Optical transceiver module and optical transceiver device

Abstract

The embodiment of the application discloses an optical transceiver module and device, and relates to the technical field of photoelectric signal conversion; the optical transceiver module comprises at least one pair of transceivers, each pair of transceivers comprises a sending end, at least two layers of circuit boards in a stacked structure and a receiving end; wherein the sending end is connected with a first ground plane to form a sending loop; the receiving end is connected with a second ground plane to form a receiving loop; the first ground plane and the second ground plane are arranged in circuit boards of different layers of the at least two layers of circuit boards; wherein the sending loop and the receiving loop are located in the circuit boards of different layers, the influence of electromagnetic waves generated when the receiving end and the sending end perform signal transmission and conversion on each other can be reduced, so that the crosstalk of signals between the receiving end and the sending end is reduced, and since the circuit boards are fixed in layers, the size of the optical transceiver module can meet preset requirements.

Description

Technical Field

[0001] This invention relates to the field of photoelectric signal conversion technology, and in particular to an optical transceiver module and an optical transceiver device. Background Technology

[0002] Current optical transceiver modules typically employ a quad small form factor pluggable-double density (QSFP-DD) package. However, QSFP-DD imposes certain size limitations on optical transceiver modules. Since the signal quality of the receiver and transmitter of an optical transceiver module has a critical impact on its performance, crosstalk between the receiver and transmitter is one of the most significant factors affecting signal quality. Therefore, resolving the crosstalk problem between the receiver and transmitter of an optical transceiver module within a predetermined size range has become an urgent problem to be solved. Summary of the Invention

[0003] The present invention aims to provide an optical transceiver module and an optical transceiver device that can reduce crosstalk between the receiver and transmitter of the optical transceiver module while ensuring that the size of the optical transceiver module meets the preset requirements.

[0004] The technical solution of this invention is implemented as follows:

[0005] This invention provides an optical transceiver module, comprising:

[0006] At least one pair of transceivers, each pair of transceivers including a transmitter, at least two circuit boards, and a receiver; wherein...

[0007] The transmitting end is connected to the output port of the digital signal processing module and is used to convert the electrical signal to be converted into the corresponding target optical signal and send the target optical signal to the optical device.

[0008] The receiving end is connected to the input port of the digital signal processing module, and is used to convert the received optical signal into an electrical signal and send the electrical signal to the digital signal processing module, so that the digital signal processing module can convert the electrical signal into a target electrical signal and send it to the electrical device.

[0009] The transmitting end is fixed on the first circuit board and connected to the first ground plane to form a transmitting loop; the receiving end is fixed on the second circuit board and connected to the second ground plane to form a receiving loop; the first ground plane and the second ground plane are both disposed on different layers of the circuit boards in the at least two circuit boards.

[0010] The at least two circuit boards are stacked.

[0011] In the above scheme,

[0012] The at least two-layer circuit board also includes:

[0013] At least one isolation plate is stacked and fixed between the first circuit board and the second circuit board in a layered structure.

[0014] In the above scheme,

[0015] The first ground plane is disposed on the first circuit board or on the first ground plane; the second ground plane is disposed on the second circuit board or on the second ground plane; wherein, the first ground plane is the circuit board adjacent to the first circuit board in the at least two circuit boards; the second ground plane is the circuit board adjacent to the second circuit board in the at least two circuit boards.

[0016] In the above scheme,

[0017] The first ground plane is located on the side of the first ground plane closest to the first circuit board; the second ground plane is located on the side of the second ground plane closest to the second circuit board.

[0018] In the above scheme,

[0019] The at least two layers of the circuit board are provided with through holes.

[0020] In the above scheme,

[0021] When there is at least one isolation plate between the first circuit board and the first ground plane, the transmitting end is connected to the first ground plane by passing a wire through the corresponding through hole;

[0022] When there is at least one isolation plate between the second circuit board and the second ground plane, the receiving end connects to the second ground plane by passing the wire through the corresponding through hole.

[0023] In the above scheme,

[0024] The projection area of ​​the transmitting end on the second circuit board does not overlap with the area where the receiving end is located.

[0025] In the above scheme,

[0026] A support block is provided on the outer surface of the second circuit board, the support block passes through the second circuit board to the first circuit board, and the transmitting end is disposed on the support block of the first circuit board.

[0027] In the above scheme,

[0028] Therefore, the first side of the transmitting end is lower than or flush with the outer surface of the first circuit board; the first side of the transmitting end is parallel to the first circuit board and away from the support block.

[0029] In the above scheme,

[0030] The receiving end includes N ports;

[0031] The N ports are respectively located on both sides of the support block on the second circuit board, or...

[0032] All N ports are located on one side of the support block on the second circuit board.

[0033] In the above scheme,

[0034] The first circuit board is the first layer of the at least two circuit boards, and the second circuit board is the last layer of the at least two circuit boards.

[0035] In the above scheme,

[0036] The transmitting end is connected to the digital signal processing module via a first wire, and the receiving end is connected to the digital signal processing module via a second wire; wherein the first wire and the second wire are respectively disposed in different layers of the circuit board in at least two layers of the circuit board, or pass through the through holes on the at least two layers of the circuit board to the digital signal processing module.

[0037] In the above scheme,

[0038] The first conductive wire is disposed on the outer surface of the first circuit board, and the second conductive wire passes through the vias on the at least two layers of circuit boards to the digital signal processing module; or...

