Metal ceramic insert and cutting tool having the same

By setting a binder phase-enriched layer in the central part of the inner wall of the through hole of the metal ceramic insert and optimizing the chip breaker groove design, the problem of abnormal damage and breakage of the metal ceramic insert during high-load cutting is solved, and more stable cutting performance is achieved.

CN116348227BActive Publication Date: 2025-09-19KYOCERA CORP
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Patent Information

Application Number
CN202180071021.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-10-21
Filing Date
2021-10-18
Publication Date
2025-09-19
Estimated Expiration
2041-10-18

AI Technical Summary

Technical Problem

Existing metal ceramic blades are prone to abnormal damage and breakage during high-load cutting, making them difficult to use stably for a long time.

Method used

A bonding phase-enriched layer is provided in the central portion of the inner wall of the through hole of the metal ceramic insert. The thickness of the bonding phase-enriched layer in the central portion is thicker than that in the end portion. Combined with the optimized design of the chip breaker groove, deformation and abnormal damage are suppressed.

Benefits of technology

It effectively suppresses abnormal damage and breakage of the blade, improves cutting stability and durability, and prolongs cutting time.

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Abstract

The metal ceramic insert (1) of the present invention comprises: a first surface (5), a second surface (7), a cutting edge (11) located at least in a portion of the ridgeline of the first surface (5) and the second surface (7), a third surface (9) located on the opposite side of the first surface (5), and a through hole (15) extending from the first surface (5) to the third surface (9). The inner wall (17) constituting the through hole (15) has a binder phase-enriched layer (19) having a higher binder phase content than the inside of the base (3) at least in the central portion. The thickness T1 of the binder phase-enriched layer (19) in the central portion is thicker than the thickness T2 of the binder phase-enriched layer (19) in the end portion. The thickness T1 is greater than 1 μm and less than 20 μm, and the thickness T2 is greater than 0.2 μm and less than 6 μm. In addition, the first surface (5) has a chip breaker groove (50). The arithmetic mean roughness Ra of the chip breaker groove (50) is greater than or equal to 0.1 μm and less than or equal to 0.27 μm when the cutoff value is 0.08 mm.
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