Motion detection method, apparatus, electronic device, and computer medium

Abstract

The present disclosure relates to a motion detection method, device, electronic device and computer medium. The motion detection method applied to the electronic device comprises: obtaining a second detection signal according to a first detection signal from a micro-mechanical based sensor; and determining motion data of the electronic device according to heat interference data of at least one heat generating component in the electronic device and the second detection signal. In this way, by considering the heat interference data of the heat generating component, the interference of heat radiation and heat conduction on the micro-mechanical based sensor can be reduced, thereby improving the motion detection accuracy of the electronic device and making the motion data of the electronic device more accurate.

Description

Technical Field

[0001] This disclosure relates to the field of smart device technology, and in particular to a motion detection method, apparatus, electronic device, and computer medium. Background Technology

[0002] Among related technologies, micromechanical gyroscopes have advantages such as small size, simple structure, and high sensitivity, and have good application prospects in both military and civilian markets.

[0003] In mobile phones, micro-mechanical gyroscopes are integrated on printed circuit boards. During the operation of the mobile phone, the micro-mechanical gyroscope will generate detection errors, which will affect the accuracy of motion detection of the mobile phone. Summary of the Invention

[0004] To overcome the problems existing in related technologies, this disclosure provides a motion detection method, apparatus, electronic device, and computer medium.

[0005] According to a first aspect of the present disclosure, a motion detection method is provided, applied to an electronic device, the method comprising:

[0006] A second detection signal is acquired based on a first detection signal from a micromachined sensor;

[0007] The motion data of the electronic device is determined based on the heat interference data of at least one heat-generating component in the electronic device and the second detection signal.

[0008] Optionally, the heat interference data of the heating component is determined in the following way:

[0009] If the interference data of the heating component is determined to be periodic, then the heating interference data of the heating component is obtained by performing spectrum analysis based on the second detection signal in the time domain.

[0010] Optionally, the heat interference data of the heating component includes a first interference value, and the step of performing spectrum analysis based on the second detection signal in the time domain to obtain the heat interference data of the heating component includes:

[0011] The second detection signal in the time domain is subjected to spectral analysis to obtain the first interference amplitude of the heating component in the frequency domain;

[0012] The first interference value in the time domain is determined based on the first interference amplitude in the frequency domain.

[0013] Optionally, the heat interference data of the heating component includes a second interference value, and the step of performing spectrum analysis based on the second detection signal in the time domain to obtain the heat interference data of the heating component includes:

[0014] Based on the second detection signal in the time domain, the first motion data of the electronic device in the time domain is determined;

[0015] The first motion data in the time domain is subjected to spectral analysis to obtain the second interference amplitude of the heating component in the frequency domain;

[0016] The second interference value in the time domain is determined based on the second interference amplitude in the frequency domain.

[0017] Optionally, the heat interference data of the heating component is determined in the following way:

[0018] The heating interference data of the heating component is determined based on the current input power of the heating component and the preset correspondence between the input power of the heating component and the heating interference data of the heating component.

[0019] Optionally, the heat interference data of the heating component includes a first interference value of the heating component, and the step of determining the motion data of the electronic device based on the heat interference data of at least one heating component in the electronic device and the second detection signal includes:

[0020] The second detection signal is corrected based on the first interference value of the heating component;

[0021] The motion data of the electronic device is determined based on the corrected second detection signal.

[0022] Optionally, the heat interference data of the heating component includes a second interference value of the heating component, and the step of determining the motion data of the electronic device based on the heat interference data of at least one heating component in the electronic device and the second detection signal includes:

[0023] Based on the second detection signal, the first motion data of the electronic device is determined;

[0024] The first motion data is corrected based on the second interference value of the heating component to obtain the second motion data of the electronic device.

[0025] Optionally, obtaining the second detection signal based on the first detection signal from the micromachined sensor includes:

[0026] The first detection signal is low-pass filtered;

[0027] The filtered first detection signal is amplified and converted from analog to digital to obtain the second detection signal.

[0028] Optionally, the micromechanical-based sensor is used to detect acceleration and / or angular velocity, and the heating component includes a WIFI communication module.

[0029] According to a second aspect of the present disclosure, a motion detection device is provided, applied to an electronic device, the device comprising:

[0030] The acquisition module is configured to acquire a second detection signal based on a first detection signal from a micromechanical sensor;

[0031] The determining module is configured to determine motion data of the electronic device based on thermal interference data of at least one heat-generating component in the electronic device and the second detection signal.

