Light-transmitting lamp panel and light-transmitting light supplementing lamp

Abstract

This invention relates to the field of lighting technology, and particularly to a light-transmitting lamp panel and a light-transmitting supplementary lighting fixture. The light-transmitting lamp panel includes a light-transmitting substrate, which has a wire pattern, a light-emitting surface, and a backlight surface. The wire pattern is disposed on the light-emitting surface. A plurality of LED beads are electrically connected to the wire pattern, and each LED bead has a top surface that faces away from the light-emitting surface. Compared with the prior art, this invention mainly achieves high light transmittance and good waterproof performance by setting a plurality of LED beads on the light-transmitting substrate and covering the LED beads and the wire pattern with a light-transmitting curing adhesive layer to form a protective layer. This prevents the LED beads and the wire pattern from being corroded by moisture. Furthermore, the setting that the distance between the first surface of the light-transmitting curing adhesive layer and the light-emitting surface of the light-transmitting substrate is equal to or exceeds half the distance between the top surface of the LED bead and the light-emitting surface makes the LED beads more securely fixed.

Description

Technical Field

[0001] This invention relates to the field of lighting technology, and in particular to a light-transmitting lamp panel and a light-transmitting supplementary lighting fixture. Background Technology

[0002] Light is an essential energy source for plant growth. However, due to limitations in natural environments, plants have low light absorption efficiency and slow growth rates, failing to meet the ever-increasing material needs of people. Therefore, artificial light sources are used to supplement light and accelerate plant growth. LEDs (Light Emitting Diodes), as a new type of light source, have advantages such as high luminous efficiency and energy saving. Their rich wavelength range matches the spectral range absorbed by plant photosynthesis, allowing for concentrated, even illumination of crops. The system generates less heat and occupies less space. Therefore, LEDs are widely used as the light source in plant lights.

[0003] For example, patent CN211780625U (published on October 27, 2020) discloses a plant light that promotes plant photosynthesis, including a power supply component, a heat sink, and a light source component. The power supply component provides power to red and white LED beads on the light source board, and the heat sink dissipates heat from the power supply component and the light source board. This can provide supplemental lighting for plants and accelerate their growth. However, this prior art does not consider the problem of the lamp itself blocking sunlight, resulting in energy waste. Furthermore, it does not consider the outdoor use environment of the supplemental lighting board, and its size, waterproof performance, and heat dissipation performance are insufficient.

[0004] In summary, existing supplementary lighting panels have problems such as blocking sunlight and poor water resistance. The purpose of this invention is to provide a light-transmitting panel with good light transmission and a stable structure, as well as a light-transmitting supplementary lighting fixture. Summary of the Invention

[0005] To address the shortcomings of the prior art, the present invention provides a light-transmitting lamp panel, comprising: a light-transmitting substrate having a wire pattern, a light-emitting surface, and a backlight surface, the wire pattern being disposed on the light-emitting surface; a plurality of lamp beads electrically connected to the wire pattern, each lamp bead having a top surface facing away from the light-emitting surface; and a light-transmitting curable adhesive layer disposed on the light-emitting surface and covering the wire pattern, the light-transmitting curable adhesive layer having a first surface facing away from and parallel to the light-emitting surface, the distance between the first surface and the light-emitting surface being equal to or greater than half the distance between the top surface of the lamp bead and the light-emitting surface.

[0006] In one embodiment, the distance between the first surface and the light-emitting surface does not exceed the distance between the top surface of the lamp bead and the light-emitting surface.

[0007] In one embodiment, the device further includes a plurality of light-transmitting curable adhesive covers, wherein the LED has a first portion surrounded by the light-transmitting curable adhesive layer and a second portion exposed by the light-transmitting curable adhesive layer, and the light-transmitting curable adhesive covers cover the second portion of the LED.

[0008] In one embodiment, the light-curing adhesive cap contains scattering particles.

[0009] In one embodiment, the light-transmitting curable cover and the light-transmitting curable layer are made of the same material and are integrally formed.

