Electronic thermometer probe assembly module, device and process thereof

Abstract

The application discloses an electronic thermometer probe assembly module, equipment and a process thereof. The electronic thermometer probe assembly module comprises a female plate, the female plate is provided with a plurality of sieve holes, and a stand column is arranged in the sieve hole; a daughter plate is provided with a plurality of insertion holes, and the insertion hole is in one-to-one correspondence with the sieve hole when the daughter plate is inverted and covered on the female plate. The electronic thermometer probe assembly equipment comprises a material frame, the material frame is provided with a vibration motor to drive the material frame to vibrate; the above-mentioned electronic thermometer probe assembly module; a dispensing machine, the dispensing machine comprises a host, a workbench and a gas pressure mechanism; the dispensing head of the host is a needle cylinder, the needle cylinder is provided with a needle head; the gas pressure mechanism is used for supplying gas to the needle cylinder to make the needle cylinder dispense glue under the action of the gas pressure; and the workbench is used for placing the daughter plate. The electronic thermometer probe assembly process comprises the following steps: material placing, material aligning, dispensing and assembling. The application has the advantages of improving the assembly efficiency and quality.

Description

Technical Field

[0001] This application relates to the field of electronic thermometer manufacturing technology, specifically to an electronic thermometer probe assembly module, equipment, and process. Background Technology

[0002] An electronic thermometer consists of a probe, a temperature sensor, an LCD display, a button battery, a dedicated integrated circuit, and other electronic components. When in use, the human body temperature is transmitted to the probe. The temperature sensor detects the temperature of the probe and outputs an electrical signal. It can directly output a digital signal or convert the current signal into a digital signal that can be recognized by the internal integrated circuit. The temperature is then displayed digitally on the display.

[0003] In the production of electronic thermometers, the probe needs to be attached to the thermometer housing using thermal gel so that the temperature sensor inside the housing can be inserted into the probe. Currently, the thermal gel is applied to each probe manually, and then the housing and probe are assembled manually one by one, allowing the thermal gel to cool and solidify. This production process is very time-consuming and labor-intensive, and the amount of adhesive used depends entirely on manual experience, making it easy to apply too little or leave any adhesive, resulting in defective products. Summary of the Invention

[0004] Therefore, there is a need to provide an electronic thermometer probe assembly module, equipment, and process to solve the problems of low efficiency and susceptibility to defects in the existing technology, where the dispensing and assembly processes of electronic thermometer probes are all done manually.

[0005] To achieve the above objectives, the inventors provide an electronic thermometer probe assembly module, comprising:

[0006] A mother plate, wherein the mother plate is provided with a plurality of sieve holes, and a column is provided in the sieve holes;

[0007] The sub-plate has a number of insertion holes, and when the sub-plate is inverted and covers the mother plate, the insertion holes are directly opposite the sieve holes.

[0008] In some embodiments, the motherboard includes:

[0009] The lower template, and the column is located at the lower template;

[0010] The upper template has the sieve holes located at the upper template, the upper template covers the upper template, and the column is inserted into the sieve holes.

[0011] In some embodiments, the upper template is fixed to the lower template by bolts.

[0012] In some embodiments, the mother plate has a positioning groove and the daughter plate has a positioning protrusion. When the positioning protrusion is inserted into the positioning groove, the insertion hole and the sieve hole are aligned one-to-one.

[0013] In some embodiments, the sieve hole is located at the bottom surface of the positioning groove, and the insertion hole is located at the top surface of the positioning protrusion.

[0014] In some embodiments, the width of the sieve holes gradually increases from the inside out.

[0015] In some embodiments, a plurality of sieve holes and a plurality of insertion holes are arranged in an array.