[0032] Optionally, the determining module is configured to determine the thermal interference data of the heat-generating component in the following manner:

[0033] If the interference data of the heating component is determined to be periodic, then the heating interference data of the heating component is obtained by performing spectrum analysis based on the second detection signal in the time domain.

[0034] Optionally, the heat interference data of the heat-generating component includes a first interference value, and the determining module is specifically configured to obtain the heat interference data of the heat-generating component by performing spectrum analysis based on the second detection signal in the time domain in the following manner:

[0035] The second detection signal in the time domain is subjected to spectral analysis to obtain the first interference amplitude of the heating component in the frequency domain;

[0036] The first interference value in the time domain is determined based on the first interference amplitude in the frequency domain.

[0037] Optionally, the heat interference data of the heat-generating component includes a second interference value, and the determining module is specifically configured to obtain the heat interference data of the heat-generating component by performing spectrum analysis based on the second detection signal in the time domain in the following manner:

[0038] Based on the second detection signal in the time domain, the first motion data of the electronic device in the time domain is determined;

[0039] The first motion data in the time domain is subjected to spectral analysis to obtain the second interference amplitude of the heating component in the frequency domain;

[0040] The second interference value in the time domain is determined based on the second interference amplitude in the frequency domain.

[0041] Optionally, the determining module is configured to determine the thermal interference data of the heat-generating component in the following manner:

[0042] The heating interference data of the heating component is determined based on the current input power of the heating component and the preset correspondence between the input power of the heating component and the heating interference data of the heating component.

[0043] Optionally, the heating interference data of the heating component includes a first interference value of the heating component, and the determining module includes:

[0044] The first correction submodule is configured to correct the second detection signal based on the first interference value of the heating component;

[0045] The first determining submodule is configured to determine the motion data of the electronic device based on the corrected second detection signal.

[0046] Optionally, the heating interference data of the heating component includes a second interference value of the heating component, and the determining module includes:

[0047] The second determining submodule is configured to determine the first motion data of the electronic device based on the second detection signal;

[0048] The second correction submodule is configured to correct the first motion data based on the second interference value of the heating component to obtain the second motion data of the electronic device.

[0049] Optionally, the acquisition module includes:

[0050] The filtering submodule is configured to perform low-pass filtering on the first detection signal;

[0051] The acquisition submodule is configured to amplify and perform analog-to-digital conversion on the filtered first detection signal to obtain the second detection signal.

[0052] According to a third aspect of the present disclosure, an electronic device is provided, comprising:

[0053] A memory on which computer programs are stored;

[0054] A processor is configured to execute the computer program in the memory to implement the steps of the motion detection method provided in the first aspect of this disclosure.

[0055] According to a fourth aspect of the present disclosure, a non-transitory computer-readable storage medium is provided, having stored thereon computer program instructions that, when executed by a processor, implement the steps of the motion detection method provided in the first aspect of the present disclosure.

[0056] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0057] When determining motion data of electronic devices, taking into account the heat interference data of heating components can reduce the interference of thermal radiation and heat conduction on micromechanical sensors, thereby improving the motion detection accuracy of electronic devices and making the motion data of electronic devices more accurate.

[0058] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0059] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0060] Figure 1 This is a flowchart illustrating a motion detection method according to an exemplary embodiment.

[0061] Figure 2 This is a flowchart illustrating a motion detection method according to another exemplary embodiment.

[0062] Figure 3 This is a flowchart illustrating a motion detection method according to yet another exemplary embodiment.

[0063] Figure 4 This is a flowchart illustrating a motion detection method according to yet another exemplary embodiment.

[0064] Figure 5 This is a block diagram illustrating a motion detection device according to an exemplary embodiment.

[0065] Figure 6 This is a block diagram illustrating an electronic device according to an exemplary embodiment. Detailed Implementation

[0066] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0067] In related technologies, the micromechanical gyroscope in a mobile phone will generate detection errors during the operation of the phone, affecting the motion detection accuracy of the phone.

[0068] The inventors of this disclosure have discovered that during the operation of a mobile phone, the devices and circuits within the phone generate heat radiation and heat conduction on the micromechanical gyroscope. Since the micromechanical gyroscope is sensitive to temperature increases, it can cause errors in the micromechanical gyroscope.

