Flexible circuit board and method of manufacturing the same

Abstract

The application provides a foldable circuit board, which comprises a circuit substrate, a wire distribution box and a plurality of conductive wires. The circuit substrate is divided into a first non-folding area, a folding area and a second non-folding area, the folding area is arranged between the first non-folding area and the second non-folding area, and the folding area is provided with an opening penetrating through the circuit substrate. The conductive wires comprise first end portions, second end portions and connecting portions, the first end portions are connected to the first non-folding area, the second end portions are connected to the second non-folding area, the connecting portions connect the first end portions and the second end portions across the opening, and the length of each conductive wire is greater than the cross-sectional width of the opening along the extending direction. The wire distribution box comprises a plurality of wire accommodating spaces, each adjacent two wire accommodating spaces are electrically isolated, and each connecting portion is movably accommodated in one wire accommodating space. The foldable circuit board provided by the application has the advantages of high processing yield and large-angle folding. In addition, the application also provides a manufacturing method of the foldable circuit board.

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