[0016] Unlike existing technologies, the electronic thermometer probe assembly module described in the above technical solution features a mother plate with perforated screens and uprights within these screens. This ensures that all probes entering the screens are in a downward-facing position. Furthermore, the mother plate can hold multiple probes simultaneously by placing them randomly on the mother plate and shaking it; the probes will then enter the screens with their openings facing downwards, enabling rapid material placement. The daughter plate has insertion holes corresponding to the screen holes. After placing the probes on the mother plate, it can be placed on top of the mother plate. By flipping the entire electronic thermometer probe assembly module, the probes are inserted correctly into the insertion holes, with their openings facing upwards. This allows for rapid probe alignment, ensuring all probes are ready for dispensing. Therefore, the electronic thermometer probe assembly module offers the advantage of rapid and batch probe alignment, significantly improving the efficiency of electronic thermometer probe assembly.

[0017] The inventors also provide an electronic thermometer probe assembly device, comprising:

[0018] A material frame, wherein the material frame is equipped with a vibration motor, and the vibration motor drives the material frame to vibrate;

[0019] An electronic thermometer probe assembly module, wherein the electronic thermometer probe assembly module is any one of the above-mentioned electronic thermometer probe assembly modules;

[0020] A dispensing machine includes a main unit, a worktable, and a pneumatic mechanism; the dispensing head of the main unit is a syringe, and the syringe is equipped with a needle; the pneumatic mechanism is connected to the syringe and is used to supply air to the syringe so that the syringe dispenses glue under air pressure; the worktable is used to place sub-boards, and the worktable is equipped with a positioning structure to limit the placement position of the sub-boards.

[0021] Unlike existing technologies, the electronic thermometer probe assembly equipment described above utilizes a material frame to store pre-applied probes. A vibration motor within the material frame vibrates the probes against the mother plate of the electronic thermometer probe assembly module, causing them to vibrate into the sieve holes of the mother plate. This allows for rapid and batch-wise placement of the probes. The daughter plate of the electronic thermometer probe assembly module enables rapid and batch-wise alignment of the probes, significantly improving the efficiency of probe placement and alignment. A dispensing machine sequentially applies adhesive to the probes on the daughter plate, achieving mechanical dispensing and greatly improving dispensing efficiency. Furthermore, due to the small opening of the probes, the dispensing machine uses pneumatic pressure to expel the adhesive and employs a syringe with a needle as the dispensing head, allowing for more precise, uniform, and efficient dispensing, avoiding issues of insufficient or leaked adhesive. Therefore, the electronic thermometer probe assembly equipment significantly improves the efficiency and quality of electronic thermometer probe assembly.

[0022] The inventors also provide an assembly process for an electronic thermometer probe, applied to the aforementioned electronic thermometer probe assembly equipment, comprising the following steps:

[0023] Material placement: The mother plate is placed into the material frame, and the vibration motor drives the material frame to vibrate, so that the probe inside the material frame is vibrated and inverted at the screen hole;

[0024] Correcting the material: Remove the motherboard and place the daughterboard on top of the motherboard. Flip the electronic thermometer probe assembly module so that the motherboard is upside down on the daughterboard. Remove the motherboard and insert the probe head into the socket.

[0025] Dispensing: Place the sub-board on the dispensing machine's worktable, and the dispensing machine will dispense adhesive to the probes at each socket in sequence;

[0026] Assembly: Insert the housing of the electronic thermometer into the probe, and then remove the housing and probe together from the socket.

[0027] In some embodiments, after the "assembly" step, the following steps are also included:

[0028] Solidification: Let stand for 2-3 hours.

[0029] Unlike existing technologies, the electronic thermometer probe assembly process described above allows for rapid and batch-wise placement of probes through a material placement step. A material alignment step ensures the probes are quickly and batch-wise aligned with their openings facing upwards, preparing them for mechanical dispensing. The preceding steps enable the dispensing process to be completed using a dispensing machine, allowing for rapid and sequential dispensing of adhesive to each probe, thus significantly improving dispensing efficiency. Furthermore, because the dispensing machine uses pneumatic pressure to expel the adhesive and employs a syringe with a needle as the dispensing head, it allows for more precise, uniform, and efficient dispensing, avoiding issues such as insufficient or leaked adhesive. Therefore, the described electronic thermometer probe assembly process significantly improves the efficiency and quality of electronic thermometer probe assembly.