[0069] Based on this, this disclosure provides a motion detection method, apparatus, electronic device, and computer medium to improve the motion detection accuracy of mobile phones when errors occur in micromechanical gyroscopes due to thermal radiation or thermal conduction.

[0070] Figure 1 This is a flowchart illustrating a motion detection method according to an exemplary embodiment. Figure 1 As shown, a motion detection method applicable to electronic devices may include steps S11 and S12.

[0071] In step S11, a second detection signal is obtained based on a first detection signal from a micromechanical sensor. For example, the first detection signal can be an analog signal acquired by a micromechanical sensor, and the second detection signal can be a digital signal. The second detection signal can be obtained by performing analog-to-digital conversion or other processing on the first detection signal.

[0072] In step S12, motion data of the electronic device is determined based on thermal interference data from at least one heat-generating component in the electronic device and the second detection signal. By considering the thermal interference data from at least one heat-generating component when determining the motion data of the electronic device, errors caused by heat in micromechanical sensors can be corrected. Thus, even when the second detection signal of the micromechanical sensor contains errors due to thermal radiation or conduction, the determined motion data of the electronic device can be made more accurate.

[0073] In this embodiment, the motion data of the electronic device may include, for example, at least one of the following: the acceleration of the electronic device and the angular velocity of the electronic device. Correspondingly, when the motion data of the electronic device includes the acceleration of the electronic device, the micromechanical sensor may be a micromechanical accelerometer; when the motion data of the electronic device includes the angular velocity of the electronic device, the micromechanical sensor may be a micromechanical gyroscope.

[0074] For example, the heat interference data of the heat-generating component can be determined in the following way: if the interference data of the heat-generating component is determined to be periodic data, then the heat interference data of the heat-generating component is obtained by performing spectrum analysis based on the second detection signal in the time domain.

[0075] It is understandable that during the operation of electronic devices, some heat-generating components will periodically generate heat conduction or heat radiation. For example, a Wi-Fi module needs to periodically scan networks, so the heat conduction or heat radiation it generates is also periodic, and the errors of micromechanical sensors affected by this are also periodic.

[0076] Therefore, given that the interference data of the heating component is determined to be periodic, spectral analysis is performed on the second detection signal in the time domain to obtain the heating interference data of all periodically interfering heating components. In this way, the periodic interference data of the heating component can be determined through spectral analysis, thereby making the motion data more accurate.

[0077] In one possible implementation, the heat interference data of the heating component may include a first interference value. The step of performing spectrum analysis based on the second detection signal in the time domain to obtain the heat interference data of the heating component may include: performing spectrum analysis on the second detection signal in the time domain to obtain the first interference amplitude of the heating component in the frequency domain; and determining the first interference value in the time domain based on the first interference amplitude in the frequency domain.

[0078] For example, the spectrum analysis of the second detection signal can be performed using the FFT (Fast Fourier Transform) algorithm to obtain the first interference amplitude corresponding to the periodic thermal radiation and thermal conduction within the electronic device. The first interference amplitude can then be subjected to an inverse Fourier transform to obtain the first interference value.

[0079] Figure 2 This is a flowchart illustrating a motion detection method according to another exemplary embodiment. (Refer to...) Figure 2 The above step S12 may include, for example, steps S121 and S122.

[0080] In step S121, the second detection signal is corrected based on the first interference value of the heating component. By correcting the second detection signal, errors caused by heat conduction or radiation from the heating component can be reduced. Subsequently, in step S122, motion data of the electronic device is determined based on the corrected second detection signal.

[0081] In this way, by correcting the second detection signal, the error of the second detection signal can be reduced, thereby making the motion data of the electronic device more accurate.

[0082] The solution presented in this example allows for the determination of a first interference value based on the acquired second detection signal, after which the second detection signal is corrected. This reduces errors caused by periodic thermal radiation or conduction from heat-generating components within the electronic device, resulting in more accurate motion data. Furthermore, this allows for real-time correction during the operation of the electronic device.

[0083] In another possible implementation, the heat interference data of the heat-generating component may include a second interference value. The step of obtaining the heat interference data of the heat-generating component by performing spectrum analysis based on the second detection signal in the time domain may include: determining the first motion data of the electronic device in the time domain based on the second detection signal in the time domain; performing spectrum analysis on the first motion data in the time domain to obtain the second interference amplitude of the heat-generating component in the frequency domain; and determining the second interference value in the time domain based on the second interference amplitude in the frequency domain.

