement around the driven gear, while the drive motor provides rotational power to the etching cage for placing the silicon wafer, causing the silicon wafer to rotate. This allows for simultaneous rotation, up and down movement, and horizontal movement of the silicon wafer, ensuring uniform etching. The transfer route is precise, fast, and controllable, enabling extremely fast transfer of silicon wafers between tanks within a specified time, and allowing for comprehensive immersion cleaning of the silicon wafers. Attached Figure Description

[0020] Appendix Figure 1 This is a first-view structural schematic diagram of the rapid transfer device for silicon wafer etching according to the present invention.

[0021] Appendix Figure 2 This is a second-view structural schematic diagram of the rapid transfer device for silicon wafer etching according to the present invention.

[0022] Appendix Figure 3 This is a schematic diagram of the working motion structure of the rapid transfer device for silicon wafer etching according to the present invention.

[0023] Appendix Figure 4 This is a schematic diagram of the structure of the tilting and swinging box of the rapid transfer device for silicon wafer etching according to the present invention.

[0024] Appendix Figure 5 This is a schematic diagram of the limiting arm of the rapid transfer device for silicon wafer etching according to the present invention.

[0025] The meanings of the various reference numerals in the above figures are as follows:

[0026] 1. Drive motor; 2. Drive gear; 3. Driven gear; 4. Tilting swing box; 5. Limiting arm; 6. Silicon wafer; 7. Etching tank; 8. Water tank; 4-1. Silicon wafer placement etching cage; 4-2. Sliding plate; 4-3. Tilting swing frame; 5-1. Limiting frame body; 5-2. Limiting guide wheel. Detailed Implementation

[0027] The following is in conjunction with the appendix Figure 1-5 The present invention provides a detailed description of the rapid transfer device for silicon wafers after etching and its usage method.

[0028] A rapid transfer device for etched silicon wafers includes an etching tank 7 and a water tank 8 located on one side of the etching tank. A power drive mechanism is provided between the etching tank and the water tank. The power drive mechanism includes a power output mechanism 1 and a tilting swing box 4. The power output mechanism is driven by the tilting swing box via a transmission mechanism. A silicon wafer 6 to be transferred is placed at the bottom of the tilting swing box. The power output mechanism drives the silicon wafer to be transferred at the bottom of the tilting swing box to tilt, transferring the silicon wafer from the etching tank to the water tank. The power output mechanism includes a mounting base, a drive motor 1 fixedly mounted on the mounting base, a drive gear 2 located on the output shaft of the drive motor, and a driven gear 3 meshing with the drive gear. The driven gear is rotatably mounted on the mounting base via a rotating shaft. One end of the rotating shaft is connected to the driven gear, and the other end is connected to the transmission mechanism. The transmission mechanism includes a swing arm, and the tilting swing box includes an inverted U-shaped tilting swing frame 4-3. At least one side arm of the tilting swing frame is equipped with a sliding plate 4-2. One end of the swing arm is splined to a rotating shaft, and the other end is hinged to the sliding plate, enabling the tilting swing frame to rotate around the rotating shaft when the swing arm rotates. A silicon wafer etching cage 4-1 is provided at the slot of the tilting swing frame. Two power output mechanisms are symmetrically arranged between the etching tank and the water tank. A limiting arm 5 is also provided on the top of the sliding plate to limit its travel. A guide pin is provided at the hinge between the sliding plate and the swing arm. The limiting arm includes a limiting frame body 5-1, and limiting guide wheels 5-2 are provided on the left and right sides of the limiting frame body, which roll in cooperation with the guide pin. The swing range of the swing arm is 0-180°. The device also includes an automatic control system, which comprises a programmable controller (PLC), a sensor assembly connected to the PLC via data signals, and a power output drive circuit connected to the PLC. The power output drive circuit is connected to a drive motor. The sensor assembly includes a current sensor mounted on the output shaft of the drive motor for real-time detection of the drive motor current and an angle sensor mounted on the rotating shaft of the swing arm for real-time detection of the swing arm rotation angle. The current sensor and angle sensor send the real-time detected data values ​​to the PLC. The PLC compares the received data values ​​with preset threshold values ​​and controls the on / off state of the power output drive circuit based on the comparison result. When the real-time current value is equal to or higher than the preset current threshold, the power output drive circuit is controlled to be in an open circuit state; otherwise, it is controlled to be in a closed circuit state. Similarly, when the real-time angle value is equal to or greater than the preset angle threshold, the power output drive circuit is controlled to be in an open circuit state; otherwise, it is controlled to be in a closed circuit state.The automatic control system also includes a wireless communication module connected to the programmable controller, and the wireless communication module is also connected to a remote intelligent terminal or monitoring center.