[0010] In one embodiment, the distance between the first surface and the light-emitting surface exceeds the distance between the top surface of the lamp bead and the light-emitting surface. The first surface has a plurality of rough microstructure regions, and the positions of the plurality of rough microstructure regions are respectively located directly above the positions of the plurality of lamp beads.

[0011] In one embodiment, the light-transmitting substrate has a plurality of holes that penetrate the light-transmitting substrate, and the light-transmitting curable adhesive layer extends into the holes.

[0012] In one embodiment, the light-transmitting substrate has a peripheral side surface connecting the light-emitting surface and the backlight surface, and the light-transmitting curable adhesive layer extends to the peripheral side surface.

[0013] In one embodiment, a light-transmitting heat dissipation layer is further included, which is attached to the backlight surface, and the material of the light-transmitting heat dissipation layer includes indium tin oxide or graphene.

[0014] This application also provides a light-transmitting lighting supplementary light fixture, including a light-transmitting light panel as described in any of the above embodiments. The light-transmitting lighting supplementary light fixture is adapted to allow ambient light to pass through the light-transmitting substrate and to provide supplementary lighting through a number of LED beads when the ambient light is lower than a specific illuminance or brightness.

[0015] Based on the above, compared with the prior art, the light-transmitting lamp panel provided by the present invention mainly involves setting a number of lamp beads and a light-transmitting curing adhesive layer on a light-transmitting substrate. The light-transmitting curing adhesive layer covers the lamp beads and wire patterns, forming a protection for the lamp beads and wire patterns. This allows the light-transmitting lamp panel to have high light transmittance and good waterproof performance, preventing the lamp beads and wire patterns from being corroded by moisture. Furthermore, the setting that the distance between the first surface of the light-transmitting curing adhesive layer and the light-emitting surface of the light-transmitting substrate is equal to or exceeds half the distance between the top surface of the lamp bead and the light-emitting surface makes the lamp beads more securely fixed.

[0016] Other features and beneficial effects of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other beneficial effects of the invention can be realized and obtained by means of the structures particularly pointed out in the description, claims and drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Unless otherwise specified, the positional relationships shown in the drawings in the following description are based on the direction in which the components are drawn in the figure.

[0018] Figure 1 A three-dimensional schematic diagram of the light-transmitting lamp plate provided by the present invention;

[0019] Figure 2 This is a cross-sectional schematic diagram of the first embodiment;

[0020] Figure 3 This is a cross-sectional schematic diagram of the molding structure in the first embodiment;

[0021] Figure 4 This is a cross-sectional schematic diagram of the second embodiment;

[0022] Figure 5 This is a cross-sectional schematic diagram of the molding structure in the second embodiment;

[0023] Figure 6 This is a cross-sectional schematic diagram of the third embodiment;

[0024] Figure 7 This is a cross-sectional schematic diagram of the fourth embodiment.

[0025] Figure label:

[0026] 10 Transparent substrate 11 Light-emitting surface 12 Backlight surface

[0027] 13. Wire pattern 14. LED bead 15. Hole

[0028] 20 Transparent curable adhesive layer 21 First surface 22 Transparent curable adhesive cap

[0029] 14a Top surface, 14b Surrounding side surfaces, 50 Transparent heat dissipation layer

[0030] 60 Bottom bearing mold, 70 Press mold, 71 Mold hole

[0031] 72 Molded bottom surface Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of the present invention, but not all embodiments. The technical features designed in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0033] In the description of this invention, it should be noted that all terms used in this invention (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains, and should not be construed as limiting the invention; it should be further understood that the terms used in this invention should be understood to have the same meaning as those in the context of this specification and in the relevant field, and should not be understood in an idealized or overly formal sense, except as expressly defined in this invention.

[0034] The following is an explanation through specific examples.