[0084] It is understandable that, without correction to the second detection signal, the first motion data determined based on the second detection signal still contains periodic interference from the heating components. Therefore, by performing spectral analysis on the first motion data in the time domain, the second interference amplitude corresponding to the periodic thermal radiation and heat conduction within the electronic device can be obtained. Subsequently, an inverse Fourier transform can be performed on the second interference amplitude to obtain the second interference values ​​corresponding to all periodic heating components.

[0085] Figure 3 This is a flowchart illustrating a motion detection method according to yet another exemplary embodiment. (Refer to...) Figure 3 The above step S12 may include, for example, steps S123 and S124.

[0086] In step S123, the first motion data of the electronic device is determined according to the second detection signal; in step S124, the first motion data is corrected according to the second interference value of the heating component to obtain the second motion data of the electronic device.

[0087] In this way, the first motion data of the electronic device can be corrected to obtain the second motion data of the electronic device, and the second motion data can be used as the final motion data of the electronic device. Compared with the scheme of correcting the second detection signal based on the first interference value, the scheme in this example can continue to use the existing motion data processing method, and reduce the interference of the heat-generating component by correcting the obtained first motion data, which is easier to implement.

[0088] For example, the heat interference data of the heating component can be determined by: determining the heat interference data of the heating component based on the current input power of the heating component and the preset correspondence between the input power of the heating component and the heat interference data of the heating component.

[0089] In this solution, since the intensity of thermal radiation or thermal conduction of the heating components within the electronic device is related to the input power of the heating components, the input power of the heating components and their corresponding thermal interference data can be calibrated in a laboratory environment. Thus, the thermal interference data of the heating components can be accurately determined based on the input power, while requiring relatively little computation, facilitating rapid determination of the heating interference data.

[0090] For example, the heat interference data of the heating component may include a first interference value corresponding to the second detection signal. During calibration, second detection signals corresponding to different input powers of the heating component can be acquired. For each input power, the second detection signal in the time domain is subjected to spectral analysis to obtain a first interference amplitude in the frequency domain. Subsequently, the first interference value in the time domain can be obtained based on the first interference amplitude. In this way, for each input power of the heating component, a corresponding first interference value can be obtained.

[0091] For example, when the heat conduction or radiation of the heating element exhibits aperiodic properties, after acquiring the second detection signals corresponding to different input powers of the heating element, a trained interference value separation model can be used to obtain the first interference value corresponding to each input power from the second detection signals. Alternatively, the heating element can be controlled to operate independently in a laboratory environment to directly obtain the first interference value corresponding to the heating element. After determining the first interference value corresponding to different input powers, the input power and the first interference value can be fitted to obtain the corresponding fitting function; or, different input powers and their corresponding first interference values ​​can be used as training samples and input into the computational model for training to obtain a trained computational model, such as a support vector machine or a neural network model.

[0092] If the heat interference data of the heat-generating component includes a first interference value corresponding to the second detection signal, the above step S12 may include: correcting the second detection signal according to the first interference value of the heat-generating component; and determining the motion data of the electronic device according to the corrected second detection signal.

[0093] Alternatively, the thermal interference data of the heating component can include a second interference value corresponding to the first motion data. For example, if the error of the micromechanical sensor affected by the heating component is also periodic, the correspondence between the input power of the heating component and the second interference value can be determined as follows: acquire the first motion data corresponding to different input powers of the heating component; for each input power, perform spectral analysis on the first motion data in the time domain to obtain the second interference amplitude in the frequency domain; then, based on the second interference amplitude, obtain the second interference value in the time domain. In this way, for each input power of the heating component, the corresponding second interference value can be obtained.

[0094] For example, when the heat conduction or radiation of a heating component exhibits aperiodic properties, after acquiring the first motion data corresponding to different input powers of the heating component, a trained interference value separation model can be used to obtain the second interference value corresponding to each input power from the first motion data. Alternatively, the heating component can be controlled to operate independently in a laboratory environment to directly obtain the second interference value corresponding to the heating component. After determining the second interference value corresponding to different input powers, the input power and the second interference value can be fitted to obtain the corresponding fitting function; alternatively, different input powers and their corresponding second interference values ​​can be used as training samples and input into the computational model for training to obtain a trained computational model, such as a support vector machine or a neural network model.