[0039] The second conductor is disposed on the outer surface of the second circuit board, and the first conductor passes through the via on the at least two layers of circuit boards to the digital signal processing module.

[0040] This invention provides an optical transceiver device, which includes an optical transceiver module, a digital signal processing module, electrical components, and optical components as described in this invention embodiment; wherein,

[0041] The electrical device is coupled to the digital signal processing module, the digital signal processing module is coupled to the optical transceiver module, and the optical transceiver module is coupled to the optical device.

[0042] The digital signal processing module is used to process the electrical signal sent by the electrical device to obtain the electrical signal to be converted, and send the electrical signal to be converted to the transmitting end in the optical transceiver module so that the transmitting end can convert the electrical signal to be converted into the target optical signal.

[0043] Alternatively, the electrical signal transmitted by the receiving end in the optical transceiver module can be converted into a target electrical signal, and the target electrical signal can be transmitted to the electrical device.

[0044] The optical device is used to receive the target optical signal transmitted by the transmitting end, or to transmit an optical signal to the receiving end;

[0045] The electrical device is used to receive the target electrical signal sent by the digital signal processing module, or to send the electrical signal to the digital signal processing module.

[0046] In the above scheme,

[0047] The digital signal processing module is mounted on the first circuit board, and the second circuit board is connected to the first circuit board by means of a second wire passing through the through holes on at least two layers of circuit boards.

[0048] In the above scheme,

[0049] The digital signal processing module is mounted on the second circuit board. The first circuit board is connected to the second circuit board via a first wire passing through a via on at least two layers of circuit boards.

[0050] This invention provides an optical transceiver module and an optical transceiver device. The optical transceiver module includes at least one pair of transceivers, wherein each pair of transceivers includes a transmitting end, at least two circuit boards, and a receiving end. The transmitting end is connected to the output port of a digital signal processing module, and the receiving end is connected to the input port of the digital signal processing module. The transmitting end is fixed on a first circuit board and connected to a first ground plane to form a transmitting loop. The receiving end is fixed on a second circuit board and connected to a second ground plane to form a receiving loop. The first ground plane and the second ground plane are both disposed on different layers of the at least two circuit boards. The at least two circuit boards are in a stacked structure.

[0051] By connecting the transmitting end to the first ground plane and the receiving end to the second ground plane in a transmitting loop and a receiving loop formed in different layers of the circuit board, the electromagnetic waves generated by the receiving end and the transmitting end during signal transmission and conversion can be reduced to reduce crosstalk between the receiving end and the transmitting end. Furthermore, since the circuit boards are all fixed in layers, the size of the optical transceiver module can be guaranteed to meet the preset requirements. Attached Figure Description

[0052] Figure 1 A schematic diagram of the structure of an optical transceiver module provided in an embodiment of the present invention. Figure One ;

[0053] Figure 2 This is a schematic diagram of the structure of a transceiver provided in an embodiment of the present invention (at least two circuit boards are not shown in the figure);

[0054] Figure 3 A side perspective view of an optical transceiver module provided in an embodiment of the present invention;

[0055] Figure 4 A schematic diagram of the structure of an optical transceiver module provided in an embodiment of the present invention. Figure Two ;

[0056] Figure 5 A top perspective view of an optical transceiver module provided in an embodiment of the present invention;

[0057] Figure 6 A schematic diagram of the structure of an optical transceiver module provided in an embodiment of the present invention. Figure Three ;

[0058] Figure 7 This is a structural block diagram of an optical transceiver device provided in an embodiment of the present invention. Detailed Implementation

[0059] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0060] This invention provides an optical transceiver module. Figure 1 A schematic diagram of the structure of an optical transceiver module provided in an embodiment of the present invention. Figure One ,like Figure 1 As shown, the optical transceiver module 1 includes:

[0061] At least one pair of transceivers 11, each pair of transceivers 11 including a transmitter 111, at least two circuit boards 12, and a receiver 112; wherein...

[0062] The transmitter 111 is connected to the output port of the digital signal processing module 2 and is used to convert the electrical signal to be converted into the corresponding target optical signal and send the target optical signal to the optical device 4.

[0063] The receiver 112 is connected to the input port of the digital signal processing module 2 and is used to convert the received optical signal into an electrical signal and send the electrical signal to the digital signal processing module 2 so that the digital signal processing module 2 can convert the electrical signal into a target electrical signal and send it to the electrical device 3.

[0064] The transmitting end 111 is fixed on the first circuit board 121 and connected to the first ground plane to form a transmitting loop; the receiving end 112 is fixed on the second circuit board 122 and connected to the second ground plane to form a receiving loop; the first ground plane and the second ground plane are both disposed on different layers of the circuit boards in at least two circuit boards 12.

[0065] At least two circuit boards 12 are stacked.

[0066] In this embodiment of the invention, Figure 2 This is a schematic diagram of the structure of a transceiver provided in an embodiment of the present invention (at least two circuit boards 12 are not shown in the figure), such as Figure 2 As shown, transceiver 11 is used to convert photoelectric signals. Each optical transceiver module 1 can be equipped with one or more transceivers 11. In practical applications, transceiver 11 can be connected to digital signal processing module 2 and optical device 4 respectively, while digital signal processing module 2 is connected to electrical device 3. When electrical device 3 needs to convert electrical signals into optical signals for transmission, electrical device 3 sends the electrical signals to digital signal processing module 2. Digital signal processing module 2 processes the electrical signals, constructs them into a signal to be converted that meets the requirements of transmitter 111, and sends the signal to be converted to transmitter 111. After receiving the signal to be converted, transmitter 111 converts it into a corresponding target optical signal and outputs the target optical signal to optical device 4. When receiver 112 receives the optical signal sent by optical device 4, receiver 112 converts the optical signal into a corresponding electrical signal and sends the electrical signal to digital signal processing module 2. Digital signal processing module 2 constructs the electrical signal into a target electrical signal that meets the receiving requirements of electrical device 3 and sends the target electrical signal to electrical device 3, thereby realizing data interaction between electrical device 3 and optical device 4.