[0030] The above description of the invention is merely an overview of the technical solution of this application. In order to enable those skilled in the art to better understand the technical solution of this application and to implement it based on the description and drawings, and to make the above-mentioned objectives and other objectives, features and advantages of this application easier to understand, the following description is provided in conjunction with the specific embodiments and drawings of this application. Attached Figure Description

[0031] The accompanying drawings are only used to illustrate the principles, implementation methods, applications, features, and effects of specific embodiments of this application and other related content, and should not be considered as limitations on this application.

[0032] In the accompanying drawings of the instruction manual:

[0033] Figure 1 This is a structural diagram of the electronic thermometer probe assembly module described in a specific embodiment;

[0034] Figure 2 This is a structural diagram of the motherboard described in a specific embodiment;

[0035] Figure 3 An exploded view of the mother plate described in the specific embodiment;

[0036] Figure 4 This is a structural diagram of the sub-board described in a specific implementation embodiment;

[0037] Figure 5 This is a structural diagram of the material frame described in a specific embodiment;

[0038] Figure 6 This is a structural diagram of the syringe described in a specific embodiment;

[0039] Figure 7 This is a structural diagram of the workbench described in a specific embodiment;

[0040] Figure 8A flowchart illustrating the assembly process of the electronic thermometer probe in a specific embodiment;

[0041] The reference numerals used in the above figures are explained as follows:

[0042] 1. Motherboard;

[0043] 100. Screen hole; 101. Column; 102. Lower template; 103. Upper template; 104. Bolt; 105. Positioning groove;

[0044] 2. Sub-board;

[0045] 200. Socket;

[0046] 3. Material frame;

[0047] 300. Vibration motor; 301. Frame;

[0048] 4. Syringe;

[0049] 400. Needle;

[0050] 5. Workbench;

[0051] 500. Placement slot. Detailed Implementation

[0052] To illustrate the possible application scenarios, technical principles, implementable specific solutions, and achievable objectives and effects of this application in detail, the following description, in conjunction with the listed specific embodiments and accompanying drawings, provides a detailed explanation. The embodiments described herein are merely illustrative of the technical solutions of this application and are therefore intended to limit the scope of protection of this application.

[0053] In this document, the term "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0054] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit this application.

[0055] In the description of this application, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " in this document generally indicates that the preceding and following objects have an "or" logical relationship.

[0056] In this application, terms such as “first” and “second” are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy or order relationship between these entities or operations.

[0057] Unless otherwise specified, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this application is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a list of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0058] Similar to the understanding in the Examination Guidelines, in this application, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments in this application, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0059] In the description of the embodiments of this application, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the purpose of describing the specific embodiments of this application or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0060] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this application, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this application pertains, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0061] An electronic thermometer consists of a probe, a temperature sensor, an LCD display, a button battery, a dedicated integrated circuit, and other electronic components. When in use, the human body temperature is transmitted to the probe. The temperature sensor detects the temperature of the probe and outputs an electrical signal. It can directly output a digital signal or convert the current signal into a digital signal that can be recognized by the internal integrated circuit. The temperature is then displayed digitally on the display.

[0062] In the production of electronic thermometers, the probe needs to be attached to the thermometer housing using thermal gel so that the temperature sensor inside the housing can be inserted into the probe. Currently, the thermal gel is applied to each probe manually, and then the housing and probe are assembled manually one by one, allowing the thermal gel to cool and solidify. This production process is very time-consuming and labor-intensive, and the amount of adhesive used depends entirely on manual experience, making it easy to apply too little or leave any adhesive, resulting in defective products.

[0063] To address this, the present invention provides an electronic thermometer probe assembly module, which can achieve the advantages of quickly and batch-arranging probes with their openings facing upwards, thereby improving the efficiency of dispensing adhesive onto the probes.