[0095] When the heat interference data of the heat-generating component includes a second interference value corresponding to the first motion data, the above step S12 may include: determining the first motion data of the electronic device based on the second detection signal; correcting the first motion data based on the second interference value of the heat-generating component to obtain the second motion data of the electronic device.

[0096] For example, the step of obtaining a second detection signal based on a first detection signal from a micromechanical sensor may include: performing low-pass filtering on the first detection signal; and amplifying and performing analog-to-digital conversion on the filtered first detection signal to obtain the second detection signal.

[0097] In this scheme, low-pass filtering of the first detection signal can reduce carrier frequency interference from other communication modules. Simultaneously, during the movement of the electronic device, the detection signal frequency detected by the micro-mechanical sensor is relatively low; therefore, low-pass filtering has minimal impact on the accuracy of the motion data.

[0098] Figure 4 This is a flowchart illustrating a motion detection method according to yet another exemplary embodiment. (Refer to...) Figure 4 The method may include steps S21 to S27.

[0099] In step S21, a first detection signal from a micromechanical sensor is acquired. For example, the first detection signal can be an analog signal. In step S22, the first detection signal is low-pass filtered. Since the electronic device operates at a low frequency during use, low-pass filtering of the first detection signal can reduce carrier frequency interference from other communication modules (such as a Wi-Fi communication module) while minimizing the impact on the accuracy of the motion data.

[0100] In step S23, the filtered first detection signal is amplified and converted from analog to digital to obtain the second detection signal.

[0101] To determine the periodic interference data of the heating component, in step S24, the second detection signal in the time domain is subjected to spectral analysis to obtain the first interference amplitude of the heating component in the frequency domain. In step S25, based on the first interference amplitude in the frequency domain, the first interference value in the time domain is determined (for example, the first interference value can be determined by inverse Fourier transform). In this way, the first interference value of the heating component in the electronic device on the second detection signal can be determined.

[0102] In step S26, the second detection signal is corrected based on the first interference value, thereby reducing periodic interference from the heating component in the second detection signal. In step S27, the motion data of the electronic device is determined based on the corrected second detection signal.

[0103] The solution in this embodiment reduces carrier frequency interference from other communication modules through low-pass filtering; at the same time, by performing spectrum analysis on the second detection signal, the first interference value of the heating component is determined, and the second detection signal is corrected according to the first interference value, thereby reducing the impact of the periodic interference of the heating component on the second detection signal, and thus making the motion data more accurate.

[0104] Figure 5 This is a block diagram illustrating a motion detection device according to an exemplary embodiment. (Refer to...) Figure 5 The embodiments of this disclosure also provide a motion detection device 400, applied to an electronic device, which may include an acquisition module 401 and a determination module 402.

[0105] The acquisition module 401 can be configured to acquire a second detection signal based on a first detection signal from a micromechanical sensor;

[0106] The determining module 402 can be configured to determine motion data of the electronic device based on heat interference data of at least one heat-generating component in the electronic device and a second detection signal.

[0107] Thus, by considering the heat interference data of the heating components when determining the motion data of electronic devices, the interference of heat radiation and heat conduction on micromechanical sensors can be reduced, thereby improving the motion detection accuracy of electronic devices and making the motion data of electronic devices more accurate.

[0108] For example, the determining module 402 can be configured to determine the heat interference data of the heat-generating component by: if the interference data of the heat-generating component is determined to be periodic data, then performing spectrum analysis based on the second detection signal in the time domain to obtain the heat interference data of the heat-generating component.

[0109] For example, the heat interference data of the heat-generating component may include a first interference value. The determining module 402 may be specifically configured to obtain the heat interference data of the heat-generating component by performing spectrum analysis on the second detection signal in the time domain in the following manner: performing spectrum analysis on the second detection signal in the time domain to obtain the first interference amplitude of the heat-generating component in the frequency domain; and determining the first interference value in the time domain based on the first interference amplitude in the frequency domain.

[0110] For example, the heat interference data of the heat-generating component may include a second interference value. Specifically, the determining module 402 may be configured to perform spectrum analysis based on the second detection signal in the time domain to obtain the heat interference data of the heat-generating component in the following manner: determining the first motion data of the electronic device in the time domain based on the second detection signal in the time domain; performing spectrum analysis on the first motion data in the time domain to obtain the second interference amplitude of the heat-generating component in the frequency domain; and determining the second interference value in the time domain based on the second interference amplitude in the frequency domain.

