A secondary circuit detection method and device, electronic equipment and storage medium

By acquiring physical and schematic images of the secondary circuits and using image recognition technology to construct and reconstruct the secondary circuit structure diagram, the problems of low efficiency and low accuracy in detecting key secondary circuits in substations are solved, achieving automated detection and saving labor costs.

CN116152217BActive Publication Date: 2026-07-07GUANGDONG POWER GRID CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
GUANGDONG POWER GRID CO LTD
Filing Date
2023-03-02
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

In existing technologies, the problems of incorrect wiring and missing circuits in critical secondary circuits of substations require manual inspection and verification, resulting in low detection efficiency and low accuracy, and wasting human and material resources.

Method used

By acquiring the physical and schematic images of the secondary circuit, using image recognition technology to extract the identifiers of the reference components, constructing a reconstructed secondary circuit structure diagram, and performing detection, the verification of the secondary circuit is automatically completed.

Benefits of technology

It improves the efficiency and accuracy of secondary circuit testing, saves labor costs, and achieves highly efficient automated testing.

✦ Generated by Eureka AI based on patent content.

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Abstract

Embodiments of the present application disclose a secondary circuit detection method, device, electronic equipment and storage medium. The secondary circuit detection method comprises: obtaining a secondary wiring entity image and a secondary wiring principle image of a secondary circuit to be detected; performing image recognition on the secondary wiring entity image to obtain a secondary wiring entity recognition image, and performing image recognition on the secondary wiring principle image to obtain a secondary wiring principle recognition image; determining a reference identifier of a reference component in the secondary circuit to be detected according to the secondary wiring entity recognition image, and determining a standard connection component matched with the reference identifier; constructing a reconstructed secondary circuit structure diagram matched with the secondary circuit to be detected according to the reference component and the standard connection component; and detecting the reconstructed secondary circuit structure diagram according to the secondary wiring principle image to obtain a detection result of the secondary circuit to be detected. The technical scheme of the embodiments of the present application improves the detection efficiency and accuracy of the secondary circuit.
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Description

Technical Field

[0001] The present invention relates to the field of circuit testing technology, and in particular to a method, apparatus, electronic device and storage medium for secondary circuit testing. Background Technology

[0002] Relay protection is a crucial measure in power systems to accurately issue alarm and trip signals, directly isolating and clearing faults when abnormalities or faults occur. Critical secondary circuits in substations are vital links connecting different relay protection devices and between relay protection devices and primary equipment. Currently, existing technologies still require manual inspection and verification to address issues such as incorrect wiring and missing circuits in critical secondary circuits.

[0003] In the process of realizing this invention, the inventors discovered that the existing technology of manually inspecting and verifying key secondary circuits wastes a lot of manpower and resources, and the accuracy and efficiency of the inspection are also not high. Summary of the Invention

[0004] This invention provides a method, apparatus, electronic device, and storage medium for detecting secondary circuits, which can improve the detection efficiency and accuracy of secondary circuits.

[0005] According to one aspect of the present invention, a method for detecting secondary loops is provided, comprising:

[0006] Obtain the physical image of the secondary wiring and the schematic image of the secondary wiring of the secondary circuit to be tested;

[0007] Image recognition is performed on the secondary wiring entity image to obtain a secondary wiring entity recognition image, and image recognition is performed on the secondary wiring principle image to obtain a secondary wiring principle recognition image;

[0008] The reference identifier of the reference component in the secondary circuit to be detected is determined based on the secondary wiring entity recognition image, and the standard connection component matching the reference identifier is determined.

[0009] Construct a reconstructed secondary loop structure diagram of the secondary loop to be detected based on the reference component and the standard connection component;

[0010] The reconstructed secondary circuit structure diagram is detected based on the secondary wiring principle image to obtain the detection result of the secondary circuit to be detected.

[0011] According to another aspect of the present invention, a secondary circuit detection device is provided, comprising:

[0012] The secondary circuit image acquisition module is used to acquire the physical image of the secondary wiring and the image of the secondary wiring principle of the secondary circuit to be detected.

[0013] The secondary circuit image recognition module is used to perform image recognition on the secondary wiring entity image to obtain a secondary wiring entity recognition image, and to perform image recognition on the secondary wiring principle image to obtain a secondary wiring principle recognition image.

[0014] The standard connection component determination module is used to determine the reference identifier of the reference component in the secondary circuit to be detected based on the secondary wiring entity recognition image, and to determine the standard connection component that matches the reference identifier.