[0067] In this embodiment of the invention, the transmitting end 111 and the receiving end 112 are disposed on two different circuit boards in at least two circuit boards 12; wherein, the transmitting end 111 is fixed on the first circuit board 121; the receiving end 112 is fixed on the second circuit board 122; the transmitting end 111 and the receiving end 112 are respectively disposed on the side opposite to the first circuit board 121 and the second circuit board 122, that is, the transmitting end 111 is fixed on the side of the first circuit board 121 away from the second circuit board 122, and the receiving end 112 is fixed on the side of the second circuit board 122 away from the first circuit board 121; for example, the first circuit board 121 is circuit board A and the second circuit board 122 is circuit board B, then the transmitting end 111 can be fixed on the side of circuit board A away from circuit board B, and the receiving end 112 can be fixed on the side of circuit board B away from circuit board A; that is, the vertical positions of the transmitting end 111, the receiving end 112, circuit board A and circuit board B can be transmitted as transmitting end 111-circuit board A-circuit board B-receiving end 112.

[0068] In this embodiment of the invention, at least two circuit boards 12 are stacked, meaning each circuit board in the at least two circuit boards 12 overlaps with its adjacent circuit board. Each circuit board includes a metal coating and a dielectric layer; the dielectric layer, made of an insulating material, maintains insulation between the lines on the metal coating and the other layers, and is also known as a substrate. The metal coating is formed by depositing a metal material onto the dielectric layer. The transmitting end 111 and the receiving end 112 can be fixed to the corresponding circuit board by soldering to the metal coating. In practical applications, the metal coating can be copper, tin, etc. Each circuit board can have one metal coating and one dielectric layer, or two metal coatings and one dielectric layer, with the dielectric layer located between the two metal coatings.

[0069] In this embodiment of the invention, the transmitting end 111 can be fixed to the first circuit board 121 by welding to the metal coating of the first circuit board 121; the receiving end 112 can be fixed to the second circuit board 122 by welding to the metal coating of the second circuit board 122.

[0070] In this embodiment of the invention, the transmitting end 111 is connected to the first ground plane to form a transmitting loop; the receiving end 112 is connected to the second ground plane to form a receiving loop; the first ground plane and the second ground plane are disposed on different layers of the circuit boards in at least two circuit boards 12. Both the first ground plane and the second ground plane are GND (Ground, wire grounding end) planes; in practical applications, the GND plane can represent the negative terminal of the power supply. The first ground plane and the second ground plane can also represent a grounding point, which is not limited in this embodiment of the invention.

[0071] In this embodiment of the invention, the transmitting end 111 can be connected to the first ground plane through a transmitting end wire, and the receiving end 112 can also be connected to the second ground plane through a receiving end wire; wherein, the transmitting end wire and the receiving end wire can be non-intersecting to avoid crosstalk between the transmitting end 111 and the receiving end 112 when transmitting signals.

[0072] In this embodiment of the invention, in order to ensure that the size of the optical transceiver module 1 meets the preset requirements, the thickness of each of the at least two circuit boards 12 can be 1mm; wherein, the preset requirements for the size of the optical transceiver module 1 can be in accordance with the size restrictions of QSFP-DD.

[0073] It is understandable that the first ground plane and the second ground plane are set on different layers of the circuit board in at least two layers of circuit, so that the transmitting loop formed by the ground of the transmitting end 111 and the receiving loop formed by the ground of the receiving end 112 are at a certain distance. In this way, the crosstalk between the transmitting end 111 and the receiving end 112 can be reduced when transmitting and converting signals. And since the at least two layers of circuit board 12 are stacked, the size of the optical transceiver module 1 can be reduced as much as possible.

[0074] In some embodiments of the present invention, the first ground plane is disposed on the first circuit board 121 or on the first ground plane 123; the second ground plane is disposed on the second circuit board 122 or on the second ground plane 124; wherein, the first ground plane 123 is a circuit board adjacent to the first circuit board 121 in at least two layers of circuit boards 12; and the second ground plane 124 is a circuit board adjacent to the second circuit board 122 in at least two layers of circuit boards 12.

[0075] In some embodiments of the present invention, when at least two circuit boards 12 are three-layered, the first ground plane 123 and the second ground plane 124 are the same circuit board, and the first ground plane and the second ground plane are respectively disposed on both sides of the circuit board; when at least two circuit boards 12 are four-layered, the first ground plane 123 is the circuit board adjacent to the first circuit board 121 in the at least two circuit boards 12; the second ground plane 124 is the circuit board adjacent to the second circuit board 122 in the at least two circuit boards 12.

[0076] In some embodiments of the present invention, the first ground plane is disposed on the side of the first ground plane 123 near the first circuit board 121; the second ground plane is disposed on the side of the second ground plane 124 near the second circuit board 122.