[0111] For example, the determining module 402 can be configured to determine the heat interference data of the heat-generating component by: determining the heat interference data of the heat-generating component based on the current input power of the heat-generating component and a preset correspondence between the input power of the heat-generating component and the heat interference data of the heat-generating component.

[0112] For example, the heat interference data of the heat-generating component may include a first interference value of the heat-generating component, and the determining module 402 may include: a first correction submodule configured to correct the second detection signal according to the first interference value of the heat-generating component; and a first determining submodule configured to determine the motion data of the electronic device according to the corrected second detection signal.

[0113] For example, the heat interference data of the heat-generating component may include a second interference value of the heat-generating component, and the determining module 402 may include: a second determining submodule configured to determine the first motion data of the electronic device based on the second detection signal; and a second correcting submodule configured to correct the first motion data based on the second interference value of the heat-generating component to obtain the second motion data of the electronic device.

[0114] For example, the acquisition module 401 may include: a filtering submodule configured to perform low-pass filtering on the first detection signal; and an acquisition submodule configured to amplify and perform analog-to-digital conversion on the filtered first detection signal to obtain a second detection signal.

[0115] Regarding the apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments related to the method, and will not be elaborated upon here.

[0116] This disclosure also provides a computer-readable storage medium having stored thereon computer program instructions that, when executed by a processor, implement the steps of the motion detection method provided in this disclosure.

[0117] Figure 6 This is a block diagram illustrating an electronic device 500 according to an exemplary embodiment. For example, the electronic device 500 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0118] Reference Figure 6 The electronic device 500 may include one or more of the following components: processing component 502, memory 504, power component 506, multimedia component 508, audio component 510, input / output (I / O) interface 512, sensor component 514, and communication component 516.

[0119] Processing component 502 typically controls the overall operation of electronic device 500, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 502 may include one or more processors 820 to execute instructions to complete all or part of the steps of the motion detection method described above. Furthermore, processing component 502 may include one or more modules to facilitate interaction between processing component 502 and other components. For example, processing component 502 may include a multimedia module to facilitate interaction between multimedia component 508 and processing component 502.

[0120] Memory 504 is configured to store various types of data to support the operation of electronic device 500. Examples of such data include instructions for any application or method operating on electronic device 500, contact data, phonebook data, messages, pictures, videos, etc. Memory 504 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0121] Power component 506 provides power to various components of electronic device 500. Power component 506 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 500.

[0122] Multimedia component 508 includes a screen that provides an output interface between the electronic device 500 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 508 includes a front-facing camera and / or a rear-facing camera. When the electronic device 500 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0123] Audio component 510 is configured to output and / or input audio signals. For example, audio component 510 includes a microphone (MIC) configured to receive external audio signals when electronic device 500 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 504 or transmitted via communication component 516. In some embodiments, audio component 510 also includes a speaker for outputting audio signals.

[0124] I / O interface 512 provides an interface between processing component 502 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0125] Sensor assembly 514 includes one or more sensors for providing state assessments of various aspects of electronic device 500. For example, sensor assembly 514 may detect the on / off state of electronic device 500, the relative positioning of components such as the display and keypad of electronic device 500, changes in position of electronic device 500 or a component of electronic device 500, the presence or absence of user contact with electronic device 500, orientation or acceleration / deceleration of electronic device 500, and temperature changes of electronic device 500. Sensor assembly 514 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 514 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 514 may also include an accelerometer, gyroscope, magnetometer, pressure sensor, or temperature sensor.

[0126] Communication component 516 is configured to facilitate wired or wireless communication between electronic device 500 and other devices. Electronic device 500 can access wireless networks based on communication standards, such as WiFi, 2G, or 3G, or combinations thereof. In one exemplary embodiment, communication component 516 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 516 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0127] In an exemplary embodiment, the electronic device 500 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the motion detection method described above.

[0128] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 504 including instructions, which can be executed by a processor 820 of an electronic device 500 to complete the motion detection method described above. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0129] In another exemplary embodiment, a computer program product is also provided, which includes a computer program executable by a programmable device, the computer program having a code portion for performing the motion detection method described above when executed by the programmable device.