[0064] Please see Figure 1 and Figure 4 In a specific embodiment, the electronic thermometer probe assembly module includes a mother plate 1 and a daughter plate 2. The probe has a tubular structure, with one end closed as the probe end and the other end open as the connection end for connecting to the housing of the electronic thermometer. The mother plate 1 is used to arrange the probes in a certain order, especially to unify the opening orientation of all probes placed on the mother plate 1, specifically ensuring that all probes placed on the mother plate 1 have their openings facing downwards. This facilitates the uniform adjustment of all probes placed on the mother plate 1 to have their openings facing upwards, making them ready for adhesive application. This uniform adjustment of all probes placed on the mother plate 1 to have their openings facing upwards is achieved through the daughter plate 2.

[0065] Please see Figure 2The mother plate 1 has several screen holes 100, and each screen hole 100 has a column 101 inside. The daughter plate 2 has several insertion holes 200, and when the daughter plate 2 is inverted on the mother plate 1, each insertion hole 200 is directly opposite to one of the screen holes 100. Because the mother plate 1 has screen holes 100 and columns 101 inside, it can be ensured that all probes entering the screen holes 100 are in a downward-facing state. Furthermore, since there are several screen holes 100, the mother plate 1 can simultaneously hold several probes. By randomly placing many probes on the mother plate 1 and shaking them, the probes enter the screen holes 100 with their openings facing downwards, thus enabling rapid material placement. The daughter plate 2 has a column 101 inside the screen holes 100. For the socket 200, after the probe is placed on the mother plate 1, it is covered on the mother plate 1. After flipping the entire electronic thermometer probe assembly module, the probe can be inserted into the socket 200 with the opening facing upwards. This allows for quick alignment of the probe, ensuring that all probes are ready for dispensing. Therefore, the electronic thermometer probe assembly module has the advantage of quick and batch alignment of probes, greatly improving the efficiency of assembling electronic thermometer probes.

[0066] The inner diameter of the sieve hole 100 is larger than the outer diameter of the probe head. This is to facilitate the smooth entry of the probe head into the sieve hole 100 and to avoid hindering the probe head's exit from the sieve hole 100. In other words, it is necessary to ensure that the probe head can be flexibly removed when inserted into the sieve hole 100. Furthermore, the sieve hole 100 has a certain depth to ensure that when the probe head is inserted into the sieve hole 100, the side wall of the sieve hole 100 and the downstream column 101 jointly stabilize the probe head, keeping it in a vertical position. This depth can be set to one-third or one-half of the probe head length.

[0067] The outer diameter of the column 101 is smaller than the inner diameter of the probe, allowing the column 101 to be inserted into the probe, while the probe can be detached from the column 101. Furthermore, the column 101 has a certain height to ensure that when the probe is inserted into the sieve hole 100, the column 101 and the side wall of the sieve hole 100 together stabilize the probe, keeping it in a vertical position. This height can be set to one-third, one-half, or two-thirds of the probe length.

[0068] The inner diameter of the insertion hole 200 is slightly larger than the outer diameter of the probe, allowing the probe to be inserted into the insertion hole 200 with a certain tightness. After the daughter plate 2 is inverted onto the mother plate 1, the insertion hole 200 slightly clamps the probe end. During the process of moving the mother plate 1 to the ion plate 2, the probe inserted into the insertion hole 200 is not easily pulled away, requiring manual pulling to remove it. The insertion hole 200 has a certain depth to ensure that the probe is inserted into the insertion hole 200 without affecting the dispensing work or the assembly of the electronic thermometer housing. It can be set to one-third or one-half the length of the probe.

[0069] Please see Figure 3 In some embodiments, the mother plate 1 includes a lower template 102 and an upper template 103, with the column 101 located at the lower template 102; the sieve hole 100 is located at the upper template 103, the upper template 103 covers the upper template 103, and the column 101 is inserted into the sieve hole 100. This arrangement, with the sieve hole 100 and the column 101 respectively located on two plates, facilitates mold manufacturing and allows for easy disassembly of the mother plate 1 to clean the accumulated dust inside. In addition, during the process of flipping the probe, if the probe gets stuck in the sieve hole 100 or clamped at the column 101, the probe can be easily pushed onto the daughter plate 2.