[0015] A reconstructed secondary loop structure diagram construction module is used to construct a reconstructed secondary loop structure diagram matching the secondary loop to be detected based on the reference component and the standard connection component.

[0016] The detection result acquisition module is used to detect the reconstructed secondary circuit structure diagram based on the secondary wiring principle image, and obtain the detection result of the secondary circuit to be detected.

[0017] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0018] At least one processor; and

[0019] A memory communicatively connected to the at least one processor; wherein,

[0020] The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform the secondary loop detection method according to any embodiment of the present invention.

[0021] According to another aspect of the present invention, a computer-readable storage medium is provided, the computer-readable storage medium storing computer instructions for causing a processor to execute and implement the secondary loop detection method according to any embodiment of the present invention.

[0022] The technical solution of this invention involves acquiring a physical image of the secondary wiring and a schematic image of the secondary wiring of the secondary circuit to be tested. Image recognition is performed on the physical image to obtain a secondary wiring entity recognition image. Image recognition is also performed on the schematic image to obtain a secondary wiring principle recognition image. Based on the secondary wiring entity recognition image, a reference identifier for a reference component in the secondary circuit to be tested is determined, and a standard connection component matching the reference identifier is identified. A reconstructed secondary circuit structure diagram matching the secondary circuit to be tested is constructed based on the reference component and the standard connection component. Finally, the reconstructed secondary circuit structure diagram is tested based on the schematic image of the secondary wiring to obtain the test result of the secondary circuit to be tested. This solution solves the problem of a lack of efficient verification methods for secondary circuits, saves labor costs, and improves the efficiency and accuracy of secondary circuit testing.

[0023] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a flowchart of a secondary loop detection method provided in Embodiment 1 of the present invention;

[0026] Figure 2 This is a flowchart of another secondary loop detection method provided in Embodiment 2 of the present invention;

[0027] Figure 3 This is a schematic diagram of a secondary wiring entity image provided in Embodiment 2 of the present invention;

[0028] Figure 4 This is a schematic diagram of a secondary wiring principle provided in Embodiment 2 of the present invention;

[0029] Figure 5 This is a schematic diagram of a reconstructed secondary loop structure provided in Embodiment 2 of the present invention;

[0030] Figure 6 This is a structural diagram of a secondary loop detection system provided in Embodiment 2 of the present invention;

[0031] Figure 7 This is a schematic diagram of a secondary circuit detection device provided in Embodiment 3 of the present invention;

[0032] Figure 8 This is a schematic diagram of the structure of an electronic device provided in Embodiment 4 of the present invention. Detailed Implementation

[0033] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0034] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0035] Example 1

[0036] Figure 1 This is a flowchart of a secondary circuit detection method provided in Embodiment 1 of the present invention. This embodiment is applicable to situations requiring efficient and accurate detection of secondary circuits in substations. The method can be executed by a secondary circuit detection device, which can be implemented in software and / or hardware, and is generally integrated into an electronic device. This electronic device can be a terminal device or a server device; the present invention does not limit the specific type of electronic device. Correspondingly, as... Figure 1 As shown, the method includes the following operations:

[0037] S110. Obtain the physical image of the secondary wiring and the principle image of the secondary wiring of the secondary circuit to be tested.

[0038] The secondary circuit under test can be an electrical circuit formed by interconnecting secondary equipment to detect, control, regulate, and protect sequentially used equipment. This mainly includes tripping within the current compartment, tripping of other compartments, and startup failure. The physical image of the secondary wiring can be obtained by capturing images of the wiring configuration within the substation protection cabinet using photographic equipment. The schematic image of the secondary wiring can be a circuit diagram provided by the secondary circuit manufacturer.

[0039] In this embodiment of the invention, a photographic device can be used to capture images of the wiring configuration of the secondary circuit to be tested in a substation protection panel, obtaining a physical image of the secondary wiring. The secondary wiring principle image can be drawn by the secondary circuit manufacturer and acquired via document file reception.

[0040] S120. Perform image recognition on the secondary wiring entity image to obtain a secondary wiring entity recognition image, and perform image recognition on the secondary wiring principle image to obtain a secondary wiring principle recognition image.

[0041] The secondary wiring entity recognition image can be obtained by processing the secondary wiring entity image using an image recognition algorithm. The secondary wiring principle recognition image can also be obtained by processing the secondary wiring principle image using an image recognition algorithm.