[0077] In some embodiments of the present invention, for example, in at least two layers of circuit boards 12, the first circuit board 121 is circuit board A, the second circuit board 122 is circuit board B, the first ground plane 123 is circuit board a, and the second ground plane 124 is circuit board b; then the transmitting end 111 is fixed on the side of circuit board A away from circuit board B, and the pin of the transmitting end 111 for grounding is connected to the first ground plane of circuit board a near the side of circuit board A; the receiving end 112 can be fixed on the side of circuit board B away from circuit board A, and the pin of the receiving end 112 for grounding is connected to the second ground plane of circuit board b near the side of circuit board B; that is, the stacking direction of the transmitting end 111, the receiving end 112, circuit board A, circuit board B, circuit board a, and circuit board b in the vertical direction can be: transmitting end 111-circuit board A-circuit board a-circuit board b-circuit board B-receiving end 112.

[0078] It is understandable that when the transmitting end 111 is connected to the first ground plane and the receiving end 112 is connected to the second ground plane, the resulting transmitting loop and receiving loop are located on different planes. In this way, when the transmitting end 111 and the receiving end 112 are transmitting and converting signals, the influence of the transmitting loop and the receiving loop on each other's signals can be reduced, thereby reducing crosstalk of the signals of the optical transceiver module 1.

[0079] In some embodiments of the present invention, at least two circuit boards 12 further include:

[0080] At least one layer of isolation plate 125 is stacked and fixed between the first circuit board 121 and the second circuit board 122.

[0081] In some embodiments of the present invention, at least one isolation plate 125 is fixed between the first circuit board 121 and the second circuit board 122 to increase the distance between the transmitting end 111 and the receiving end 112, thereby improving the isolation effect between the transmitting end 111 and the receiving end 112.

[0082] In some embodiments of the present invention, in practical applications, circuits can be designed on the metal coating of the isolation plate according to actual needs, connecting the transmitting end 111 and the receiving end 112 to the aforementioned circuits, so that the signals transmitted by the optical transceiver module 1 can be further processed. The aforementioned circuits can be amplifier circuits, filter circuits, etc., and the embodiments of the present invention are not limited thereto.

[0083] In some embodiments of the present invention, at least one isolation plate 125 can be a five-layer isolation plate, which is fixed between the first circuit board 121 and the second circuit board 122; wherein, between each adjacent pair of isolation plates, the dielectric layer and the metal coating can be stacked symmetrically. For example, the first circuit board 121 is circuit board A, the second circuit board 122 is circuit board B, the first ground plane 123 is circuit board a, the second ground plane 124 is circuit board b, and the five isolation plates are, in sequence, isolation plate C, isolation plate D, isolation plate E, isolation plate F, and isolation plate G. Then, the fixing sequence of the optical transceiver module 1 along the vertical direction can be: transmitting end 111 - circuit board A - circuit board a - isolation plate C - isolation plate D - isolation plate E - isolation plate F - isolation plate G - circuit board b - circuit board B - receiving end 112. If circuit board A is composed of dielectric layer A1 and metal coating A2, circuit board B is composed of dielectric layer B1 and metal coating B2; circuit board a is composed of dielectric layer a1 and metal coating a2, circuit board b is composed of dielectric layer b1 and metal coating b2, isolation plate C is composed of dielectric layer C1 and metal coating C2, isolation plate D is composed of dielectric layer D1 and metal coating D2, isolation plate E is composed of dielectric layer E1 and metal coating E2, isolation plate F is composed of dielectric layer F1 and metal coating F2, and isolation plate G is composed of dielectric layer G1 and metal coating G2, then the order of the dielectric layer and metal coating in the vertical direction of the above optical transceiver module 1 can be: A2-A1-a2-a1-C2-C1-D2-D1-E2-E1-F1-F2-G1-G2-b1-b2-B1-B2

[0084] Understandably, the isolation plate can increase the distance between the transmitter 111 and the receiver 112, thereby isolating the transmitter 111 and the receiver 112 and reducing crosstalk of signals in the above-mentioned optical transceiver module 1 application.

[0085] In some embodiments of the present invention, Figure 3 This is a side perspective view of an optical transceiver module provided in an embodiment of the present invention. Figure 4 A schematic diagram of the structure of an optical transceiver module provided in an embodiment of the present invention. Figure Two ;like Figure 3 , 4 As shown; in the optical transceiver module 1 provided in the embodiment of the present invention, at least two circuit boards 12 are provided with through holes 16.

[0086] In some embodiments of the present invention, the via 16 can be a metal via. The transmitting end 111 can be connected to the first ground plane 123 via a wire passing through the via 16 on the first circuit board 121; the receiving end 112 can be connected to the second ground plane 124 via a wire passing through the via 16 on the second circuit board 122. In practical applications, if one of the at least one layer of the isolation plate 125 has a processing circuit etched on it, the output end of the receiving end 112 can be connected to the circuit board with the etched processing circuit via a wire passing through the second circuit board 122 and electrically connected to the processing circuit. Thus, after the receiving end 112 receives the optical signal, converts the optical signal into an electrical signal and outputs it, the electrical signal will pass through the processing circuit and be processed.

[0087] In some embodiments of the present invention, when there is at least one isolation plate 125 between the first circuit board 121 and the first ground plane 123, the transmitting end 111 is connected to the first ground plane 123 by passing a wire through the corresponding through hole 16; when there is at least one isolation plate 125 between the second circuit board 122 and the second ground plane 124, the receiving end 112 is connected to the second ground plane 124 by passing a wire through the corresponding through hole 16.