[0029] The method of using the rapid transfer device for silicon wafer etching of the present invention includes the following steps:

[0030] 1) Silicon wafer etching: The silicon wafer 6 to be transferred is first placed in the silicon wafer placement etching cage 4-1. The silicon wafer placement etching cage 4-1 is flipped into the etching tank 7 by controlling the power output mechanism for etching.

[0031] 2) After the corrosion is completed, the power output mechanism 1 drives the drive gear 2 to rotate, which in turn drives the driven gear 3 to rotate, and drives the connected tilting swing box 4 to move. The limit arm 5 limits the tilting swing box 4 to rotate half a circle according to the set route until it enters the water tank to immerse and clean the silicon wafer in all directions.

[0032] The above description of the embodiments is provided to enable those skilled in the art to understand and apply the present invention. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present invention is not limited to the embodiments described herein, and any improvements and modifications made by those skilled in the art based on the disclosure of the present invention without departing from the scope of the invention should be within the protection scope of the present invention.

Claims

1. A rapid transfer device for silicon wafers after etching, characterized in that: The device includes an etching tank (7) and a water tank (8) located on one side of the etching tank; a power drive mechanism is provided between the etching tank and the water tank, the power drive mechanism including a power output mechanism (1) and a tilting swing box (4), the power output mechanism being driven to the tilting swing box via a transmission mechanism; a silicon wafer (6) to be transferred is provided at the bottom of the tilting swing box, the power output mechanism driving the silicon wafer to be transferred at the bottom of the tilting swing box to tilt via the transmission mechanism, transferring the silicon wafer to be transferred from the etching tank to the water tank; the power output mechanism includes a mounting base, a drive motor (1) fixedly mounted on the mounting base, a drive gear (2) located on the output shaft of the drive motor, and a driven gear (3) meshing with the drive gear, the driven gear being rotatably mounted on the mounting base via a rotating shaft, one end of the rotating shaft being connected to the driven gear, and the other end being connected to the transmission mechanism; the transmission mechanism includes The swing arm, the flipping swing box includes an inverted "U"-shaped flipping swing frame (4-3), at least one side arm of the left and right arms of the flipping swing frame is provided with a sliding plate (4-2), one end of the swing arm is splined to the rotating shaft, and the other end is hinged to the sliding plate, and can drive the flipping swing frame to make a circular motion around the rotating shaft when the swing arm rotates; a silicon wafer placement etching cage (4-1) is provided at the slot of the flipping swing frame; there are two power output mechanisms, which are symmetrically arranged between the etching tank and the water tank; the top of the sliding plate is also provided with a limiting arm (5) for limiting the movement stroke of the sliding plate; a guide pin is provided at the hinge of the sliding plate and the swing arm, the limiting arm includes a limiting frame body (5-1), and limiting guide wheels (5-2) that roll with the guide pin are provided on the left and right sides of the limiting frame body; the swing range of the swing arm is 0-180°.

2. The rapid transfer device for silicon wafers after etching according to claim 1, characterized in that: The device also includes an automatic control system, which comprises a programmable controller (PLC), a sensor assembly connected to the PLC via data signals, and a power output drive circuit connected to the PLC. The power output drive circuit is connected to a drive motor. The sensor assembly includes a current sensor mounted on the output shaft of the drive motor for real-time detection of the drive motor current and an angle sensor mounted on the rotating shaft of the swing arm for real-time detection of the swing arm rotation angle. The current sensor and angle sensor send the real-time detected data values ​​to the PLC. The PLC compares the received data values ​​with preset threshold values ​​and controls the on / off state of the power output drive circuit based on the comparison result. When the real-time current value is equal to or higher than the preset current threshold, the power output drive circuit is controlled to be in an open circuit state; otherwise, it is controlled to be in a closed circuit state. Similarly, when the real-time angle value is equal to or greater than the preset angle threshold, the power output drive circuit is controlled to be in an open circuit state; otherwise, it is controlled to be in a closed circuit state.

3. The rapid transfer device for silicon wafers after etching according to claim 2, characterized in that: The automatic control system also includes a wireless communication module connected to the programmable controller, and the wireless communication module is also connected to a remote intelligent terminal or monitoring center.

4. A method of using a rapid transfer device for silicon wafer etching according to any one of claims 1-3, characterized in that, The usage method includes the following steps: 1) Silicon wafer etching: The silicon wafer (6) to be transferred is first placed in the silicon wafer placement etching cage (4-1), and the silicon wafer placement etching cage (4-1) is flipped into the etching tank (7) by controlling the power output mechanism for etching; 2) After the corrosion is completed, the power output mechanism (1) drives the active gear (2) to rotate, which in turn drives the driven gear (3) to rotate, and drives the connected tilting swing box (4) to move. The limiting arm (5) limits the tilting swing box (4) to rotate half a circle according to the specified route until it enters the water tank to immerse and clean the silicon wafer in all directions.

Images