[0042] In this embodiment of the invention, the secondary wiring entity identification image is processed by an image recognition algorithm to extract the manufacturer's internal wiring wire number set, external cable wire number set, and protection cabinet name information from the secondary wiring entity identification image. Then, a secondary wiring entity identification image is generated from the manufacturer's internal wiring wire number set, external cable wire number set, and protection cabinet name information from the secondary wiring entity identification image. Similarly, the secondary wiring principle identification image is processed by an image recognition algorithm to extract the manufacturer's internal wiring wire number set and trip entry point information from the secondary wiring principle identification image. Then, a secondary wiring principle identification image is generated from the manufacturer's internal wiring wire number set and trip entry point information from the secondary wiring principle identification image.

[0043] S130. Determine the reference identifier of the reference component in the secondary circuit to be detected based on the secondary wiring entity recognition image, and determine the standard connection component that matches the reference identifier.

[0044] The reference component can be either an internal wiring number sleeve in the secondary circuit or an external cable number sleeve. The reference identifier can be an identifier that uniquely identifies the wiring number sleeve in the secondary circuit. The standard connection component can be a component used to indicate the connection of the wiring terminal to the internal wiring.

[0045] In this embodiment of the invention, the reference identifier of the reference component in the secondary circuit to be detected is obtained from the secondary wiring entity recognition image obtained by the above steps. It is easy to understand that the reference identifier can uniquely identify a reference component, and the standard connection component that matches the reference identifier can be uniquely identified based on the reference identifier of the reference component.

[0046] S140. Construct a reconstructed secondary loop structure diagram of the secondary loop to be detected based on the reference component and the standard connection component.

[0047] Among them, the reconstructed secondary loop structure diagram can be a relational image used to represent the connection relationship between the reference component and the standard connection component.

[0048] In this embodiment of the invention, by obtaining the reference component, standard connection component, and mapping relationship between the reference component and the standard connection component in the image based on the above steps, a reconstructed secondary circuit structure diagram matching the secondary circuit to be detected can be obtained. The reconstructed secondary circuit structure diagram may include, but is not limited to, information on internal wiring numbers and external cable numbers from the manufacturer.

[0049] S150. The reconstructed secondary circuit structure diagram is detected based on the secondary wiring principle image to obtain the detection result of the secondary circuit to be detected.

[0050] In this embodiment of the invention, after obtaining the reconstructed secondary circuit structure diagram, it can be used as the structure diagram of the secondary circuit to be tested. The reconstructed secondary circuit structure diagram is then tested based on the secondary wiring principle image, for example, to determine whether the connections between various circuit components in the reconstructed secondary circuit structure diagram are correct, thereby obtaining the test result of the secondary circuit to be tested. Simultaneously, the reconstructed secondary circuit structure diagram is printed so that it can be pasted inside the protective enclosure for display.

[0051] The technical solution of this invention involves acquiring a physical image of the secondary wiring and a schematic image of the secondary wiring of the secondary circuit to be tested. Image recognition is performed on the physical image to obtain a secondary wiring entity recognition image. Image recognition is also performed on the schematic image to obtain a secondary wiring principle recognition image. Based on the secondary wiring entity recognition image, a reference identifier for a reference component in the secondary circuit to be tested is determined, and a standard connection component matching the reference identifier is identified. A reconstructed secondary circuit structure diagram matching the secondary circuit to be tested is constructed based on the reference component and the standard connection component. Finally, the reconstructed secondary circuit structure diagram is tested based on the schematic image of the secondary wiring to obtain the test result of the secondary circuit to be tested. This solution solves the problem of a lack of efficient verification methods for secondary circuits, saves labor costs, and improves the efficiency and accuracy of secondary circuit testing.

[0052] Example 2

[0053] Figure 2 This is a flowchart of another secondary loop detection method provided in Embodiment 2 of the present invention. The embodiments of the present invention are based on the above embodiments and are further specified. In this embodiment, a specific optional implementation method is given for detecting the reconstructed secondary loop structure diagram to obtain the detection result of the secondary loop to be detected.

[0054] Correspondingly, such as Figure 2 As shown, the method in this embodiment may include:

[0055] S210. Obtain the physical image of the secondary wiring and the principle image of the secondary wiring of the secondary circuit to be tested.

[0056] S220. Perform image recognition on the secondary wiring entity image to obtain a secondary wiring entity recognition image, and perform image recognition on the secondary wiring principle image to obtain a secondary wiring principle recognition image.

[0057] Figure 3 This is a schematic diagram of a secondary wiring entity provided in Embodiment 2 of the present invention. Figure 3 As shown, the secondary wiring entity image may include the manufacturer's internal wiring number sleeve, external cable number sleeve, and substation protection panel cabinet name information.