[0070] The sieve hole 100 can be configured as an inverted frustum shape. In some embodiments, the width of the sieve hole 100 gradually increases from the inside to the outside. When the mother plate 1 is a structure including a lower template 102 and an upper template 103, the inner diameter of the inner port of the sieve hole 100 is smaller than the outer diameter of the probe, and the inner diameter of the outer port of the sieve hole 100 is larger than the outer diameter of the probe. With this configuration, when the probe is stuck at the column 101, and the lower template 102 is removed from the upper template 103, the probe cannot pass through the sieve hole 100 because the outer diameter of the probe is smaller than the inner diameter of the inner port of the sieve hole 100. The probe is blocked by the sieve hole 100 and can be pulled away from the column 101, thus avoiding the problem of the probe getting stuck at the column 101 and unable to come out.

[0071] The upper template 103 and the lower template 102 are stacked one on top of the other to form the mother plate 1. There can be multiple upper templates 103, and the inner diameter of the sieve holes 100 of different upper templates 103 is different. There can also be multiple lower templates 102, and the outer diameter of the column 101 of different lower templates 102 is different. The user can select different upper templates 103 and lower templates 102 to assemble together according to the actual size of the probe head. Similarly, there can also be multiple sub-plates 2, and the inner diameter of the insertion holes 200 of different sub-plates 2 is different. The user can select different sub-plates 2 according to the actual size of the probe head.

[0072] The upper template 103 and the lower template 102 can be snapped together using a snap-fit ​​structure. In some embodiments, the upper template 103 is fixed to the lower template 102 by bolts 104. That is, both the upper template 103 and the lower template 102 have bolt holes, and the positions of the bolt holes are such that when the upper template 103 and the lower template 102 are stacked together, each column 101 is located at the center of its corresponding screen hole 100. When the lower template 102 and the upper template 103 are stacked together, the bolt holes of the upper template 103 and the lower template 102 are aligned, and they can be locked together by bolts 104. Firstly, bolts 104 serve as a locking structure, and secondly, bolts 104 serve as a positioning structure, ensuring that when the upper template 103 and the lower template 102 are stacked together, each column 101 is located at the center of its corresponding screen hole 100.

[0073] Since the sub-plate 2 and the mother plate 1 are in a covered state when the probe head is aligned, it is not possible or difficult to see the alignment of the sub-plate 2 and the mother plate 1. In order to ensure that the insertion hole 200 is directly aligned with the sieve hole 100 when the sub-plate 2 is upside down on the mother plate 1, in some embodiments, the mother plate 1 is provided with a positioning groove 105 and the sub-plate 2 is provided with a positioning protrusion. The positioning groove 105 and the positioning protrusion are positioned so that when the positioning protrusion is inserted into the positioning groove 105, the insertion hole 200 is directly aligned with the sieve hole 100.

[0074] In some embodiments, the sieve hole 100 is located on the bottom surface of the positioning groove 105, and the insertion hole 200 is located on the top surface of the positioning protrusion.

[0075] In another embodiment, the mother plate 1 may have a positioning groove 105, and the size of the daughter plate 2 may be adapted to the size of the positioning groove 105. When the daughter plate 2 is inserted into the positioning groove 105, the insertion hole 200 and the sieve hole 100 are aligned one-to-one.

[0076] In some embodiments, a plurality of sieve holes 100 and a plurality of insertion holes 200 are arranged in an array, which is beneficial for the subsequent planning and design of the dispensing machine route for mechanical dispensing.

[0077] The present invention also provides an electronic thermometer probe assembly device, including a material frame 3, an electronic thermometer probe assembly module, and a dispensing machine; the material frame 3 is used to hold the probe to be dispensed with adhesive; the electronic thermometer probe assembly module is any one of the above-mentioned electronic thermometer probe assembly modules; the dispensing machine is used to dispense adhesive onto the probe.