[0088] Understandably, in practical applications, when the transmitting end 111 or the receiving end 112 needs to be connected to the target layer circuit board in at least two circuit boards 12, a wire can be used to pass through the through hole 16 to the target layer circuit board to achieve the connection. This eliminates the need to run wires on the outside of at least two circuit boards 12, allows control over the distance between wires, and reduces crosstalk of signals in the application of the optical transceiver module 1.

[0089] Figure 5 A top perspective view of an optical transceiver module provided in an embodiment of the present invention, as shown below. Figure 5 As shown, in some embodiments of the present invention, the projection area of ​​the transmitting end 111 on the second circuit board 122 does not overlap with the area where the receiving end 112 is located.

[0090] In some embodiments of the present invention, the transmitting end 111 projects onto the second circuit board 122 to obtain a corresponding projection area, and the projection area does not overlap with the area where the receiving end 112 is located.

[0091] Understandably, this can reduce crosstalk between the receiver 112 and the transmitter 111 during the application process.

[0092] In some embodiments of the present invention, a support block 15 is provided on the outer surface of the second circuit board 122, the support block 15 passes through the second circuit board 122 to the first circuit board 121, and the transmitting end 111 is provided on the support block 15 of the first circuit board 121.

[0093] In some embodiments of the present invention, such as Figures 3-5 As shown, a support block 15 is provided on the second circuit board 122. The support block 15 passes through all the circuit boards between the second circuit board 122 and the first circuit board 121, and also passes through the first circuit board 121, so that the transmitting end 111 can be disposed on the support block 15 of the first circuit board 121. The support block 15 is fixed to the second circuit board 122 by soldering, and the transmitting end 111 can be placed on the outer surface of the support block 15 away from the second circuit board 122 and is not fixed to the outer surface of the support block 15, or it can be fixed to the outer surface of the support block 15.

[0094] In some embodiments of the present invention, the transmitting end 111 is fixed to the first circuit board 121 by a fixing member. The fixing member may be a gold wire for packaging, with one end of the gold wire fixed to the transmitting end 111 and the other end fixed to the first circuit board 121, thereby achieving the fixing of the transmitting end 111 to the first circuit board 121.

[0095] In some embodiments of the present invention, the support block 15 may be a tungsten copper block. Since the tungsten copper block has good heat dissipation performance, the heat dissipation performance of the transceiver 11 is improved.

[0096] Understandably, the support block 15 can serve as a limiting element, making it less likely for the circuit boards 15 penetrating at least two layers of circuit boards 12 to shift, thereby improving the stability of the stacked structure of at least two layers of circuit boards 12.

[0097] In some embodiments of the present invention, the first side of the transmitting end 111 is lower than or flush with the outer surface of the first circuit board 121; the first side of the transmitting end 111 is parallel to the first circuit board 121 and away from the support block 15.

[0098] In some embodiments of the present invention, when the support block 15 penetrates the first circuit board 121, the support block 15 is parallel to the first circuit board 121 and located on one side of the first circuit board 121. A groove is formed between the support block 15 and the side surface of the through groove formed when the support block 15 penetrates the first circuit board 121. When the transmitting end 111 is disposed on the support block 15 of the first circuit board 121, the transmitting end 111 will be located in the groove. The depth of the groove is greater than or equal to the thickness of the transmitting end 111, such that the side of the transmitting end 111 that is parallel to the first circuit board 121 and away from the support block 15 is lower than or flush with the outer surface of the first circuit board 121.

[0099] Understandably, the first side of the transmitter 111 does not protrude from the first circuit board 121. On the one hand, this can reduce the size of the optical transceiver module 1. On the other hand, in practical applications, it is not easy to touch the transmitter 111, which can reduce the probability of the transmitter 111 being damaged, thereby extending the service life of the transmitter 111.

[0100] In some embodiments of the present invention, the receiving end 112 includes N ports; the N ports are respectively disposed on both sides of the support block 15 on the second circuit board 122, or the N ports are all disposed on one side of the support block 15 on the second circuit board 122.

[0101] In some embodiments of the present invention, N can be any positive integer; when N is 1, the receiving end 112 includes one port, which is located on one side of the support block 15 on the second circuit board 122; when N is greater than or equal to 2, the receiving end 112 includes multiple ports, which are located on both sides of the support block 15 on the second circuit board 122; or, located on any side of the support block 15 on the second circuit board 122. The embodiments of the present invention are not limited.

[0102] In some embodiments of the present invention, such as Figure 5 As shown, for example, the receiver 112 may include two ports, each of which has four channels. The receiver 112 can receive optical signals through the eight channels on the two ports. Correspondingly, the transmitter 111 should have eight channels for receiving electrical signals. When the signal rate of each of the 16 channels of the receiver 112 and the transmitter 111 is 100 Gbit / s, the optical transceiver module 1 is an 800 G optical transceiver module.

[0103] It is understandable that the port of the receiver 112 is located on the side of the support block 15, so that the projection area of ​​the transmitter 111 on the second circuit board 122 does not overlap with the area of ​​the receiver 112 on the second circuit board 122, thereby reducing the crosstalk between the receiver 112 and the transmitter 111 during the application process.

[0104] In some embodiments of the present invention, the first circuit board 121 is the first layer of at least two circuit boards 12, and the second circuit board 122 is the last layer of at least two circuit boards 12.