[0058] Figure 4 This is a schematic diagram of a secondary wiring principle provided in Embodiment 2 of the present invention. Figure 4 As shown, the secondary wiring diagram may include information such as substation protection cabinet information, manufacturer's internal wiring number information, and different tripping input functions.

[0059] In this embodiment of the invention, a photographic device can be used to capture images of the wiring configuration of the secondary circuits to be tested in a substation protection cabinet, obtaining a physical image of the secondary wiring. The secondary wiring principle image can be acquired via document file transfer. Further, the secondary wiring entity recognition image is processed by an image recognition algorithm to extract the manufacturer's internal wiring wire number set, external cable wire number set, and protection cabinet name information. Then, a secondary wiring entity recognition image is generated from the manufacturer's internal wiring wire number set, external cable wire number set, and protection cabinet name information. The secondary wiring principle recognition image is also processed by an image recognition algorithm to extract the manufacturer's internal wiring wire number set and trip entry point information. Then, a secondary wiring principle recognition image is generated from the manufacturer's internal wiring wire number set and trip entry point information.

[0060] S230. Determine the reference identifier of the reference component in the secondary circuit to be detected based on the secondary wiring entity recognition image, and determine the standard connection component that matches the reference identifier.

[0061] In this embodiment of the invention, the reference component may include a reference outer wire number sleeve, and the reference identifier may include a reference outer wire number sleeve identifier; determining the standard connection component that matches the reference identifier may include: obtaining a preset mapping table between the outer wire number sleeve identifier and the outer wire number sleeve connection component; matching the reference outer wire number sleeve identifier with the preset mapping table to determine the standard connection component that matches the reference outer wire number sleeve identifier based on the matching result; wherein, the standard connection component includes a first standard connection component and a second standard connection component.

[0062] The reference external wire number sleeve can be a wire number sleeve wound on the external cable in the substation protection cabinet. The reference external wire number sleeve identifier can be an identifier that uniquely identifies one reference external wire number sleeve. The preset mapping relationship table can be a diagram used to show the association between the reference external wire number sleeve and the external wire number sleeve connection components. The first standard connection component can be a relay protection component connected to the reference external wiring. The second standard connection component can be another relay protection component connected to the reference external wiring.

[0063] In this embodiment of the invention, firstly, the mapping relationship between the external wire number sleeve identifier and the external wire number sleeve connection component is obtained according to the external wire number sleeve identifier and the external wire number sleeve connection component. Then, a preset mapping relationship table is obtained according to the external wire number sleeve identifier, the external wire number sleeve connection component, and the mapping relationship between the external wire number sleeve identifier and the external wire number sleeve connection component. The reference external wire number sleeve identifier is matched with the preset mapping relationship table. Based on the matching result, the first standard connection component and the second standard connection component connected to the left and right ends of the reference external line where the reference external wire number sleeve identifier is located are determined.

[0064] S240. Construct a reconstructed secondary loop structure diagram of the secondary loop to be detected based on the reference component and the standard connection component.

[0065] In this embodiment of the invention, constructing the reconstructed secondary loop structure diagram of the secondary loop to be detected based on the reference component and the standard connection component may include: determining a first connection relationship between the first standard connection component and the reference outer wire number sleeve, and a second connection relationship between the second standard connection component and the reference outer wire number sleeve; connecting the reference outer wire number sleeve and the first standard connection component based on the first connection relationship, and connecting the reference outer wire number sleeve and the second standard connection component based on the second connection relationship to obtain the reconstructed secondary loop structure diagram.

[0066] In this embodiment of the invention, the above steps determine a first standard connection component that matches the identifier of the reference outer wire number sleeve, then determine a first connection relationship between the first standard connection component and the reference outer wire number sleeve, and connect the reference outer wire number sleeve and the first standard connection component based on the first connection relationship. Next, a second standard connection component that matches the identifier of the reference outer wire number sleeve is determined, then a second connection relationship between the second standard connection component and the reference outer wire number sleeve is determined, and connect the reference outer wire number sleeve and the second standard connection component based on the second connection relationship, finally obtaining the reconstructed secondary loop structure diagram of the reference outer wire number sleeve.