[0078] Please see Figure 5The material frame 3 is equipped with a vibration motor 300, which drives the material frame 3 to vibrate; the dispensing machine includes a main unit, a worktable 5, and a pneumatic mechanism; please refer to... Figure 6 The dispensing head of the main unit is a syringe 4, which is equipped with a needle 400; the pneumatic mechanism is connected to the syringe 4 and is used to supply air to the syringe 4 so that the syringe 4 dispenses glue under pneumatic pressure; the worktable 5 is used to place the sub-board 2, please refer to [link to relevant documentation]. Figure 7 The workbench 5 is equipped with a positioning structure to restrict the placement of the sub-board 2.

[0079] The electronic thermometer probe assembly equipment uses a material frame 3 to store pre-applied probes. A vibration motor 300 in the material frame 3 vibrates the probes onto the mother plate 1 of the electronic thermometer probe assembly module, causing them to vibrate into the sieve holes 100 of the mother plate 1. This allows for rapid and batch-wise placement of the probes. The daughter plate 2 of the electronic thermometer probe assembly module allows for rapid and batch-wise alignment of the probes, significantly improving the efficiency of probe placement and alignment. A dispensing machine sequentially dispenses adhesive onto the probes on the daughter plate 2, achieving mechanical dispensing and greatly improving dispensing efficiency. Furthermore, due to the small opening of the probes, the dispensing machine uses pneumatic pressure to expel the adhesive, and a syringe 4 with a needle 400 is used as the dispensing head, allowing for more precise, uniform, and efficient dispensing, avoiding insufficient or leaky adhesive. Therefore, the electronic thermometer probe assembly equipment significantly improves the efficiency and quality of electronic thermometer probe assembly.

[0080] The material frame 3 support includes a base and a surrounding frame 301. The vibration motor 300 is located inside the surrounding frame 301. The material frame 3 is placed on the vibration motor 300 and is movably located inside the surrounding frame 301. That is, there is enough space inside the surrounding frame 301 for the material frame 3 to vibrate, and the material frame 3 can be rotated.

[0081] The syringe 4 has a piston inside and a cover at the tail. The gas delivery tube passes through the cover. After the gas delivery tube delivers gas, the piston is squeezed and moves, thereby squeezing the glue inside the syringe 4 and squeezing the glue out from the needle tip 400 to achieve pneumatic dispensing.

[0082] Because the workbench 5 has a positioning structure to restrict the placement position of the sub-board 2, the positions of each insertion hole 200 are fixed after the sub-board 2 is placed on the workbench 5, which allows the movement trajectory of the dispensing machine to be set in advance. Specifically, the positioning structure can be a placement groove 500, in which the sub-board 2 is placed. The center of the placement groove 500 extends outwards to facilitate the removal of the sub-board 2.

[0083] Please see Figure 8The present invention also provides an assembly process for an electronic thermometer probe, applied to the above-mentioned electronic thermometer probe assembly equipment, comprising the following steps:

[0084] S801 Material placement: Mother plate 1 is placed into material frame 3, and vibration motor 300 drives material frame 3 to vibrate, so that the probe in material frame 3 is vibrated and inverted at screen hole 100.

[0085] S802 Correct Material: Take out the mother plate 1 and cover the daughter plate 2 on the mother plate 1. Flip the electronic thermometer probe assembly module so that the mother plate 1 covers the daughter plate 2. Remove the mother plate 1 and insert the probe into the socket 200.

[0086] S803 dispensing: Place the sub-board 2 on the worktable 5 of the dispensing machine, and the dispensing machine will dispense adhesive to the probes at each of the sockets 200 in sequence;

[0087] S804 Assembly: Insert the housing of the electronic thermometer into the probe, and remove the housing and probe together from the socket 200.

[0088] The assembly process for the electronic thermometer probe head involves several key steps. The initial placement step allows for the rapid and batch-wise arrangement of the probe heads, while the alignment step ensures they are aligned with their openings facing upwards, preparing them for mechanical dispensing. The preceding steps enable the dispensing process to be completed using a dispensing machine, allowing for rapid, sequential dispensing of adhesive to each probe head, significantly improving efficiency. Furthermore, the dispensing machine utilizes pneumatic pressure to expel the adhesive and employs a syringe 4 equipped with a needle 400 as the dispensing head, resulting in more precise, uniform, and efficient dispensing, preventing issues like insufficient or leaked adhesive. Therefore, this electronic thermometer probe head assembly process significantly improves both the efficiency and quality of the assembly process.