[0035] This invention provides a light-transmitting light panel, such as... Figure 1 and Figure 2As shown, the light-transmitting substrate 10 mainly includes a light-transmitting substrate 10, a plurality of LED beads 14, and a light-transmitting curing adhesive layer 20. The light-transmitting substrate 10 is made of, for example, hard or flexible glass. The light-transmitting substrate 10 has a wire pattern 13, a light-emitting surface 11, and a backlight surface 12. The light-emitting surface 11 is provided with the wire pattern 13 and a plurality of LED beads 14 electrically connected to the wire pattern 13. The plurality of LED beads 14 are arranged in a matrix. Each LED bead 14 has a top surface 14a and peripheral side surfaces 14b extending from the top surface 14a toward the light-emitting surface 11. The top surface 14a faces away from the light-emitting surface 11. The light-transmitting curing adhesive layer 20 is laid on the light-emitting surface 11 of the light-transmitting substrate 10 and covers the wire pattern 13. The light-transmitting curing adhesive layer 20 has a first surface 21, which faces away from the light-emitting surface 11. The light-emitting surface 11 is parallel to the light-emitting surface 11. Here, "parallel" means that the product design aims to achieve parallelism, but errors may occur during subsequent manufacturing. The distance between the first surface 21 and the light-emitting surface 11 is equal to or greater than half the distance between the top surface 14a of the LED bead 14 and the light-emitting surface 11. This allows the light-curing adhesive layer 20 to cover the light-transmitting substrate 10 and at least part of the surrounding side surface 14b of each LED bead 14, providing sufficient waterproof sealing protection for the LED bead 14 and the wire pattern 13. By controlling the distance between the light-curing adhesive layer 20 covering the surrounding side surface of the LED bead 14 and the light-emitting surface 11, the tangential and normal pushing and pulling forces of the LED bead 14 fixed on the light-transmitting substrate 10 are increased, thus stabilizing the position of each LED bead 14. The material of the light-curing adhesive layer 20 can be, for example, transparent epoxy resin, polyurethane, PMMA (polymethyl methacrylate, acrylic), transparent rubber, or transparent silicone.

[0036] By selecting the type of LED bead 14, the light-transmitting light panel of the present invention can be used not only as a light-transmitting display device (e.g., the LED bead is a red, green, or blue LED package) but also as a light-transmitting lighting device (e.g., the LED bead is a white LED package). This avoids the light panel obstructing the view when not in use. It can also be applied to occasions requiring sufficient light, such as plant cultivation rooms or aquariums (e.g., the LED bead is a plant lighting LED package). The above structure ensures that when the ambient light is sufficient, the light-transmitting light panel blocks very little ambient light, improving the utilization rate of natural green energy and conforming to the concept of environmental protection and energy conservation. On the other hand, when the ambient light is lower than a specific illuminance or brightness, the LED bead 14 can be lit to provide supplemental light. By controlling the input voltage of the LED bead 14, the supplemental light brightness can be adjusted to provide continuous and suitable light for plants or algae, maintain photosynthesis, improve productivity, and solve the problem of shading sunlight compared to existing traditional plant lights.

[0037] The conductive pattern 13 and the plurality of LED beads 14 occupy no more than 5-10% of the area of ​​the light-emitting surface 11, so that the light transmittance of the light-transmitting panel reaches 90-95% or more, thereby maximizing the utilization rate of clean energy. Preferably, in one embodiment, the conductive pattern 13 is made of copper wire, for example, by attaching copper foil and then etching the wire shape or by sputtering. Compared with wires made by printing, the conductive pattern 13 in this embodiment has lower impedance and less heat generation, avoiding severe heat generation of the conductive pattern 13 that could damage the sealing of the light-transmitting curing adhesive layer 20 or the connection structure between the light-transmitting substrate 10 and the plurality of LED beads 14. Specifically, the present invention provides the following specific embodiments.