[0067] Figure 5 This is a schematic diagram of a reconstructed secondary loop structure provided in Embodiment 2 of the present invention. In a specific example, such as... Figure 5 As shown, the above steps determine that the first standard connection component matching the reference external wire number sleeve identifier "EMB-103 / 133R" is "1LP5-1". Then, the first connection relationship between the first standard connection component and the reference external wire number sleeve is determined, and the reference external wire number sleeve "EMB-103 / 133R" and the first standard connection component "1LP5-1" are connected based on this first connection relationship. Next, the second standard connection component matching the reference external wire number sleeve identifier "EMB-103 / 133R" is determined, and the second connection relationship between the second standard connection component and the reference external wire number sleeve is determined, and the reference external wire number sleeve "EMB-103 / 133R" and the second standard connection component "4n38" are connected based on this second connection relationship. The above steps determine that the first standard connection component matching the reference external wire number sleeve identifier "EMB-103 / 101" is "1n1417". Then, the first connection relationship between the first standard connection component and the reference external wire number sleeve is determined, and the reference external wire number sleeve "EMB-103 / 101" and the first standard connection component "1n1417" are connected based on this first connection relationship. Next, the second standard connection component matching the reference external wire number sleeve identifier "EMB-103 / 101" is determined, and the second connection relationship between the second standard connection component and the reference external wire number sleeve is determined. The reference external wire number sleeve "EMB-103 / 101" and the second standard connection component "4n1" are connected based on this second connection relationship, finally yielding the reconstructed secondary loop structure diagram of the reference external wire number sleeve.

[0068] S250. The reconstructed secondary circuit structure diagram is detected based on the secondary wiring principle image to obtain the detection result of the secondary circuit to be detected.

[0069] In an optional embodiment of the present invention, the step of detecting the reconstructed secondary circuit structure diagram based on the secondary wiring principle image may include: determining the mapping relationship to be detected between the trip entry point, internal wiring and external cable in the reconstructed secondary circuit structure diagram; determining the reference mapping relationship between the trip entry point, internal wiring and external cable in the secondary wiring principle image; and determining that the reconstructed secondary circuit structure diagram passes the preliminary detection if the mapping relationship to be detected matches the reference mapping relationship.

[0070] In this embodiment of the invention, the one-to-one mapping relationship between the trip entry point, internal wiring, and external cable in the reconstructed secondary circuit structure diagram is determined based on the reconstructed secondary circuit structure diagram and used as the mapping relationship to be tested. The one-to-one mapping relationship between the trip entry point, internal wiring, and external cable in the secondary wiring principle image is determined based on the secondary wiring principle image and used as the reference mapping relationship. The mapping relationship to be tested is matched with the reference mapping. If the matching fails, it is determined that the reconstructed secondary circuit structure diagram has failed the preliminary test; if the matching is successful, it is determined that the reconstructed secondary circuit structure diagram has passed the preliminary test.

[0071] In an optional embodiment of the present invention, after determining that the reconstructed secondary circuit structure diagram has passed the preliminary test, the method may further include: acquiring the protection configuration data of the secondary circuit to be tested; matching the target secondary circuit standard database from each secondary circuit standard database according to the protection configuration data of the secondary circuit to be tested; acquiring the circuit structure data of each standard secondary circuit and the standard security association configuration data of each standard secondary circuit; reorganizing the protection configuration information of the circuit structure of the standard secondary circuit according to the standard security association configuration data to obtain the secondary circuit standard database. The method further includes acquiring the secondary circuit network diagram stored in the target secondary circuit standard database; wherein the secondary circuit network diagram includes standard protection configuration data; and matching the protection configuration data to be tested with the secondary circuit network diagram to detect the security compliance of the reconstructed secondary circuit structure diagram.

[0072] The data includes: **Protection Configuration Data to be Tested:** Attribute information for the safety configuration of the secondary circuit under test. **Secondary Circuit Standard Database:** A collection of secondary circuit network diagrams conforming to substation protection configurations. **Target Secondary Circuit Standard Database:** A collection of secondary circuit network diagrams with the same circuit structure as the secondary circuit under test. **Secondary Circuit Network Diagram:** A secondary circuit structure diagram conforming to substation protection configurations. **Standard Safety Association Configuration Data:** Attribute information for the safety configuration of secondary circuit network diagrams in the standard database. **Protection Configuration Information:** Configuration information representing the safety of secondary circuits, including but not limited to relay protection anti-accident measures, secondary wiring standard requirements, primary wiring methods of different substations, and protection configurations.

[0073] In this embodiment of the invention, firstly, the protection configuration data of the secondary circuit to be tested is obtained. Then, the protection configuration data of the secondary circuit to be tested is used to match the target secondary circuit standard database in the secondary circuit standard database to obtain the circuit structure data and standard safety association configuration data of each standard secondary circuit. Next, the protection configuration information of the circuit structure of the standard secondary circuits is reconstructed according to the standard safety association configuration data to obtain the secondary circuit standard database. Further, the secondary circuit network diagram stored in the target secondary circuit standard database is obtained; the protection configuration data to be tested is matched with the secondary circuit network diagram. If the match is successful, the reconstructed secondary circuit structure diagram complies with safety compliance; if the match fails, the reconstructed secondary circuit structure diagram does not comply with safety compliance.