[0089] In the material placement step, the probe can be quickly inserted into the screen hole 100 and inserted into the column 101. If the screen holes 100 of each mother plate 1 are arranged in a 10*10 pattern, this method can accurately place 90-95 of them, with a success rate of about 90%.

[0090] In some embodiments, after the "assembly" step, the following steps are also included:

[0091] Solidification: Let stand for 2-3 hours.

[0092] The adhesive used is a thermal gel. This step ensures that the adhesive inside the probe completely solidifies, allowing the probe to be completely bonded to the housing of the electronic thermometer.

[0093] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. An electronic thermometer probe assembly module, characterized in that, include: A mother plate, wherein the mother plate is provided with a plurality of sieve holes, the sieve holes are arranged vertically, and a column is provided in the sieve holes; The sub-plate has several insertion holes, which are vertically arranged, and when the sub-plate is inverted and covers the mother plate, the insertion holes are directly aligned with the sieve holes. The mother plate includes: The lower template, and the column is located at the lower template; The upper template has the sieve holes located on it. The upper template covers the lower template, and the column is inserted into the sieve holes. The width of the sieve holes gradually increases from the inside to the outside. The inner diameter of the inner port of the sieve hole is smaller than the outer diameter of the probe, and the inner diameter of the outer port of the sieve hole is larger than the outer diameter of the probe.

2. The electronic thermometer probe assembly module according to claim 1, characterized in that, The upper template is fixed to the lower template by bolts.

3. The electronic thermometer probe assembly module according to claim 1, characterized in that, The mother plate has a positioning groove, and the daughter plate has a positioning protrusion. When the positioning protrusion is inserted into the positioning groove, the insertion hole and the sieve hole are aligned one-to-one.

4. The electronic thermometer probe assembly module according to claim 3, characterized in that, The sieve hole is located on the bottom surface of the positioning groove, and the insertion hole is located on the top surface of the positioning protrusion.

5. The electronic thermometer probe assembly module according to claim 1, characterized in that, Several sieve holes and several insertion holes are arranged in an array.

6. An assembly device for an electronic thermometer probe, characterized in that, include: A material frame, wherein the material frame is equipped with a vibration motor, and the vibration motor drives the material frame to vibrate; An electronic thermometer probe assembly module, wherein the electronic thermometer probe assembly module is the electronic thermometer probe assembly module according to any one of claims 1-5; A dispensing machine includes a main unit, a worktable, and a pneumatic mechanism; the dispensing head of the main unit is a syringe, and the syringe is equipped with a needle; the pneumatic mechanism is connected to the syringe and is used to supply air to the syringe so that the syringe dispenses glue under air pressure; the worktable is used to place sub-boards, and the worktable is equipped with a positioning structure to limit the placement position of the sub-boards.

7. An assembly process for an electronic thermometer probe, characterized in that, The application of the electronic thermometer probe assembly equipment according to claim 6 includes the following steps: Material placement: The mother plate is placed into the material frame, and the vibration motor drives the material frame to vibrate, so that the probe inside the material frame is vibrated and inverted at the screen hole; Correcting the material: Remove the motherboard and place the daughterboard on top of the motherboard. Flip the electronic thermometer probe assembly module so that the motherboard is upside down on the daughterboard. Remove the motherboard and insert the probe head into the socket. Dispensing: Place the sub-board on the dispensing machine's worktable, and the dispensing machine will dispense adhesive to the probes at each socket in sequence; Assembly: Insert the housing of the electronic thermometer into the probe, and then remove the housing and probe together from the socket.

8. The assembly process of the electronic thermometer probe according to claim 7, characterized in that, Following the "assembly" step, the following steps are also included: Solidification: Let stand for 2-3 hours.

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