[0038] First Embodiment

[0039] Preferably, in such Figure 2 In the first embodiment shown, based on the above embodiment, the distance between the first surface 21 and the light-emitting surface 11 is more than half the distance between the top surface 14a of the lamp bead 14 and the light-emitting surface 11. The top surface 14a of the lamp bead 14 protrudes from the first surface 21, which is the side of the lamp bead 14 that faces away from the light-transmitting substrate 10. Conversely, the bottom of the lamp bead 14 is the side of the lamp bead 14 that contacts the wire pattern 13 of the light-transmitting substrate 10. The top surface 14a of the lamp bead 14 protruding from the first surface 21 means that the distance between the top surface 14a of the lamp bead 14 and the light-emitting surface 11 is greater than the distance between the first surface 21 and the light-emitting surface 11. The lower part of the surrounding side surface 14b of the lamp bead 14 is covered and sealed by the light-transmitting curable adhesive layer 20. In this embodiment, the distance between the first surface 21 and the light-emitting surface 11 is not greater than the distance between the top surface 14a of the lamp bead 14 and the light-emitting surface 11, so that the height of the first surface 21 is lower than the height of the lamp bead 14. On the one hand, this does not affect the light shape and light emission efficiency of the lamp bead 14 (avoiding the light emitted by the lamp bead 14 being reflected by the medium covering the top surface 14a of the lamp bead 14), and on the other hand, it greatly saves the amount of adhesive required for the light-transmitting curing adhesive layer 20.

[0040] By setting the height of the first surface 21 from the light-emitting surface 11 to be more than half the height of the lamp bead 14 in the normal direction of the light-emitting surface 11, when the lamp bead 14 is subjected to a force parallel to the first surface 21, the moment fulcrum exceeds the midpoint of the height of the lamp bead 14 from the light-emitting surface 11, which greatly improves the force-bearing capacity of the lamp bead 14 in the direction parallel to the first surface 21, and makes the structure more stable.

[0041] In some preferred embodiments of this example, such as Figure 2As shown, the light-transmitting substrate 10 has a plurality of holes 15. When the light-transmitting curing adhesive layer 20 is formed, the adhesive is squeezed and extended into the holes 15. Through the structure of the light-transmitting curing adhesive layer 20 extending into the holes 15, the adhesion between the light-transmitting curing adhesive layer 20 and the light-transmitting substrate 10 can be increased. Moreover, for the soft light-transmitting curing adhesive layer 20, it is more conducive to preventing the light-transmitting curing adhesive layer 20, the LED bead 14 and the wire pattern 13 from falling off due to tangential force during bending and other deformations.

[0042] Preferably, the positions of the holes 15 correspond to the positions of the LED beads 14, such as... Figure 2 As shown, each hole 15 is located at the bottom of the corresponding LED bead 14 to avoid affecting the light transmission effect of the light-transmitting panel.

[0043] In some preferred embodiments of this example, the light-transmitting substrate 10 has a surrounding side surface connecting the light-emitting surface 11 and the backlight surface 12, and the light-transmitting curing adhesive layer 20 extends to the periphery of the side surface of the light-transmitting substrate 10 to further prevent moisture from seeping from the surrounding side surface of the light-transmitting lamp plate into the space between the light-transmitting substrate 10 and the light-transmitting curing adhesive layer 20.

[0044] In some preferred embodiments of this example, such as Figure 1 As shown, based on the above embodiment, a light-transmitting heat dissipation layer 50 is also included. The light-transmitting heat dissipation layer 50 is attached to the backlight surface 12 to improve the heat dissipation capacity of the light-transmitting lamp panel and increase the lifespan of the lamp panel. Preferably, the light-transmitting heat dissipation layer 50 is, for example, made of ITO (Indium Tin Oxide) or graphene.

[0045] Please refer to Figure 3 This embodiment also provides a method for manufacturing a light-transmitting lamp panel using a molding process, comprising the following steps:

[0046] S10: Provides a bottom support mold 60, such as Figure 3 The bottom support mold 60 has a recessed area. When viewed from above in the direction perpendicular to the first surface 21, the outline shape of the recessed area matches the outline shape of the light-transmitting substrate 10. The backlight surface 12 of the light-transmitting substrate 10, on which a plurality of lamp beads 14 are mounted, is placed at the bottom of the recessed area. The depth of the recessed area is relatively greater than the thickness of the light-transmitting substrate 10.