[0074] S260. If it is determined that there is an abnormal result in the detection result of the secondary circuit to be tested, an abnormal alarm shall be triggered; wherein, the abnormal result includes abnormality of the standard connection component and / or abnormality of circuit missing component.

[0075] Among these, a standard connection component malfunction can occur when only one end of the connection component is properly connected. A loop defect malfunction can occur when a loop fails to close properly.

[0076] In this embodiment of the invention, it is determined whether the detection result of the secondary circuit to be tested is abnormal. If it is determined that it is not abnormal, the connection of the secondary circuit to be tested is normal. If it is determined that it is abnormal, an abnormal alarm is triggered. The abnormal alarm includes, but is not limited to, issuing an abnormal error correction alarm signal or illuminating a red light, so as to serve as a warning.

[0077] Figure 6 This is a structural diagram of a secondary loop detection system provided in Embodiment 2 of the present invention. Figure 6As shown, the system first imports the physical image of the secondary circuit's secondary wiring using the image import and extraction module, and then imports the image of the secondary circuit's secondary wiring principle using the drawing import and extraction module. A key data comparison module is then used for comparison. After the key data comparison is completed, a standard database management module is used for matching. For mismatched secondary circuits, an anomaly correction and alarm module is used to issue an anomaly alarm. Alternatively, based on the user-selected single maintenance relay protection device, the system can automatically identify the key terminals of the operating equipment and activate the maintenance status early warning function, illuminating a red light to serve as a warning. Finally, the reconstructed secondary circuit structure diagram is exported using the data result export module.

[0078] The technical solution of this invention involves acquiring a physical image of the secondary wiring and a schematic image of the secondary wiring of the secondary circuit to be tested. Image recognition is performed on the physical image to obtain a secondary wiring entity recognition image. Image recognition is also performed on the schematic image to obtain a secondary wiring principle recognition image. Based on the secondary wiring entity recognition image, a reference identifier for a reference component in the secondary circuit to be tested is determined, and a standard connection component matching the reference identifier is identified. A reconstructed secondary circuit structure diagram matching the secondary circuit to be tested is constructed based on the reference component and the standard connection component. Finally, the reconstructed secondary circuit structure diagram is tested based on the schematic image to obtain the test result of the secondary circuit to be tested. If an abnormal result is found in the test result of the secondary circuit to be tested, an abnormal alarm is triggered. By matching the schematic image of the secondary wiring with the reconstructed secondary circuit structure diagram, efficient verification of the secondary circuit is achieved, saving labor costs and improving the efficiency and accuracy of secondary circuit testing.

[0079] Example 3

[0080] Figure 7 This is a schematic diagram of a secondary circuit detection device provided in Embodiment 3 of the present invention, as shown below. Figure 7 As shown, the device includes: a secondary loop image acquisition module 310, a secondary loop image recognition module 320, a standard connection component determination module 330, a reconstructed secondary loop structure diagram construction module 340, and a detection result acquisition module 350, wherein:

[0081] The secondary circuit image acquisition module 310 is used to acquire the physical image of the secondary wiring and the principle image of the secondary wiring of the secondary circuit to be tested.

[0082] The secondary circuit image recognition module 320 is used to: perform image recognition on the secondary wiring entity image to obtain a secondary wiring entity recognition image, and perform image recognition on the secondary wiring principle image to obtain a secondary wiring principle recognition image.

[0083] The standard connection component determination module 330 is used to: determine the reference identifier of the reference component in the secondary circuit to be detected based on the secondary wiring entity recognition image, and determine the standard connection component that matches the reference identifier.

[0084] The reconstructed secondary loop structure diagram construction module 340 is used to: construct a reconstructed secondary loop structure diagram matching the secondary loop to be detected based on the reference component and the standard connection component.

[0085] The detection result acquisition module 350 is used to: detect the reconstructed secondary circuit structure diagram based on the secondary wiring principle image, and obtain the detection result of the secondary circuit to be detected.