[0105] In some embodiments of the present invention, in at least two layers of circuit boards 12, all circuit boards except the first circuit board 121 and the second circuit board 122 are disposed between the first circuit board 121 and the second circuit board 122.

[0106] Understandably, this maximizes the distance between the transmitter 111 and the receiver 112, thereby reducing crosstalk between the receiver 112 and the transmitter 111 during application.

[0107] In some embodiments of the present invention, the transmitting end 111 is connected to the digital signal processing module 2 via a first wire 1111, and the receiving end 112 is connected to the digital signal processing module 2 via a second wire 1121; wherein the first wire 1111 and the second wire 1121 are respectively disposed in different layers of the circuit boards of at least two circuit boards 12, or pass through the through holes 16 on the at least two circuit boards 12 to the digital signal processing module 2.

[0108] In some embodiments of the present invention, for example, when the digital signal processing module 2 is disposed on any one of the at least two circuit boards 12, or on a circuit board other than the at least two circuit boards 12, the transmitting end 111 can pass through the through hole 16 through the first wire 1111 to the circuit board where the digital signal processing module 2 is located and connect to the digital signal processing module 2; the receiving end 112 can pass through the through hole 16 through the second wire 1121 to the circuit board where the digital signal processing module 2 is located and connect to the digital signal processing module 2; wherein, the first wire 1111 and the second wire 1121 should pass through the through hole 16 on different layers of circuit boards to the circuit board where the digital signal processing module 2 is located.

[0109] Understandably, this avoids the first wire 1111 intersecting with the second wire 1121, reducing crosstalk between the receiver 112 and the transmitter 111.

[0110] In some embodiments of the present invention, a first conductive wire 1111 is disposed on the outer surface of a first circuit board 121, and a second conductive wire 1121 passes through vias 16 on at least two layers of circuit boards 12 to a digital signal processing module 2; or,

[0111] The second wire 1121 is disposed on the outer surface of the second circuit board 122, and the first wire 1111 passes through the through holes 16 on at least two layers of circuit boards 12 to the digital signal processing module 2.

[0112] In some embodiments of the present invention, such as Figure 3 As shown, when the digital signal processing module 2 is mounted on the first circuit board 121, the transmitting end 111 is connected to the digital signal processing module 2 through the first wire 1111, and the receiving end 112 passes through the through holes 16 on at least two layers of circuit boards 12 through the second wire 1121 to the first circuit board 121 and is connected to the digital signal processing module 2.

[0113] In some embodiments of the present invention, when the digital signal processing module 2 is disposed on the second circuit board 122, the receiving end 112 is connected to the digital signal processing module 2 through the second wire 1121, and the transmitting end 111 passes through the through holes 16 on at least two layers of circuit boards 12 through the first wire 1111 to the second circuit board 122 and is connected to the digital signal processing module 2.

[0114] In some embodiments of the present invention, the first conductor 1111 can be fixed to the first circuit board 121 using a clamp or an insulator, and the second conductor 1121 can be fixed to the second circuit board 122 using a clamp or an insulator to prevent movement of the first conductor 1111 and the second conductor 1121. A solder resist ink layer can be provided on the outer surfaces of the first circuit board 121 and the second circuit board 122 to prevent short circuits caused by contact between a damaged first conductor 1111 and the metal coating of the first circuit board 121, or by a damaged second conductor 1121 and the metal coating of the second circuit board 122.

[0115] It is understandable that the first conductor 1111 and the second conductor 1121 are located in different planes, which can reduce crosstalk between the signals of the receiving end 112 and the transmitting end 111.

[0116] In some embodiments of the present invention, based on Figure 6 , Figure 6 A schematic diagram of the structure of an optical transceiver module provided in an embodiment of the present invention. Figure Three ,like Figure 6 As shown, the optical transceiver module 1 provided in this embodiment of the invention includes:

[0117] Printed Circuit Board (PCB);

[0118] A tungsten copper block (support block 15) is soldered to the BOTTOM side (second circuit board 122) of the PCB, and the tungsten copper block penetrates the PCB to the TOP side (first circuit board 121); a DSP unit (digital signal processing module 2) is fixed on the TOP side of the PCB.

[0119] The rx trace (second conductor 1121) at the rx (receive) end is fixed on the BOTTOM side of the PCB.

[0120] The TX (transport) end's TX trace (first conductor 1111) is fixed on the TOP side of the PCB;

[0121] The TX end (transmitter 111) is placed on a tungsten copper block and connected to the TX trace on the TOP side of the PCB through gold wire (fixture).

[0122] The rx end (receiver 112) is fixed to the BOTTOM side of the PCB.

[0123] In some embodiments of the present invention, the PCB stack-up structure includes 10 sub-PCBs with a thickness of 1mm, and the 10 sub-PCBs are stacked sequentially in a vertical direction. The first sub-PCB is the TOP surface of the PCB, and the tenth sub-PCB is the BOTTOM surface of the PCB. The second sub-PCB near the first sub-PCB and the ninth sub-PCB near the tenth sub-PCB both have GND planes (first ground plane and second ground plane), i.e., the second sub-PCB is the first ground plane 123, and the ninth sub-PCB is the second ground plane 124.

[0124] In some embodiments of the present invention, the tx terminal is placed on the tungsten copper block and is flush with the outer surface of the TOP surface, and the tx trace is on the TOP surface of the PCB; the rx terminal is placed on the BOTTOM surface of the PCB, and the rx trace is on the BOTTOM surface of the PCB; the tx terminal and the rx terminal do not overlap in the vertical projection direction of the PCB and belong to the TOP surface and BOTTOM surface of the PCB respectively, which reduces crosstalk of high-speed signals from the tx terminal and the rx terminal.