[0047] S20: A molding die 70 is provided, which has a plurality of mold holes 71. The positions of the mold holes 71 correspond to the positions of the lamp beads 14, and the shape of the mold hole 71 matches the contour of the top surface 14a of the lamp beads 14. The molding die 70 has a molding bottom surface 72 whose contour shape matches the recessed area. The molding bottom surface 72 is smooth and flat. In this embodiment, the working height of the molding bottom surface 72 is relatively higher than the upper surface of the light-transmitting substrate 10 and relatively lower than the height of the top surface 14a of the lamp beads 14. Preferably, the working height of the molding bottom surface 72 is relatively higher than half the distance between the top surface 14a of the lamp beads 14 and the light-emitting surface 11.

[0048] S30: Inject colloid into the cavity formed by the compression mold 70, the bottom support mold 60 and the light-transmitting substrate 10, and then cure the colloid to form a light-transmitting cured adhesive layer 20.

[0049] S40: After demolding, it forms a light-transmitting panel.

[0050] The molding manufacturing method provided in this embodiment can easily control the thickness of the light-transmitting curable adhesive layer 20 through the cooperation of the molding die 70 and the bottom support die 60, saving the amount of adhesive as needed, while increasing the stability of the lamp bead 14; the molding process makes the first surface 21 smooth and flat, without defects such as water ripples affecting the transparency effect; and during the molding process, the adhesive will seep to the surrounding sides of the light-transmitting substrate 10, enhancing the waterproof performance of the wire 13.

[0051] Second Embodiment

[0052] In the first embodiment, since a portion of the LED bead 14 is exposed, in order to enhance the waterproof protection of the LED bead 14, the present invention provides a second embodiment to solve the waterproof protection problem without affecting the light output efficiency of the LED bead 14. The difference between this embodiment and the first embodiment lies in the sealing structure of the LED bead 14. The following only describes the differences, and the similarities will not be elaborated.

[0053] like Figure 4As shown, to further enhance the waterproof protection of the LED chip 14, the second embodiment adds a light-transmitting curing adhesive cover 22 based on the first embodiment. The top surface 14a of the LED chip 14 protrudes from the first surface 21, so that the LED chip 14 has a first part surrounded by the light-transmitting curing adhesive layer 20 and a second part exposed by the light-transmitting curing adhesive layer 20. The light-transmitting curing adhesive cover 22 covers the second part of the LED chip 14 and is bonded to the first surface 21. Since the light-transmitting curing adhesive cover 22 covers the part of the LED chip 14 exposed outside the first surface 21, and the light-transmitting curing adhesive cover 22 also protrudes from the first surface 21, most of the light emitted by the LED chip 14 will not be reflected into the light-transmitting curing adhesive layer 20, so as not to affect the light emission efficiency of the LED chip 14 as much as possible and to achieve a waterproof effect. The thickness of the light-transmitting curing adhesive cover 22 covering the LED chip 14 only needs to be a thin layer. In some embodiments, the thickness of the light-transmitting curing adhesive cover 22 is 1 mm to achieve the aforementioned effect. Preferably, in some embodiments, the light-transmitting curing adhesive cover 22 contains scattering particles to soften the light emitted by the LED beads 14, avoiding excessive concentration or glare from the light emitted by the LED beads. The light-transmitting curing adhesive cover 22 and the light-transmitting curing adhesive layer 20 are made of the same material and are integrally formed, which can achieve the convenience of manufacturing and waterproof effect.

[0054] Accordingly, in the manufacturing method of the second embodiment, as Figure 5 As shown, the difference from the first embodiment is that the outline of the mold hole 71 of the molding 70 should be slightly larger than the outline of the top surface 14a of the lamp bead 14. After the glue is dripped into the mold hole 71 and flows into the gap between the wall of the mold hole 71 and the lamp bead 14, it is cured to form a light-transmitting curable glue cover 22.