[0086] The technical solution of this invention involves acquiring a physical image of the secondary wiring and a schematic image of the secondary wiring of the secondary circuit to be tested. Image recognition is performed on the physical image to obtain a secondary wiring entity recognition image. Image recognition is also performed on the schematic image to obtain a secondary wiring principle recognition image. Based on the secondary wiring entity recognition image, a reference identifier for a reference component in the secondary circuit to be tested is determined, and a standard connection component matching the reference identifier is identified. A reconstructed secondary circuit structure diagram matching the secondary circuit to be tested is constructed based on the reference component and the standard connection component. Finally, the reconstructed secondary circuit structure diagram is tested based on the schematic image of the secondary wiring to obtain the test result of the secondary circuit to be tested. This solution solves the problem of a lack of efficient verification methods for secondary circuits, saves labor costs, and improves the efficiency and accuracy of secondary circuit testing.

[0087] Optionally, the reference component includes a reference outer wire number sleeve, and the reference identifier includes a reference outer wire number sleeve identifier; the standard connection component determination module 330 is specifically used for: obtaining a preset mapping relationship table between the outer wire number sleeve identifier and the outer wire number sleeve connection component; matching the reference outer wire number sleeve identifier with the preset mapping relationship table, so as to determine the standard connection component matching the reference outer wire number sleeve identifier according to the matching result; wherein, the standard connection component includes a first standard connection component and a second standard connection component.

[0088] Optionally, the reconstructed secondary loop structure diagram construction module 340 is specifically used to: determine the first connection relationship between the first standard connection component and the reference external wire number sleeve, and the second connection relationship between the second standard connection component and the reference external wire number sleeve; connect the reference external wire number sleeve and the first standard connection component based on the first connection relationship, and connect the reference external wire number sleeve and the second standard connection component based on the second connection relationship to obtain the reconstructed secondary loop structure diagram.

[0089] Optionally, the detection result acquisition module 350 is specifically used to: determine the mapping relationship to be detected between the trip entry point, internal wiring and external cable in the reconstructed secondary circuit structure diagram; determine the reference mapping relationship between the trip entry point, internal wiring and external cable in the secondary wiring principle diagram; and determine that the reconstructed secondary circuit structure diagram passes the preliminary detection if the mapping relationship to be detected matches the reference mapping relationship.

[0090] Optionally, the detection result acquisition module 350 is specifically used for: acquiring the protection configuration data of the secondary circuit to be tested; matching the target secondary circuit standard database from each secondary circuit standard database according to the protection configuration data of the secondary circuit to be tested; acquiring the secondary circuit network diagram stored in the target secondary circuit standard database; wherein the secondary circuit network diagram includes standard protection configuration data; and matching the protection configuration data to be tested with the secondary circuit network diagram to detect the safety compliance of the reconstructed secondary circuit structure diagram.

[0091] Optionally, the detection result acquisition module 350 is specifically used to: acquire the loop structure data of each standard secondary circuit and the standard safety association configuration data of each standard secondary circuit; and reorganize the protection configuration information of the loop structure of the standard secondary circuit according to the standard safety association configuration data to obtain the secondary circuit standard database.

[0092] Optionally, the secondary circuit detection device further includes an anomaly warning module, specifically used to: issue an anomaly alarm when it is determined that there is an abnormal result in the detection result of the secondary circuit to be tested; wherein the abnormal result includes the abnormality of the standard connection component and / or the abnormality of the circuit missing.

[0093] The above-described secondary circuit detection device can execute the secondary circuit detection method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the method. Technical details not described in detail in this embodiment can be found in the secondary circuit detection method provided in any embodiment of the present invention.

[0094] Example 4

[0095] Figure 8A schematic diagram of an electronic device 10 that can be used to implement embodiments of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0096] like Figure 8 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded from storage unit 18 into the RAM 13. The RAM 13 may also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0097] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0098] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as the secondary loop detection method.

[0099] In some embodiments, the secondary loop detection method may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or installed on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the secondary loop detection method described above may be performed. Alternatively, in other embodiments, processor 11 may be configured to perform the secondary loop detection method by any other suitable means (e.g., by means of firmware).

[0100] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0101] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0102] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0103] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0104] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or computing systems that include middleware components (e.g., application servers), or computing systems that include frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0105] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through a communication network. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

Claims

1. A secondary circuit detection method characterized by, include: Obtain the physical image of the secondary wiring and the schematic image of the secondary wiring of the secondary circuit to be tested; Image recognition is performed on the secondary wiring entity image to obtain a secondary wiring entity recognition image, and image recognition is performed on the secondary wiring principle image to obtain a secondary wiring principle recognition image; The reference identifier of the reference component in the secondary circuit to be detected is determined based on the secondary wiring entity recognition image, and the standard connection component matching the reference identifier is determined. Construct a reconstructed secondary loop structure diagram of the secondary loop to be detected based on the reference component and the standard connection component; The reconstructed secondary circuit structure diagram is detected based on the secondary wiring principle image to obtain the detection result of the secondary circuit to be detected, including: determining the mapping relationship to be detected between the trip entry point, internal wiring and external cable in the reconstructed secondary circuit structure diagram; Determine the reference mapping relationship between the trip entry point, internal wiring and external cable in the secondary wiring principle diagram; if the mapping relationship to be detected matches the reference mapping relationship, determine that the reconstructed secondary circuit structure diagram passes the preliminary test.