[0125] It is understood that, in this embodiment of the invention, by fixing the TX end and RX end to the TOP and BOTTOM surfaces of the PCB respectively, a certain distance is maintained between the TX end and RX end. Combined with the layout of the TX end and RX end not overlapping in the vertical projection direction of the PCB and belonging to the TOP and BOTTOM surfaces of the PCB respectively, as well as the design of the GND plane, the goal of reducing high-speed signal crosstalk is achieved while ensuring that the size of the optical transceiver module 1 meets the preset size.

[0126] Figure 7 This is a structural block diagram of an optical transceiver device provided in an embodiment of the present invention, as shown below. Figure 7 As shown, this embodiment of the invention also provides an optical transceiver device 5, which includes an optical transceiver module 1, a digital signal processing module 2, an electrical component 3, and an optical component 4; wherein,

[0127] Electrical component 3 is coupled to digital signal processing module 2, digital signal processing module 2 is coupled to optical transceiver module 1, and optical transceiver module 1 is coupled to optical component 4.

[0128] The digital signal processing module 2 is used to process the electrical signal sent by the electrical device 3 to obtain the electrical signal to be converted, and send the electrical signal to be converted to the transmitter 111 in the optical transceiver module 1 so that the transmitter 111 converts the electrical signal to be converted into the target optical signal.

[0129] Alternatively, the electrical signal transmitted by the receiver 112 in the optical transceiver module 1 can be converted into a target electrical signal and then transmitted to the electrical device 3.

[0130] Optical device 4 is used to receive the target optical signal sent by transmitter 111, or to send an optical signal to receiver 112;

[0131] Electrical device 3 is used to receive target electrical signals sent by digital signal processing module 2, or to send electrical signals to digital signal processing module 2.

[0132] In this embodiment of the invention, the electrical device 3 is used to receive or output electrical signals, and the optical device 4 is used to receive or output optical signals. In practical applications, when the electrical device 3 needs to perform long-distance data transmission, the electrical device 3 carries the information to be transmitted in the electrical signal and outputs the electrical signal to the digital signal processing module 2. After receiving the electrical signal sent by the electrical device 3, the digital signal processing module 2 processes the electrical signal to obtain the electrical signal to be converted, and sends the electrical signal to be converted to the transmitting end 111 in the optical transceiver module 1. After receiving the electrical signal to be converted, the transmitting end 111 converts the electrical signal to be converted into the corresponding target optical signal, and then sends the target optical signal to the optical device 4. The optical device 4 can obtain the information to be transmitted by the electrical device 3 through the target optical signal. When optical device 4 needs to transmit information to electrical device 3, optical device 4 carries the information to be transmitted in an optical signal and outputs the optical signal to the receiver 112 in optical transceiver module 1. After receiving the optical signal, receiver 112 converts the optical signal into an electrical signal and sends the electrical signal to digital signal processing module 2. After receiving the electrical signal sent by receiver 112, digital signal processing module 2 processes the electrical signal to obtain the target electrical signal and sends the target electrical signal to electrical device 3. Electrical device 3 can obtain the information to be transmitted by optical device 4 through the target electrical signal.

[0133] It is understandable that, since the crosstalk of the signal from the optical transceiver module 1 is relatively small, the optical transceiver device 5 improves the signal transmission quality when transmitting signals through the optical transceiver module 1, thereby enhancing the performance of the optical transceiver device.

[0134] In some embodiments of the present invention, the digital signal processing module 2 is disposed on the first circuit board 121, and the second circuit board 122 is connected to the first circuit board 121 by means of the second wire 1121 passing through the through holes 16 on at least two layers of circuit boards 12.

[0135] In some embodiments of the present invention, when the digital signal processing module 2 is disposed on the first circuit board 121, it passes through the first wire 1111 and the digital signal processing terminal 112 through the second wire 121 through the through hole 16 on at least two layers of circuit board 12 to the first circuit board 121 and connects with the digital signal processing module 2.

[0136] In some embodiments of the present invention, the digital signal processing module 2 is disposed on the second circuit board 122, and the first circuit board 121 is connected to the second circuit board 122 by means of the first wire 1111 passing through the through holes 16 on at least two layers of circuit boards 12.

[0137] It is understandable that when the receiver 112 and the transmitter 111 are connected to the digital signal processing module 2, the first wire 1111 and the second wire 1121 are located in different planes, which can reduce crosstalk between the signals in the receiver 112 and the transmitter 111.

[0138] It should be understood that the terms "one embodiment," "an embodiment," "some embodiments," or "other embodiments" used throughout the specification mean that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, phrases such as "in one embodiment," "in some embodiments," or "in other embodiments" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of the invention, the sequence numbers of the above-described processes do not imply a sequential order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the invention. The sequence numbers of the above-described embodiments are merely descriptive and do not represent the superiority or inferiority of the embodiments. The descriptions of the various embodiments above tend to emphasize the differences between the various embodiments; their similarities or commonalities can be referred to mutually, and for the sake of brevity, they will not be repeated here.

[0139] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three kinds of relationships. For example, object A and / or object B can represent three situations: object A exists alone, object A and object B exist simultaneously, and object B exists alone.