[0055] Third Embodiment

[0056] The present invention also provides a third embodiment to obtain a structure in which the lamp bead 14 has a stronger ability to resist external force and can achieve a waterproof effect. In this embodiment, the materials, basic structural settings and interrelationships of the light-transmitting substrate 10, the wire pattern 13 and the lamp bead 14 are similar to those of the previous embodiments, and will not be repeated here. The following only describes the differences.

[0057] like Figure 6As shown, in this embodiment, the first surface 21 of the light-transmitting curable adhesive layer 20 is flush with the top surface 14a of the LED bead 14. Here, "flush" means that the product design aims for a flush surface, but errors may occur during subsequent manufacturing. The LED bead 14, except for its top surface 14a, is covered by the light-transmitting curable adhesive layer 20, providing stronger horizontal load-bearing capacity. Preferably, in some preferred embodiments, a light-transmitting curable adhesive cover 22 is also included. The cover 22 covers the top surface 14a of the LED bead 14, and its edges contact the first surface 21 of the light-transmitting curable adhesive layer 20, which is flush with the top surface 14a of the LED bead 14. This provides waterproof protection for the LED bead 14 while scattering the light emitted by the LED bead 14, resulting in more uniform and softer light output from the lamp panel.

[0058] Accordingly, in the manufacturing method of the third embodiment, the difference from the first embodiment is that the working height of the molding bottom surface 72 is flush with the height of the top surface 14a of the lamp bead 14. A light-transmitting curable adhesive cover 22 can be formed by applying adhesive to the top surface 14a of the lamp bead 14 through the mold hole 71.

[0059] Fourth embodiment

[0060] Similar to the above embodiments, the materials, basic structural settings and interrelationships of the light-transmitting substrate 10, the wire pattern 13 and the lamp beads 14 are similar to those of the aforementioned embodiments, and will not be repeated here. The following will only describe the differences in detail.

[0061] like Figure 7 As shown, in the fourth embodiment, the distance between the first surface 21 and the light-emitting surface 11 of the light-transmitting substrate 10 exceeds the distance between the top surface 14a of the lamp bead 14 and the light-emitting surface 11. The lamp bead 14 is completely covered by the light-transmitting curable adhesive layer 20, providing good waterproofing and load-bearing capacity. Preferably, the first surface 21 has several rough microstructure regions, the positions of which correspond to the positional distribution of the lamp bead 14, and the contours of the rough microstructure regions match the contours of the top surface 14a of the lamp bead 14. This ensures that the rough microstructure regions are located directly above the lamp beads 14, thereby disrupting the total internal reflection of the light emitted from the lamp bead 14 by the first surface 21 and improving the light extraction efficiency.

[0062] Accordingly, in the manufacturing method of the fourth embodiment, the difference from the first embodiment is that no mold hole is opened in the mold 70, and the working height of the bottom surface 72 of the mold is relatively higher than the height of the top surface 14a of the lamp bead 14.

[0063] The present invention also provides a light-transmitting lighting supplement lamp, including a light-transmitting lamp plate as described in any of the above embodiments. The light-transmitting lighting supplement lamp is adapted to allow ambient light to pass through the light-transmitting substrate 10 and to provide supplementary lighting through a plurality of lamp beads 14 when the ambient light is lower than a specific illuminance or brightness. The light-transmitting lighting supplement lamp may further include a power supply component and a sensing component. When the sensing component senses that the ambient light is lower than a specific illuminance or brightness, it provides a supplementary lighting signal to the power supply component to control the power supply output of the power supply component and adjust the light-emitting state of the plurality of lamp beads to provide supplementary lighting.

