Semiconductor power module, motor controller, and vehicle
CN116130447BActive Publication Date: 2026-10-16BYD SEMICON CO LTD
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Patent Information
- Application Number
- CN202111342964.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-11-12
- Publication Date
- 2026-10-16
- Estimated Expiration
- 2041-11-12
AI Technical Summary
Technical Problem
但在逆变过程中,回路的杂散电感在半导体芯片开关期间产生电压过大,由于阻尼振荡而产生电磁干扰,会增大开关损耗,同时若要输出大电流则需多颗芯片并联,但该方式使得芯片所占据的位置偏大,电感随之也会增大
Benefits of technology
[0032] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
✦ Generated by Eureka AI based on patent content.
Abstract
The application discloses a semiconductor power module, a motor controller and a vehicle, and relates to the technical field of semiconductor power modules.The semiconductor power module comprises a substrate, a first conductive area, a second conductive area, a third conductive area and a fourth conductive area arranged on the substrate, the first conductive area and the second conductive area extend along a first direction of the substrate and are arranged along a second direction of the substrate, the third conductive area and the fourth conductive area are located between the first conductive area and the second conductive area and are arranged along the first direction, wherein the first conductive area, the second conductive area and the third conductive area are used for accessing direct-current signals, and the fourth conductive area is used for outputting alternating-current signals; a first power chip, a second power chip and a third power chip are arranged on the substrate.The semiconductor power module can reduce the inductance of the module and improve the heat dissipation of the module.
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