[0140] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0141] In the several embodiments provided by this invention, it should be understood that the disclosed device can be implemented in other ways. The embodiments described above are merely illustrative. For example, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods, such as: multiple modules or components can be combined, or integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the various components shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or modules can be electrical, mechanical, or other forms.

[0142] The features disclosed in the several product embodiments provided by this invention can be arbitrarily combined without conflict to obtain new product embodiments.

[0143] The above description is merely an embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An optical transceiver module, characterized in that, include: At least one pair of transceivers, each pair of transceivers including a transmitter, at least two circuit boards, and a receiver; wherein... The transmitting end is connected to the output port of the digital signal processing module and is used to convert the electrical signal to be converted into the corresponding target optical signal and send the target optical signal to the optical device. The receiving end is connected to the input port of the digital signal processing module, and is used to convert the received optical signal into an electrical signal and send the electrical signal to the digital signal processing module, so that the digital signal processing module can convert the electrical signal into a target electrical signal and send it to the electrical device. The transmitting end is fixed on the first circuit board and connected to the first ground plane to form a transmitting loop; the receiving end is fixed on the second circuit board and connected to the second ground plane to form a receiving loop; the first ground plane and the second ground plane are both disposed on different layers of the at least two circuit boards; at least one layer of isolation plate is fixedly overlapped between the first circuit board and the second circuit board, and the at least one layer of isolation plate, the first circuit board and the second circuit board are in a stacked structure; a support block is disposed on the outer surface of the second circuit board, and the support block penetrates through the second circuit board to the first circuit board; the transmitting end is disposed on the support block of the first circuit board, and the port of the receiving end is disposed on the side of the support block, so that the projection area of ​​the transmitting end on the second circuit board does not overlap with the area of ​​the receiving end on the second circuit board; The at least two circuit boards are stacked.

2. The optical transceiver module according to claim 1, characterized in that, The first ground plane is disposed on the first circuit board or on the first ground plane; the second ground plane is disposed on the second circuit board or on the second ground plane; wherein, the first ground plane is the circuit board adjacent to the first circuit board in the at least two circuit boards; the second ground plane is the circuit board adjacent to the second circuit board in the at least two circuit boards.

3. The optical transceiver module according to claim 2, characterized in that, The first ground plane is located on the side of the first ground plane closest to the first circuit board; the second ground plane is located on the side of the second ground plane closest to the second circuit board.

4. The optical transceiver module according to any one of claims 1-3, characterized in that, The at least two layers of the circuit board are provided with through holes.

5. The optical transceiver module according to claim 4, characterized in that, When there is at least one isolation plate between the first circuit board and the first ground plane, the transmitting end is connected to the first ground plane by passing a wire through the corresponding through hole; When there is at least one isolation plate between the second circuit board and the second ground plane, the receiving end connects to the second ground plane by passing the wire through the corresponding through hole.

6. The optical transceiver module according to claim 5, characterized in that, Therefore, the first side of the transmitting end is lower than or flush with the outer surface of the first circuit board; the first side of the transmitting end is parallel to the first circuit board and away from the support block.

7. The optical transceiver module according to claim 5 or 6, characterized in that, The receiving end includes N ports; The N ports are respectively located on both sides of the support block on the second circuit board, or, All N ports are located on one side of the support block on the second circuit board.

8. The optical transceiver module according to any one of claims 1-3, characterized in that, The first circuit board is the first layer of the at least two circuit boards, and the second circuit board is the last layer of the at least two circuit boards.

9. The optical transceiver module according to claim 4, characterized in that, The transmitting end is connected to the digital signal processing module via a first wire, and the receiving end is connected to the digital signal processing module via a second wire; wherein the first wire and the second wire are respectively disposed in different layers of the circuit board in at least two layers of the circuit board, or pass through the through holes on the at least two layers of the circuit board to the digital signal processing module.

10. The optical transceiver module according to claim 9, characterized in that, The first wire is disposed on the outer surface of the first circuit board, and the second wire passes through the through-hole on the at least two layers of circuit boards to the digital signal processing module; or, The second conductor is disposed on the outer surface of the second circuit board, and the first conductor passes through the via on the at least two layers of circuit boards to the digital signal processing module.

11. An optical transceiver, characterized in that, The device includes an optical transceiver module, a digital signal processing module, electrical components, and optical components as described in any one of claims 1-10; wherein... The electrical device is coupled to the digital signal processing module, the digital signal processing module is coupled to the optical transceiver module, and the optical transceiver module is coupled to the optical device. The digital signal processing module is used to process the electrical signal sent by the electrical device to obtain the electrical signal to be converted, and send the electrical signal to be converted to the transmitting end in the optical transceiver module so that the transmitting end can convert the electrical signal to be converted into the target optical signal. Alternatively, the electrical signal transmitted by the receiving end in the optical transceiver module can be converted into a target electrical signal, and the target electrical signal can be transmitted to the electrical device. The optical device is used to receive the target optical signal transmitted by the transmitting end, or to transmit an optical signal to the receiving end; The electrical device is used to receive the target electrical signal sent by the digital signal processing module, or to send the electrical signal to the digital signal processing module.

12. The optical transceiver according to claim 11, characterized in that, The digital signal processing module is mounted on the first circuit board, and the second circuit board is connected to the first circuit board by means of a second wire passing through the through holes on at least two layers of circuit boards.

13. The optical transceiver according to claim 11, characterized in that, The digital signal processing module is mounted on the second circuit board. The first circuit board is connected to the second circuit board via a first wire passing through a via on at least two layers of circuit boards.

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