[0064] In summary, the light-transmitting light panel provided by the present invention mainly involves setting a number of LED beads and a light-transmitting curing adhesive layer on a light-transmitting substrate. The light-transmitting curing adhesive layer covers the LED beads and wire patterns, forming a protective layer for the LED beads and wire patterns. This allows the light-transmitting light panel to have high light transmittance while also having good waterproof performance, preventing the LED beads and wire patterns from being corroded by moisture. Furthermore, the setting that the distance between the first surface of the light-transmitting curing adhesive layer and the light-emitting surface of the light-transmitting substrate is equal to or exceeds half the distance between the top surface of the LED bead and the light-emitting surface makes the LED beads more securely fixed.

[0065] Furthermore, those skilled in the art should understand that although many problems exist in the prior art, each embodiment or technical solution of the present invention can be improved in only one or a few aspects, without necessarily solving all the technical problems listed in the prior art or the background art simultaneously. Those skilled in the art should understand that any content not mentioned in a claim should not be construed as a limitation on that claim.

[0066] Although this document frequently uses terms such as light-transmitting substrate, wire pattern, LED bead, light-transmitting curing adhesive layer, light-transmitting curing adhesive cover, and light-transmitting heat dissipation layer, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of the invention; interpreting them as any additional limitation would contradict the spirit of the invention. The terms "first," "second," etc. (if present) in the specification, claims, and accompanying drawings of the embodiments of the invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A light-transmissive lamp panel, characterized by: include A light-transmitting substrate, the light-transmitting substrate having a wire pattern, a light-emitting surface and a backlight surface, the wire pattern being disposed on the light-emitting surface; A plurality of LED beads are electrically connected to the wire pattern, and each LED bead has a top surface that faces away from the light-emitting surface. as well as A light-transmitting curable adhesive layer is disposed on the light-emitting surface and covers the wire pattern. The light-transmitting curable adhesive layer has a first surface that is opposite to and parallel to the light-emitting surface. The distance between the first surface and the light-emitting surface is equal to or greater than half the distance between the top surface of the lamp bead and the light-emitting surface, but does not exceed the distance between the top surface of the lamp bead and the light-emitting surface. The light-transmitting substrate has several holes, and the positions of the holes correspond to the positions of the LED beads.

2. The light-transmissive lamp panel according to claim 1, characterized in that: It also includes several light-transmitting curable adhesive covers, wherein the lamp bead has a first portion surrounded by the light-transmitting curable adhesive layer and a second portion exposed by the light-transmitting curable adhesive layer, and the light-transmitting curable adhesive covers cover the second portion of the lamp bead.

3. The light-transmissive lamp panel of claim 2, wherein: The light-transmitting curable adhesive cover contains scattering particles.

4. The light-transmissive lamp panel of claim 2, wherein: The light-transmitting curable adhesive cover and the light-transmitting curable adhesive layer are made of the same material and are integrally formed.

5. The light-transmissive lamp panel according to claim 4, characterized in that: The distance between the first surface and the light-emitting surface exceeds the distance between the top surface of the lamp bead and the light-emitting surface. The first surface has several rough microstructure regions, and the positions of the several rough microstructure regions are respectively located directly above the positions of the several lamp beads.

6. The light-transmissive lamp panel of claim 1, wherein: The hole penetrates the light-transmitting substrate, and the light-transmitting cured adhesive layer extends into the hole.

7. The light-transmissive lamp panel of claim 1, wherein: The light-transmitting substrate has a surrounding side surface connecting the light-emitting surface and the backlight surface, and the light-transmitting curable adhesive layer extends to the surrounding side surface.

8. The light-transmissive lamp panel of claim 1, wherein: It also includes a light-transmitting and heat-dissipating layer, which is attached to the backlight surface, and the material of the light-transmitting and heat-dissipating layer includes indium tin oxide or graphene.

9. A see-through illumination light supplementing luminaire, characterized by: Including the light-transmitting light panel as described in any one of claims 1-8, the light-transmitting lighting supplementary light fixture is adapted to allow ambient light to pass through the light-transmitting substrate and to provide supplementary lighting through a plurality of LED beads when the ambient light is lower than a specific illuminance or brightness.

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