[0130] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of this disclosure. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0131] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A motion detection method, characterized by, Applied to electronic devices, the method includes: A second detection signal is acquired based on a first detection signal from a micromechanical sensor; the first detection signal is an analog signal acquired by the micromechanical sensor, and the second detection signal is a digital signal obtained by performing analog-to-digital conversion on the first detection signal. Based on the thermal interference data of at least one heat-generating component in the electronic device and the second detection signal, the motion data of the electronic device is determined; wherein, if the interference data of the heat-generating component is determined to be periodic data, then spectral analysis is performed based on the second detection signal in the time domain to obtain the thermal interference data of the heat-generating component.

2. The method of claim 1, wherein, The thermal interference data of the heating component is determined in the following way: If the interference data of the heating component is determined to be periodic, then the heating interference data of the heating component is obtained by performing spectrum analysis based on the second detection signal in the time domain.

3. The method of claim 2, wherein, The heat interference data of the heating component includes a first interference value. The step of performing spectrum analysis based on the second detection signal in the time domain to obtain the heat interference data of the heating component includes: The second detection signal in the time domain is subjected to spectrum analysis to obtain the first interference amplitude of the heating component in the frequency domain; The first interference value in the time domain is determined based on the first interference amplitude in the frequency domain.

4. The method of claim 2, wherein, The heat interference data of the heating component includes a second interference value. The step of performing spectrum analysis based on the second detection signal in the time domain to obtain the heat interference data of the heating component includes: Based on the second detection signal in the time domain, the first motion data of the electronic device in the time domain is determined; The first motion data in the time domain is subjected to spectral analysis to obtain the second interference amplitude of the heating component in the frequency domain; The second interference value in the time domain is determined based on the second interference amplitude in the frequency domain.

5. The method of claim 1, wherein, The thermal interference data of the heating component is determined in the following way: The heating interference data of the heating component is determined based on the current input power of the heating component and the preset correspondence between the input power of the heating component and the heating interference data of the heating component.

6. The method according to any one of claims 1 to 5, characterized in that, The heating interference data of the heating component includes a first interference value of the heating component, which is a value obtained by performing an inverse Fourier transform on a first interference amplitude, and the first interference amplitude is an amplitude obtained by performing spectral analysis on the second detection signal. The step of determining the motion data of the electronic device based on the heat interference data of at least one heat-generating component in the electronic device and the second detection signal includes: The second detection signal is corrected based on the first interference value of the heating component; The motion data of the electronic device is determined based on the corrected second detection signal.

7. The method according to any one of claims 1 to 5, characterized in that, The heating interference data of the heating component includes a second interference value of the heating component. The second interference value is obtained based on the second interference amplitude in the frequency domain. The second interference amplitude in the frequency domain is the amplitude obtained after performing spectral analysis on the first motion data in the time domain. The first motion data in the time domain is obtained based on the second detection signal in the time domain. The step of determining the motion data of the electronic device based on the heat interference data of at least one heat-generating component in the electronic device and the second detection signal includes: Based on the second detection signal, the first motion data of the electronic device is determined; The first motion data is corrected based on the second interference value of the heating component to obtain the second motion data of the electronic device.

8. The method according to any one of claims 1 to 5, characterized in that, The step of acquiring the second detection signal based on the first detection signal from the micromachined sensor includes: The first detection signal is low-pass filtered; The filtered first detection signal is amplified and converted from analog to digital to obtain the second detection signal.

9. The method according to claim 6, characterized in that, The micromechanical-based sensor is used to detect acceleration and / or angular velocity, and the heating component includes a WIFI communication module.

10. A motion detection apparatus, characterized by Applied to electronic devices, the device includes: The acquisition module is configured to acquire a second detection signal based on a first detection signal from a micromechanical sensor; the first detection signal is an analog signal acquired by the micromechanical sensor, and the second detection signal is a digital signal obtained by performing analog-to-digital conversion on the first detection signal; The determining module is configured to determine motion data of the electronic device based on thermal interference data of at least one heat-generating component in the electronic device and the second detection signal; wherein, if the interference data of the heat-generating component is determined to be periodic data, then spectral analysis is performed based on the second detection signal in the time domain to obtain the thermal interference data of the heat-generating component.

11. An electronic device, comprising: include: A memory on which computer programs are stored; A processor for executing the computer program in the memory to implement the steps of the method according to any one of claims 1 to 9.

12. A non-transitory computer-readable storage medium having stored thereon computer program instructions, wherein, When executed by a processor, the program instructions implement the steps of the method according to any one of claims 1 to 9.

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