2. The method of claim 1, wherein, The reference component includes a reference outer wire number sleeve, and the reference identifier includes a reference outer wire number sleeve identifier; The standard connection component for determining the benchmark identifier match includes: Obtain the preset mapping table between the external wire sleeve identifier and the external wire sleeve connection component; The reference outer wire number set identifier is matched with the preset mapping relationship table to determine the standard connection component that matches the reference outer wire number set identifier based on the matching result; The standard connection components include a first standard connection component and a second standard connection component.

3. The method according to claim 2, characterized in that, The step of constructing the reconstructed secondary loop structure diagram for matching the secondary loop to be detected based on the reference component and the standard connection component includes: Determine the first connection relationship between the first standard connection component and the reference outer wire sleeve, and the second connection relationship between the second standard connection component and the reference outer wire sleeve; The reference external wire number sleeve and the first standard connection component are connected based on the first connection relationship, and the reference external wire number sleeve and the second standard connection component are connected based on the second connection relationship to obtain the reconstructed secondary loop structure diagram.

4. The method according to claim 1, characterized in that, After determining that the reconstructed secondary loop structure diagram has passed the preliminary test, the method further includes: Obtain the protection configuration data of the secondary circuit to be tested; The target secondary circuit standard database is matched from each secondary circuit standard database based on the protection configuration data of the secondary circuit to be tested. Obtain the secondary circuit network diagram stored in the target secondary circuit standard database; wherein, the secondary circuit network diagram includes standard protection configuration data; The protection configuration data to be tested is matched with the secondary loop network diagram to detect the security compliance of the reconstructed secondary loop structure diagram.

5. The method according to claim 4, characterized in that, Before obtaining the secondary circuit network diagram stored in the secondary circuit standard database, the following steps are also included: Obtain the loop structure data of each standard secondary loop and the standard safety association configuration data of each standard secondary loop; The protection configuration information of the loop structure of the standard secondary circuit is reorganized based on the standard safety association configuration data to obtain the standard database of the secondary circuit.

6. The method according to claim 1, characterized in that, After detecting the reconstructed secondary circuit structure diagram based on the secondary wiring principle image to obtain the detection result of the secondary circuit to be detected, the method further includes: If an abnormal result is found in the detection result of the secondary circuit to be tested, an abnormal alarm will be triggered; The abnormal results include abnormalities in the standard connection components and / or loop defects.

7. A secondary circuit detection device, characterized in that, include: The secondary circuit image acquisition module is used to acquire the physical image of the secondary wiring and the image of the secondary wiring principle of the secondary circuit to be detected. The secondary circuit image recognition module is used to perform image recognition on the secondary wiring entity image to obtain a secondary wiring entity recognition image, and to perform image recognition on the secondary wiring principle image to obtain a secondary wiring principle recognition image. The standard connection component determination module is used to determine the reference identifier of the reference component in the secondary circuit to be detected based on the secondary wiring entity recognition image, and to determine the standard connection component that matches the reference identifier. A reconstructed secondary loop structure diagram construction module is used to construct a reconstructed secondary loop structure diagram matching the secondary loop to be detected based on the reference component and the standard connection component. The detection result acquisition module is used to detect the reconstructed secondary circuit structure diagram based on the secondary wiring principle image, and obtain the detection result of the secondary circuit to be detected, including: determining the mapping relationship to be detected between the trip entry point, internal wiring and external cable in the reconstructed secondary circuit structure diagram; Determine the reference mapping relationship between the trip entry point, internal wiring and external cable in the secondary wiring principle diagram; if the mapping relationship to be detected matches the reference mapping relationship, determine that the reconstructed secondary circuit structure diagram passes the preliminary test.

8. An electronic device, characterized in that, The electronic device includes: At least one processor; and A memory communicatively connected to the at least one processor; wherein, The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the secondary loop detection method according to any one of claims 1-6.

9. A computer storage medium, characterized in that, The computer storage medium stores computer instructions, which are used to cause the processor to execute the secondary loop detection method according to any one of claims 1-6.